CN102617886A - Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin - Google Patents
Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin Download PDFInfo
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- CN102617886A CN102617886A CN2012100044443A CN201210004444A CN102617886A CN 102617886 A CN102617886 A CN 102617886A CN 2012100044443 A CN2012100044443 A CN 2012100044443A CN 201210004444 A CN201210004444 A CN 201210004444A CN 102617886 A CN102617886 A CN 102617886A
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- vacuum pressure
- conductive filler
- heat conductive
- resin
- pressure impregnation
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Abstract
The invention discloses application of a heat conducting filling material in VPI resin. The invention is characterized in that the heat conducting filling material employs boron nitride of a hexahedron structure, said boron nitride of a hexahedron structure is in the form of crystals and has a crystal particle size of 2 mu m to 5 mu m, the addition amount of boron nitride is in a range of from 3% to 35% and boron nitride is dispersed into resinite by using microwave dispersion. The beneficial effects of the invention are as follows: by adopting the heat conducting filling material provided in the invention, the coefficient of heat conductivity of the insulator of a high voltage motor can be effectively improved, loss of a thermal state medium of a solidified substance in a resin system is reduced, and electric strength of the medium is improved.
Description
Technical field
The present invention relates to the insulating treatment process that in motor is made, generally uses, be specifically related to the application of heat conductive filler in VPI vacuum pressure impregnation resin.
Background technology
In the manufacturing of motor, the radiating efficiency key that improves motor is to improve the heat transfer efficiency of insulating motor coil body, just improves the thermal conductivity of isolator, helps air cooling, reduces electric machine temperature rise, improves electrical efficiency.
External major company recognizes that already the heat conductivility that improves insulating material can promote the manufacture level of electronic product; The leading superiority that keeps science and technology; Therefore constantly there is new high heat conductive insulating material to occur abroad; As: the epoxy glue of HIT's development, thermal conductivity is brought up to 0.96W/mK from 0.15W/mK; The dry mica paper tape of Switzerland Yi Suola company development, thermal conductivity is brought up to 0.5W/mK from 0.25W/mK; The silk bag lead of Siemens development, thermal conductivity is brought up to 0.5W/mK from 0.25W/mK; The Kapton of du pont company development, thermal conductivity is brought up to 0.45W/mK from 0.15W/mK.
At present; The thermal conductivity that improves high-voltage motor insulated body mainly contains following two kinds of effective ways: the one, in mica tape, add a certain amount of heat conductive filler; The 2nd, in VPI solvent impregnated resin system, add heat conductive filler; When handling, import to heat conductive filler in the isolator, perhaps two kinds of methods are combined processing through the VPI vacuum pressure impregnation.
Technique of vacuum pressure for dipping electrical is a kind of insulating treatment process that the most generally uses during present motor is made.
Heat conductive filler is divided into metallic stuffing, mineral filler and conductive organic matter filler.Yet metallic stuffing and the use of conductive organic matter filler in the electrical machine insulation body can reduce the dielectric level of isolator.Therefore, adopting inorganic heat conductive filler is to select preferably.
Inorganic heat conductive filler can adopt in pottery, thomel, aluminum oxide, Natural manganese dioxide, aluminium nitride AlN, silit, the SP 1 etc., and the powder of any material is as heat conductive filler.
Summary of the invention
The objective of the invention is: in VPI solvent impregnated resin system, add heat conductive filler, to reach the purpose of the thermal conductivity that improves high-voltage motor insulated body.
The technical scheme that the present invention adopted is:
The application of heat conductive filler in VPI vacuum pressure impregnation resin is characterized in that, heat conductive filler adopts hexahedron structure SP 1;
Said hexahedron structure SP 1 powder is a crystalline form, and the crystal particle diameter size range is 2 microns to 5 microns;
The addition scope of said hexahedron structure SP 1 is 3%～35%, and employing microwave dispersion technology is distributed in the resinite;
Said heat conductive filler has also added VPI vacuum pressure impregnation resin, and through the technique of vacuum pressure for dipping electrical technology solvent impregnated resin that contains heat conductive filler fully is filled in the insulation layer of motor coil conductor, thereby makes insulating layer of conductor become the insulation layer of heat conduction;
In addition, add tackiness agent at heat conductive filler, thereby form heat-conductive bonding agent, it is bonding between electronic devices and components and radiator, to form heat conductor;
Said tackiness agent generally adopts silica gel.
The invention has the beneficial effects as follows: adopt heat conductive filler provided by the invention, can effectively improve the thermal conductivity of high-voltage motor insulated body, reduce the loss of the hot medium of resin system cured article, and promote its electrical strength.
Embodiment
Embodiment 1:
A, when in bisphenol A epoxide resin-liquid acid anhydride curing agents system, adding 5% 3 micron grain size hexagonal boron nitride fillers, its system cured article thermal conductivity is brought up to 0.24w/m.k (25 ℃ time) from 0.19w/m.k;
B, the resin system cured article when adding filler 5%, what its hot dielectric loss (155 ℃ time) was never filled 3.21% is reduced to 2.81%;
C, the resin system cured article when adding filler 5%, the never filled 30.8MV/m of its electrical strength brings up to 34.5MV/m.
Embodiment 2:
When adding 3 microns hexagonal boron nitride fillers of 15% in bisphenol A epoxide resin-liquid acid anhydride curing agents system, the thermal conductivity of its resin solidification objects system is brought up to 0.84w/m.k (25 ℃ time) from 0.19w/m.k.
Embodiment 3:
When adding 3 microns hexagonal boron nitride fillers of 12.5% in bisphenol A epoxide resin-liquid acid anhydride curing agents system; Handle 6KV level HV Electric Machine Coil through the VPI technique of vacuum pressure for dipping electrical, the insulation layer thermal conductivity of its coil-conductor is brought up to 0.76w/m.k from 0.25w/m.k when 105 ℃ of temperature rises.
Claims (5)
1. the application of heat conductive filler in VPI vacuum pressure impregnation resin is characterized in that, heat conductive filler adopts hexahedron structure SP 1; Said hexahedron structure SP 1 powder is a crystalline form, and the crystal particle diameter size range is 2 microns to 5 microns, and the addition scope of said hexahedron structure SP 1 is 3%～35%, and adopts the microwave dispersion technology to be distributed in the resinite.
2. the application of heat conductive filler as claimed in claim 1 in VPI vacuum pressure impregnation resin; It is characterized in that; Said heat conductive filler has also added VPI vacuum pressure impregnation resin; And the solvent impregnated resin that contains heat conductive filler fully is filled in the insulation layer of motor coil conductor, thereby make insulating layer of conductor become the insulation layer of heat conduction through the technique of vacuum pressure for dipping electrical technology.
3. the application of heat conductive filler as claimed in claim 2 in VPI vacuum pressure impregnation resin is characterized in that, described VPI vacuum pressure impregnation resin is bisphenol A epoxide resin-liquid acid anhydride curing agents system.
4. the application of heat conductive filler as claimed in claim 1 in VPI vacuum pressure impregnation resin is characterized in that said heat conductive filler also adds tackiness agent, thereby forms heat-conductive bonding agent, and it is bonding between electronic devices and components and radiator, to form heat conductor.
5. the application of heat conductive filler as claimed in claim 4 in VPI vacuum pressure impregnation resin is characterized in that, said tackiness agent adopts silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100044443A CN102617886A (en) | 2012-01-06 | 2012-01-06 | Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100044443A CN102617886A (en) | 2012-01-06 | 2012-01-06 | Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102617886A true CN102617886A (en) | 2012-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100044443A Pending CN102617886A (en) | 2012-01-06 | 2012-01-06 | Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin |
Country Status (1)
| Country | Link |
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| CN (1) | CN102617886A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087476A (en) * | 2013-02-17 | 2013-05-08 | 桂林理工大学 | Impregnating resin for manufacturing nano composite major insulator for high-voltage motors |
| CN114479757A (en) * | 2022-03-02 | 2022-05-13 | 深圳市美宝昕新材料有限公司 | Environment-friendly vulcanized silicone rubber for fixing electronic element and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1819408A (en) * | 2006-01-23 | 2006-08-16 | 株洲时代新材料科技股份有限公司 | Insulating structure and production for vacuum-pressure immersing process of high-voltage motor |
| CN101121878A (en) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | Thermally conductive material |
| CN101861353A (en) * | 2007-11-16 | 2010-10-13 | 纳幕尔杜邦公司 | Thermally conductive resin compositions |
| CN102295878A (en) * | 2011-07-06 | 2011-12-28 | 上海大学 | Fill-type thermal conductive insulation impregnating varnish |
-
2012
- 2012-01-06 CN CN2012100044443A patent/CN102617886A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1819408A (en) * | 2006-01-23 | 2006-08-16 | 株洲时代新材料科技股份有限公司 | Insulating structure and production for vacuum-pressure immersing process of high-voltage motor |
| CN101121878A (en) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | Thermally conductive material |
| CN101861353A (en) * | 2007-11-16 | 2010-10-13 | 纳幕尔杜邦公司 | Thermally conductive resin compositions |
| CN102295878A (en) * | 2011-07-06 | 2011-12-28 | 上海大学 | Fill-type thermal conductive insulation impregnating varnish |
Non-Patent Citations (2)
| Title |
|---|
| 周文英、齐暑华等: "BN/HDPE导热塑料的热导率", 《高分子材料科学与工程》, vol. 24, no. 2, 29 February 2008 (2008-02-29), pages 83 - 86 * |
| 赵超亮、刘立柱等: "导热填料对云母胶导热系数的影响研究", 《绝缘材料》, vol. 44, no. 1, 31 January 2011 (2011-01-31), pages 61 - 65 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087476A (en) * | 2013-02-17 | 2013-05-08 | 桂林理工大学 | Impregnating resin for manufacturing nano composite major insulator for high-voltage motors |
| CN114479757A (en) * | 2022-03-02 | 2022-05-13 | 深圳市美宝昕新材料有限公司 | Environment-friendly vulcanized silicone rubber for fixing electronic element and preparation method thereof |
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Application publication date: 20120801 |