CN102610948A - Connecting mechanism for voice output module of mobile equipment - Google Patents

Connecting mechanism for voice output module of mobile equipment Download PDF

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Publication number
CN102610948A
CN102610948A CN2012100915478A CN201210091547A CN102610948A CN 102610948 A CN102610948 A CN 102610948A CN 2012100915478 A CN2012100915478 A CN 2012100915478A CN 201210091547 A CN201210091547 A CN 201210091547A CN 102610948 A CN102610948 A CN 102610948A
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CN
China
Prior art keywords
output module
voice output
mobile device
bindiny mechanism
circuit board
Prior art date
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Granted
Application number
CN2012100915478A
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Chinese (zh)
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CN102610948B (en
Inventor
杨思闯
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Huaqin Technology Co Ltd
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Huaqin Telecom Technology Co Ltd
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Priority to CN201210091547.8A priority Critical patent/CN102610948B/en
Publication of CN102610948A publication Critical patent/CN102610948A/en
Application granted granted Critical
Publication of CN102610948B publication Critical patent/CN102610948B/en
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Abstract

The invention discloses a connecting mechanism for a voice output module of mobile equipment. The connecting mechanism comprises a slot which is arranged on a circuit board and is used for installing the voice output module; and at least two elastic clamping mechanisms which are fixedly arranged on two opposite side surfaces of the voice output module, wherein the two elastic clamping mechanisms respectively abut against the inner wall of the slot, the voice output module is clamped in the slot and the elastic clamping mechanisms are made of conductive materials. Since the thickness space of the circuit board is fully utilized and the voice output module is clamped in the slot through at least a pair of the elastic clamping mechanisms, on the premise that the voice output module can work normally, the connecting mechanism for the voice output module of the mobile equipment has the advantages that the height of the voice output module in the thickness direction relative to the circuit board can be freely adjusted, the internal space of the mobile equipment is utilized more ingeniously and the structure is more compact.

Description

The bindiny mechanism of the voice output module of mobile device
Technical field
The present invention relates to a kind of mobile device, particularly relate to a kind of bindiny mechanism of voice output module of mobile device.
Background technology
As shown in Figure 1; The voice output module 2 ' of mobile device of the prior art be positioned at circuit board 1 ' directly over; And through one be fixed in voice output module 2 ' below connection shell fragment 3 ' is connected whole along continuous straight runs extension of this connection shell fragment 3 ' with circuit board 1 '.
But this mode that stacks causes the voice output module to remain applying with circuit board on the one hand, on thickness direction, can't adjust relatively, causes mobile device on thickness direction, to take up space excessive in voice output module region on the other hand.
Summary of the invention
The technical problem that the present invention will solve is to stack mode and cause it on thickness direction, can't to adjust relatively for the voice output module that overcomes mobile device in the prior art and circuit board adopt; And the bigger defective that takes up space provides a kind of bindiny mechanism of voice output module of mobile device.
The present invention solves above-mentioned technical problem through following technical proposals:
A kind of bindiny mechanism of voice output module of mobile device, said mobile device comprises a circuit board, and its characteristics are, and this bindiny mechanism comprises and is located on the said circuit board, is used to install the draw-in groove of voice output module; At least two elasticity snap fasteners that are fixed in the two relative side of said voice output module; Said two elasticity snap fasteners press on the inwall of said draw-in groove respectively; Said voice output module card is located in the said draw-in groove, and said elasticity snap fastener adopts electric conducting material to process.Said electric conducting material can be conductive rubber, metal clips etc.Said voice output module comprises loudspeaker and receiver.
Wherein, said elasticity snap fastener is a connection shell fragment; Said connection shell fragment include one with the fixing stiff end in the side of said voice output module; By the extended pressure section of said stiff end, this pressure section is resisted against the inwall of said draw-in groove.
Wherein, said stiff end is connected through one " U " type transition part with said pressure section.Thereby improved the fatigue resistance that is communicated with shell fragment, prolonged the useful life of connecting shell fragment.
Wherein, said stiff end and said pressure section are connected through anyhow " S " type transition part.Thereby improved the fatigue resistance that is communicated with shell fragment, prolonged the useful life of connecting shell fragment.
Wherein, said stiff end and said voice output module are injection mo(u)lding.Certainly, those skilled in the art also can adopt glue or other bindiny mechanisms that stiff end is connected with the voice output module.
Wherein, said pressure section has a free end, said free end downwarping.Thereby prevent that free end sharp-pointed in assembling process from damaging personnel.
Among the present invention, but above-mentioned optimum condition combination in any on the basis that meets this area general knowledge promptly gets each preferred embodiment of the present invention.
Positive progressive effect of the present invention is: the bindiny mechanism of the voice output module of mobile device of the present invention has made full use of the thickness space of circuit board; The voice output module is arranged in the draw-in groove through at least one pair of elasticity snap fastener; Under the prerequisite of the operate as normal of guaranteeing this voice output module; Can freely adjust its relative altitude at thickness direction and circuit board, utilize the mobile device volume inside more dexterously, structure is more compact.
Description of drawings
Fig. 1 is the syndeton sketch map of voice output module of the prior art and circuit board.
Fig. 2 is the voice output module in the present invention's one preferred embodiment and the syndeton sketch map of circuit board.
Fig. 3 is communicated with the structural representation of shell fragment under nature on the voice output module among Fig. 2.
Fig. 4 is the voice output module in another preferred embodiment of the present invention and the syndeton sketch map of circuit board.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to specify technical scheme of the present invention.
As shown in Figure 2, in the mobile device in the present embodiment, be provided with a draw-in groove 11 in the position of voice output module to be installed, this draw-in groove 11 has run through upper and lower two surfaces of circuit board 1.The and arranged on left and right sides face of voice output module 2 respectively injection moulding one connection shell fragment 3 as the elasticity snap fastener, the connection shell fragment 3 in the present embodiment adopts metal materials to process.This is communicated with, and shell fragment 3 also can pass through glue or other mechanical connection manners and voice output module 2 is fixing, and their connected mode can repeat no more at this with reference to prior art.
Above-mentioned connection shell fragment 3 comprised one with the fixing stiff end 31 in the side of voice output module 2, extend upward out the pressure section 32 of a strip by this stiff end 31, the free end 33 of this pressure section 32 each other away from.That is, 32 one-tenth " V " fonts of these two pressure sections that are oppositely arranged are opened (see figure 3) under nature.After voice output module 2 snapped in draw-in groove 11, deformation inwardly took place in pressure section 32 under the extruding of draw-in groove 11 inwalls, be communicated with shell fragment 3 and utilize the elastic restoring force of himself tightly to press on the inwall of draw-in groove 11, reaches the fixedly purpose of sound output module 2.
In order to improve the fatigue resistance of this connection shell fragment 3, pressure section 32 is connected through horizontal " S " type transition part with stiff end 31 in the present embodiment.Implement assembling for the ease of the assembly crewman, when avoiding assembling hand is damaged free end 33 downwarpings of pressure section 32.
In addition, pressure section 32 also can be connected through " U " type transition part among Fig. 4 with stiff end 31.
Certainly; The metal that in the foregoing description, adopts is communicated with the shell fragment, and those skilled in the art also can adopt conductive rubber to substitute, can be fixed in when adopting conductive rubber the voice output module around; Its fixed form can also repeat no more at this with reference to prior art.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited appended claims.Those skilled in the art can make numerous variations or modification to these execution modes under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.

Claims (6)

1. the bindiny mechanism of the voice output module of a mobile device, said mobile device comprises a circuit board, it is characterized in that, this bindiny mechanism comprises and is located on the said circuit board, is used to install the draw-in groove of voice output module; At least two elasticity snap fasteners that are fixed in the two relative side of said voice output module; Said two elasticity snap fasteners press on the inwall of said draw-in groove respectively; Said voice output module card is located in the said draw-in groove, and said elasticity snap fastener adopts electric conducting material to process.
2. the bindiny mechanism of the voice output module of mobile device as claimed in claim 1 is characterized in that, said elasticity snap fastener is one and is communicated with shell fragment; Said connection shell fragment include one with the fixing stiff end in the side of said voice output module; By the extended pressure section of said stiff end, this pressure section is resisted against the inwall of said draw-in groove.
3. the bindiny mechanism of the voice output module of mobile device as claimed in claim 2 is characterized in that, said stiff end is connected through one " U " type transition part with said pressure section.
4. the bindiny mechanism of the voice output module of mobile device as claimed in claim 2 is characterized in that, said stiff end and said pressure section are connected through anyhow " S " type transition part.
5. the bindiny mechanism of the voice output module of mobile device as claimed in claim 2 is characterized in that, said stiff end and said voice output module are injection mo(u)lding.
6. like the bindiny mechanism of the voice output module of each described mobile device among the claim 2-5, it is characterized in that said pressure section has a free end, said free end downwarping.
CN201210091547.8A 2012-03-30 2012-03-30 Connecting mechanism for voice output module of mobile equipment Active CN102610948B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210091547.8A CN102610948B (en) 2012-03-30 2012-03-30 Connecting mechanism for voice output module of mobile equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210091547.8A CN102610948B (en) 2012-03-30 2012-03-30 Connecting mechanism for voice output module of mobile equipment

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CN102610948A true CN102610948A (en) 2012-07-25
CN102610948B CN102610948B (en) 2015-02-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106299773A (en) * 2015-06-05 2017-01-04 富士康(昆山)电脑接插件有限公司 Audio connector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4923404A (en) * 1989-10-20 1990-05-08 Amp Incorporated Sealed chip carrier
CN201194254Y (en) * 2008-05-19 2009-02-11 珑骅科技有限公司 Conductive shrapnel
EP2251939A2 (en) * 2009-05-11 2010-11-17 Multi-Holding AG Press contact device and contact device
CN202004242U (en) * 2011-01-25 2011-10-05 富士康(昆山)电脑接插件有限公司 Audio connector
CN202495588U (en) * 2012-03-30 2012-10-17 上海华勤通讯技术有限公司 Connection device of audio module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4923404A (en) * 1989-10-20 1990-05-08 Amp Incorporated Sealed chip carrier
CN201194254Y (en) * 2008-05-19 2009-02-11 珑骅科技有限公司 Conductive shrapnel
EP2251939A2 (en) * 2009-05-11 2010-11-17 Multi-Holding AG Press contact device and contact device
CN202004242U (en) * 2011-01-25 2011-10-05 富士康(昆山)电脑接插件有限公司 Audio connector
CN202495588U (en) * 2012-03-30 2012-10-17 上海华勤通讯技术有限公司 Connection device of audio module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106299773A (en) * 2015-06-05 2017-01-04 富士康(昆山)电脑接插件有限公司 Audio connector
CN106299773B (en) * 2015-06-05 2019-01-11 富士康(昆山)电脑接插件有限公司 Audio connector

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Address after: 201203 Shanghai city Pudong New Area Zhangjiang Keyuan Road No. 399 Building No. 1

Patentee after: HUAQIN TELECOM TECHNOLOGY Co.,Ltd.

Address before: 201203 Shanghai city Pudong New Area Zhangjiang Keyuan Road No. 399 Building No. 1

Patentee before: SHANGHAI HUAQIN TELECOM TECHNOLOGY Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203

Patentee after: Huaqin Technology Co.,Ltd.

Address before: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203

Patentee before: Huaqin Technology Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Building 1, No. 399 Keyuan Road, Zhangjiang hi tech park, Pudong New Area, Shanghai, 201203

Patentee after: Huaqin Technology Co.,Ltd.

Address before: 201203 Building 1, 399 Zhangyuan Road, Zhangjiang, Pudong New Area, Shanghai

Patentee before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd.