CN102544689B - Electronic installation - Google Patents
Electronic installation Download PDFInfo
- Publication number
- CN102544689B CN102544689B CN201010609175.4A CN201010609175A CN102544689B CN 102544689 B CN102544689 B CN 102544689B CN 201010609175 A CN201010609175 A CN 201010609175A CN 102544689 B CN102544689 B CN 102544689B
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- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- antenna portion
- main antenna
- electron element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A kind of electronic installation, comprise multilayer circuit board, main antenna portion and metal electron element, described multilayer circuit board comprises top layer and ground plane, described multilayer circuit board is provided with at least one signal lead being electrically connected to this metal electron element, described main antenna portion is arranged at the top layer of this multilayer circuit board and is electrically connected to this ground plane, this metal electron element is arranged at this top layer and is soldered in this main antenna portion, and this metal electron element is by this main antenna portion ground connection.The main antenna portion of described electronic installation has good radiation efficiency.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of by the electronic installation of metal electron element design on antenna.
Background technology
General when Antenna Design, certain design space must be had, and metal electron element can not be had in this space, otherwise the radiation efficiency of antenna can be affected.Especially, when described metal electron element will be connected to systematically by the wiring route ground connection on circuit board, the radiation efficiency of the antenna near it can more greatly be affected.Therefore Traditional mobility phone is when designing antenna, is by Antenna Design for exposing form, ensure antenna surrounding can not affect by metal electron element.In order to exquisite good looking appearance, present antenna has designed in mobile phone inner, and the design of mobile phone is towards light, thin, short, little trend development, and this will certainly increase the probability of metal electron element near antenna.
When carrying out antenna and circuit board wiring design, if when the situation in Antenna Design region is just in time dropped in generation metal electron element installation site on circuit boards, a kind of solution is other region metal electron element being moved to circuit board, the change of this metal electron element wiring route on circuit boards will certainly be caused like this, cause the difficulty in design.Another solution is by Antenna Design in the board area away from this metal electron element, but, change the mounting position of antenna, then easily make the radiation efficiency of antenna not good and frequency range can narrow.
Summary of the invention
In view of this, be necessary to provide a kind of and metal electron element design can be ensured that antenna has the electronic installation of better radiation efficiency on antenna.
A kind of electronic installation, comprise multilayer circuit board, main antenna portion and metal electron element, described multilayer circuit board comprises top layer and ground plane, described multilayer circuit board is provided with at least one signal lead being electrically connected to this metal electron element, described main antenna portion is arranged at the top layer of this multilayer circuit board and is electrically connected to this ground plane, this metal electron element is arranged at this top layer and is soldered in this main antenna portion, and this metal electron element is by this main antenna portion ground connection.
Described electronic installation is by being directly welded in described main antenna portion by metal electron element, make this metal electron element by this main antenna portion ground connection, the impact that the ground plane that the earth terminal of this metal electron element can be avoided thus to be directly electrically connected to multilayer circuit board brings to the radiance in described main antenna portion.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the electronic installation of better embodiment of the present invention.
Fig. 2 is the top layer floor map of the multilayer circuit board of electronic installation shown in Fig. 1.
Fig. 3 is the second internal layer floor map of the multilayer circuit board of electronic installation shown in Fig. 1.
Fig. 4 is the first internal layer floor map of the multilayer circuit board of electronic installation shown in Fig. 1.
Main element symbol description
Electronic installation 10
Multilayer circuit board 11
Top layer 111
First internal layer 113
Metal isolation strip 1131
Second internal layer 115
Ground plane 116
Via hole 117
Main antenna portion 13
Auxiliary antenna part 15
Metal electron element 17
Signal lead 19
Embodiment
Refer to Fig. 1, the electronic installation 10 of better embodiment of the present invention comprises multilayer circuit board 11, antenna (figure does not mark), metal electron element 17 and is electrically connected to the printed circuit (figure does not mark) of this metal electron element 17.Described antenna comprises main antenna portion 13 and auxiliary antenna part 15.Described main antenna portion 13, auxiliary antenna part 15, metal electron element 17 and printed circuit are all arranged on this multilayer circuit board 11.
Described multilayer circuit board 11 can be four-layer circuit board, 6-layer circuit board or 8-layer printed circuit board etc.Described multilayer circuit board 11 comprises top layer 111, first internal layer 113, second internal layer 115, ground plane 116 and the multiple via hole 117 that stack successively and be printed in together.Described multiple via hole 117 is communicated with this top layer 111, first internal layer 113 and the second internal layer 115, for realizing electrically conducting between this top layer 111, first internal layer 113 and the second internal layer 115.
Refer to Fig. 2, described main antenna portion 13 is arranged on the top layer 111 of this multilayer circuit board 11.Described main antenna portion 13 can be pico farad (PIFA) antenna or coil antenna.In this better embodiment, described main antenna portion 13 is PIFA antenna.The earth point (not shown) in described main antenna portion 13 is electrically connected to the ground plane of this multilayer circuit board 11 by via hole 117 or signal lead (not shown) etc., realize the ground connection of this antenna.
Described metal electron element 17 is arranged at the top layer of this multilayer circuit board 11 and is welded in described main antenna portion 13, the earth terminal of this metal electron element 17 passes through this main antenna portion 13 ground connection, the impact that the ground plane that the earth terminal of this metal electron element 17 can be avoided thus to be directly electrically connected to multilayer circuit board 11 brings to the radiance in described main antenna portion 13.
Refer to Fig. 3, described auxiliary antenna part 15 is arranged at the second internal layer 115 of this multilayer circuit board 11.Described auxiliary antenna part 15 is layer of metal, and it is electrically connected to this main antenna portion 13 by described multiple via hole 117.
Refer to Fig. 4, described printed circuit is arranged at the first internal layer 113 of this multilayer circuit board 11.This printed circuit is used for for described multilayer circuit board 11 transmission of electric signals.This printed circuit comprises at least one signal lead 19.Described signal lead 19 is electrically connected to metal electron element 17 by via hole 117.Described first internal layer 113 arranges a strip metal isolation strip 1131 respectively in the both sides of signal lead described in this 19.So, described signal lead 19 is contained in the space that described two strip metal isolation strip 1131, main antenna portion 13 and auxiliary antenna part 15 surround, and is electrically connected by described multiple via hole 117 between each described metal isolation strip 1131 and described main antenna portion 13 and auxiliary antenna part 15.When first internal layer 113 or other conductive layer of this multilayer circuit board 11 produce noise, described noise is then sent to main antenna portion 13 by described auxiliary antenna part 15 or metal isolation strip 1131, again by main antenna portion 13 ground connection, so, described noise can be prevented to be sent to metal electron element 17 by described signal lead 19, and this metal electron element 17 is impacted.
Refer to table 1, table 1 for be arranged at when described metal electron element 17 this main antenna portion 13 neighbouring and this metal electron element 17 is directly electrically connected to the ground plane of multilayer circuit board 11 time, the return loss of this main antenna portion 13 recorded on 2400MHz to 2500MHz frequency band and radiation efficiency value.As can be seen from Table 1, this main antenna portion 13 radiation efficiency when 2460MHz is the highest, but also only has 22.8%, and return loss value is also high to-6.4dB, does not reach designing requirement far away.
Table 1
| Frequency (MHz) | 2400 | 2420 | 2440 | 2450 | 2460 | 2470 | 2480 | 2500 |
| Return loss (dB) | -8.6 | -7.5 | -6.8 | -6.6 | -6.4 | -6.8 | -7.0 | -7.8 |
| Radiation efficiency (%) | 13.8 | 17.8 | 20.7 | 21.9 | 22.8 | 20.9 | 19.9 | 16.6 |
Refer to table 2, table 2 is in better embodiment of the present invention, when described metal electron element 17 to be directly welded in this main antenna portion 13 and this metal electron element 17 by this main antenna portion 13 ground connection time, the return loss of this antenna recorded on 2400MHz to 2500MHz frequency band and radiation efficiency value.As can be seen from Table 2, the radiation efficiency of this antenna when 2460MHz reaches 82.9%, and return loss value is also low to moderate-0.8dB, has good radiation efficiency.
Table 2
| Frequency (MHz) | 2400 | 2420 | 2440 | 2450 | 2460 | 2470 | 2480 | 2500 |
| Return loss (dB) | -1.3 | -10. | -1.0 | -0.9 | -0.8 | -1.0 | -1.1 | -1.2 |
| Radiation efficiency (%) | 74.9 | 78.7 | 79.2 | 81.2 | 82.9 | 78.9 | 78.4 | 76.4 |
Described electronic installation 10 is by being directly welded in described main antenna portion 13 by metal electron element 17, make this metal electron element 17 by this main antenna portion 13 ground connection, the impact that the ground plane that the earth terminal of this metal electron element 17 can be avoided thus to be directly electrically connected to multilayer circuit board 11 brings to the radiance in described main antenna portion 13.In addition, by arranging described auxiliary antenna part 15 and the signal lead 19 being electrically connected to this metal electron element 17 is carried out coated in conjunction with main antenna portion 13 by metal isolation strip 1131, noise can be avoided to pass through be sent to this metal electron element 17 in signal lead 19 and impact this metal electron element 17.
Claims (5)
1. an electronic installation, comprise multilayer circuit board, main antenna portion, auxiliary antenna part and metal electron element, this auxiliary antenna part is electrically connected to this main antenna portion, described multilayer circuit board comprises top layer and ground plane, described multilayer circuit board is provided with printed circuit, this printed circuit is used for for multilayer circuit board transmission of electric signals, this printed circuit comprises at least one signal lead being electrically connected to this metal electron element, it is characterized in that: described main antenna portion is arranged at the top layer of this multilayer circuit board and is electrically connected to this ground plane, this metal electron element is arranged at this top layer and is soldered in this main antenna portion, this metal electron element is by this main antenna portion ground connection, the two strip metal isolation strip that the both sides that described multilayer circuit board is also included in this signal lead are arranged respectively, this signal lead is contained in two strip metal isolation strip, in the space that main antenna portion and auxiliary antenna part surround, each this metal isolation strip and this main antenna portion and auxiliary antenna part are electrically connected.
2. electronic installation as claimed in claim 1, it is characterized in that: described multilayer circuit board comprises the second internal layer, this auxiliary antenna part is arranged at the second internal layer of this multilayer circuit board.
3. electronic installation as claimed in claim 2, is characterized in that: described main antenna portion with carry out electric connection by the via hole on this multilayer circuit board between auxiliary antenna part and be connected.
4. electronic installation as claimed in claim 2, is characterized in that: described auxiliary antenna part is layer of metal.
5. electronic installation as claimed in claim 4, it is characterized in that: described multilayer circuit board also comprises the first internal layer, this top layer, the first internal layer and the second internal layer stack on together successively, described signal lead is arranged at this first internal layer, is electrically connected between this metal isolation strip and described main antenna portion and auxiliary antenna part by multiple via holes of this multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010609175.4A CN102544689B (en) | 2010-12-28 | 2010-12-28 | Electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010609175.4A CN102544689B (en) | 2010-12-28 | 2010-12-28 | Electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102544689A CN102544689A (en) | 2012-07-04 |
| CN102544689B true CN102544689B (en) | 2016-03-02 |
Family
ID=46351033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010609175.4A Expired - Fee Related CN102544689B (en) | 2010-12-28 | 2010-12-28 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102544689B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770182B (en) * | 2018-04-17 | 2019-08-06 | 胜宏科技（惠州）股份有限公司 | A kind of double ladder portable antenna PCB and production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286588A (en) * | 2007-04-09 | 2008-10-15 | 佳邦科技股份有限公司 | Antenna module of global position system and manufacturing method therefor |
| CN201611688U (en) * | 2010-04-08 | 2010-10-20 | 湖南华诺星空电子技术有限公司 | Double-frequency stacked microstrip antenna for adaptive anti-interference antenna array |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363392A (en) * | 2003-06-05 | 2004-12-24 | Hitachi Ltd | Printed wiring board and radio communication apparatus |
-
2010
- 2010-12-28 CN CN201010609175.4A patent/CN102544689B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286588A (en) * | 2007-04-09 | 2008-10-15 | 佳邦科技股份有限公司 | Antenna module of global position system and manufacturing method therefor |
| CN201611688U (en) * | 2010-04-08 | 2010-10-20 | 湖南华诺星空电子技术有限公司 | Double-frequency stacked microstrip antenna for adaptive anti-interference antenna array |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102544689A (en) | 2012-07-04 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20181228 |