CN102523678A - PCB (Print Circuit Board) and electronic equipment - Google Patents
PCB (Print Circuit Board) and electronic equipment Download PDFInfo
- Publication number
- CN102523678A CN102523678A CN2011103675698A CN201110367569A CN102523678A CN 102523678 A CN102523678 A CN 102523678A CN 2011103675698 A CN2011103675698 A CN 2011103675698A CN 201110367569 A CN201110367569 A CN 201110367569A CN 102523678 A CN102523678 A CN 102523678A
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- pcb
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- fpc
- link
- cavity
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Abstract
The invention provides a PCB (Print Circuit Board) and electronic equipment. According to the embodiment of the invention, a cavity for accommodating a connecting piece of an FPC (Flexible Printed Circuit) is arranged in a base plate of the PCB, so that the problem that: in the prior art, since a connector arranged on the surface of the PCB can occupy a layout space of the surface of the PCB, low space utilization ratio of the PCB is caused, can be solved, and thus, the space utilization ration of the PCB is improved.
Description
Technical field
The present invention relates to the communication technology, relate in particular to a kind of printed circuit board (PCB) (Printed Circuit Board is called for short PCB) and electronic equipment.
Background technology
Along with the develop rapidly of telecommunication technology, various electronic equipments arise at the historic moment, and because the intensification gradually of market competition, the structure of electronic device and electronic equipment and kind are more and more various and complicated.Wherein, printed circuit board (PCB) (Printed Circuit Board is called for short PCB) and flexible printed circuit board (Flexible Printed Circuit is called for short FPC) as the supporter of electronic equipment, are used for providing being electrically connected of the various components and parts of electronic equipment.In the prior art, FPC can be connected to PCB through the connector that is provided with on the PCB surface, and being electrically connected of various components and parts in the electronic equipment is provided jointly.
Yet,, thereby caused the space availability ratio of PCB low because the connector that is provided with on the PCB surface can take the arrangement space on PCB surface.
Summary of the invention
The present invention provides a kind of PCB and electronic equipment, in order to improve the space availability ratio of PCB.
On the one hand a kind of PCB is provided, said PCB comprises a substrate, offers a cavity in the said substrate, and said cavity is used to hold the link of FPC; The part of offering cavity in the said substrate is provided with a junction spare, and the link of said substrate is used for contacting with each other with the link of said FPC, so that the signal lead of the signal lead of said PCB and said FPC is electrically connected.
A kind of electronic equipment is provided on the other hand, has comprised above-mentioned PCB, said PCB connects said FPC,
Can know by technique scheme; Offer the cavity of the link that is used to hold FPC in the substrate of the embodiment of the invention through PCB; Can avoid in the prior art can taking the low problem of space availability ratio of the PCB that the arrangement space on PCB surface causes, thereby improve the space availability ratio of PCB owing to the connector that is provided with on the PCB surface.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do one to the accompanying drawing of required use in embodiment or the description of the Prior Art below introduces simply; Obviously, the accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the PCB that Fig. 1 provides for one embodiment of the invention;
The structural representation of the PCB that Fig. 2 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 3 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 4 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 5 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 6 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 7 provides for another embodiment of the present invention;
The structural representation of the PCB that Fig. 8 provides for another embodiment of the present invention.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the invention clearer; To combine the accompanying drawing in the embodiment of the invention below; Technical scheme in the embodiment of the invention is carried out clear, intactly description; Obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of PCB, and PCB comprises a substrate, offers a cavity in the substrate, and cavity is used to hold the link of FPC; The part of offering cavity in the substrate is provided with a junction spare, and the link of substrate is used for contacting with each other with the link of FPC, so that the signal lead of the signal lead of PCB and FPC is electrically connected.Offer the cavity of the link that is used to hold FPC in the substrate of the embodiment of the invention through PCB; Can avoid in the prior art can taking the low problem of space availability ratio of the PCB that the arrangement space on PCB surface causes, thereby improve the space availability ratio of PCB owing to the connector that is provided with on the PCB surface.
The structural representation of the PCB that Fig. 1 provides for one embodiment of the invention, as shown in Figure 1, the PCB of present embodiment can comprise a substrate 10, and the marginal position of substrate 10 offers a cavity 20, and cavity 20 is used to hold the link of FPC; The part of offering cavity 20 in the substrate 10 is provided with a junction spare, and the link of substrate 10 is used for contacting with each other with the link of above-mentioned FPC, so that the signal lead of the signal lead of above-mentioned PCB and above-mentioned FPC is electrically connected.
Alternatively, the link of above-mentioned FPC can be pad; Correspondingly, as shown in Figure 2 and shown in Figure 3, the link of substrate 10 then can be at least one metal needle 30.Simple in order to realize, at least one metal needle 30 can be installed on the fastener 31.Metal needle 30 is used for offering the via hole 40 that the part of cavity 20 offers through substrate 10 and contacts with each other with above-mentioned pad, thereby can be so that the signal lead of the signal lead of above-mentioned PCB and above-mentioned FPC is electrically connected.
Alternatively, the link of above-mentioned FPC can also be golden finger, perhaps also can be other the link of similar golden finger, and present embodiment does not limit this; Correspondingly, like Fig. 4 and shown in Figure 5, the link of substrate 10 then can be metal clips 50, and metal clips 50 is used for contacting with each other with above-mentioned golden finger, thereby can be so that the signal lead of the signal lead of above-mentioned PCB and above-mentioned FPC is electrically connected.
In the present embodiment; Offer the cavity of the link that is used to hold FPC in the substrate through PCB; Can avoid in the prior art can taking the low problem of space availability ratio of the PCB that the arrangement space on PCB surface causes, thereby improve the space availability ratio of PCB owing to the connector that is provided with on the PCB surface.
Alternatively, in the present embodiment, like Fig. 6 and shown in Figure 7; The part of offering cavity 20 in the substrate 10 can also further offer location parts; For example: location hole 60, the positioning element that is used for offering with above-mentioned FPC cooperates, for example: location hole; Above-mentioned PCB and above-mentioned FPC are positioned, thereby guaranteed the reliability that is electrically connected between the signal lead of signal lead and FPC of PCB.
Alternatively, as shown in Figure 8, cavity 20 can also be opened in the surface location of substrate 10.Similarly, the link of substrate 10 can repeat no more referring to the link among the embodiment of Fig. 2～5 correspondences here.
The embodiment of the invention also provides a kind of electronic equipment; Comprise like the PCB among the corresponding embodiment in Fig. 1～8; This PCB connects FPC; Offer the cavity of the link that is used to hold FPC in the substrate through PCB, can avoid in the prior art can taking the low problem of space availability ratio of the PCB that the arrangement space on PCB surface causes, thereby improved the space availability ratio of PCB owing to the connector that is provided with on the PCB surface; Simultaneously, help the miniaturization of electronic equipment.
In several embodiment that the application provided, should be understood that system that is disclosed and device can be realized through other mode.For example, device embodiment described above only is schematically, for example; The division of said unit; Only be that a kind of logic function is divided, during actual the realization other dividing mode can be arranged, for example a plurality of unit or assembly can combine or can be integrated into another system; Or some characteristics can ignore, or do not carry out.Another point, the coupling each other that shows or discuss or directly coupling or communication to connect can be through some interfaces, the INDIRECT COUPLING of device or unit or communication connect, and can be electrically, machinery or other form.
Said unit as separating component explanation can or can not be physically to separate also, and the parts that show as the unit can be or can not be physical locations also, promptly can be positioned at a place, perhaps also can be distributed on a plurality of units.Can realize the purpose of present embodiment scheme according to the needs selection some or all of unit wherein of reality.
In addition, each functional unit in each embodiment of the present invention can be integrated in the processing unit, also can be that the independent physics in each unit exists, and also can be integrated in the unit two or more unit.
What should explain at last is: above embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although with reference to previous embodiment the present invention has been carried out detailed explanation, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.
Claims (7)
1. PCB, said PCB comprises a substrate, it is characterized in that, offers a cavity in the said substrate, said cavity is used to hold the link of FPC; The part of offering cavity in the said substrate is provided with a junction spare, and the link of said substrate is used for contacting with each other with the link of said FPC, so that the signal lead of the signal lead of said PCB and said FPC is electrically connected.
2. PCB according to claim 1 is characterized in that said cavity is opened in the marginal position of said substrate.
3. PCB according to claim 1 is characterized in that said cavity is opened in the surface location of said substrate.
4. according to the described PCB of the arbitrary claim of claim 1～3; It is characterized in that; The link of said FPC is a pad; The link of said substrate is at least one metal needle, and said at least one metal needle is used for offering via hole and the said pad that the part of cavity offers through said substrate and contacts with each other.
5. according to the described PCB of the arbitrary claim of claim 1～3, it is characterized in that the link of said FPC is a golden finger, the link of said substrate is a metal clips, and said metal clips is used for contacting with each other with said golden finger.
6. according to the described PCB of the arbitrary claim of claim 1～5, it is characterized in that the part of offering cavity in the said substrate offers location parts, the positioning element that is used for offering with said FPC cooperates, and said PCB and said FPC are positioned.
7. an electronic equipment is characterized in that, comprises that said PCB connects said FPC like the described PCB of the arbitrary claim of claim 1～6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103675698A CN102523678A (en) | 2011-11-18 | 2011-11-18 | PCB (Print Circuit Board) and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103675698A CN102523678A (en) | 2011-11-18 | 2011-11-18 | PCB (Print Circuit Board) and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102523678A true CN102523678A (en) | 2012-06-27 |
Family
ID=46294433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103675698A Pending CN102523678A (en) | 2011-11-18 | 2011-11-18 | PCB (Print Circuit Board) and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102523678A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379841A (en) * | 2018-10-29 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its board structure of circuit and BGA Package mould group |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219292A (en) * | 1992-04-03 | 1993-06-15 | Motorola, Inc. | Printed circuit board interconnection |
| US5365268A (en) * | 1991-04-26 | 1994-11-15 | Fuji Photo Optical Co., Ltd. | Circuit board of solid-state image sensor for electronic endoscope |
| JP2003217830A (en) * | 2002-01-28 | 2003-07-31 | Toyota Industries Corp | Organic el panel with sealing member |
| US7102891B1 (en) * | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
| CN101938882A (en) * | 2009-06-30 | 2011-01-05 | 日立电线株式会社 | High speed transmission circuit board connection structure |
-
2011
- 2011-11-18 CN CN2011103675698A patent/CN102523678A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5365268A (en) * | 1991-04-26 | 1994-11-15 | Fuji Photo Optical Co., Ltd. | Circuit board of solid-state image sensor for electronic endoscope |
| US5219292A (en) * | 1992-04-03 | 1993-06-15 | Motorola, Inc. | Printed circuit board interconnection |
| JP2003217830A (en) * | 2002-01-28 | 2003-07-31 | Toyota Industries Corp | Organic el panel with sealing member |
| US7102891B1 (en) * | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
| CN101938882A (en) * | 2009-06-30 | 2011-01-05 | 日立电线株式会社 | High speed transmission circuit board connection structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379841A (en) * | 2018-10-29 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its board structure of circuit and BGA Package mould group |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120627 |