CN102547102B - Camera equipment and image sensor replacing method - Google Patents
Camera equipment and image sensor replacing method Download PDFInfo
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- CN102547102B CN102547102B CN201010609288.4A CN201010609288A CN102547102B CN 102547102 B CN102547102 B CN 102547102B CN 201010609288 A CN201010609288 A CN 201010609288A CN 102547102 B CN102547102 B CN 102547102B
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Abstract
The invention provides camera equipment comprising a main board system and an image sensing system. The main board system comprises a system chip and the image sensing system comprises an image sensor, a bus switch and a level switch. The bus switch is respectively connected with the system chip and the image sensor; the switch-on and switch-off of the bus switch are respectively corresponding to those of the image sensor and the system chip. One end of the level switch is grounded and the other end of the level switch is connected with the system chip; the closing and opening of the level switch are respectively corresponding to levels, which are received by the system ship and comprise a low level and a high level, of the level switch; and the switch-off and switch-on states of the system chip and the image sensor are controlled by the system chip according to the high level and low level of the level switch. The invention further relates to an image sensor replacing method.
Description
Technical field
The present invention relates to a kind of camera device, relate in particular to the image sensor replacing method of the conveniently replaced camera device of a kind of image sensor and this camera device.
Background technology
Current monitoring product, as have image sensor (as CMOS(Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductors (CMOS))) webcam machine equipment, comprises a main board system and an image sensing system.This main board system comprises the chip of the high prices such as network chip, System on Chip/SoC (as SOC compression chip H.264/MPEG-4), system power supply (system power) chip; And the chip mainly comprising in this image sensing system is image sensor (as CMOS chip).For obtaining better monitoring effect, camera device need to constantly be upgraded, and the upgrading of camera device mainly concentrates on the upgrading of image sensor, and chip on main board system substantially can not change in the escalation process of camera device.
In prior art, the replacing method of the image sensor in the camera device of connecting monitoring is: first, and by the energising circuit power-off of whole connection camera device; Then, change the operation of image sensor; Finally, the energising circuit of this camera device is communicated with again.Yet this image sensor replacing method upgrade cost is higher, the replacing time is longer.
Summary of the invention
In view of this, provide a kind of camera device and the image sensor replacing method that image sensor replacing method is easy.
A camera device, comprises a main board system and an image sensing system.This main board system comprises a System on Chip/SoC, and this System on Chip/SoC controls and process image for system.This image sensing system comprises an image sensor, an electricallyerasable ROM (EEROM), a bus switch and a level switch.This image sensor is for sensing image.The setup parameter information of this electricallyerasable ROM (EEROM) for storing this image sensor.This bus switch is connected respectively with this System on Chip/SoC and this image sensor, the connection of this bus switch with disconnect respectively should image sensor and being connected and disconnection of this System on Chip/SoC.This electricallyerasable ROM (EEROM) is connected with this System on Chip/SoC by this bus switch, and the connection of this bus switch and disconnection are respectively to should electricallyerasable ROM (EEROM) and being communicated with and disconnection of this System on Chip/SoC.One end ground connection of this level switch, the other end is connected with this System on Chip/SoC, the closure of this level switch is low level and high level with the level of opening respectively this should System on Chip/SoC received level switch, this System on Chip/SoC is disconnection and connection according to the state of the high level of this level switch and this bus switch of low level control, and then controls disconnection and the connected state of this System on Chip/SoC and this image sensor.
A kind of image sensor replacing method of camera device as above, comprise the following steps: adjust this level switch, make this System on Chip/SoC send open command to this bus switch, this bus switch is disconnected, and then disconnect being connected of this System on Chip/SoC and this image sensor; Remove image sensor to be replaced, and install image sensor to be installed; Adjust this level switch, make this System on Chip/SoC send connection instruction to this bus switch, this bus switch is communicated with, thereby make this System on Chip/SoC be communicated with also move instruction, in this, image sensor has been installed, this has been installed image sensor and to this System on Chip/SoC, has transmitted image information according to the instruction of this System on Chip/SoC, and now image sensor is changed complete.
With respect to prior art, this camera device and image sensor replacing method only need be adjusted this level switch, i.e. replaceable upgrading image sensor, and without by whole camera device power-off; In addition, after image sensor is changed, only need again adjust this level switch and can make camera device proceed camera monitoring action.Therefore, the image sensor replacing method of this camera device can realize real-time hot plug and change, and the replacing time is short, can reduce upgrade cost, can not exert an influence to sharing other image sensing system of main board system simultaneously.
Accompanying drawing explanation
Fig. 1 is the Organization Chart of embodiment of the present invention camera device.
Fig. 2 is that the image sensor of the camera device of Fig. 1 is changed flow chart.
Main element symbol description
Camera device 100
Main board system 10
Image sensing system 12
System on Chip/SoC 102
Audio encoding chip 104
ICR control circuit 106
Ethernet physical layer 108
Network connector 110
Camera lens module 122
Image sensor 124
Microphone 126
Two optical-filter switchers 128
Bus switch 130
Level switch S1
Memory 132
YUV bus 134
I2C bus 136
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Refer to Fig. 1, first embodiment of the invention provides a kind of camera device 100, and this camera device 100 comprises a main board system 10 and an image sensing system 12.In the present embodiment, this camera device 100 is for monitoring product.
This main board system 10 comprises a System on Chip/SoC (system-on-chip, SOC) 102, one audio encoding chip (audio code) 104, a pair of optical-filter switcher (Infrared Cut Removable, ICR) control circuit 106, an ethernet physical layer (Ethernet PHY) 108 and one network connector 110.
This System on Chip/SoC 102 has been integrated image processing, control circuit and network function, and in the present embodiment, this System on Chip/SoC 102 is the hardware compilation code chip of multi-protocols such as supporting H.264/MPEG-4; In addition, this System on Chip/SoC is also for carrying out system control to camera device 100.
This audio encoding chip 104 is connected with this System on Chip/SoC 102, for audio frequency is encoded, and the coded data of audio frequency is transmitted in to this System on Chip/SoC 102.
Two optical-filter switchers (Infrared Cut Removable of this ICR control circuit 106 and System on Chip/SoC 102 and image sensing system 12, ICR, two optical-filter switchers 128 as shown in Figure 1) be connected respectively, the instruction of sending for receiving system chip 102, and produce and to control signal to two optical-filter switchers 128, to control this pair of optical-filter switcher 128, carry out the switching of filter.
This ethernet physical layer 108 is connected with this System on Chip/SoC 102, and this network connector 110 is connected with this ethernet physical layer 108.This network connector 110 is that as RJ-45 connector (claiming again crystal head), this System on Chip/SoC 102 is connected in this network connector 110 by ethernet physical layer 108, and then is connected in Internet or local area network (LAN) for connecting the connector of Internet or local area network (LAN).The main purpose of these System on Chip/SoC 102 networkings, for connecting the monitoring server (not shown) of monitor terminal, makes monitor staff can observe the image that this camera device 100 is absorbed.
This image sensing system 12 comprises a camera lens module 122, an image sensor 124, a microphone 126 and a pair of optical-filter switcher 128.
This camera lens module 122 is connected with this image sensor 124 and optical coupled, and this camera lens module 122 carries out sensing and processes for obtaining monitoring image and transferring to this image sensor 124.
This microphone 126 is for the audio-frequency information in acquisition monitoring region, and the audio encoding chip 104 that the audio-frequency information collecting transfers to main board system 10 is carried out to audio coding, and the audio-frequency information of this process coding transfers to this System on Chip/SoC 102 and processes subsequently.
This pair of optical-filter switcher 128 comprises cutoff filter and the visible region interferometric filter that can mutually switch.On daytime, two optical-filter switchers 128 switch to cutoff filter, and all infrared lights are filtered to obtain distortionless colour picture; In evening, ICR128 switches to visible region interferometric filter, to eliminate other, disturbs veiling glare, makes image sensor 124 can access image clearly.This pair of optical-filter switcher 128 is connected with the ICR control circuit 106 of main board system 10, to collect the switching command that ICR control circuit 106 sends to it, filter switched.
This image sensing system 12 further comprises a level switch S1, a bus switch (bus switch) 130 and one electricallyerasable ROM (EEROM) (electrically erasable programmable read-only memory, EEPROM) 132.
One end ground connection of this level switch S1, the other end is connected with this System on Chip/SoC 102, and level switch S1 is normally closed switch, and, when image sensor 124 normal operation, level switch S1 is in closure state, and the two ends of level switch S1 conduct.The level signal of the received level switch S1 of System on Chip/SoC 102 is defined as to Detect_IO, when image sensor 124 normal operation, because level switch S1 ground connection and closure, therefore Detect_IO is low level, i.e. Detect_IO=Low.When level switch, S1 opens, and when the two ends of level switch S1 disconnect, Detect_IO is high level, i.e. Detect_IO=High.This level switch S1 can be designed to a button, and pressing button is closure and the open mode of capable of regulating level switch S1.
This bus switch 130 is connected respectively with System on Chip/SoC 102, image sensor 124 and memory 132, when Detect_IO=Low, System on Chip/SoC 102 sends connection instruction to bus switch 130, make bus switch 130 in connected state, now, bus switch 130 is communicated with image sensor 124 and memory 132 respectively with System on Chip/SoC 102.In the present embodiment, this image sensor 124 completes by the component vide bus (YUV bus) 134 being connected between image sensor 124 and bus switch 130 and between bus switch 130 and System on Chip/SoC 102 to these System on Chip/SoC 102 transmission video signal systems; The twin wire universal serial bus (I2C bus) 136 that memory 132 is connected with the signal of System on Chip/SoC 102 by being connected between memory 132 and bus switch 130 and between bus switch 130 and System on Chip/SoC 102 completes; In addition, between bus switch 130 and image sensor 124, further by I2C bus 136, be connected, System on Chip/SoC 102 by between System on Chip/SoC 102 and bus switch 130 and the I2C bus 136 between bus switch 130 and image sensor 124 to image sensor 124 transmission instructions.
This memory 132 is connected with this image sensor 124, for storing the setup parameter information of this image sensor 124.
When Detect_IO=Low, be that level switch S1 is when closure state, System on Chip/SoC 102 sends connection instruction to bus switch 130, make bus switch 130 in connected state, System on Chip/SoC 102 is communicated with and obtains setup parameter from memory 132 with this memory 132, then System on Chip/SoC 102 sends to image sensor 124 instruction producing according to this parameter information by I2C bus 136, makes image sensor 124 that monitoring video information is transferred to this System on Chip/SoC 102 by YUV bus 134 and compresses processing.Video information after System on Chip/SoC 102 is processed transfers to monitoring server by ethernet physical layer 108 and network connector 110, and is presented at (not shown) on monitoring monitor.
When Detect_IO=High, be that level switch S1 is when open mode, System on Chip/SoC 102 sends open command to bus switch 130, bus switch 130 disconnects, it is image sensor 124 and memory 132 and the disconnection that is connected of System on Chip/SoC 102, now, the camera function of camera device 100 suspends, and can change image sensor 124 and in the action of the new parameter information of the interior storage of memory 132.After changing, level switch S1 is adjusted into closure state again, proceed camera monitoring action.
In the present embodiment, only level switch S1 need be adjusted to (as pressing button) be open mode, i.e. replaceable upgrading image sensor 124, and without by whole camera device 100 power-off; After image sensor 124 is changed, only need again level switch S1 be adjusted to (as again pressed button) is closure state, can make camera device 100 proceed camera monitoring action.So the image sensor replacing method of the camera device 100 of the present embodiment can realize real-time hot plug and change, the replacing time is short, can reduce upgrade cost, can not exert an influence to sharing other image sensing system of main board system simultaneously.
Be appreciated that, this level switch S1 can also be normal open switch, be that level switch S1 is while being open mode, this System on Chip/SoC 102 is connected respectively with this image sensor 124 and memory 132, when level switch S1 is closure state, this System on Chip/SoC 102 disconnects respectively mutually with this image sensor 124 and memory 132.
See also Fig. 1 and Fig. 2, second embodiment of the invention provides a kind of image sensor replacing method, and for the image sensor of the camera device of the first embodiment 100 124 is changed, Fig. 2 is for changing the flow chart of image sensor 124.This image sensor replacing method comprises the following steps:
First, observing level switch S1 and be no is open mode (S201), when level switch, S1 does not open, and level switch S1 is closure state, now, Detect_IO=Low, the level signal that is the received level switch S1 of System on Chip/SoC 102 is low level (S202), now, needs to adjust level switch S1 state (as push switch button), make level switch S1 in open mode (S203), continue step S201.When level switch S1 is open mode, now, Detect_IO=High, the level signal that is the received level switch S1 of System on Chip/SoC 102 is high level (S204), now, System on Chip/SoC 102 sends open command to bus switch 130, makes bus switch 130 disconnect (S205), be parting system chip 102 and being connected of image sensor 124 and memory 132, and make YUV bus 134 and I2C bus 136 be discharged (S206).
Secondly, by before image sensor 124(upgrading to be replaced) from image sensing system 12, remove (207), and image sensor to be installed (after upgrading) is installed on to (S208) in image sensing system 12.
Finally, adjusting level switch S1 is closure state (S209), now, Detect_IO=Low, the level signal that is the received level switch S1 of System on Chip/SoC 102 is low level (S210), System on Chip/SoC 102 sends and is communicated with instruction to bus switch 130, make bus switch 130 in connected state (S211), System on Chip/SoC 102 is communicated with this memory 132 and obtains setup parameter information (S212) from memory 132, then System on Chip/SoC 102 sends to image sensor 124 instruction (S213) producing according to this parameter information by I2C bus 136, make image sensor 124 that monitoring video information is transferred to this System on Chip/SoC 102 by YUV bus 134 and compress processing (S214).Video information after System on Chip/SoC 102 is processed transfers to monitoring server by ethernet physical layer 108 and network connector 110, and is presented on monitor.So far, image sensor is changed complete.
In addition, those skilled in the art can also do other and change in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (9)
1. a camera device, comprising:
One main board system, comprises a System on Chip/SoC, and this System on Chip/SoC controls and process image for system; And
One image sensing system, comprising:
One image sensor, this image sensor is for sensing image; It is characterized in that,
This image sensing system further comprises:
One electricallyerasable ROM (EEROM), the setup parameter information of this electricallyerasable ROM (EEROM) for storing this image sensor,
One bus switch, this bus switch is connected respectively with this System on Chip/SoC and this image sensor, the connection of this bus switch with disconnect respectively should image sensor and being connected and disconnection of this System on Chip/SoC, this electricallyerasable ROM (EEROM) is connected with this System on Chip/SoC by this bus switch, the connection of this bus switch with disconnect respectively should electricallyerasable ROM (EEROM) and being communicated with and disconnection of this System on Chip/SoC, and
One level switch, one end ground connection of this level switch, the other end is connected with this System on Chip/SoC, the closure of this level switch is low level and high level with the level of opening respectively this should System on Chip/SoC received level switch, this System on Chip/SoC is disconnection and connection according to the state of the high level of this level switch and this bus switch of low level control, and then controls disconnection and the connected state of this System on Chip/SoC and this image sensor.
2. camera device as claimed in claim 1, it is characterized in that, between this bus switch and this electricallyerasable ROM (EEROM) and this System on Chip/SoC, be connected with respectively I2C bus, this System on Chip/SoC reads the setup parameter information of this image sensor in this electricallyerasable ROM (EEROM) by this I2C bus.
3. camera device as claimed in claim 2, wherein, between this image sensor and this bus switch, be connected with I2C bus, this System on Chip/SoC sends the instruction producing according to this setup parameter information to this image sensor by the I2C bus between this image sensor and this bus switch.
4. camera device as claimed in claim 3, is characterized in that, between this bus switch and this image sensor and this System on Chip/SoC, is connected with respectively YUV bus, and this image sensor passes through this YUV bus to this System on Chip/SoC transmission of video information.
5. camera device as claimed in claim 1, it is characterized in that, this image sensing system further comprises a pair of optical-filter switcher, this pair of optical-filter switcher comprises cutoff filter and the visible region interferometric filter that can mutually switch, this main board system further comprises a pair of optical-filter switcher control circuit, this pair of optical-filter switcher control circuit is connected respectively with this pair of optical-filter switcher with this System on Chip/SoC, this pair of optical-filter switcher is for receiving the switching command of this System on Chip/SoC and controlling the mutual switching that this pair of optical-filter switcher carries out filter.
6. camera device as claimed in claim 1, it is characterized in that, this main board system further comprises an ethernet physical layer being connected with this System on Chip/SoC, and the network connector being connected with this ethernet physical layer, this ethernet physical layer and network connector are for being connected this System on Chip/SoC with local area network (LAN) or Internet.
7. the image sensor replacing method of a camera device as claimed in claim 1, comprises the following steps:
Adjust this level switch, make this System on Chip/SoC send open command to this bus switch, this bus switch is disconnected, and then disconnect being connected of this System on Chip/SoC and this image sensor;
Remove image sensor to be replaced, and install image sensor to be installed;
Adjust this level switch, make this System on Chip/SoC send connection instruction to this bus switch, this bus switch is communicated with, thereby make this System on Chip/SoC be communicated with also move instruction, in this, image sensor has been installed, this has been installed image sensor and to this System on Chip/SoC, has transmitted image information according to the instruction of this System on Chip/SoC, and now image sensor is changed complete.
8. image sensor replacing method as claimed in claim 7, it is characterized in that, image sensing system further comprises an electricallyerasable ROM (EEROM), the setup parameter information of this electricallyerasable ROM (EEROM) for storing this image sensor, this electricallyerasable ROM (EEROM) is connected with this System on Chip/SoC by this bus switch, when this bus switch disconnects, this electricallyerasable ROM (EEROM) and this System on Chip/SoC disconnect, when this bus switch is communicated with, this electricallyerasable ROM (EEROM) is communicated with this System on Chip/SoC, this System on Chip/SoC reads the setup parameter information of the image sensor in this electricallyerasable ROM (EEROM) and to this image sensor, transmits the instruction producing according to this setup parameter information, make this image sensor to this System on Chip/SoC transmission image information.
9. image sensor replacing method as claimed in claim 7, is characterized in that, when adjusting this level switch and be open mode, this System on Chip/SoC receives this level switch to be high level and to send open command to this bus switch; When adjusting this level switch and be closure state, this System on Chip/SoC receives this level switch to be low level and to send connection instruction to this bus switch.
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| CN108200322A (en) * | 2018-02-01 | 2018-06-22 | 天津天地伟业信息系统集成有限公司 | A kind of empty burnt solution of video camera camera lens under white-black pattern |
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| CN1701598A (en) * | 2003-05-30 | 2005-11-23 | 索尼株式会社 | Image pickup device and image pickup method |
| CN201039335Y (en) * | 2007-04-29 | 2008-03-19 | 青岛海信电器股份有限公司 | Power supply circuit and TV set for multi-channel voltage switch output |
| CN201252599Y (en) * | 2008-08-07 | 2009-06-03 | 无锡亿普得科技有限公司 | Network camera of intelligent on-off CCD power supply |
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| US20060098729A1 (en) * | 2004-11-09 | 2006-05-11 | Lien-Chieh Shen | Smart image processing CCTV camera device and method for operating same |
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| US4437111A (en) * | 1981-01-16 | 1984-03-13 | Matsushita Electric Industrial Co., Ltd. | Color television camera |
| CN1701598A (en) * | 2003-05-30 | 2005-11-23 | 索尼株式会社 | Image pickup device and image pickup method |
| CN201039335Y (en) * | 2007-04-29 | 2008-03-19 | 青岛海信电器股份有限公司 | Power supply circuit and TV set for multi-channel voltage switch output |
| CN201252599Y (en) * | 2008-08-07 | 2009-06-03 | 无锡亿普得科技有限公司 | Network camera of intelligent on-off CCD power supply |
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