CN102572665A - Condenser microphone structure appropriate for vacuum suction mounting, and mounting method thereof - Google Patents
Condenser microphone structure appropriate for vacuum suction mounting, and mounting method thereof Download PDFInfo
- Publication number
- CN102572665A CN102572665A CN2011101963807A CN201110196380A CN102572665A CN 102572665 A CN102572665 A CN 102572665A CN 2011101963807 A CN2011101963807 A CN 2011101963807A CN 201110196380 A CN201110196380 A CN 201110196380A CN 102572665 A CN102572665 A CN 102572665A
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- vacuum suction
- electret condencer
- condencer microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
The present invention relates to a condenser microphone structure appropriate for vacuum suction mounting, and a mounting method of the condenser microphone structure. In the condenser microphone according to the present invention, a housing provided with sound holes and a printed circuit board are combined to form an accommodation space used for installing parts, an air through hole is arranged on the printed circuit board, and the air through hole can be formed on any connecting terminal formed at an exposed surface of the printed circuit board and can be automatically sealed when the capacitance microphone is installed on a main circuit board of an electronic component. Because the air through hole is arranged on the printed circuit board, internal parts of the capacitance microphone are prevented from being damaged by attractive force when the internal parts are absorbed by an absorption module of a chip mounter. When the air through hole is arranged on a connecting terminal of the printed circuit board, the capacitance microphone is installed on a main circuit board of a handset etc. in a vacuum absorption manner, the connecting terminal is welded on the main circuit board in a reflow process, and the air through hole is automatically sealed, so the capacitance microphone structure can be easily realized with no additional air through hole sealing operation.
Description
Technical field
The present invention relates to Electret Condencer Microphone, more specifically, relate to and be suitable for Electret Condencer Microphone structure and the installation method thereof that vacuum suction is installed.
Background technology
Usually; With surface mounting assembly (SMD; When Surface Mount Device) being installed to the main circuit board of electronic product such as mobile phone, accepting to be attached to electronic unit from the feeding reel and install with behind the SMD parts on the carrier band (TAB, Tape Automated Bonding); Utilize the suction nozzle of chip mounter to carry out vacuum suction, be installed to the relevant position of main circuit board.Usually, chip mounter is by constituting like lower member: head assembly possesses the suction nozzle that electronic unit absorption is transplanted on the installation site of printed circuit board (PCB); Identification module, the adsorbed state that identification is adsorbed the electronic unit of handover promptly adsorbs posture; Electronic part feeder is used for various electronic units stably are supplied to head assembly.
Fig. 1 is the skeleton diagram of the notion of the expression main circuit board that is installed to electronic unit with the Electret Condencer Microphone of being installed on the suction nozzle of vacuum suction machine (chip mounter 30) the 31 attraction TAB carrier bands 10 20, and this TAB carrier band is wrapped on the spool.With reference to Fig. 1, Electret Condencer Microphone 20 is inserted in by certain intervals in the groove 10a of carrier band, and when suction nozzle 31 adsorbed, Electret Condencer Microphone 20 separated from the groove 10a of carrier band, is together transferred with suction nozzle 31, is installed to the installation site of main circuit board.At this moment; Suction nozzle 31 possesses the various sizes that internal diameter differs from one another; According to the size and dimension of the parts that will adsorb use suitable suction nozzle, still, as shown in Figure 2; Under the situation of the Electret Condencer Microphone 20 that is formed with sound hole 21a on the shell 21, suction nozzle 31 also adsorbs through the sound hole 21a of Electret Condencer Microphone 20.
But when the internal diameter of suction nozzle comprises sound hole as stated, have following problem: because of pull of vacuum, the inside of Electret Condencer Microphone becomes vacuum state, thus the impaired situation of generation part.That is, have following problem: because of the pull of vacuum of chip mounter, the diaphragm of Electret Condencer Microphone is torn or is impaired.
Summary of the invention
The present invention proposes in order to solve aforesaid problem, and its purpose is, the structure and the installation method thereof of the Electret Condencer Microphone that is suitable for the vacuum suction installation is provided.
For realizing aforesaid purpose; Be suitable in the Electret Condencer Microphone structure that vacuum suction installs of the present invention; Shell and the printed circuit board (PCB) that is formed with sound hole combines and is formed for the receiving space of installing component in the inner space, and goes up at said printed circuit board (PCB) (PCB) and to form air hole, so that when said shell is attracted because of vacuum suction; Extraneous air is inhaled into through said air hole, thereby can protect institute's mounted component in the said receiving space.
Said air hole can be formed on any in the splicing ear, and said splicing ear is formed on exposing on the face of said printed circuit board (PCB), and when said Electret Condencer Microphone was installed on the main circuit board of electronic unit, this air hole was sealed.
In addition, in order to realize aforesaid purpose, the micro electronmechanical Electret Condencer Microphone of one embodiment of the invention comprises: printed circuit board (PCB) is formed with air hole; Micro electronmechanical converter is installed on the one side of said printed circuit board (PCB); Application-specific IC (ASIC) is installed on the said printed circuit board (PCB) with the mode with said micro electronmechanical converter adjacency, drives said micro electronmechanical converter, and the input that receives the signal of conversion outputs to the splicing ear that exposes face; And shell, be formed with sound hole, combine with said printed circuit board (PCB), form the parts receiving space.
In addition, in order to realize aforesaid purpose, method of the present invention comprises: the Electret Condencer Microphone that will on printed circuit board (PCB), be formed with air hole is put into the step in the operation; The shell that is formed with sound hole of said Electret Condencer Microphone is carried out the step of vacuum suction; The Electret Condencer Microphone that carries out said vacuum suction is installed to the step on the main circuit board; And the step that seals said air hole, wherein, when said Electret Condencer Microphone during by vacuum suction, extraneous air is inhaled into through said air hole, thus institute's mounted component in the protection receiving space.
Comparatively ideally be, said air hole is formed on the splicing ear of said printed circuit board (PCB), and the step that seals said air hole is when said splicing ear is carried out reflow (welding), to realize automatically.
Electret Condencer Microphone of the present invention is formed with air hole on printed circuit board (PCB), can prevent that thus the internal part of Electret Condencer Microphone is impaired because of attraction when being adsorbed by the adsorption module of chip erector.Particularly; According to the present invention; When the splicing ear face of printed circuit board (PCB) formed air hole, Electret Condencer Microphone is installed on the main circuit board of mobile phone etc. through vacuum suction after, splicing ear was soldered to main circuit board in reflow process; Air hole also can be from movable sealing simultaneously, and need not other air hole sealing process just can simple realization.
Description of drawings
Fig. 1 is that the vacuum suction of expression common electrical capacitance-type microphone is installed the skeleton diagram of notion.
The vertical view of the contact-making surface of suction nozzle and Electret Condencer Microphone when Fig. 2 is the expression vacuum suction.
Fig. 3 is the partial cut stereogram of the Electret Condencer Microphone of one embodiment of the invention.
Fig. 4 is the face that exposes of printed circuit board (PCB) shown in Figure 3.
Fig. 5 is the sectional view of the Electret Condencer Microphone of one embodiment of the invention.
Fig. 6 is the precedence diagram that expression is installed to Electret Condencer Microphone of the present invention Overall Steps on the mobile phone.
Fig. 7 is the circuit diagram of common computer electricity Electret Condencer Microphone.
[description of reference numerals]
The 10-TAB carrier band
The 20-Electret Condencer Microphone
The 21-shell
The 21a-sound hole
The micro electronmechanical converter of 22-
The 23-application-specific IC
The 24-spun gold
The 26-printed circuit board (PCB)
The 27-encapsulant
The 28-air hole
The 30-chip mounter
The 31-suction nozzle
Embodiment
The technical problem that is realized by the present invention and embodiments of the invention will be clearer and more definite through the desirable embodiment of the present invention of following explanation.Following examples are only enumerated for the present invention is described, are not to be in order to limit scope of the present invention.
Fig. 3 is the partial cut stereogram of the Electret Condencer Microphone of one embodiment of the invention, and Fig. 4 is the vertical view that exposes face of expression printed circuit board (PCB) shown in Figure 3, and Fig. 5 is the sectional view of the Electret Condencer Microphone of one embodiment of the invention.In one embodiment of this invention, be that example describes with micro electronmechanical Electret Condencer Microphone.
As shown in Figure 3, micro electronmechanical Electret Condencer Microphone 20 of the present invention is by constituting like lower member: printed circuit board (PCB) 26 is formed with air hole 28; Micro electronmechanical (MEMS) converter 22 is installed on the one side of printed circuit board (PCB) 26; Application-specific IC 23 is installed on the said printed circuit board (PCB) 26 with the mode with said micro electronmechanical converter 22 adjacency, drives said micro electronmechanical converter 22, and the input that receives the signal of conversion outputs to the splicing ear of this face; Shell 21 is formed with sound hole 21a, combines with said printed circuit board (PCB) 26 and forms the parts receiving space.Comparatively ideally be, micro electronmechanical converter 22 is connected by spun gold 24 with application-specific IC 23, and application-specific IC 23 is by moulding 25, and shell 21 is bonding by encapsulant 27 with printed circuit board (PCB) 26.
As shown in Figure 4; In 26 expose and be formed with the main circuit board connection terminals that is used for mobile phone etc. on the face of printed circuit board (PCB); Like embodiments of the invention; Under the situation of micro electronmechanical Electret Condencer Microphone, splicing ear is made up of lead-out terminal 29-1, earth terminal 29-2,29-3 and Vdd power supply terminal 29-4.In addition; Prevent when carrying out vacuum suction that according to the present invention the impaired air hole of diaphragm 28 needs from being sealed after installation, therefore, in order to reduce flow chart; Comparatively ideal is that this air hole 28 is formed on any more than in the splicing ear; When on other positions of printed circuit board (PCB) 26 or shell 21, forming air hole, after installing, need the operation of sealing air through hole 28.
In addition; As shown in Figure 5; Being formed with on the printed circuit board (PCB) 26 under the situation of air hole 28 as stated, when suction nozzle 31 carries out vacuum suction, even sound hole 21a is through the boundary face of suction nozzle; Not only flow into (approach 1.) air through sound hole; Also flow into (approach 2.) air, thereby alleviate the air attraction (the inner vacuum state of Electret Condencer Microphone is eased) that attracted to the suction nozzle side from micro electronmechanical converter 22 inside, can prevent that the inner diaphragm of micro electronmechanical converter is impaired through air hole 28.
Fig. 6 is the precedence diagram that expression is installed to Electret Condencer Microphone of the present invention Overall Steps on the mobile phone.
With reference to Fig. 6; Electret Condencer Microphone 20 of the present invention has been formed with air hole 28 on printed circuit board (PCB) 26 in Electret Condencer Microphone manufacturing company, utilize this printed circuit board (PCB) to be assembled into micro-electro-mechanical microphone 20 after; Carry out after TAB installs, to mobile phone manufacturing company delivery (S1～S3).
After mobile phone manufacturing company puts into operation with the Electret Condencer Microphone of receiving 20, utilize chip mounter etc. to carry out vacuum suction and be installed on the main circuit board of mobile phone products, afterwards sealing air through hole (S4～S6).At this moment,, need not extra air hole sealing process, and splicing ear is soldered in reflow process, and air hole also can be by together sealing when air hole 28 is formed on any last time in the splicing ear.In addition, air hole 28 can also use other materials such as encapsulant or silicon, polymer, resin, band to stop up.
As shown in Figure 7; As stated; Be installed in micro electronmechanical (MEMS) Electret Condencer Microphone 20 on the mobile phone main circuit board according to the present invention; When applying the Vdd power supply through splicing ear 29-4, the voltage pump of application-specific IC (Voltage Pump) boosts to being used to drive the driving voltage of micro electronmechanical converter 22, between the backboard of micro electronmechanical converter 22 and diaphragm, applies driving voltage.In addition; The acoustic pressure that sound hole through shell 21 flow into micro electronmechanical converter 22 makes the diaphragm vibration of micro electronmechanical converter 22; Interval between backboard and the diaphragm is changed, and thereupon, electrostatic capacitance changes; After in amplifier (AMP), being enlarged into the signal of telecommunication, output to the main circuit board of mobile phone through lead-out terminal 29-1.
In the superincumbent explanation; The present invention is with reference to an embodiment shown in the drawings; With the mode that on PCB, is formed with air hole is that example is illustrated; But air hole also can be formed on the shell, so long as possess the Chang Shizhe in present technique field, should understand and can realize various distortion and other equal embodiment in view of the above.
Claims (7)
1. one kind is suitable for the Electret Condencer Microphone structure that vacuum suction is installed, and it is characterized in that:
Shell and the printed circuit board (PCB) that is formed with sound hole combines and is formed for the receiving space of installing component in the inner space; And on said shell or printed circuit board (PCB), form air hole; So that when said shell is attracted because of vacuum suction; Extraneous air is inhaled into through said air hole, thereby can protect institute's mounted component in the said receiving space.
2. the Electret Condencer Microphone structure that is suitable for the vacuum suction installation according to claim 1 is characterized in that:
Said air hole is formed on any in the splicing ear, and this splicing ear is formed on exposing on the face of said printed circuit board (PCB).
3. the Electret Condencer Microphone structure that is suitable for the vacuum suction installation according to claim 1 is characterized in that:
Be installed on the main circuit board of mobile phone products at said Electret Condencer Microphone after, seal said air hole through welding or by in encapsulant, silicon, resin, polymer, the band any one.
4. one kind is suitable for the micro electronmechanical Electret Condencer Microphone that vacuum suction is installed, and it is characterized in that, comprising:
Printed circuit board (PCB) is formed with air hole;
Micro electronmechanical converter is installed on the one side of said printed circuit board (PCB);
Application-specific IC is installed on the said printed circuit board (PCB) with the mode with said micro electronmechanical converter adjacency, drives said micro electronmechanical converter, and the input that receives the signal of conversion outputs to splicing ear; And
Shell is formed with sound hole, combines with said printed circuit board (PCB), forms the parts receiving space.
5. an installation method that is suitable for the Electret Condencer Microphone of vacuum suction installation is characterized in that, comprising:
The Electret Condencer Microphone that will on printed circuit board (PCB) or shell, be formed with air hole is put into the step of operation;
The shell that is formed with sound hole of said Electret Condencer Microphone is carried out the step of vacuum suction;
The Electret Condencer Microphone that carries out said vacuum suction is installed to the step on the main circuit board;
And the step that seals said air hole,
Wherein, when said Electret Condencer Microphone during by vacuum suction, extraneous air is inhaled into through said air hole, thus institute's mounted component in the protection receiving space.
6. the installation method that is suitable for the Electret Condencer Microphone of vacuum suction installation according to claim 5 is characterized in that:
Said air hole is formed on the splicing ear of said printed circuit board (PCB).
7. the installation method that is suitable for the Electret Condencer Microphone of vacuum suction installation according to claim 6 is characterized in that:
Automatically realize sealing the step of said air hole at the welded ends period of the day from 11 p.m. to 1 a.m, perhaps realize the step of the said air hole of sealing by in encapsulant, silicon, resin, polymer, the band any one.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0127777 | 2010-12-14 | ||
| KR1020100127777A KR101074732B1 (en) | 2010-12-14 | 2010-12-14 | Condenser microphone structure for vacuum suction mount and method of mounting the microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102572665A true CN102572665A (en) | 2012-07-11 |
Family
ID=45033022
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101963807A Pending CN102572665A (en) | 2010-12-14 | 2011-07-12 | Condenser microphone structure appropriate for vacuum suction mounting, and mounting method thereof |
| CN 201120246818 Expired - Fee Related CN202172491U (en) | 2010-12-14 | 2011-07-12 | Capacitance microphone structure suitable for vacuum adsorption installation and MEMS capacitance microphone |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120246818 Expired - Fee Related CN202172491U (en) | 2010-12-14 | 2011-07-12 | Capacitance microphone structure suitable for vacuum adsorption installation and MEMS capacitance microphone |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101074732B1 (en) |
| CN (2) | CN102572665A (en) |
| WO (1) | WO2012081772A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109641739A (en) * | 2016-07-27 | 2019-04-16 | 美商楼氏电子有限公司 | The encapsulation of MEMS (MEMS) device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101074732B1 (en) * | 2010-12-14 | 2011-10-18 | 주식회사 비에스이 | Condenser microphone structure for vacuum suction mount and method of mounting the microphone |
| CN104801587B (en) * | 2015-03-16 | 2016-09-14 | 浙江理工大学 | A kind of simple high-precision miaow head edge banding apparatus |
| CN106412791A (en) * | 2016-12-02 | 2017-02-15 | 东莞市纳声电子设备科技有限公司 | Earpiece loudspeaker automatic production device and production process thereof |
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| JP3017165B2 (en) * | 1998-05-07 | 2000-03-06 | 静岡日本電気株式会社 | Sounder |
| CN1717122A (en) * | 2004-06-28 | 2006-01-04 | 株式会社L&Lp | Directionality capacitance microphone of improved orientation property |
| CN1933680A (en) * | 2005-09-14 | 2007-03-21 | 宝星电子株式会社 | Condenser microphone and packaging method for the same |
| KR20080076779A (en) * | 2007-02-16 | 2008-08-20 | 야마하 가부시키가이샤 | Semiconductor device |
| EP2023658A2 (en) * | 2007-08-08 | 2009-02-11 | Yamaha Corporation | Semiconductor device, lead frame, and microphone package therefor |
| CN202172491U (en) * | 2010-12-14 | 2012-03-21 | 宝星电子股份有限公司 | Capacitance microphone structure suitable for vacuum adsorption installation and MEMS capacitance microphone |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3436205B2 (en) | 1999-02-22 | 2003-08-11 | 株式会社村田製作所 | Piezo acoustic components |
| KR20060119278A (en) * | 2005-05-19 | 2006-11-24 | 이승택 | Condenser microphone having internal air ventilation system |
| JP2007060285A (en) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Silicon microphone package |
| KR100737726B1 (en) * | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | Packaging structure of mems microphone |
| KR20080092101A (en) * | 2007-04-11 | 2008-10-15 | 주식회사 비에스이 | Condenser microphone |
-
2010
- 2010-12-14 KR KR1020100127777A patent/KR101074732B1/en not_active IP Right Cessation
-
2011
- 2011-04-13 WO PCT/KR2011/002618 patent/WO2012081772A1/en active Application Filing
- 2011-07-12 CN CN2011101963807A patent/CN102572665A/en active Pending
- 2011-07-12 CN CN 201120246818 patent/CN202172491U/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3017165B2 (en) * | 1998-05-07 | 2000-03-06 | 静岡日本電気株式会社 | Sounder |
| CN1717122A (en) * | 2004-06-28 | 2006-01-04 | 株式会社L&Lp | Directionality capacitance microphone of improved orientation property |
| CN1933680A (en) * | 2005-09-14 | 2007-03-21 | 宝星电子株式会社 | Condenser microphone and packaging method for the same |
| KR20080076779A (en) * | 2007-02-16 | 2008-08-20 | 야마하 가부시키가이샤 | Semiconductor device |
| EP2023658A2 (en) * | 2007-08-08 | 2009-02-11 | Yamaha Corporation | Semiconductor device, lead frame, and microphone package therefor |
| CN202172491U (en) * | 2010-12-14 | 2012-03-21 | 宝星电子股份有限公司 | Capacitance microphone structure suitable for vacuum adsorption installation and MEMS capacitance microphone |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109641739A (en) * | 2016-07-27 | 2019-04-16 | 美商楼氏电子有限公司 | The encapsulation of MEMS (MEMS) device |
| CN109641739B (en) * | 2016-07-27 | 2023-03-31 | 美商楼氏电子有限公司 | Micro-electro-mechanical system (MEMS) device packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012081772A1 (en) | 2012-06-21 |
| KR101074732B1 (en) | 2011-10-18 |
| CN202172491U (en) | 2012-03-21 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |