CN102573424B - Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device - Google Patents
Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device Download PDFInfo
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- CN102573424B CN102573424B CN201210014468.7A CN201210014468A CN102573424B CN 102573424 B CN102573424 B CN 102573424B CN 201210014468 A CN201210014468 A CN 201210014468A CN 102573424 B CN102573424 B CN 102573424B
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Abstract
The invention provides a wick material for a heat sink device for an electronic component. The wick material is three-dimensional porous metal copper, pores are intercommunicated, the diameter of the pores ranges from 10 mu m to 900 mu m, the thickness of the pores ranges from 0.1 to 10.0mm, and volume density of the metal copper ranges from 0.1 to 2.0g/cm<3>. The invention also provides a method for manufacturing the heat sink device by using the wick material, and the heat sink device. The wick material has high hydrophilic property, and the heat sink device manufactured by the wick material has excellent heat dissipation property; and meanwhile, the preparation process of the heat sink device is simple, and the heat sink device is low in cost.
Description
Technical field
The present invention relates to electronic component fitment material, accessory and preparation method, particularly the liquid-sucking core material of radiating element, radiating element and preparation method.
Background technology
Along with the development of electronic technology, some electronic devices and components volumes do more and more less, and power is more and more higher, and heat density is increasing, more and more higher to the requirement of heat radiation.If heat can not fall apart in time, performance and the life-span of chip will be had a strong impact on.Heat pipe and soaking plate are conventional radiators, to be delivered to fast on fin by the heat of thermal source and to dispel the heat in time, can effectively reduce the temperature of electronic devices and components chip, thus improve the performance of electronic devices and components and improve useful life with efficient heat-transfer capability.The liquid-sucking core of heat pipe and soaking plate is the core material of heat pipe and soaking plate, and the size of liquid-sucking core parent working medium ability determines the quality of heat pipe and soaking plate performance.Liquid-sucking core in current heat pipe generally adopts copper powder to sinter, and soaking plate generally adopts copper mesh as liquid-sucking core.Copper powder sintering causes rate of finished products low because its complex process controllability is lower, and the disposable input of copper powder agglomerating plant is larger.Copper mesh is as liquid-sucking core, and because of its material structure feature, its hydrophilicity is not enough, thus makes the heat transfer efficiency of soaking plate restricted.
Summary of the invention
The present invention aims to provide the good heat exchanger core material of a kind of hydrophilicity, and and then provides the radiating element of corresponding excellent radiation performance and technique is simple, cost is low device preparation method.
The present invention is realized by following scheme:
A liquid-sucking core material for electronic component radiator part is three-dimensional porous shape metallic copper, intercommunication between Kong Yukong, and bore dia scope is 10 μm ~ 900 μm, the thickness range 0.1 ~ 10.0mm of liquid-sucking core material, and the volume density scope of metallic copper is 0.1 ~ 2.0g/cm
3.
Above-mentioned liquid-sucking core material can be prepared by the conventional method of existing porous metal material, specifically: select aperture≤900 μm, the sponge substrate of thick≤10mm, by conductive treatment---plating---heat treatment prepares Porous Cu, press the thickness needs of radiating element afterwards, above-mentioned obtained Porous Cu product is rolled required thickness.
A kind of be used for electronic component radiator part, place above-mentioned liquid-sucking core material in the inwall stent support of shell of the air locking being marked with water, shell is generally pipe or plate, and correspondence is exactly the radiating element of heat pipe or soaking plate.
The preparation method of above-mentioned electronic component radiator part, by space in the liquid-sucking core material loader part shell of above-mentioned feature, then is supported in the inwall of shell, vacuumizes afterwards by the shell of device by liquid-sucking core material with support, seal after injecting pure water.
Compare with radiating element with existing liquid-sucking core, advantage applies of the present invention in:
1. the hydrophilicity of liquid-sucking core material is very good, and this will make the heat transfer property of radiating element excellent.
2., after adopting liquid-sucking core material of the present invention, the manufacture craft of radiating element itself becomes very simple, and only physical process i.e. " support " just can solve, and cost is also very low.
Accompanying drawing explanation
Fig. 1 soaking plate cross-sectional view
Embodiment
embodiment 1
The heat pipe wicks material of electronic element radiating, in three-dimensional porous shape, intercommunication between Kong Yukong, bore dia is 300 μm, the thickness 1.5mm of liquid-sucking core material, and the volume density scope of metallic copper is 0.53g/cm
3.
Select thick 3.0mm, the sponge substrate that aperture is 600 μm, by liquor potassic permanganate alligatoring, oxalic acid striping, carries out electroless copper after stannous chloride sensitization and palladium activation.Electro-coppering in the copper plating bath being main salt with cupric pyrophosphate and potassium pyrophosphate after electroless copper.Copper plating bath is containing cupric pyrophosphate 60g/L, and potassium pyrophosphate 350g/L, oxygen-free copper does anode.Electricity plated with copper 800g/m
2, the product after plating carries out high-temperature heat treatment after cleaning up.Porous Cu is according to heat pipe thickness afterwards, is rolled to thickness 1.5mm.Obtaining aperture is 300 μm, thick 1.5mm, and volume density is 0.53g/cm
3liquid-sucking core material.
embodiment 2
The liquid-sucking core material of embodiment 1 is loaded in tube-like envelope, then with support, liquid-sucking core material is supported in the inwall of shell, vacuumize in pipe afterwards, seal after injecting pure water, can heat pipe be obtained.
embodiment 3
The soaking plate liquid-sucking core material of electronic element radiating, in three-dimensional porous shape, intercommunication between Kong Yukong, bore dia is 50 μm, the thickness 0.5mm of liquid-sucking core material, and the volume density scope of metallic copper is 1.6g/cm
3.
Select thick 2.0mm, the sponge substrate that aperture is 200 μm, by coated with conductive glue, base material is conducted electricity.Electro-coppering in copper sulphate copper plating bath afterwards.Copper plating bath sulfur acid copper 100g/L, sulfuric acid 100ml/L, the acid copper plating bath of chloride ion 80mg/L take phosphor-copper as anode, electric plated with copper 800g/m
2, the product after plating carries out high-temperature heat treatment after cleaning up.Porous Cu material is according to soaking plate thickness afterwards, is rolled to thickness 0.5mm.Obtaining aperture is 50 μm, thick 0.5mm, and volume density is 1.6g/cm
3liquid-sucking core material.
embodiment 4
By in the liquid-sucking core material load plate shape shell of embodiment 3, then with support, liquid-sucking core material is supported in plate inwall, vacuumizes in plate afterwards, seal after injecting pure water, can soaking plate be obtained.
Face, the portion structure chart of above-mentioned soaking plate as shown in Figure 1, has the liquid-sucking core material 2 of embodiment 3, and makes it be supported in metallic plate inwall place with bracing frame 3, be marked with water in sheet metal cavity at the internal cavity of the metallic plate 1 of sealing.
embodiment 5
The heat pipe wicks material of electronic element radiating, in three-dimensional porous shape, intercommunication between Kong Yukong, bore dia is 800 μm, the thickness 9.0mm of liquid-sucking core material, and the volume density scope of metallic copper is 0.2g/cm
3.
Select thick 9.0mm, the sponge substrate that aperture is 800 μm, by liquor potassic permanganate alligatoring, oxalic acid striping, carries out electroless copper after stannous chloride sensitization and palladium activation.Electro-coppering in the copper plating bath being main salt with cupric pyrophosphate and potassium pyrophosphate after electroless copper.Copper plating bath is containing cupric pyrophosphate 60g/L, and potassium pyrophosphate 350g/L, oxygen-free copper does anode.Electricity plated with copper 1800g/m
2, the product after plating carries out high-temperature heat treatment after cleaning up.Obtaining aperture is 800 μm, thick 9.0mm, and volume density is 0.2g/cm
3liquid-sucking core material.
embodiment 6
The liquid-sucking core material of embodiment 5 is loaded in tube-like envelope, then with support, liquid-sucking core material is supported in the inwall of shell, vacuumize in pipe afterwards, seal after injecting pure water, can heat pipe be obtained.
Claims (3)
1. the liquid-sucking core material of an electronic component radiator part, it is characterized in that: be three-dimensional porous shape metallic copper, intercommunication between Kong Yukong, bore dia scope is 10 μm ~ 900 μm, the thickness range of liquid-sucking core material is 0.1 ~ 10.0mm, and the volume density scope of metallic copper is 0.1 ~ 2.0g/cm
3.
2. for an electronic component radiator part, it is characterized in that: be placed with liquid-sucking core material as claimed in claim 1 in the inwall stent support of shell of the air locking being marked with water.
3. as claimed in claim 2 for the preparation method of electronic component radiator part, it is characterized in that: by space in liquid-sucking core material loader part shell as claimed in claim 1, with support, liquid-sucking core material is supported in the inwall of shell again, vacuumize in device outer case afterwards, seal after injecting pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210014468.7A CN102573424B (en) | 2012-01-17 | 2012-01-17 | Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210014468.7A CN102573424B (en) | 2012-01-17 | 2012-01-17 | Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device |
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| Publication Number | Publication Date |
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| CN102573424A CN102573424A (en) | 2012-07-11 |
| CN102573424B true CN102573424B (en) | 2015-05-20 |
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| CN201210014468.7A Active CN102573424B (en) | 2012-01-17 | 2012-01-17 | Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102811590B (en) * | 2012-07-31 | 2014-12-31 | 华南理工大学 | Wick structure for vapor chamber |
| US10835447B2 (en) * | 2018-02-02 | 2020-11-17 | Elc Management Llc | Personal care tool for cooling and treating skin |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1627031A (en) * | 2003-12-13 | 2005-06-15 | 鸿富锦精密工业（深圳）有限公司 | Heat-pipe and preparation method |
| CN1847770A (en) * | 2005-04-15 | 2006-10-18 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and its making process |
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- 2012-01-17 CN CN201210014468.7A patent/CN102573424B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1627031A (en) * | 2003-12-13 | 2005-06-15 | 鸿富锦精密工业（深圳）有限公司 | Heat-pipe and preparation method |
| CN1847770A (en) * | 2005-04-15 | 2006-10-18 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and its making process |
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| CN102573424A (en) | 2012-07-11 |
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Effective date of registration: 20160628 Address after: Lotus pond neighborhood 415000 Changde city in Hunan Province Economic and Technological Development Zone Changde Hill Street office fourteen groups Patentee after: Changde Liyuan New Material Co., Ltd. Address before: 410100 No. 16, Xingsha Avenue, Changsha economic and Technological Development Zone, Changsha, Hunan Patentee before: Changsha Liyuan New Material Co., Ltd. |