CN102527802B - Processing method of back board light emitting component board of LED(light emitting diode) display - Google Patents
Processing method of back board light emitting component board of LED(light emitting diode) display Download PDFInfo
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- CN102527802B CN102527802B CN201110458768.XA CN201110458768A CN102527802B CN 102527802 B CN102527802 B CN 102527802B CN 201110458768 A CN201110458768 A CN 201110458768A CN 102527802 B CN102527802 B CN 102527802B
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Abstract
The invention discloses a processing method of a back board light emitting component board of an LED(light emitting diode) display, relating to LED displays. The back board light emitting component board is provided with a side surface forming a certain angle with a main body, a gap and a small hole to be processed are formed on the side surface, a stamping mold bottom half with multiple steps is arranged, and then stamping is performed; automatic conveying structures are arranged on two sides of the mold bottom half and move the back board light emitting component side half-finished product in sequence among the molds of multiple steps to be stamped; the mold of the final step is provided with an inclined surface, and the automatic conveying structures rotate the half-finished product to be abutted against the inclined surface to perform stamping of detailed structure on a hem. The method disclosed by the invention realizes unit set stamping and has low cost, high speed and high processing accuracy.
Description
Technical field
The present invention relates to light-emitting diode display, particularly a kind of parts of light-emitting diode display---the processing method of backboard.
Background technology
Light-emitting diode display consists of LED panel, backboard and control circuit etc., and backboard is the device that bears LED panel and control circuit, is important part.Due to the complicated structure of a light-emitting diode display, so backboard, except profile, has a lot of CONSTRUCTED SPECIFICATIONs accordingly: breach, aperture, chamfering, mint-mark etc.And the Assembly part of whole backboard is many, required precision is very high.
Existing backboard is all sheet metal, and the processing method of most convenient is punching press.As the schematic diagram of accompanying drawing 1, form one of assembly of backboard---the luminescence component plate (AL Bar) of backboard, a kind of metal sheet stamping part equally, but it is different from miscellaneous part, it is not simple pieces of sheet, and there is the side of a bending, on this side, there is the process details such as breach, aperture.
Prior art is processed this side, is all to use many stamping machines to carry out, because side cannot process.Typical flow process is: prepare 4 ~ 6 molds, corresponding 4 ~ 6 stamping machines of use are produced simultaneously, every stamping machine processing part details, and semi-finished product move between each stamping machine by manpower, in the time of punching press side detail, with manpower, turned to side and upwards carried out punching press.Prior art scheme, cost is high, and not only equipment is many, consumption is large, and needs extensive work personnel manual operation; And each half-finished on each stamping machine carrying need the time, production efficiency is low, the accuracy of manufacture is also not easy to guarantee.
Summary of the invention
The present invention is exactly in order to overcome the defect of existing many stamping machine processing schemes described in background technology, to invent a kind of method of using separate unit stamping machine automatically to carry out punch process light-emitting diode display backboard luminescence component plate.
Method of the present invention, use pressing equipment stamped, it is characterized in that: a diel mo(u)ld bottom half with multi-step is set, and the both sides of mould mo(u)ld bottom half are provided with automatic transporting structure, automatic transporting structure is accepted punching press by the order operation between each step mould of backboard luminescence component side semi-finished product; Last step mould has inclined-plane, and automatic transporting structure rotation semi-finished product laminating inclined-plane carries out the detailed structure punching press on flanging.
Described automatic transporting structure is symmetrical structure, be arranged on the both sides of diel mo(u)ld bottom half, contain guide rail, transporting supports is set on guide rail, transporting supports can move along guide rail, transporting supports tail end is connected to connecting rod, and the tail end of connecting rod connects longitudinal pneumatic pinch whirligig, and connecting rod bottom is fixed on horizontal pneumatic transfer devices.
Preferably, guide rail is arranged on diel mo(u)ld bottom half.Guide rail also can be arranged on the fixed position, both sides outside diel mo(u)ld bottom half.
Processing method of the present invention, is all incorporated into all punching press programs on a stamping machine, uses single mold to complete punching press.Production cost is low, occupy little space, and utilizes automatic transporting structure automatically to complete feeding and rotation, and precision is fast at a high speed.
Accompanying drawing explanation
Fig. 1, the structure chart of light-emitting diode display backboard luminescence component plate.
Fig. 2, the embodiment of the mould mo(u)ld bottom half that the inventive method is used.
The specific embodiment
The present embodiment is used the mould of 4 steps to carry out complete punch process.
As Fig. 1, first prepare a mould with four steps (I, II, III, IV), the 4th step (IV) of mould mo(u)ld bottom half has inclined-plane, for the side detail of punching press light-emitting diode display backboard luminescence component plate: as breach, aperture etc.
The both sides of mould mo(u)ld bottom half 1, the symmetrical automatic transporting structure that is provided with: guide rail 2 is arranged on the both sides of the edge of mould mo(u)ld bottom half, a plurality of transporting supports 3 are set on guide rail, transporting supports 3 can move along guide rail 2, transporting supports tail end is connected to connecting rod 4, the tail end of connecting rod 4 connects longitudinal pneumatic pinch whirligig 6, and connecting rod 4 bottoms are fixed on horizontal pneumatic transfer devices 5.Transporting supports 3 arranges a plurality of, can guarantee to carry half-finished reliability.
Procedure of processing: 1, filling raw material enter automatic conveying device, transporting supports 3 is by longitudinally pneumatic pinch whirligig 6 drives, lengthwise movement clamps raw material plate, then transverse shifting under the effect of horizontal pneumatic transfer devices 5, raw material plate is transferred to stamping machine, in diel 1 first step, stamps out part profile.
2, by transporting supports 3, under the action of horizontal pneumatic transfer devices 5, semi-finished product are transferred in mould second step, stamp out whole profiles and inner aperture.
3, by transporting supports 3, semi-finished product are transferred in mould third step, stamp out the chamfering of interiors of products aperture and mint-mark etc.So far, punching press is still plane punching press, there is no the side detail of converted products.
4, longitudinally pneumatic pinch whirligig 6 drives transporting supports 3 rotations, semi-finished product is rotated to an angle and is sent in mould the 4th step, the inclined-plane of the mould of the step 4 of fitting, product side, towards above, is stamped out to the notch geometry of product side and aperture etc.
The inventive method, is used separate unit stamping machine to produce, and through measuring and calculating, equipment investment cost reduces approximately 61%, and corresponding equipment maintenance cost and inventory carrying cost reduce; Space reduces approximately 75%; Productivity improves approximately 3 times.And semi-finished product accurate positioning, greatly improves product quality and device security; Owing to only having filling raw material to use manpower in whole punching course, other participate in without manpower, thereby reduce potential safety hazard to greatest extent.
Claims (3)
- The processing method of the backboard luminescence component plate of 1.LED display, described backboard luminescence component plate side has one and has the side of certain angle with main body, on side, there are the breach and the aperture that need processing, use pressing equipment stamped, it is characterized in that: a diel mo(u)ld bottom half (1) with multi-step is set, and the both sides of mould mo(u)ld bottom half are provided with automatic transporting structure; Automatic transporting structure is symmetrical structure, be arranged on the both sides of diel mo(u)ld bottom half (1), contain guide rail (2), transporting supports (3) is set on guide rail, transporting supports can move along guide rail, transporting supports (3) tail end is connected to connecting rod (4), and the tail end of connecting rod connects longitudinal pneumatic pinch whirligig (6), and connecting rod bottom is fixed on horizontal pneumatic transfer devices (5); Laterally pneumatic transfer devices (5) is accepted punching press by the order operation between each step mould of backboard luminescence component side semi-finished product; Last step mould has inclined-plane, and longitudinally pneumatic pinch whirligig (6) rotation semi-finished product laminating inclined-plane carries out the detailed structure punching press on flanging.
- 2. the processing method of the backboard luminescence component plate of light-emitting diode display according to claim 1, is characterized in that: described guide rail (2) is arranged on diel mo(u)ld bottom half (1).
- 3. the processing method of the backboard luminescence component plate of light-emitting diode display according to claim 1, is characterized in that: 4 punch steps are set, first step punching press profile on described diel mo(u)ld bottom half; Second step punching press profile details and inner aperture; Chamfering and the mint-mark of third step punching press inner aperture; Notch geometry and the aperture of the 4th step stamping products side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110458768.XA CN102527802B (en) | 2011-12-31 | 2011-12-31 | Processing method of back board light emitting component board of LED(light emitting diode) display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110458768.XA CN102527802B (en) | 2011-12-31 | 2011-12-31 | Processing method of back board light emitting component board of LED(light emitting diode) display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102527802A CN102527802A (en) | 2012-07-04 |
| CN102527802B true CN102527802B (en) | 2014-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110458768.XA Active CN102527802B (en) | 2011-12-31 | 2011-12-31 | Processing method of back board light emitting component board of LED(light emitting diode) display |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101295088A (en) * | 2007-04-25 | 2008-10-29 | 群康科技(深圳)有限公司 | LCD device |
| CN201143538Y (en) * | 2007-10-31 | 2008-11-05 | 莫元春 | Multi-station aerosol can cover automatic press forming mold |
| CN201346604Y (en) * | 2008-12-22 | 2009-11-18 | 上海通彩自动化设备有限公司 | Single-set, multi-station transfer manipulator |
| CN101614884A (en) * | 2008-06-26 | 2009-12-30 | 上海通升捷电子有限公司 | LCD panel frame manufacture method and the framework that utilizes this method to make |
| CN101927302A (en) * | 2010-08-11 | 2010-12-29 | 江苏凡润电子股份有限公司 | A kind of LCD display module casing processing method |
| CN202079191U (en) * | 2010-12-27 | 2011-12-21 | 陆明康 | Multi-station feeding device for punch |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290873A (en) * | 2001-03-26 | 2002-10-04 | Nec Corp | Method for manufacturing display panel support frame, display panel support frame and display device |
| JP2006171566A (en) * | 2004-12-17 | 2006-06-29 | Seiko Epson Corp | Packaging case for electro-optical device, manufacturing method thereof, electro-optical device, and electronic apparatus |
| US7911774B2 (en) * | 2007-06-28 | 2011-03-22 | Epson Imaging Devices Corporation | Metal frame for electro-optical device having a folding portion and a seamless curved shape |
-
2011
- 2011-12-31 CN CN201110458768.XA patent/CN102527802B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295088A (en) * | 2007-04-25 | 2008-10-29 | 群康科技(深圳)有限公司 | LCD device |
| CN201143538Y (en) * | 2007-10-31 | 2008-11-05 | 莫元春 | Multi-station aerosol can cover automatic press forming mold |
| CN101614884A (en) * | 2008-06-26 | 2009-12-30 | 上海通升捷电子有限公司 | LCD panel frame manufacture method and the framework that utilizes this method to make |
| CN201346604Y (en) * | 2008-12-22 | 2009-11-18 | 上海通彩自动化设备有限公司 | Single-set, multi-station transfer manipulator |
| CN101927302A (en) * | 2010-08-11 | 2010-12-29 | 江苏凡润电子股份有限公司 | A kind of LCD display module casing processing method |
| CN202079191U (en) * | 2010-12-27 | 2011-12-21 | 陆明康 | Multi-station feeding device for punch |
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| CN102527802A (en) | 2012-07-04 |
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Address after: 214000 7 tin Jin Road, New District, Jiangsu, Wuxi Applicant after: Jiangsu Fanrun Electronics Co.,Ltd. Address before: 214000 7 tin Jin Road, New District, Jiangsu, Wuxi Applicant before: Jiangsu Fanrun Electronic Co.,Ltd. |
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