CN102601476A - Method for welding manual patches of superconducting chips - Google Patents
Method for welding manual patches of superconducting chips Download PDFInfo
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- CN102601476A CN102601476A CN2012100702861A CN201210070286A CN102601476A CN 102601476 A CN102601476 A CN 102601476A CN 2012100702861 A CN2012100702861 A CN 2012100702861A CN 201210070286 A CN201210070286 A CN 201210070286A CN 102601476 A CN102601476 A CN 102601476A
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- chip
- solder
- metal case
- superconduction
- indium
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Abstract
The invention relates to a method for welding manual patches of superconducting chips. A superconducting is reliably fixedly mounted by means of manual welding by the aid of soft solder. The method includes preliminarily coating the solder on a to-be-welded surface of a metal box and a grounded surface of the superconducting chip on a heating table at first, and then welding patches of the two welding surfaces. By the aid of the method, high-quality welding of the patches of the superconducting chip can be realized, technological consistency is good, shearing strength is higher than 4MPa, and a process capacity index Cpk reaches 1.23.
Description
Affiliated technical field
The present invention relates to a kind of superconduction chip manual pasting welding method, use this method welding superconduction chip can obtain high quality welding.
Background technology
At present, the superconduction chip adopts generally that frame for movement compresses, the mode of conductive adhesive, brazing metal soldering realizes installing and fixing.Though but the mechanical compaction fixed method allows chip and box body thermal expansion and contraction independently, cause vibration easily and then bring microphony; Increase the probability of chip damage; Requirement to machining accuracy is very high; And because there is air gap in the chip lower surface, for microwave signal provides leakage paths, with the index and the stability of remarkable deterioration device.The method of conductive adhesive is high to technological requirement, is easy to produce bubble at adhesive surface, understands the index of deterioration device equally; This method of using is the superconduction chip fixedly, and damage ratio is high.
Summary of the invention
To the defective that exists in the above-mentioned existing skill, the object of the present invention is to provide a kind of superconduction chip manual pasting welding method, it can realize reliably installing and fixing of superconduction chip ground plane.
The technical solution adopted for the present invention to solve the technical problems: a kind of superconduction chip manual pasting welding method comprises the steps:
1), uses the frock superconductive device metal case that is installed; To be welded maintenance level of metal case of/silver gold-plated is placed on the warm table, applies the indium scolder at face to be welded; When being heated to indium solder fusing state; Use dustless long fibre cotton swab to sprawl scolder by hand, remove the solder surface oxide layer simultaneously, accomplish to be welded indium solder pre-coating of metal case;
2), on warm table, use surface finish, cleaning; The carrier (glass plate, ceramic wafer etc.) that heat conduction is good upwards is positioned over above-mentioned carrier surface with the gold-plated ground plane of superconduction chip, on ground plane, applies the indium scolder; When being heated to indium solder fusing state; Use dustless long fibre cotton swab to sprawl scolder by hand, remove the solder surface oxide layer simultaneously, accomplish superconduction chip ground plane indium solder pre-coating;
3), use the frock superconductive device metal case that is installed; Make to be welded maintenance level of metal case, be placed on the warm table, superconduction chip ground plane is pasted be placed on to be welded top of metal case; Solder side is after being adjacent under the capillary effect naturally about being heated to the indium solder fusing; At superconduction sides of chip applied thrust, pass the superconduction chip back and forth with corresponding tool (tweezers, blade), drive away the bubble that comprises in the solder side along being parallel to the solder side direction; Pass number of times: 6～10 times, the passing amplitude: chip is along 1/3 of the moving direction size;
4), said process aligns the superconduction chip after finishing, and is cooled to normal temperature, promptly accomplishes the paster welding.
The invention has the beneficial effects as follows, use the method for this manual welding, can obtain high-quality superconduction chip paster welding, shear strength satisfies military standard of China, and process consistency is good, and Process Capability Index Cpk has reached 1.23.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is to be welded indium solder pre-coating of a metal case of the present invention sketch map.
Fig. 2 is a superconduction chip ground plane indium solder pre-coating sketch map of the present invention.
Fig. 3 is that the superconduction chip is to be welded paster sketch map of metal case.
Fig. 4 is that the superconduction chip is to be welded welding of metal case sketch map.
Among the figure: 1. warm table, 2. dustless long fibre cotton swab, 3. indium scolder, 4. metal case surface to be welded, 5. metal case, 6. superconduction chip, 7. clean glass plate, 8. tweezers.
The specific embodiment
In Fig. 1, use the be installed metal case 5 of superconductive device of frock, to be welded 4 maintenance level of metal case of/silver gold-plated; Be placed on the warm table 1; Apply indium scolder 3 at face to be welded, when being heated to indium solder fusing state, use the dustless long fibre cotton swab 2 manual scolders of sprawling; Remove indium solder surface oxide layer simultaneously, accomplish to be welded indium solder pre-coating of metal case.
In Fig. 2; On warm table 1, use clean glass plate 7 (also useful ceramics plate) as carrier, superconduction chip 6 gold-plated ground planes upwards are positioned over above-mentioned carrier surface, on ground plane, apply indium scolder 3; When being heated to indium solder fusing state; Use dustless long fibre cotton swab 2 to sprawl scolder by hand, remove indium solder surface oxide layer simultaneously, accomplish superconduction chip ground plane indium solder pre-coating.
In Fig. 3; Use the frock superconductive device-metal case 5 that is installed; Make to be welded 4 maintenance level of metal case; Be placed on the warm table 1, superconduction chip 6 ground planes pasted be placed on to be welded 4 top of metal case, be heated to indium scolder 3 and be melted to up and down that solder side is adjacent to naturally under capillary effect.
In Fig. 4; At superconduction chip 6 side applied thrusts, pass the superconduction chip back and forth with corresponding tools such as tweezers 8 or blades, drive away the bubble that comprises in the solder side along the solder side direction; Pass number of times: 6～10 times, the passing amplitude: chip is along 1/3 of the moving direction size.Said process aligns the superconduction chip after finishing, and is cooled to normal temperature, promptly accomplishes the paster welding.
The present invention adopts indium as brazing material, does not use scaling powder, the manual contact-making surface welding of accomplishing superconduction chip and metal case.Keep superconductive device box body solder side level in the welding process, the additional passing chip action that is parallel to solder side of paster process.
Claims (3)
1. a superconduction chip manual pasting welding method is characterized in that: comprise the steps:
1), uses the be installed metal case of superconductive device of frock; To be welded maintenance level of metal case of/silver gold-plated is placed on the warm table, applies the indium scolder at face to be welded; When being heated to indium solder fusing state; Use dustless long fibre cotton swab to sprawl scolder by hand, remove the solder surface oxide layer simultaneously, accomplish to be welded indium solder pre-coating of metal case;
2), on warm table, the gold-plated ground plane of superconduction chip upwards is positioned over carrier surface with carrier; On ground plane, apply the indium scolder; When being heated to indium solder fusing state; Use dustless long fibre cotton swab to sprawl scolder by hand, remove the solder surface oxide layer simultaneously, accomplish superconduction chip ground plane indium solder pre-coating;
3), use the be installed metal case of superconductive device of frock; Make to be welded maintenance level of metal case, be placed on the warm table, superconduction chip ground plane is pasted be placed on to be welded top of metal case; Solder side is after being adjacent under the capillary effect naturally about being heated to the indium solder fusing; At superconduction sides of chip applied thrust, pass the superconduction chip back and forth with corresponding tool, drive away the bubble that comprises in the solder side along being parallel to the solder side direction;
4), align the superconduction chip, be cooled to normal temperature, promptly accomplish paster welding.
2. welding method according to claim 1 is characterized in that: in step 2, said carrier is surface finish, cleaning, glass plate that heat conduction is good or ceramic wafer.
3. welding method according to claim 1 is characterized in that: in step 3, said passing is the action that is parallel to the passing chip of solder side, and pass number of times: 6～10 times, the passing amplitude: chip is along 1/3 of the moving direction size; Said corresponding tool is tweezers or blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100702861A CN102601476A (en) | 2012-03-16 | 2012-03-16 | Method for welding manual patches of superconducting chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100702861A CN102601476A (en) | 2012-03-16 | 2012-03-16 | Method for welding manual patches of superconducting chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102601476A true CN102601476A (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100702861A Pending CN102601476A (en) | 2012-03-16 | 2012-03-16 | Method for welding manual patches of superconducting chips |
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| CN (1) | CN102601476A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270870A (en) * | 2016-08-31 | 2017-01-04 | 太仓市华盈电子材料有限公司 | A kind of Chip-R welding method |
| CN110560826A (en) * | 2019-08-02 | 2019-12-13 | 广州汉源新材料股份有限公司 | welded piece with soft solder layer pre-coated on surface and preparation method thereof |
| CN112935441A (en) * | 2021-01-29 | 2021-06-11 | 贵州瑞讯科技有限公司 | Paster welding process for processing electronic detonator module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1666839A (en) * | 2005-02-23 | 2005-09-14 | 中国电子科技集团公司第三十八研究所 | Chip and carrier self-contrapositioning soft soldering method under gas protection |
-
2012
- 2012-03-16 CN CN2012100702861A patent/CN102601476A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1666839A (en) * | 2005-02-23 | 2005-09-14 | 中国电子科技集团公司第三十八研究所 | Chip and carrier self-contrapositioning soft soldering method under gas protection |
Non-Patent Citations (1)
| Title |
|---|
| 丁晓杰等: "YBCO超导芯片Ag-Au电极金带压接实验探讨", 《低温与超导》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270870A (en) * | 2016-08-31 | 2017-01-04 | 太仓市华盈电子材料有限公司 | A kind of Chip-R welding method |
| CN110560826A (en) * | 2019-08-02 | 2019-12-13 | 广州汉源新材料股份有限公司 | welded piece with soft solder layer pre-coated on surface and preparation method thereof |
| CN112935441A (en) * | 2021-01-29 | 2021-06-11 | 贵州瑞讯科技有限公司 | Paster welding process for processing electronic detonator module |
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Application publication date: 20120725 |