CN102573396A - Cooling system and method for electronic equipment - Google Patents
Cooling system and method for electronic equipment Download PDFInfo
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- CN102573396A CN102573396A CN2010106084036A CN201010608403A CN102573396A CN 102573396 A CN102573396 A CN 102573396A CN 2010106084036 A CN2010106084036 A CN 2010106084036A CN 201010608403 A CN201010608403 A CN 201010608403A CN 102573396 A CN102573396 A CN 102573396A
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Abstract
The invention relates to a cooling system for electronic equipment. The electronic equipment comprises at least one unit for generating heat and the cooling system comprises a heat collecting and transmitting module, wherein the heat collecting and transmitting module is thermally connected with the unit for generating the heat so as to transmit the heat generated by the unit; the heat collecting and transmitting module comprises a heat transmission loop containing a flowing heat-carrying medium; the heat collecting and transmitting module further comprises a main heat collection plate; the main heat collection plate is arranged on the downstream of the heat transmission loop, which corresponds to a heat transmission direction; the main heat collection plate is communicated with the heat transmission loop so as to collect the heat transmitted by the heat transmission loop; and the cooling system further comprises a cooling end module and the cooling end module is detachably and thermally connected with the main heat collection plate. According to the cooling system, provided by the invention, the cooling energy consumption is reduced, the power density of an electronic equipment device is increased, and the miniaturization of the electronic equipment is easy to realize. The invention further relates to a method for cooling the electronic equipment by using the cooling system.
Description
Technical field
The present invention relates to the cooling of electric or electronic equipment, especially comprise the cooling of electric or electronic equipment of the unit of a plurality of generation heats.
Background technology
The electronic equipment for example electronic device in the power supply produces a large amount of heat usually when operation, these caloric requirements in time and are effectively dissipated, thereby so that guarantees these electronic devices and guarantee that electronic equipment normally moves.For this reason, cooling system need be set in electronic equipment, to incite somebody to action the heat transferred that electronic device was produced wherein and to be discharged into the external world.
Typical cooling system mainly comprises two types of air cooling system and liquid-cooling systems.For example, fan is set near can in electronic equipment, being easy to generate the electronic device of heat,, thereby takes away the heat that this electronic device operation produces so that air flows via said electronic device; Perhaps, can be close to the heat exchange loop that said electronic device setting contains cooling liquid, so that realize cooling to said electronic device through the heat exchange action of cooling liquid.
Yet; No matter adopt air cooling still to adopt liquid cools; All require in electronic equipment, to lay the space for the cooling system setting; And the electronic device that is easy to generate heat in the electronic equipment arranges that usually ground relatively disperses, so the set-up mode of conventional cooling system often produces adverse influence to the miniaturization developing direction of electronic equipment.In addition, because electronic equipment worldwide is widely used, given electronic equipment often possibly be used in weather, and especially temperature contrast is very significantly in the varying environment, and these environment have different requirement to the cooling capacity of electronic device cooling system.Usually, because the cooling system on the given electronic equipment is fixing,, often design cooling system, thereby cause the waste of cooling capacity easily according to maximum one in order to satisfy the requirement of varying environment.
One or more during the present invention is intended to address the above problem.
Summary of the invention
On the one hand, the invention provides a kind of cooling system that is used for electronic equipment, this electronic equipment comprises that at least one produces the unit of heat; This cooling system comprises heat collection and transmits module; The unit hot link of this heat collection and transmission module and said generation heat is so that collect and transmit the heat that this unit produces, and this heat collection and transmission module comprise the heat transfer loop that contains heat-carrying agent, wherein; Heat-carrying agent flows in this heat transfer loop; It is characterized in that this heat collection and transmission module also comprise main thermal-arrest plate, this main thermal-arrest plate is arranged on the downstream with respect to the heat transferred direction of heat transfer loop; And be communicated with this heat transfer loop fluid, so that collect the heat that transmits by this heat transfer loop; This cooling system also comprises the colling end module, and this colling end module and this main thermal-arrest plate detachable ground hot link are so that the heat in this main thermal-arrest plate that dissipates.
Should be understood that; In the present invention; Term " hot link " is meant and makes relative the connection or locate mode between any parts that can carry out heat exchange between the parts; For example include but not limited to, make to connect through the contact or the attaching type of conductive thermal exchange heat between parts that perhaps making can be through the relative positioning close to each other of thermal radiation heat-shift between parts.
This cooling system makes the user to adopt different colling end modules according to external environment especially variation of temperature; The cooling power and the type of cooling can be easily regulated thus, thereby energy consumption can be reduced, increase the power density of the electronic equipment be associated.In addition, this cooling system also helps the size that reduces electronic equipment, and the noise that helps reducing electronic equipment.
On the other hand, the present invention relates to a kind of method of cooling electronic apparatus, this electronic equipment comprises that at least one produces the unit of heat, and this method comprises:
-prepare heat collection and transmit module, and with each unit hot link of this module and electronic equipment, wherein this heat collection and transmission module comprise the heat transfer loop that contains mobile heat-carrying agent;
-be that this heat collection and transmission module are provided with main thermal-arrest plate, wherein, this main thermal-arrest plate is arranged in the downstream with respect to the heat transferred direction of heat transfer loop, and this main thermal-arrest plate is communicated with this heat transfer loop fluid; And
-the colling end module is provided, so that this colling end module and this heat collection and transmission module especially are the main thermal-arrest plate detachable ground hot links of this heat collection and transmission module.
Description of drawings
Specify the preferred embodiments of the present invention below with reference to accompanying drawings, in the accompanying drawings:
Fig. 1 illustrates the sketch map of the electronic equipment of the cooling system that is equipped with first embodiment of the invention;
Fig. 2 illustrates the electronic equipment Fig. 1 from another angle;
Fig. 3 is the overall perspective view of electronic equipment that the cooling system of first embodiment is installed; And
Fig. 4 illustrates the sketch map of the electronic equipment of the cooling system that is equipped with second embodiment of the invention.
Embodiment
Cooling system of the present invention is used to cool off and has at least one especially a plurality of electronic equipment that are easy to generate the unit of heat, for example UPS (uninterrupted power supply).Said electronic equipment for example can be unit UPS, also can be mounted in the rack UPS array in the rack, for example is used for the UPS array of data center.Especially, cooling system of the present invention can be the cooling system of pcb board (printed circuit board (PCB)) level, that is to say that this cooling system can be arranged on the pcb board and be used to cool off the electronic device on this pcb board.
Specify preferred implementation of the present invention with reference to the accompanying drawings.In the accompanying drawings, same or analogous parts are represented with same label.
Referring to Fig. 1 and Fig. 2, can use the example electronic device 20 of cooling system of the present invention shown in it, this electronic equipment 20 has a plurality of unit 21,22,23,24 that are easy to generate heat.Scheme among the shown embodiment at these; Electronic equipment 20 specifically can be UPS (its inner pcb board especially is shown among the figure); Heat generation unit 21-24 then can be the electronic device that is fixed on the pcb board of UPS, for example inductance 21,22,23 and comprise a plurality of transistorized transistor groups 24.On this pcb board; With said heat generation unit 21,22,23,24 hot links explicitly-especially ground-be provided with cooling system according to first embodiment of the invention; This cooling system comprises mutual hot linked heat collection and transmits module 11 and colling end module 12, shown in figure.
According to the present invention, this heat collection and transmission module 11 are configured to the liquid-cooling type module.In the present embodiment, this liquid-cooling type module comprises the heat transfer loop that is formed by coldplate 111 and optional pump unit 113, and heat-carrying agent for example water flows in this heat transfer loop, so that realize the collection and the transmission of heat.
Particularly, as shown in figs. 1 and 2, in the electronic equipment 20 as the inductance of heat generation unit 21,22,23 each all hot link a coldplate 111 is arranged, said coldplate 111 for example is attached on the corresponding inductance through epoxy resin; Can two coldplates 111 of hot link as 24 of the transistor groups of heat generation unit, that is, one is attached to coldplate 111 and an additional coldplate 111 ' of connecting with this coldplate on this transistor group 24 through for example epoxy resin.
In order to help heat transferred, coldplate 111 preferably by metal for example aluminium or copper become, and be constructed with the preferred closed fluid channel that is used to admit and transmit heat transport fluid.Especially, in a preferred embodiment of the invention, each coldplate 111 all can have the conduit that supplies thermal liquid to flow in inside, a plurality of conduits that for example form through machine work.Said conduit can be configured to be interconnected in the inside of coldplate 111 and only on the opposing end faces of for example this coldplate 111, have entrance and exit; Perhaps; More preferably; Said a plurality of conduit can be configured to each two opposing end surface that all connect coldplate 111 and be interconnected through the outside tube connector 115 of coldplate, like what can from Fig. 1 or 2, find out.Tube connector 115 can be the flexible pipe of being processed by for example silica gel, or by the metal metal tube that becomes of aluminium or copper for example.
In another unshowned preferred implementation; Each coldplate 111 can comprise all that preferably said duct section is for example processed by copper pipe or aluminum pipe and can or be adhesively fixed on the side of this board through welding by the metal board that becomes of aluminium or copper and be fixed on a plurality of duct sections on the opposite side of heat generation unit this board and electronic equipment for example.These duct sections are interconnected so that constitute the closed fluid channel that allows heat-carrying agent to flow.As a kind of replacement scheme, can single copper pipe or aluminum pipe complications be fixed on the side of each coldplate with coiling, supply heat transport fluid flowing fluid passage so that on this coldplate, form.
Still referring to Fig. 1 and 2; In preferred embodiment as shown in the figure; With each heat generation unit 21,22,23,24 hot linked each coldplates 111 of electronic equipment 20 through flexible pipe 112 for example silicone tube be connected in series each other, and between them, connect pump unit 113 so that be the mobile power that provides of heat transport fluid in each coldplate 111 and between different coldplates 111.Like this, just formed heat transfer loop.At this, flexible pipe 112 also can replace with metal tube, for example aluminum pipe or copper pipe.
In addition; Should be understood that; Be connected to form heat transfer loop though be one another in series with the hot linked coldplate of each heat generation unit of electronic equipment among the embodiment in front; But the coldplate of different heat generation units also can be connected in parallel and be connected on the common pipeline, so that form heat transfer loop.
According to an important characteristic of the present invention, heat collection and transmission module 11 comprise that also the heat collection that is used for that heat transfer loop is transmitted arrives together so that the main thermal-arrest plate 110 that dissipates through colling end module 12 subsequently.Particularly; As shown in Figure 1, on the heat transferred direction, main thermal-arrest plate 110 is arranged on heat collection and transmits the downstream of the heat transfer loop that is made up of coldplate 111 etc. of module 11; And be communicated with this heat transfer loop fluid, so that admit the heat transport fluid that has carried heat in this heat transfer loop.At this; Should be understood that; As it will be appreciated by those skilled in the art that, the heat transferred direction be meant from cooling system than thermal modules towards the directed direction of the colder module of this cooling system, just from heat collection and transmit module 11 towards the directed direction of colling end module 12.
This main thermal- arrest plate 110 and 12 hot links of colling end module are so that through the heat in these colling end module 12 these main thermal-arrest plates 110 of dissipation.Certainly, being connected between main thermal-arrest plate 110 and the colling end module 12 is that detachable connects.
Main thermal-arrest plate 110 can be processed by the metal that aluminium or copper etc. has a good heat conductive performance, and can have and aforementioned coldplate 111 similar structures.Specifically; Main thermal-arrest plate 110 can be constructed with closed fluid channel; This fluid passage can be through setting up at the main thermal-arrest plate 110 inner conduits that form, perhaps through main thermal-arrest plate 110 with the opposing side of colling end module 12 on fixing tortuous pipeline set up.Fluid passage in the coldplate 111 of fluid passage in the main thermal-arrest plate 110 and formation heat transfer loop is interconnected; So that heat transport fluid circulates in these passages; And, realize cooling thus to the heat generation unit of electronic equipment through dissipating with the cooling effect of main thermal-arrest plate 111 hot linked colling end modules 12 heat that this heat transport fluid is entrained.
Advantageously, as shown in Figure 1, main thermal-arrest plate 110 can be placed in the especially end of the pcb board of electronic equipment of electronic equipment, so that the next-door neighbour preferably is arranged on the colling end module 12 of electronic device exterior.Should be understood that; In the present invention; Term " next-door neighbour " not only comprises between the parts the directly relative positioning mode of contact, and comprises between the parts relative positioning mode that for example separates with less interval (middle exist or do not exist sept) between the relative positioning mode that is bonded with each other of adhesive and the parts through intermediate medium.
Especially referring to Fig. 2, according to preferred implementation as shown in the figure, colling end module 12 is air-cooled refrigerating module, and it can specifically be configured to the for example combination of tube-axial fan of gilled radiator or fin and fan.This colling end module 12 can for example be passed through similar device and the removably hot links of main thermal-arrest plate 111 such as bolt, clamping apparatus or clamping device.For example; In the embodiment shown in this figure; Colling end module 12 is installed in the hull outside of electronic equipment 20 through for example bolt; Heat collection and 110 housing inboards at this electronic equipment 20 of main thermal-arrest plate of transmitting module 11 are close to this housing and are laid, and between colling end module 12 and main thermal-arrest plate 110, set up detachable hot link thus.
Like this; Cooling system of the present invention can allow the user to have the colling end module 12 of different heat-sinking capabilities or power according to the difference replacing of environment for use; Thereby can improve cooling effectiveness, and avoid the waste of cooling capacity, can reduce energy consumption thus.
Cooling system of the present invention can be provided with or uses according to following mode:
-prepare heat collection and transmit module 11; And each heat generation unit 21,22,23,24 of the electronic equipment 20 that this module 11 next-door neighbours are to be cooled is provided with so that between this module 11 and each unit, set up hot link; Wherein, It contains the for example coldplate 111 of water of heat-carrying agent to be close to each heat generation unit placement, and these coldplate 111 serial or parallel connections are connected so that set up heat transfer loop;
-in the downstream with respect to the heat transferred direction of heat transfer loop; The right side of Fig. 1 for example; Arrange single main thermal-arrest plate 110, and this main thermal-arrest plate 110 is communicated with this heat transfer loop fluid through the fluid passage in it, focus on this main thermal-arrest plate 110 to be used for the heat that heat transfer loop is entrained;
-colling end module 12 is provided; And with this colling end module 12 and heat collection and especially main thermal-arrest plate 110 hot links of this module 11 of transmission module 11; So that through heat exchange consumption by the heat in this main thermal-arrest plate 111; Wherein, colling end module 12 is connected with the detachable that is connected between the main thermal-arrest plate 110;
-when needed, change according to the difference of ambient temperature and to have the colling end module 12 of different abilities or power, so that the cooling effectiveness of this cooling system and power consumption reach optimum value.
Advantageously, colling end module 12 is arranged in the outside of electronic equipment 20.For example; When electronic equipment 20 is unit UPS; Can this colling end module 12 be arranged on the hull outside of this UPS; As shown in Figure 3, and make this colling end module 12 and in the inboard heat collection of UPS housing and transmit module 11 and especially set up hot link between the main thermal-arrest plate 110 of this module 11.
Like this; Because colling end module 12 is exposed in the external environment; Further improved cooling capacity on the one hand; Increased the design freedom of this colling end module 12 self on the other hand, and helped the miniaturization of electronic equipment, because no longer need keep spaces such as colling end module 12 necessary circulation of air paths at electronic equipment.Deposit at this cloth, can also additional cooling device be set, for example be used for to these colling end module 12 blows cold air with blower fan of making it to cool off etc. for colling end module 12.
Fig. 4 illustrates the electronic equipment 20 that is equipped with according to the cooling system of second embodiment of the invention.Embodiment shown in this embodiment and Fig. 1-2 is basic identical, and difference only is that the colling end module 12 among this second embodiment is the liquid-cooling type module.Specifically; In this second embodiment; Colling end module 12 specifically is configured to coldplate, and this coldplate can have the structure similar with aforesaid coldplate 111, that is to say; Have in this coldplate and be used to fluid passage that heat transport fluid is circulated, and realize heat radiation through circulating of this heat transport fluid.
When electronic equipment is the rack that comprises a plurality of electronic installations when especially being installed in the rack in the machine room, this second embodiment is with advantageous particularly.Because in this case, can the cooling water recirculation system of the colling end module 12 and machine room self of coldplate form be connected, thereby utilize this cooling water recirculation system to realize effectively cooling.Should be pointed out that in this execution mode, can cooling system of the present invention all be set for each electronic installation in the rack.
At last, it will be understood by those skilled in the art that the foregoing description can mutually combine.For example, colling end module 12 can not only comprise air cooling formula module section but also comprise the liquid-cooling type module section.
Should be pointed out that shown herely to go out and the preferred embodiment of explanation only is used to explain the present invention that do not breaking away under the situation of inventing spirit, those skilled in the art can make various changes or modification to concrete form of the present invention and details.
Claims (13)
1. cooling system that is used for electronic equipment; This electronic equipment comprises that at least one produces the unit of heat; This cooling system comprises heat collection and transmission module, and the unit hot link of this heat collection and transmission module and said generation heat is so that collect and transmit the heat that is produced by this unit, and this heat collection and transmission module comprise the heat transfer loop that contains mobile heat-carrying agent; It is characterized in that; This heat collection and transmission module also comprise main thermal-arrest plate, and this main thermal-arrest plate is arranged on being communicated with respect to the downstream of heat transferred direction and with this heat transfer loop fluid of heat transfer loop, so that collect the heat that is transmitted by this heat transfer loop; This cooling system also comprises the colling end module, and this colling end module and said main thermal-arrest plate detachable ground hot link are so that the heat in this main thermal-arrest plate that dissipates.
2. cooling system according to claim 1; It is characterized in that; This electronic equipment comprises pcb board, and the unit of said generation heat is the electronic device that is arranged on this pcb board, and said heat collection and transmission module are close to said electronic device and are arranged on this pcb board.
3. cooling system according to claim 2 is characterized in that, said electronic equipment is unit UPS or is the rack that comprises a plurality of UPS.
4. according to the described cooling system of one of claim 1-3, it is characterized in that said main thermal-arrest plate is the metallic plate with closed fluid channel, this metallic plate is communicated with said heat transfer loop fluid through its closed fluid channel.
5. cooling system according to claim 4 is characterized in that, said closed fluid channel comprises the conduit that is formed on this metallic plate inside.
6. cooling system according to claim 4 is characterized in that, said closed fluid channel comprises the pipeline on the side that deviates from the colling end module that is fixed on this metallic plate.
7. cooling system according to claim 1; It is characterized in that; Said heat transfer loop comprises the coldplate that each unit that produces heat of next-door neighbour is laid; These coldplates all have the closed fluid channel that is used to make heat-carrying agent to flow, and different coldplates is communicated with through the connection in series or in parallel with each other of its fluid passage and with said main thermal-arrest plate current body.
8. cooling system according to claim 7 is characterized in that different coldplates are connected in series through flexible pipe each other.
9. according to the described cooling system of one of claim 1-3, it is characterized in that said colling end module is arranged on the outside of this electronic equipment.
10. according to the described cooling system of one of claim 1-3, it is characterized in that said colling end module comprises fin and fan.
11., it is characterized in that said colling end module comprises coldplate according to the described cooling system of one of claim 1-3, this coldplate is constructed with the closed fluid passages that contains cooling fluid.
12. the method for a cooling electronic apparatus, this electronic equipment comprise that at least one produces the unit of heat, this method comprises:
-heat collection is provided and transmits module, and with this heat collection and transmit module and this electronic equipment each produce the unit hot link of heat, wherein this heat collection and transmission module comprise the heat transfer loop that contains mobile heat-carrying agent;
It is characterized in that, further comprising the steps of:
-be that this heat collection and transmission module are provided with main thermal-arrest plate, wherein, this main thermal-arrest plate is placed in the downstream with respect to the heat transferred direction of this heat transfer loop, and this main thermal-arrest plate is communicated with this heat transfer loop fluid; And
-the colling end module is provided, so that this colling end module and this main thermal-arrest plate detachable ground hot link.
13. method according to claim 12 is characterized in that, changes according to the difference of ambient temperature to have the colling end module of different cooling capacities or power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106084036A CN102573396A (en) | 2010-12-23 | 2010-12-23 | Cooling system and method for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106084036A CN102573396A (en) | 2010-12-23 | 2010-12-23 | Cooling system and method for electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN102573396A true CN102573396A (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010106084036A Pending CN102573396A (en) | 2010-12-23 | 2010-12-23 | Cooling system and method for electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109618530A (en) * | 2018-12-05 | 2019-04-12 | 西安石油大学 | A kind of cooling system of the fever electronic equipment of downhole tool |
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| US20080013283A1 (en) * | 2006-07-17 | 2008-01-17 | Gilbert Gary L | Mechanism for cooling electronic components |
| CN101115373A (en) * | 2006-07-25 | 2008-01-30 | 富士通株式会社 | Electronic apparatus including liquid cooling unit |
| CN101266513A (en) * | 2008-05-15 | 2008-09-17 | 华硕电脑股份有限公司 | Collapsible type radiation system |
| US20090225515A1 (en) * | 2008-03-10 | 2009-09-10 | James Hom | Thermal bus or junction for the removal of heat from electronic components |
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2010
- 2010-12-23 CN CN2010106084036A patent/CN102573396A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1293774A (en) * | 1998-03-16 | 2001-05-02 | 李穆炯 | System for cooling device in computer |
| CN1458816A (en) * | 2002-05-16 | 2003-11-26 | Abb瑞士有限公司 | Cooling element |
| CN1485906A (en) * | 2002-09-24 | 2004-03-31 | ������������ʽ���� | Electronic equipment |
| US20050068728A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
| US20080013283A1 (en) * | 2006-07-17 | 2008-01-17 | Gilbert Gary L | Mechanism for cooling electronic components |
| CN101115373A (en) * | 2006-07-25 | 2008-01-30 | 富士通株式会社 | Electronic apparatus including liquid cooling unit |
| US20090225515A1 (en) * | 2008-03-10 | 2009-09-10 | James Hom | Thermal bus or junction for the removal of heat from electronic components |
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| CN109618530A (en) * | 2018-12-05 | 2019-04-12 | 西安石油大学 | A kind of cooling system of the fever electronic equipment of downhole tool |
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Application publication date: 20120711 |