CN102532851B - PC (Polycarbonate) alloy material and preparation method as well as application thereof - Google Patents
PC (Polycarbonate) alloy material and preparation method as well as application thereof Download PDFInfo
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- CN102532851B CN102532851B CN201110454123.9A CN201110454123A CN102532851B CN 102532851 B CN102532851 B CN 102532851B CN 201110454123 A CN201110454123 A CN 201110454123A CN 102532851 B CN102532851 B CN 102532851B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/78—Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling
- B29C48/875—Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling for achieving a non-uniform temperature distribution, e.g. using barrels having both cooling and heating zones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92514—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92561—Time, e.g. start, termination, duration or interruption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
- B29C2948/92895—Barrel or housing
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- Engineering & Computer Science (AREA)
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- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention is applicable to the technical field of engineering plastic, and provides a PC (Polycarbonate) alloy material and a preparation method as well as application thereof. The PC alloy material comprises PC, ASA (Acrylonitrile-Styrene-Acrylate), a flow promoter, an antioxidant, a lubricant and a toughening agent. Through the PC alloy material, the weather resistance performance of the alloy material is obviously improved through modification by using ASA; and the processing fluidity of the alloy material is greatly improved under the action of the flow promoter. The preparation method of the PC alloy material is easy to operate and low in cost and is extremely suitable for industrial production.
Description
Technical field
The invention belongs to engineering plastics technical field, relate in particular to a kind of PC alloy material, its preparation method and application.
Background technology
Polycarbonate (Polycarbonate, be called for short PC) be a kind of noncrystalline thermoplastic engineering plastic of excellent property, there is outstanding impact resistance, resistance to creep and good stability of the dimension, heat-resisting, water-intake rate is low, nontoxic, dielectric properties are good, being unique product with good transparency in five large-engineering plastics, is also the fastest general engineering plastic of growth in recent years.Be widely used at present the fields such as automobile, electric, building, office equipment, packing, sports equipment, health care, along with deepening continuously of study on the modification, be extended to just rapidly the high-tech areas such as aerospace, computer, CD.Yet the polycarbonate of non-modified still has weak point.Show that processing fluidity is not enough, chemical resistance is poor etc.
PC/ABS alloy material is a lot of fields because excellent combination property is applied in, but because the weathering resistance of ABS is good, its application is out of doors limited significantly, also have the processing fluidity of PC material poor, be difficult to directly be applied in fine thin-wall product (SD card etc.) above.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of PC alloy material, solve the technical problem that in prior art, PC alloy material weathering resistance is poor, processing fluidity is low; And the preparation method and application of this PC alloy material.
The present invention is achieved in that
A PC alloy material, comprises the component of following weight percentage:
And,
The preparation method of above-mentioned PC alloy material, comprises the steps:
The component of following weight percentage is provided respectively:
By described PC, ASA, oxidation inhibitor, toughner and mix lubricant, obtain the first mixture;
In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
Described the second mixture is extruded to processing, obtain PC alloy material.
The present invention further provides the application of above-mentioned PC alloy material in SD card.
PC alloy material of the present invention, by using ASA modification, significantly promotes the weather resistance of alloy material; By the effect of flow improver additive, realize alloy material processing fluidity and greatly improve.PC alloy material preparation method of the present invention, simple to operate, with low cost, be very suitable for suitability for industrialized production.
Accompanying drawing explanation
Fig. 1 is PC alloy material preparation method schema of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The embodiment of the present invention provides a kind of PC alloy material, comprises the component of following weight percentage:
Particularly, in the embodiment of the present invention, the unit of weight percentage is restriction not, such as gram, kilogram, ton etc.
Particularly, PC refers to polycarbonate, and the specific refractory power of this PC is 1.58~1.61, and transmissivity is 88%~90%.Can select Japanese Supreme Being people PC 1250Y, the PC IR2200 of LG-DOW PC 201-10 or Japanese bright dipping.The weight percentage of this polycarbonate is 80~92%, for example, and 87%.
Particularly, this ASA refers to acrylonitrile-butadiene-acrylate terpolymer, and wherein, the weight percentage of vinyl cyanide is 5~20%, and cinnamic weight percentage is 50~80%, and the weight percentage of acrylate is 1~15%.Can select U.S. Sabic XTWE291, German BASF ASA 757G.The weight percentage of this ASA is 1~8%, for example, and 4%.By selecting the ASA of above-mentioned weight percentage, the weather resistance of alloy material is promoted greatly.
Particularly, this oxidation inhibitor is Hinered phenols antioxidant or phosphite ester kind antioxidant.For example, four [β-<3,5-di-tert-butyl-4-hydroxy phenyl > propionic acid] season tetrol ester or three <2,4-di-tert-butylphenol > phosphorous acid ester, can select 1010,168 or its mixture of U.S.'s vapour bar.
Particularly, the MBS that this toughner is nucleocapsid structure, for example, the C-233A of the beautiful sun of Mitsubishi, the 2691A of ROHM AND HAAS, LG EM500A.
Particularly, this lubricant is vinyl bis-stearamides, for example, and the EBS 120 of vapour bar.
Particularly, this flow improver additive is liquefied compound, is specially a kind of organic phosphorus compound, and in this organic phosphorus compound, the weight percentage of phosphorus is that phosphorus content is 6~20%.The proportion of this organic phosphorus compound is 1.2-1.3, refined precious P-30 for example, big bus CR741, dihydroxyphenyl propane-bis-(diphenyl phosphoester).The weight percentage of this flow improver additive is 1~5%, for example 3%.By selecting above-mentioned flow improver additive, the processing fluidity of alloy material is improved greatly; By using 1~5%, because organic phosphorus compound shared weight proportion in alloy material is lower, do not affecting under the prerequisite of other performances of alloy material, the processing fluidity of alloy material is promoted greatly, the warpage properties of having realized PC alloy material reduces greatly.
In embodiment of the present invention PC alloy material, each component is mutually promoted, and cooperatively interacts, and has realized alloy material weathering resistance, processing fluidity, low warpage properties and has greatly strengthened, and prepared PC alloy material has a wide range of applications field.
Refer to Fig. 1, Fig. 1 shows embodiment of the present invention PC alloy material preparation method schema, comprises the steps:
Step S01, supplies raw materials:
Particularly, above-mentioned PC, ASA, oxidation inhibitor, toughner, lubricant, flow improver additive etc., with aforementioned identical, do not repeat to set forth at this.
Step S02, preparation the first mixture:
By described PC, ASA, oxidation inhibitor, toughner and mix lubricant, obtain the first mixture;
Particularly, in step S02, after PC, ASA are dried, be added in stirrer, then add oxidation inhibitor, toughner and lubricant, stir, obtain the first mixture;
Step S03, preparation the second mixture:
In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
Step S04, extrudes processing:
Described the second mixture is extruded to processing, obtain PC alloy material;
Particularly, in this step S04, extrusion equipment is restriction not, for example, single screw extrusion machine, twin screw extruder, in extrusion, processing parameter is:
240~250 ℃ of 230~240 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
Embodiment of the present invention PC alloy material preparation method, by PC, ASA, flow improver additive and other auxiliary agents are extruded to processing together, weathering resistance, the processing fluidity of having realized PC alloy material significantly promote, and warpage performance reduces greatly; Embodiment of the present invention PC alloy material preparation method, simple to operate, with low cost, productivity effect is high, is very suitable for suitability for industrialized production.
The embodiment of the present invention further provide above-mentioned PC alloy material at thin wall parts as the application in SD card, ultra thin handset shell or wireless network card shell.
Below in conjunction with specific embodiment specific embodiment, above-mentioned PC alloy material preparation method is described in detail.
Embodiment mono-
Embodiment of the present invention PC alloy material preparation method, comprises the steps:
The component of following weight percentage is provided:
PC 80%, ASA 8%, toughner 9%, lubricant 0.5%, oxidation inhibitor 0.5%, rheology control agent 2%%;
After PC, ASA is dry, be added in stirrer, then add oxidation inhibitor, toughner and lubricant, stir, obtain the first mixture; In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
The second mixture is placed in to dual-screw-stem machine through melt extruding granulation, its technique is: 250~260 ℃ of 240~250 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature of twin screw, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
Embodiment bis-
Embodiment of the present invention PC alloy material preparation method, comprises the steps:
The component of following weight percentage is provided:
Prepare according to the following formulation premix:
PC 85%, ASA 3%, toughner 7%, lubricant 0.5%, oxidation inhibitor 1.5%, rheology control agent 3%;
After PC, ASA is dry, be added in stirrer, then add oxidation inhibitor, toughner and lubricant, stir, obtain the first mixture; In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
The second mixture is placed in to dual-screw-stem machine through melt extruding granulation, its technique is: 250~260 ℃ of 240~250 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature of twin screw, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
Embodiment tri-
Embodiment of the present invention PC alloy material preparation method, comprises the steps:
The component of following weight percentage is provided:
PC 88%, ASA 8%, toughner 12%, lubricant 0.5%, oxidation inhibitor 0.5%, rheology control agent 1%;
After PC, ASA is dry, be added in stirrer, then add oxidation inhibitor, toughner and lubricant, stir, obtain the first mixture; In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
The second mixture is placed in to dual-screw-stem machine through melt extruding granulation, its technique is: 250~260 ℃ of 240~250 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature of twin screw, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
Embodiment tetra-
Embodiment of the present invention PC alloy material preparation method, comprises the steps:
The component of following weight percentage is provided:
PC 90%, ASA 1%, toughner 3%, lubricant 1.5%, oxidation inhibitor 0.5%, rheology control agent 4%;
After PC, ASA is dry, be added in stirrer, then add oxidation inhibitor, toughner and lubricant, stir, obtain the first mixture; In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
The second mixture is placed in to dual-screw-stem machine through melt extruding granulation, its technique is: 250~260 ℃ of 240~250 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature of twin screw, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
Refer to table 1, table 1 is embodiment of the present invention PC alloy material and Sabic EXL1414 performance synopsis:
By contrast, can see that PC alloy material filling flow of the present invention is good, processing characteristics is good, low warpage, and tear strength is good, and weathering resistance is strong, is the best materials of a production ultra-thin-wall product, and out of doors can life-time service.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. a PC alloy material, comprises the component of following weight percentage:
In described organic phosphorus compound, phosphorus weight percentage is 6~20%; Described ASA comprises that weight percentage is 5~20% vinyl cyanide, the vinylbenzene that weight percentage is 50~80%, the acrylate that weight percentage is 1~15%.
2. PC alloy material as claimed in claim 1, is characterized in that, described toughner is MBS.
3. the preparation method of the PC alloy material as described in claim 1~2 any one, comprises the steps:
The component of following weight percentage is provided respectively:
In described organic phosphorus compound, phosphorus weight percentage is 6~20%; Described ASA comprises that weight percentage is 5~20% vinyl cyanide, the vinylbenzene that weight percentage is 50~80%, the acrylate that weight percentage is 1~15%;
By described PC, ASA, oxidation inhibitor, toughner and mix lubricant, obtain the first mixture;
In described the first mixture, add described flow improver additive, be mixed to get the second mixture;
Described the second mixture is extruded to processing, obtain PC alloy material.
4. PC alloy material preparation method as claimed in claim 3, is characterized in that, described in extrude treatment process condition and be:
240~250 ℃ of 230~240 ℃, three sections temperature of 220~230 ℃, two sections temperature of one section of temperature, 60~100 ℃ of die temperatures, 1~2 minute residence time, pressure are 10~15MPa.
5. the application of the PC alloy material as described in claim 1~2 any one in SD card, ultra thin handset shell or wireless network card shell.
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CN103497497A (en) * | 2013-09-22 | 2014-01-08 | 安徽科聚新材料有限公司 | High flame retardance polycarbonate (PC) alloy material and preparation method thereof |
CN114106547B (en) * | 2021-11-29 | 2024-02-23 | 金发科技股份有限公司 | Polycarbonate composition and preparation method and application thereof |
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CN101486825A (en) * | 2008-01-17 | 2009-07-22 | 深圳市亚塑科技有限公司 | Preparation of weather resistant PC and ASA copolymer alloy |
CN101759982A (en) * | 2008-12-23 | 2010-06-30 | 上海普利特复合材料股份有限公司 | Antistatic and ultraviolet resistant PC/ASA material composition |
CN101899204A (en) * | 2010-03-05 | 2010-12-01 | 上海锦湖日丽塑料有限公司 | Antistatic PC/ASA alloy material and preparation method thereof |
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DE102009039121A1 (en) * | 2009-08-28 | 2011-03-03 | Bayer Materialscience Ag | Flame-retardant composition, useful e.g. to produce power strip, comprises polycarbonate, flame retardant salt comprising a metal salt of sulfonic acid-, sulfonamide- and/or sulfonimide-derivatives and brominated flame retardant additive |
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CN101486825A (en) * | 2008-01-17 | 2009-07-22 | 深圳市亚塑科技有限公司 | Preparation of weather resistant PC and ASA copolymer alloy |
CN101759982A (en) * | 2008-12-23 | 2010-06-30 | 上海普利特复合材料股份有限公司 | Antistatic and ultraviolet resistant PC/ASA material composition |
CN101899204A (en) * | 2010-03-05 | 2010-12-01 | 上海锦湖日丽塑料有限公司 | Antistatic PC/ASA alloy material and preparation method thereof |
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