CN102601926A - Heat conduction pinpoint component - Google Patents
Heat conduction pinpoint component Download PDFInfo
- Publication number
- CN102601926A CN102601926A CN2012100882559A CN201210088255A CN102601926A CN 102601926 A CN102601926 A CN 102601926A CN 2012100882559 A CN2012100882559 A CN 2012100882559A CN 201210088255 A CN201210088255 A CN 201210088255A CN 102601926 A CN102601926 A CN 102601926A
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- CN
- China
- Prior art keywords
- heat conduction
- pinpoint
- needle point
- conduction needle
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a heat conduction pinpoint component, which comprises a heat conduction pinpoint core, a hot conduction pinpoint sleeve and a heat conduction pinpoint cover; the heat conduction pinpoint sleeve is fixed on the external periphery of the heat conduction pinpoint core through interference fit; and the heat conduction pinpoint cover is fixed on the external periphery of the heat conduction pinpoint sleeve through threads. The beneficial effects provided by the invention are mainly embodied as follows: 1, twice sealing is adopted by the heat conduction pinpoint component, during the first sealing, the diameter is small, the wall is thin, no blind angle exists, and no material is piled, so that the quality of products can be effectively improved; 2, the first sealing is not the main sealing, so that the contact area with a cold cavity plate is very small, the heat loss is little, little influence on a high-temperature raw material is brought, and the material does not cooled; and 3, the additionally increased heat conduction pinpoint sleeve plays the role of a thermal insulating layer, so that the temperature of the material is stable.
Description
Technical field
The present invention relates to a kind of improvement of heat conduction needle point assembly, it is little especially to relate to a kind of thermal loss, do not have the dead angle, can not buildup heat conduction needle point assembly, belong to injection mold component technology field.
Background technology
In injection mold, often can use heat conduction needle point assembly, said heat conduction needle point assembly comprises heat conduction needle point core 1, heat conduction needle point lid 2; Said heat conduction needle point covers 2 screw threads and is fixed on the heat conduction needle point core 1; Sketch map when being depicted as the application state of said heat conduction needle point assembly like accompanying drawing 1, the discharge end of said heat conduction needle point assembly insert in the cavityplate 3; The heat conduction needle point assembly of this structure when application state, a sealing, the sealing aperture is big, and the dead angle is arranged, easily buildup produces bad to product after the material carbonization; Sealing place directly cooperates with cold cavityplate, and thermal loss is big, and temperature descends fast, easy cold burden, not plastic emitting.
Summary of the invention
The present invention seeks to provides a kind of thermal loss little for the deficiency that overcomes prior art, do not have the dead angle, can not buildup heat conduction needle point assembly.
For achieving the above object, the technical scheme that the present invention adopts is: a kind of heat conduction needle point assembly comprises heat conduction needle point core, heat conduction needle point cover, heat conduction needle point lid; Said heat conduction needle point cover is fixed on the excircle of heat conduction needle point core through interference fit; Said heat conduction needle point lid screw thread is fixed on the excircle of heat conduction needle point cover.
Beneficial effect of the present invention is mainly reflected in: 1, heat conduction needle point assembly of the present invention is twice sealing, and for the first time the sealing diameter is little, and wall is thin, does not have the dead angle, can buildup, can effectively improve the bad of product;
2, sealing for the first time is not main sealing, and very little with cold cavityplate contact area, thermal loss is little, and is little to the influence of high temperature raw material yet, can cold burden;
3, the heat conduction needle point cover that increases plays the heat-insulation layer effect, and the material temperature is stable.
Description of drawings
Below in conjunction with accompanying drawing technical scheme of the present invention is described further:
Sketch map when accompanying drawing 1 is the application state of heat conduction needle point assembly of prior art;
Sketch map when accompanying drawing 2 is the application state of heat conduction needle point assembly of the present invention;
Wherein: 1, heat conduction needle point core; 2, heat conduction needle point lid; 3, cavityplate; 11, heat conduction needle point core; 12, heat conduction needle point cover; 13, heat conduction needle point lid; 14, cavityplate.
The specific embodiment
Of the present invention a kind of heat conduction needle point assembly shown in accompanying drawing 2 comprises heat conduction needle point core 11, heat conduction needle point cover 12, heat conduction needle point lid 13; Said heat conduction needle point cover 12 is fixed on the excircle of heat conduction needle point core 11 through interference fit; Said heat conduction needle point covers on the excircle that 13 screw threads are fixed on heat conduction needle point cover 12.When the application state of said heat conduction needle point assembly, the discharge end of said heat conduction needle point assembly inserts in the cavityplate 14.
Beneficial effect of the present invention is mainly reflected in: 1, heat conduction needle point assembly of the present invention is twice sealing, and for the first time the sealing diameter is little, and wall is thin, does not have the dead angle, can buildup, can effectively improve the bad of product;
2, sealing for the first time is not main sealing, and very little with cold cavityplate contact area, thermal loss is little, and is little to the influence of high temperature raw material yet, can cold burden;
3, the heat conduction needle point cover that increases plays the heat-insulation layer effect, and the material temperature is stable.
The foregoing description only is explanation technical conceive of the present invention and characteristics; Its purpose is to let the personage that is familiar with this technology can understand content of the present invention and implements; Can not limit protection scope of the present invention with this; All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. a heat conduction needle point assembly comprises heat conduction needle point core, heat conduction needle point cover, heat conduction needle point lid; It is characterized in that: said heat conduction needle point cover is fixed on the excircle of heat conduction needle point core through interference fit; Said heat conduction needle point lid screw thread is fixed on the excircle of heat conduction needle point cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100882559A CN102601926A (en) | 2012-03-30 | 2012-03-30 | Heat conduction pinpoint component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100882559A CN102601926A (en) | 2012-03-30 | 2012-03-30 | Heat conduction pinpoint component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102601926A true CN102601926A (en) | 2012-07-25 |
Family
ID=46519885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100882559A Pending CN102601926A (en) | 2012-03-30 | 2012-03-30 | Heat conduction pinpoint component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102601926A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381862A (en) * | 2017-09-26 | 2018-08-10 | 蒋米娜 | The through-type hot mouth component of the high high carbon fiber of glass |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2183866Y (en) * | 1993-05-17 | 1994-11-30 | 罗伯特·费尔 | Nozzle of injection molder |
| CN1128698A (en) * | 1994-12-07 | 1996-08-14 | 乔布斯特·乌尔里克·盖勒特 | Injection molding nozzle with disassembled core part and single over sleeve |
| EP2008789A1 (en) * | 2007-06-28 | 2008-12-31 | SFR Formenbau GmbH | Assembly of an injection nozzle for introducing a molten mass into a plastic injection moulding form |
-
2012
- 2012-03-30 CN CN2012100882559A patent/CN102601926A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2183866Y (en) * | 1993-05-17 | 1994-11-30 | 罗伯特·费尔 | Nozzle of injection molder |
| CN1128698A (en) * | 1994-12-07 | 1996-08-14 | 乔布斯特·乌尔里克·盖勒特 | Injection molding nozzle with disassembled core part and single over sleeve |
| EP2008789A1 (en) * | 2007-06-28 | 2008-12-31 | SFR Formenbau GmbH | Assembly of an injection nozzle for introducing a molten mass into a plastic injection moulding form |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381862A (en) * | 2017-09-26 | 2018-08-10 | 蒋米娜 | The through-type hot mouth component of the high high carbon fiber of glass |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120725 |