CN102538672B - CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method - Google Patents
CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method Download PDFInfo
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Abstract
The invention discloses a CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and a measurement test method. The CMOS-machine-vision-based component size measuring system comprises an image acquisition module, an image processing module and a size measuring module, wherein the image acquisition module acquires images of contour edges of a shot component; the image processing module performs binaryzation and filtering processing on the acquired images, and then performs edge detection to obtain edges of the images of the component; and the size measuring module calculates a pixel value of an edge contour of a measured object through feature extraction, and the pixel value can directly reflect the size of the component through calibration. According to the CMOS-machine-vision-based component size measuring system and the measurement test method disclosed by the invention, the measurement of the contour size can be realized, and the measurement of the aperture of a small through hole can be finished; and after a special assistant tool is provided, the measurement of the bottom width of a trumpet-shaped groove can be realized.
Description
Technical field
The invention belongs to field of machine vision, relate to a kind of part dimension measurement system based on CMOS machine vision and measure the method for inspection, specifically, be by with CMOS camera and optical lens for sighting device that core builds realizes the contactless accurate measurement of same specification spare part outside measurement and the whether qualified judgement of part, this system can also realize the measurement of fine through-hole aperture and tubaeform groove slot bottom width.
Background technology
In modern industry is produced, relate to the identification application of various inspection, production monitoring and part, the such as dimension inspection of spare and accessory parts batch machining, the integrity checking of automatic assembling, the element of electronic assemblies line is located automatically, the character recognition etc. of IC, usual human eye cannot complete these continuously and stably with brightness repeatability and intelligent work.Now people utilize photo electric imaging system to gather controlled object image, then machine or special image processing module carry out digitized processing as calculated, carry out the judgement of size, shape etc. according to the information such as pixel distribution brightness and color of image, thereby produce the concept of machine vision.Machine vision is exactly the visual performance with computer simulation human eye, information extraction from image or image sequence, carries out form and motion identification to the object of objective world.Machine vision technique is applied comparatively general at present, but it is still rare to be applied to dimensional measurement.Current most of machine vision technique is all based on CCD technology, but CCD technical costs is higher, and the CMOS low price of same specification, and show through experimental study: the Vision Builder for Automated Inspection measuring accuracy based on CMOS can reach a μm class precision, meets the dimensional measurement accuracy requirement of most part.
Gordian technique based on the dimensional measurement of CMOS machine vision comprises the technology contents of hardware components and software section two aspect.The contactless dimension measurement method of current widespread use mainly contains following four classes: 1. laser measurement method.Adopt laser projection on workpiece, install a laser detector at workpiece rear, the width X blocking dash area that bias light produces corresponding by workpiece directly reacts measured workpiece size value.Shortcoming is that device manufactures difficulty comparatively greatly, and cost is higher, and optical system needs to keep clean, otherwise impact is measured.Can not there be barrier centre, have receiver, because the feedback signal change of light can not measure mobile object too greatly.2. pneumatic type non-contact measurement method.Its measuring method size signal is converted into the change of measuring gas flow in pipeline, and carry out indicating value by the buoy in graduated glass tube, or gas signal is converted to by pneumatic-to-current converter the light beam indicating value that electric signal is made up of luminotron.Electronics pillar pneumatic measuring instrument not easily realizes electro-pneumatic, and measurement target has limitation, is used for greatly the size of measured hole footpath or semi-closed structure, is not suitable for measuring external dimensions, and cost is higher; And gauge head needs, near workpiece, therefore to need certain action and can realize dimensional measurement.3. electric vortex type measuring method.Application current vortex technology, current vortex sensor just can the position of measurement target object without the need to contacting measured piece, but carries out the necessary close-in measurement of measurement timer, and can not carry out comparatively telemeasurement, measuring accuracy is not high, and is suitable only for measurement metal parts.4. image-type measuring method.The imaging of high magnification optical amplifier is carried out by optical microscope measuring targets, after the object image after amplification is sent into computing machine by CCD camera system, detect profile and the surface configuration size of workpiece, but image measurer is based on CCD technology, cost is high, and can not carry out on-line measurement.
The above-mentioned contactless dimension measurement method of four classes has comparatively proven technique have more detailed introduction in many sections of pertinent literatures at present, but these contactless dimension measuring devices all exist respective deficiency.And current existing dimension measurement method is difficult to the accurate measurement realizing fine through-hole aperture and tubaeform groove slot bottom width.
Summary of the invention
In order to overcome above-mentioned deficiency of the prior art, the invention provides a kind of part dimension measurement system based on CMOS machine vision and measure the method for inspection, can not only non-cpntact measurement be realized, good reliability and measuring accuracy can be reached, after being equipped with special loading and unloading system, line can also be conveniently implemented in measure, and this invention structure is simple, cost is low, and work efficiency is high, flexibly, measure substantially not by the restriction of accessory size; Not only can realize appearance profile dimensional measurement, also can complete the inside diameter measurement of small through hole; The measurement of tubaeform slot bottom width can be realized after being equipped with special accessory.
The present invention adopts following technical scheme to realize: design, manufactured one based on CMOS machine vision Size Measuring System, comprise image capture module, image processing module and dimensional measurement module.First be transferred to the part edge image of computing machine through USB interface by CMOS camera by image capture software collection, then the simulating signal collected be converted to digital signal and be input in calculator memory, image procossing and dimensional measurement belong to the software section of detection system, first effective image processing method is adopted to carry out pre-service and rim detection to the image gathered, obtain the edge of part image, then the pixel value of edge contour is obtained by feature detection, dimensional measurement, by demarcating, this pixel value directly reflects the size of part.
Part dimension measurement system based on CMOS machine vision comprises base plate, locating piece, riser, backlight, imaging system, Level tune plate, vertically adjustable plate etc., described locating piece is fixedly mounted on described base plate, described riser is fixed by screws on described locating piece, described backlight is connected on riser, described Level tune plate is fixedly mounted on described base plate, and described vertical adjustable plate is arranged on described Level tune plate.
Described imaging system comprises CCD camera assembly, camera mounting blocks, and described CCD camera assembly is connected with described vertical adjustable plate by camera mounting blocks.
Described CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, and described CMOS camera is with USB interface, and USB port direct plugging-in CMOS camera is fixed on CCD camera assembly tail end.
There is draw-in groove described locating piece front end, matches, be convenient to fixation workpiece with workpiece shapes.
Described Level tune plate has track, and described vertical adjustable plate is arranged on described Level tune plate, and described vertical adjustable plate can be moved by track on described leveling board.
Described vertical adjustable plate is provided with track, and described CCD camera assembly moves up and down on described vertical adjustable plate by described camera mounting blocks.
Invention further provides a kind of part dimension measurement method, comprise the following steps (A1) and regulate all parts of installation hardware components, CCD camera assembly is installed on camera mounting blocks, regulate Level tune plate and vertical adjustable plate, make CCD camera assembly roughly the same with backlight height, measured workpiece is between imaging system and backlight.(A2) the strict fixation workpiece position of at every turn putting, is realized the accurate location of workpiece, is powered by 1.5V direct current to backlight by locating piece.(A3) system connects rear collection image, sets up grey level histogram, carries out histogram specification, medium filtering process, and single threshold is split, and arrangement for closed configuration process and Canny rim detection, carry out matching by least square method to image border profile; Gone out the pixel value of edge contour by the sub-VI function calculating adopting LabVIEW to provide, according to the pixel value calculated, after system is demarcated, the corresponding relation of pixel value and size value can be set up; According to the pixel value calculated, just can calculate the size value corresponding to this pixel value according to the result of demarcating, then can complete the dimensional measurement of part.
Present invention also offers the method for inspection that whether qualified a kind of accessory size is, concrete steps and part dimension measurement method similar, (A1) all parts of installation hardware components are regulated, CCD camera assembly is installed on camera mounting blocks, regulate Level tune plate and vertical adjustable plate, make CCD camera assembly roughly the same with backlight height, measured workpiece is between imaging system and backlight.(A2) the strict fixation workpiece position of at every turn putting, is realized the accurate location of workpiece, is powered by 1.5V direct current to backlight by locating piece.(A3) system connects rear collection image, carries out contrast strengthen, noise filtering, obtain image border to it; Then carry out matching by least square method edge, obtain the pixel value of institute's matching edge line according to the algorithm of exploitation.(A4) residing for pixel value, whether qualified region detection part is, the test specimen of Upper-lower Limit size is adopted to obtain Upper-lower Limit pixel value, judge whether surveyed accessory size is in dimensional tolerance range, if if the edge contour pixel value that measured piece records is between Upper-lower Limit pixel value, then measured piece is qualified, otherwise defective.
The present invention not only can realize appearance profile dimensional measurement and tolerance range judges, also the measurement of fine through-hole aperture can be completed, the measurement of tubaeform slot bottom width can be realized after being equipped with special accessory, the described corresponding accessory of measurement that can complete tubaeform slot bottom width refers to corresponding gauge head, it is completely the same that gauge head shape and tubaeform groove obtain shape, but width is slightly larger than the greatest limit width of groove.
The present invention improves further, comprises base plate, locating piece, riser, backlight, imaging system, Level tune plate, vertically adjustable plate based on CMOS machine vision part dimension measurement system; Described imaging system comprises CCD camera assembly and camera mounting blocks; Described locating piece is fixedly mounted on described base plate, and described locating piece can be changed according to different part shapes, can realize better locating tested part and measuring; Described riser is fixed by screws on described locating piece; Described backlight is connected on riser; Described imaging system comprises CCD camera assembly, camera mounting blocks; Described CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, and described CMOS camera is with USB interface, and USB port direct plugging-in CMOS camera is fixed on CCD camera assembly tail end; Described CCD camera assembly is connected with described vertical adjustable plate by camera mounting blocks; Described Level tune plate is fixedly mounted on described base plate; Described vertical adjustable plate is arranged on described Level tune plate; Described Level tune plate has track, and described vertical adjustable plate can be moved by track on described leveling board; Described vertical adjustable plate is provided with track, and described CCD camera assembly moves up and down on described vertical adjustable plate by described camera mounting blocks.As described in step measure time, outline to be measured by the adjustment of Level tune plate and vertical adjustable plate, can make surveyed edge of work profile be imaged on the zone line of image, adapts to the dimensional measurement requirement of different part thus; The sharpness of imaging can pass through the installation site of adjustment mounting blocks and camera mounting blocks, thus the distance changing measured workpiece and imaging system realizes.
A kind of part dimension measurement system based on CMOS machine vision of the present invention, through experimental analysis, this system repeatability precision is high, and the linearity is good, the measuring precision is little by the impact of time and temperature, and measuring accuracy can reach the requirement of micron order measuring accuracy; This system can be used in online part dimension measurement, good economy performance.
The invention has the beneficial effects as follows: the present invention can realize non-cpntact measurement, good reliability and measuring accuracy can be reached, after being equipped with special loading and unloading system, line can also be conveniently implemented in measure, and this invention structure is simple, low cost of manufacture, work efficiency is high, flexibly, measure substantially not by the restriction of accessory size; Not only can realize appearance profile dimensional measurement, also can complete the inside diameter measurement of small through hole; The measurement of tubaeform slot bottom width can be realized after being equipped with special accessory.
Accompanying drawing explanation
Fig. 1 is measuring system overall framework figure;
Fig. 2 is the overall construction drawing of measuring system;
Fig. 3 is the schematic diagram that whether qualified inspection accessory size is;
Fig. 4 is fine small through hole inside diameter measurement schematic diagram when being;
Fig. 5 is that tubaeform groove groove width measures sectional view;
Fig. 6 is tubaeform groove groove width measuring principle figure
In figure: 1-base plate, 2-locating piece, 3-riser, 4-backlight, 5-measured workpiece, 6-object lens, 7-lens barrel, 8-camera mounting blocks, 9-Level tune plate, the vertical adjustable plate of 10-, 11-eyepiece, 12-CMOS camera.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
A kind of based on CMOS machine vision Size Measuring System, comprise image capture module, image processing module and dimensional measurement module.Fig. 1 gives the overall framework figure of the automated part Size Measuring System based on CMOS machine vision.Image capture module completes the image collecting function to captured parts profile edge; After image processing module carries out binaryzation, filtering process to the image gathered, then by rim detection, obtain the edge of part image; Dimensional measurement module is by feature extraction, the pixel value calculating surveyed target edges profile, and by demarcating, this pixel value then directly can reflect the size of part.
Described image capture module structure is as Fig. 2, comprise imaging system and mechanical part, mechanical part comprises base plate 1, locating piece 2, riser 3, backlight 4, Level tune plate 9, vertically adjustable plate 10, described locating piece 2 is fixedly mounted on described base plate 1, described riser 3 is fixed by screws on described locating piece 2, described backlight 4 is connected on riser 3, and described Level tune plate 9 is fixedly mounted on described base plate 1, and described vertical adjustable plate 10 is arranged on described Level tune plate 9.Described imaging system comprises CCD camera assembly, camera mounting blocks 8, and described CCD camera assembly is connected with described vertical adjustable plate 10 by camera mounting blocks 8.
Described CCD camera assembly comprises eyepiece 11, object lens 6, lens barrel 7, CMOS camera 12, and described CMOS camera 12 is with USB interface, and USB port direct plugging-in CMOS camera 12 is fixed on CCD camera assembly tail end.
There is draw-in groove described locating piece 2 front end, matches, be convenient to fixation workpiece with workpiece shapes.
Described Level tune plate 9 has track, and described vertical adjustable plate 10 is arranged on described Level tune plate 9, and described vertical adjustable plate 10 can be moved by track on described Level tune plate 9.
On described vertical adjustable plate, 10 are provided with track, and described CCD camera assembly moves up and down on described vertical adjustable plate 10 by described camera mounting blocks 8.
Invention also provides a kind of part dimension measurement method, comprise the following steps:
(A1) all parts of installation hardware components are regulated, CCD camera assembly is installed on camera mounting blocks 8, regulate Level tune plate 9 and vertical adjustable plate 10, make CCD camera assembly highly roughly the same with backlight 4, measured workpiece 5 is between imaging system and backlight 4.
(A2) the strict fixation workpiece position of at every turn putting, is realized the accurate location of workpiece, is powered by 1.5V direct current to backlight 4 by locating piece 2.
(A3) system connects rear collection image, sets up grey level histogram, carries out histogram specification, medium filtering process, and single threshold is split, and arrangement for closed configuration process and Canny rim detection, carry out matching by least square method to image border profile; Gone out the pixel value of edge contour by the sub-VI function calculating adopting LabVIEW to provide, according to the pixel value calculated, after system is demarcated, the corresponding relation of pixel value and size value can be set up; According to the pixel value calculated, just can calculate the size value corresponding to this pixel value, then can complete the dimensional measurement of part.
Present invention also offers the method for inspection that whether qualified a kind of accessory size is, the present invention not only can realize appearance profile dimensional measurement, also can complete the measurement of fine through-hole aperture, the measurement of tubaeform slot bottom width can be realized after being equipped with gauge head (as shown in Figure 5).
Described based on CMOS machine vision part dimension measurement system, comprise base plate 1, locating piece 2, riser 3, backlight 4, imaging system, Level tune plate 9, vertically adjustable plate 10; Described imaging system comprises CCD camera assembly and camera mounting blocks 8; Described locating piece 2 is fixedly mounted on described base plate 1, and described locating piece 2 can be changed according to different part shapes, can realize better locating tested part and measuring; Described riser 3 is fixed by screws on described locating piece 2; Described backlight 4 is connected on riser 3; Described imaging system comprises CCD camera assembly, camera mounting blocks 8; Described CCD camera assembly comprises eyepiece 11, object lens 6, lens barrel 7, CMOS camera 12, and described CMOS camera 12 is with USB interface, and USB port direct plugging-in CMOS camera is fixed on CCD camera assembly tail end; Described CCD camera assembly is connected with described vertical adjustable plate 10 by camera mounting blocks 8; Described Level tune plate 9 is fixedly mounted on described base plate 1; Described vertical adjustable plate 10 is arranged on described Level tune plate 9; Described Level tune plate 9 has track, and described vertical adjustable plate 10 can be moved by track on described leveling board 9; Described vertical adjustable plate 10 is provided with track, and described CCD camera assembly moves up and down on described vertical adjustable plate 10 by described camera mounting blocks 8.As described in step measure time, outline to be measured by the adjustment of Level tune plate 9 and vertical adjustable plate 10, can make surveyed edge of work profile be imaged on the zone line of image, adapts to the dimensional measurement requirement of different part thus; The sharpness of imaging can pass through the installation site of adjustment mounting blocks and camera mounting blocks, thus the distance changing measured workpiece and imaging system realizes.
Enumerate three measurements below, inspection embodiment 2-4 does the present invention and more describes in detail.
Embodiment 2
The method of inspection that whether qualified accessory size is.A kind of based on CMOS machine vision part dimension measurement system by base plate, locating piece, riser, backlight, imaging system, Level tune plate, the compositions such as vertical adjustable plate, imaging system is made up of CCD camera assembly and camera mounting blocks, CCD camera assembly comprises eyepiece, object lens, lens barrel and CMOS camera, described locating piece is fixedly mounted on described base plate, described riser is fixed by screws on described locating piece, described backlight is connected on riser, described Level tune plate is fixedly mounted on described base plate, described vertical adjustable plate is arranged on described Level tune plate, described Level tune plate there is track, described vertical adjustable plate is arranged on described Level tune plate, described vertical adjustable plate can be moved by track on described leveling board.During measurement, the status requirement strict conformance that workpiece is put at every turn, is realized the accurate location of workpiece by locating piece.Backlight is fixed on riser, is powered to it by 1.5V direct supply.After the good all parts of mounting and adjusting, connected system, gathers image, set up grey level histogram, carry out histogram specification, medium filtering process, single threshold is split, and arrangement for closed configuration process and Canny rim detection, carry out matching by least square method to image border profile; Gone out the pixel value of edge contour by the sub-VI function calculating adopting LabVIEW to provide, according to the pixel value calculated, after system is demarcated, the corresponding relation of pixel value and size value can be set up; According to the pixel value calculated, the size value corresponding to this pixel value just can be calculated.
If whether inspection tested part is qualified, then only need judge whether accessory size is in dimensional tolerance range, be illustrated in figure 3 the schematic diagram that whether qualified inspection accessory size is, by above-mentioned steps, measurement is carried out to the test specimen of Upper-lower Limit size and obtain corresponding Upper-lower Limit pixel value, demarcate the region 31 that measured workpiece is qualified, according to the corresponding relation of pixel value and size value, if if the edge contour pixel value that measured piece records is positioned between Upper-lower Limit pixel value (i.e. region 31), then measured piece is qualified; If measured piece edge contour pixel value is positioned at more than the upper limit (workpiece is the longest) contour edge, part overlength; If measured piece edge contour pixel value is positioned at below lower limit (workpiece is the shortest) contour edge, part length requirement not up to standard, part is defective.
Embodiment 3
The measuring method of fine through-hole aperture.One is made up of base plate, locating piece, riser, backlight, imaging system, Level tune plate, vertically adjustable plate etc. based on CMOS machine vision part dimension measurement system, imaging system is made up of CCD camera assembly and camera mounting blocks, and USB port direct plugging-in CMOS camera is fixed on CCD camera assembly tail end.CCD camera assembly is installed on camera mounting blocks, roughly the same with backlight height, measured workpiece is between imaging system and backlight, outline to be measured makes surveyed edge of work profile be imaged on the zone line of image by the adjustment of Level tune plate and vertical adjustable plate, can adapt to the dimensional measurement requirement of different part thus; The sharpness of imaging can pass through the installation site of adjustment mounting blocks and camera mounting blocks, thus the distance changing measured workpiece and imaging system realizes.Compared with shape dimension measurement, system only need change different locating pieces to realize the positioning instant of surveyed workpiece can.During measurement, imaging system homing position is adjusted near aperture, make the ground imaging of aperture clear-cut to image middle position, due to the irradiation of system back light 4, light is by small through hole aperture, obtain the image that a width comprises aperture district 41 and workpiece shadow region 42, see Fig. 4, concrete measuring method is: after the good all parts of mounting and adjusting, connected system, gather image, set up grey level histogram, carry out histogram specification, medium filtering process, single threshold is split, arrangement for closed configuration process and Canny rim detection, by least square method, matching is carried out to image border profile, the pixel value of small through hole edge contour is gone out by the sub-VI function calculating adopting LabVIEW to provide, according to the pixel value calculated, system is being demarcated, the corresponding relation of pixel value and small through hole diameter can set up, the diameter of the corresponding different small through hole of different pixel values.
Embodiment 4
The measuring method of tubaeform groove slot bottom width.A kind of based on CMOS machine vision part dimension measurement system by base plate, locating piece, riser, backlight, imaging system, Level tune plate, the compositions such as vertical adjustable plate, imaging system is made up of CCD camera assembly and camera mounting blocks, CCD camera assembly comprises eyepiece, object lens, lens barrel and CMOS camera, described locating piece is fixedly mounted on described base plate, described riser is fixed by screws on described locating piece, described backlight is connected on riser, described Level tune plate is fixedly mounted on described base plate, described vertical adjustable plate is arranged on described Level tune plate, described Level tune plate there is track, described vertical adjustable plate can be moved by track on described leveling board.When measuring tubaeform groove slot bottom width, (shape of gauge head 51 shape and tubaeform groove is completely the same to need to be equipped with corresponding gauge head 51, but width is slightly larger than the greatest limit width of groove), measure the schematic diagram of tubaeform slot bottom width as Fig. 5, because in the process of processing, point of a knife always has certain fillet, and therefore processed bottom land can not be definitely right angle, and current existing dimension measurement method is difficult to the accurate measurement realizing tubaeform slot bottom width.As Fig. 5, during measurement, special accessory and gauge head 51 move to notch near, gap between CMOS camera panting probe 51 and workpiece notch, captured image effect is as Fig. 6, because backlight 4 irradiates the gap between gauge head 51 and workpiece notch, light passes through gap, to clap gap area be clear zone 61 (photic zone), the width in clear zone 61 is determined by the width in gauge head and bottom land gap, the clear zone width of image display is larger, then show that the gap of gauge head and slot bottom width is larger, the numerical value of slot bottom width is larger, according to the corresponding relation of pixel value and size value, slot bottom width can be obtained.
Above content to do the present invention in conjunction with concrete embodiment to describe in detail further, can not assert that specific embodiments of the invention are only limited to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, any type of simple deduction or equivalence are replaced, and all fall within protection scope of the present invention.
Claims (4)
1. based on a CMOS machine vision part dimension measurement system, it is characterized in that, comprise image capture module, image processing module and dimensional measurement module; Described image capture module completes the image acquisition to captured parts profile edge; After image processing module carries out binaryzation, filtering process to the image gathered, then by rim detection, obtain the edge of part image; Dimensional measurement module is by feature extraction, the pixel value calculating surveyed target edges profile, and by demarcating, this pixel value then directly can reflect the size of part;
Described image capture module comprises imaging system and mechanical part, described mechanical part comprises base plate, locating piece, riser, backlight, Level tune plate, vertically adjustable plate, described locating piece is fixedly mounted on described base plate, described riser is fixed by screws on described locating piece, described backlight is connected on riser, described Level tune plate is fixedly mounted on described base plate, and described vertical adjustable plate is arranged on described Level tune plate;
Described imaging system comprises CCD camera assembly, camera mounting blocks, described CCD camera assembly is connected with described vertical adjustable plate by camera mounting blocks, described CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, described CMOS camera is USB port direct plugging-in CMOS camera, and described CMOS camera is fixed on CCD camera assembly tail end.
2. as claimed in claim 1 based on CMOS machine vision part dimension measurement system, it is characterized in that, there is draw-in groove described locating piece front end, matches, be convenient to fixation workpiece with workpiece shapes.
3. as claimed in claim 1 based on CMOS machine vision part dimension measurement system, it is characterized in that, described Level tune plate has track, and described vertical adjustable plate is arranged on described Level tune plate, and described vertical adjustable plate can be moved by track on described Level tune plate.
4. as claimed in claim 1 based on CMOS machine vision part dimension measurement system, it is characterized in that, described vertical adjustable plate is provided with track, and described CCD camera assembly moves up and down on described vertical adjustable plate by described camera mounting blocks.
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| CN105279756A (en) * | 2015-10-19 | 2016-01-27 | 天津理工大学 | Notch circular arc part dimension visual detection method based on self-adapting region division |
| CN105279756B (en) * | 2015-10-19 | 2018-06-12 | 天津理工大学 | Notch circular arc accessory size visible detection method based on adaptive region segmentation |
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