CN102573376B - Insulation structure used for fixing electronic element, electronic element and component - Google Patents
Insulation structure used for fixing electronic element, electronic element and component Download PDFInfo
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- CN102573376B CN102573376B CN201210047414.0A CN201210047414A CN102573376B CN 102573376 B CN102573376 B CN 102573376B CN 201210047414 A CN201210047414 A CN 201210047414A CN 102573376 B CN102573376 B CN 102573376B
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- insulating component
- thin portion
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- installing hole
- insulating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
The invention discloses an insulation structure used for fixing an electronic element, the electronic element and a component, relates to the field of communication, and has the advantages that the insulation distance can be extended, the insulation degree can be increased and the voltage withstanding grade can satisfy the requirement of insulation reinforcing. The insulation structure comprises a hollow first insulation member and a ring-shaped second insulation member, wherein the first insulation member comprises a thick part on the upper section and a thin part on the lower section; the outer diameter of the thick part is larger than the outer diameter of the thin part, and the inner diameter of the thick part is equal to the outer diameter of the thin part; the outer diameter size of the thin part satisfies the condition that when the thin part passes through a mounting hole of the electronic element, the outer surface of the thin part is attached to the mounting hole; the second insulation member is arranged in a mounting hole to be mounted on a heat dissipation plate; a mounting screw passes through the first insulation member; the thin part of the first insulation member passes through the mounting hole of the electronic element and the second insulation member; the second insulation member is jacketed at the thin part of the first insulation member; and the inner surface of the second insulation member is closely stuck to the outer surface of the thin part of the first insulation member. The insulation structure used for fixing the electronic element can improve the insulation effect of the electronic element.
Description
Technical field
The present invention relates to electronic circuit field, particularly relate to the assembly of a kind of insulation system for fixed electronic element, electronic component and electronic devices and components.
Background technology
Field-effect transistor (Metal Oxide Semiconductor, MOS) is electronic component conventional in a kind of Contemporary Industrial Design, is mainly used in realizing switching logic in Digital Logical Circuits, namely in logic 0 or 1.In actual applications, usually need to be fixed by metal-oxide-semiconductor by screw, at this moment, metal-oxide-semiconductor must insulate with screw.
As shown in Figure 1, in prior art, by screw 30 by metal-oxide-semiconductor 20 fixing circuit board, and circuit board is equipped with radiating insulating pad 40 and heating panel 50.Screw 30 is separated by insulation system 11 and metal-oxide-semiconductor 20, and the length of figure middle polyline A is metal-oxide-semiconductor 20 and the insulation distance of screw 30, uses this insulation system, and its voltage withstand class can reach the requirement of general insulation.
In said structure, at least there are the following problems:
Insulation distance is short, and dielectric strength is inadequate, and be easily short-circuited spark phenomenon, damages circuit board.
Summary of the invention
Technical problem to be solved by this invention is the assembly providing a kind of insulation system for fixed electronic element, electronic component and electronic devices and components, use insulation system fixed electronic element provided by the invention, can insulation distance be increased, make voltage withstand class reach the requirement of reinforced insulation.
For achieving the above object, embodiments of the invention adopt following technical scheme:
For an insulation system for fixed electronic element, described electronic component is provided with installing hole, described installing hole, for inserting mounting screw, comprising:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets, when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described second insulating component is coated at the thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the thin portion of described first insulating component.
The embodiment of the present invention also provides a kind of electronic component being provided with insulation system, and described electronic component is provided with installing hole, and described installing hole is for inserting mounting screw, and described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets, when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described electronic component is fixed on described heating panel, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
The embodiment of the present invention also provides a kind of assembly of electronic devices and components, comprise: electronic component, for the insulation system of fixing described electronic component and circuit board, described electronic component is provided with installing hole, described electronic component is fixed on described circuit board for inserting mounting screw by described installing hole, described circuit board is provided with heating panel, and described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets, when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
The embodiment of the present invention provides the assembly of a kind of insulation system for fixed electronic element, electronic component and electronic devices and components, compared to existing technology, increase the second insulating component being coated at the first insulating component newly, during for fixed electronic element, insulating wall thickness increases, insulation degree increases, and makes voltage withstand class reach the requirement of reinforced insulation.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of insulation system for fixing metal-oxide-semiconductor of prior art;
Fig. 2 is the schematic diagram one of the insulation system in the embodiment of the present invention;
Fig. 3 is the schematic diagram of the insulation system in the embodiment of the present invention for fixing metal-oxide-semiconductor;
Fig. 4 is the partial enlarged drawing of Fig. 3;
Fig. 5 is the schematic diagram two of the insulation system in the embodiment of the present invention;
Fig. 6 is the structural representation of the first insulating component in the embodiment of the present invention.
Description of reference numerals
11-insulation system, 12-first insulating component, the thick portion of 121-first insulating component,
The thin portion of 122-first insulating component, 13-second insulating component, 20-MOS manages,
30-screw, 40-radiating insulating pad, 50-heating panel.
Embodiment
The embodiment of the present invention provides the assembly of a kind of insulation system for fixed electronic element, electronic component and electronic devices and components, can extend insulation distance, increases insulation degree, makes voltage withstand class reach the requirement of reinforced insulation.
Below in conjunction with accompanying drawing, the embodiment of the present invention is described in detail.Embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Embodiment
The embodiment of the present invention provides a kind of insulation system of electronic component, and as shown in Figure 2, this insulation system comprises:
First insulating component 12 of hollow, comprise the thick portion 121 of epimere and the thin portion 122 of hypomere, the external diameter in thick portion 121 is greater than the external diameter in thin portion 122, the internal diameter in thick portion 121 is equal with the internal diameter in thin portion 122, the outside dimension in the thin portion 122 of the first insulating component 12 meets, when the installing hole of electronic component is passed in thin portion 122, the outer surface in thin portion 122 and the installing hole of electronic component are fitted;
Second insulating component 13 of ring-type, second insulating component 13 is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component 12 of hollow, installing hole and second insulating component 13 of electronic component pass in the thin portion 122 of the first insulating component 12, second insulating component 13 is coated at the thin portion 122 of the first insulating component 12, and the inner surface of the second insulating component 13 is close to the outer surface in the thin portion 122 of the first insulating component 12.
As shown in Figure 3, when insulation system in the present embodiment is used for fixed electronic element (metal-oxide-semiconductor 20), first on heating panel and circuit board, arrange installing hole, the external diameter of size and the second insulating component 13 is suitable, then is arranged in the installing hole on heating panel 50 by the second insulating component 13; Mounting screw 30 wears the first insulating component 12, through the installing hole on electronic component (metal-oxide-semiconductor 20) installation foot, again through the second insulating component 13 in installing hole on heating panel 50, metal-oxide-semiconductor 20 is fixed on heating panel 50, second insulating component 13 is coated at the thin portion 121 of the first insulating component 12, and the inner surface of the second insulating component 13 is close to the outer surface in the thin portion 121 of the first insulating component 12.
The external diameter size of the second insulating component 13 and circuit board and on heating panel on the size of installing hole relevant, unified design can be carried out as required in practical application.
During for fixed electronic element as metal-oxide-semiconductor, because the size of electronic component installing hole is fixed, the thickness be difficult to by increasing insulation system 11 increases insulation distance, the present embodiment is by increase by second insulating component 13, extend insulation distance, add insulation degree, make voltage withstand class reach the requirement of reinforced insulation.As shown in Figure 3, metal-oxide-semiconductor 20, through the first insulating component 12 and the second insulating component 13, is fixed by screw 30, and metal-oxide-semiconductor 20 is separated by radiating insulating pad 40 and heating panel 50.As shown in Figure 4, the thin portion of the first insulating component 12 is enclosed within outside the second insulating component 13 newly increased, and to ensure that the inner surface of the second insulating component 13 is close to the outer surface in the thin portion of the first insulating component 12 after installing, space can not be left, like this, although the insulation system of the present embodiment is in order to easy for installation, have employed split double layer design, but the second insulating component 13 is close on the first insulating component 12 after installing, reach the insulation effect same with global formation, insulation distance between metal-oxide-semiconductor 20 and screw 30 is the length of figure middle polyline B, so the insulation distance in the present embodiment, more than 2 times are added than prior art, voltage withstand class reaches the requirement of reinforced insulation.Insulation distance of the prior art is the length of broken line A.
Simultaneously; the inner surface of the second insulating component 13 is close to the outer surface in the thin portion of the first insulating component 12; so also can prevent from, because dust granule or other particulate are along the space between metal-oxide-semiconductor and the first insulating component 12, enter the place shown in broken line B and the insulation degree of metal-oxide-semiconductor being reduced.
The insulation system that the embodiment of the present invention provides, because the second insulating component of the first embedded insulating component and overcoat have employed split double layer design, during for fixed electronic element, easy for installation.
Wherein, the material of the second insulating component is electro-insulating rubber.In the present embodiment, second insulating component will be enclosed within the thin portion of the first insulating component outward, and will ensure that the second insulating component is close to the thin portion of the first insulating component, so the second insulating component is on the basis ensureing insulating properties, preferably select resilient insulating material, such as electro-insulating rubber etc.
Further, the internal diameter of the second insulating component equals the external diameter in thin portion, is the second insulating component in order to ensure to be enclosed within the first thin portion of insulating component equally, the outer surface in the first thin portion of insulating component can be close to, such insulation distance just can become broken line B, and insulation distance increases, and withstand voltage degree improves.
Alternatively, as shown in Figure 5, the height H of the second insulating component 13
2be more than or equal to the height H in thin portion 122
1.As seen from Figure 4, the height H of the second insulating component 13
2than the height H in thin portion 122
1larger, it is more that the length of broken line B and insulation distance increase.
Alternatively, as shown in Figure 6, the end outer, thin portion 122 of the first insulating component 12 is in introversive skewed, and the thin portion that can make the first insulating component is like this sharpening shape, is convenient to be set in the second insulating component.
When the insulation system of the present embodiment is used for fixed electronic element, to the thin portion 122 of the first insulating component 12 be inserted in the second insulating component 13, and the outer surface in thin portion 122 can be close in order to the second insulating component 13 ensureing to be enclosed within thin portion 122, the external diameter in thin portion 122 and the internal diameter of the second insulating component can not differ again too large, so just bring difficulty to installation, so the detailing of the first insulating component in the present embodiment becomes sharpening shape, be convenient to install.
For fixing metal-oxide-semiconductor in the embodiment of the present invention, but can find out in practical application and should be not limited thereto.
Insulation system in the embodiment of the present invention is used for fixed electronic element, due on the basis of original first insulating component, add the second insulating component, so the insulation distance of electronic component and screw or other ground structure parts increases, reinforced insulation intensity, avoid short circuit spark phenomenon, employ device or the equipment of the insulation system in the embodiment of the present invention, reliability improves.Further, because insulation distance increases, voltage withstand class reaches the requirement of reinforced insulation, and the degree of protection of device or equipment packages can correspondingly reduce, and holistic cost is declined.
In practice, the degree of protection of device or equipment packages can be reduced to IP3 or IP4.
The embodiment of the present invention also provides a kind of electronic component, and electronic component is provided with installing hole, and described installing hole is for inserting mounting screw, and electronic component is provided with insulation system, and described insulation system comprises:
First insulating component of hollow, comprise the thick portion of epimere and the thin portion of hypomere, the external diameter in thick portion is greater than the external diameter in thin portion, the internal diameter in thick portion is equal with the internal diameter in thin portion, the outside dimension in the thin portion of the first insulating component meets, when passing the installing hole of electronic component in thin portion, the outer surface in thin portion and the installing hole of electronic component are fitted;
The second insulating component in the form of a ring, be arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, installing hole and second insulating component of electronic component pass in the thin portion of the first insulating component, electronic component is fixed on heating panel, second insulating component is coated at the thin portion of the first insulating component, and the inner surface of the second insulating component is close to the outer surface in the thin portion of the first insulating component.
Wherein, alternatively, the internal diameter of the second insulating component equals the external diameter in thin portion.
Alternatively, the height of the second insulating component is more than or equal to the height in thin portion.
Alternatively, end outer, thin portion is in introversive skewed.
Alternatively, the material of the second insulating component is electro-insulating rubber.
Electronic component in the embodiment of the present invention, because the insulation system used is on the basis of original first insulating component, add the second insulating component, so the insulation distance of electronic component and screw or other ground structure parts increases, reinforced insulation intensity, avoid short circuit spark phenomenon, employ device or the equipment of electronic component in the embodiment of the present invention, reliability improves.Further, because insulation distance increases, voltage withstand class reaches the requirement of reinforced insulation, and the degree of protection of device or equipment packages can correspondingly reduce, and holistic cost is declined.
The embodiment of the present invention also provides a kind of assembly of electronic devices and components, comprise: electronic component, for the insulation system of fixing described electronic component and circuit board, described electronic component is provided with installing hole, described electronic component is fixed on described circuit board for inserting mounting screw by described installing hole, described circuit board is provided with heating panel, and described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets, when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
The electronic element assembly described in the present embodiment selected by electronic equipment, and insulation distance can be made to increase, and dielectric strength strengthens, avoid short circuit spark phenomenon, thus improving the reliability of electronic equipment, the degree of protection of equipment packages can correspondingly reduce simultaneously, and holistic cost declines.
It should be noted that, when not conflicting, the feature in the embodiment of the present invention can combination in any mutually.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should described be as the criterion with the protection range of claim.
Claims (11)
1. for an insulation system for fixed electronic element, described electronic component is provided with installing hole, described installing hole, for inserting mounting screw, is characterized in that, described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets: when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
2. insulation system according to claim 1, is characterized in that,
The internal diameter of described second insulating component equals the external diameter in described thin portion.
3. insulation system according to claim 1, is characterized in that,
The height of described second insulating component is more than or equal to the height in described thin portion.
4. insulation system according to claim 1, is characterized in that,
End outer, described thin portion is in introversive skewed.
5. the insulation system according to any one of Claims 1-4, is characterized in that,
The material of described second insulating component is electro-insulating rubber.
6. an electronic component, described electronic component is provided with installing hole, and described installing hole, for inserting mounting screw, is characterized in that, described electronic component is provided with insulation system, and described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets: when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described electronic component is fixed on described heating panel, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
7. electronic component according to claim 6, is characterized in that,
The internal diameter of described second insulating component equals the external diameter in described thin portion.
8. electronic component according to claim 6, is characterized in that,
The height of described second insulating component is more than or equal to the height in described thin portion.
9. electronic component according to claim 6, is characterized in that,
End outer, described thin portion is in introversive skewed.
10. the electronic component according to any one of claim 6 to 9, is characterized in that,
The material of described second insulating component is electro-insulating rubber.
The assembly of 11. 1 kinds of electronic devices and components, comprise: electronic component, for the insulation system of fixing described electronic component and circuit board, described electronic component is provided with installing hole, described electronic component is fixed on described circuit board for inserting mounting screw by described installing hole, described circuit board is provided with heating panel, it is characterized in that, described insulation system comprises:
First insulating component of hollow, described first insulating component comprises the thick portion of epimere and the thin portion of hypomere, the external diameter in described thick portion is greater than the external diameter in described thin portion, the internal diameter in described thick portion is equal with the internal diameter in described thin portion, the outside dimension in the described thin portion of described first insulating component meets: when passing the installing hole of described electronic component in described thin portion, the outer surface in described thin portion and the installing hole of described electronic component are fitted;
The second insulating component in the form of a ring, described second insulating component is arranged in installing hole to be installed on heating panel, mounting screw is through the first insulating component of described hollow, the installing hole of described electronic component and described second insulating component pass in the described thin portion of described first insulating component, described second insulating component is coated at the described thin portion of described first insulating component, and the inner surface of described second insulating component is close to the outer surface in the described thin portion of described first insulating component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047414.0A CN102573376B (en) | 2012-02-27 | 2012-02-27 | Insulation structure used for fixing electronic element, electronic element and component |
| PCT/CN2012/082385 WO2013127176A1 (en) | 2012-02-27 | 2012-09-28 | Insulation structure for fixing electronic element, electronic element and assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210047414.0A CN102573376B (en) | 2012-02-27 | 2012-02-27 | Insulation structure used for fixing electronic element, electronic element and component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102573376A CN102573376A (en) | 2012-07-11 |
| CN102573376B true CN102573376B (en) | 2015-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210047414.0A Active CN102573376B (en) | 2012-02-27 | 2012-02-27 | Insulation structure used for fixing electronic element, electronic element and component |
Country Status (2)
| Country | Link |
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| CN (1) | CN102573376B (en) |
| WO (1) | WO2013127176A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573376B (en) * | 2012-02-27 | 2015-01-21 | 华为技术有限公司 | Insulation structure used for fixing electronic element, electronic element and component |
| CN103532023A (en) * | 2013-10-13 | 2014-01-22 | 昆山顺康达工业产品设计有限公司 | Mounting plate of distribution box |
| DE102021127647A1 (en) | 2021-10-25 | 2023-04-27 | Rolls-Royce Deutschland Ltd & Co Kg | Circuit board and method for its manufacture |
| DE102021127641A1 (en) | 2021-10-25 | 2023-04-27 | Rolls-Royce Deutschland Ltd & Co Kg | Printed circuit board assembly and method for its manufacture |
| CN217336227U (en) * | 2021-12-28 | 2022-08-30 | 北京比特大陆科技有限公司 | Fastener, heat dissipation module and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500786A (en) * | 1993-10-08 | 1996-03-19 | Fujitsu Ltd. | Insulating element having height greater than heights of neighboring components |
| CN101136445A (en) * | 2006-08-30 | 2008-03-05 | 牟小波 | Ultra-high power illumination LED metallic packaging structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821847A (en) * | 1981-07-31 | 1983-02-08 | Nec Corp | Structure for mounting electronic part and manufacture thereof |
| CN201215766Y (en) * | 2008-05-26 | 2009-04-01 | 江苏东源电器集团股份有限公司 | Current mutual inductor having ring shaped metal sleeve |
| CN102573376B (en) * | 2012-02-27 | 2015-01-21 | 华为技术有限公司 | Insulation structure used for fixing electronic element, electronic element and component |
-
2012
- 2012-02-27 CN CN201210047414.0A patent/CN102573376B/en active Active
- 2012-09-28 WO PCT/CN2012/082385 patent/WO2013127176A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500786A (en) * | 1993-10-08 | 1996-03-19 | Fujitsu Ltd. | Insulating element having height greater than heights of neighboring components |
| CN101136445A (en) * | 2006-08-30 | 2008-03-05 | 牟小波 | Ultra-high power illumination LED metallic packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102573376A (en) | 2012-07-11 |
| WO2013127176A1 (en) | 2013-09-06 |
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Effective date of registration: 20171225 Address after: The 404600 Chongqing city Fengjie County Zhenping on Village 7 Patentee after: FENGJIE DONGYANG BUILDING MATERIALS CO., LTD. Address before: 510640 Guangdong City, Tianhe District Province, No. five, road, public education building, unit 371-1, unit 2401 Patentee before: Guangdong Gaohang Intellectual Property Operation Co., Ltd. |
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