CN102509523A - Display module - Google Patents
Display module Download PDFInfo
- Publication number
- CN102509523A CN102509523A CN201110396698XA CN201110396698A CN102509523A CN 102509523 A CN102509523 A CN 102509523A CN 201110396698X A CN201110396698X A CN 201110396698XA CN 201110396698 A CN201110396698 A CN 201110396698A CN 102509523 A CN102509523 A CN 102509523A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- display module
- dissipation film
- circuit board
- back frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 34
- 239000011889 copper foil Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Planar Illumination Modules (AREA)
Abstract
A display module comprises a metal back frame, a backlight module, a driving circuit board and a heat dissipation film. The metal back frame is provided with a bearing surface and a back surface which are opposite to each other; the backlight module comprises a reflecting plate which is arranged on the bearing surface of the metal back frame and is provided with a reflecting surface and a heat radiating surface which are opposite to each other. The driving circuit board is attached to the back of the metal back frame, the heat dissipation film is formed on the heat dissipation surface of the reflection plate, and at least one part of the heat dissipation film corresponds to the driving circuit board. Therefore, the display module can dissipate the heat energy on the driving circuit board through the heat dissipation film, and has larger heat dissipation area on the premise of not influencing the configuration space of other elements, thereby obtaining better heat dissipation effect.
Description
Technical field
The present invention relates to a kind of display module, and be particularly related to the good display module of a kind of radiating effect.
Background technology
The use of computing machine is except develop into the notebook computer from desktop computer gradually; More develop the computing machine more frivolous in recent years than notebook computer; The flat computer of just quite having popularized on the market at present (tablet personal computer is called for short Tablet PC).Flat computer is designed with touch controllable function mostly so that the user can directly carry out various function operations on screen; Compared to notebook computer, PDA and intelligent mobile phone at present; More have light and handy external form and bigger screen concurrently; Therefore, the appearance of flat computer provides user's another kind to select easily undoubtedly.
Existing flat computer uses Thin Film Transistor-LCD (thin film transistor liquid crystal display mostly; Be called for short TFT-LCD); And based on lightening consideration, the stainless steel of hollow out in the middle of the back of the body frame of backlight module (rear bezel) can use.Yet; The coefficient of heat conductivity of stainless steel is little; The area of dissipation of adding back of the body frame itself is not enough; Can't be rapidly with adjacent to the heat energy loss that electronic component produced on the drive circuit board of backlight module, thereby cause producing on the LCD significantly interval dark line (mura), or the too high problem of touch-screen glass (cover lens) surface temperature take place.
In order to address this problem, present way is between the back side of drive circuit board and back of the body frame, to stick on the efficient that the higher Copper Foil of coefficient of heat conductivity or graphite increase heat radiation.Yet; Usually be provided with parts such as battery and mainboard at the LCD back side; If add the area and the thickness of Copper Foil or graphite; Can cause the LCD size to increase and problem that other part gap is not enough, cause touch-screen to occur the phenomenon of Newton ring (Newton ' s ring) in use.In addition, be difficult to recover original outward appearance after easy fold of Copper Foil and the fold, use graphite then can cause the raising of whole cost as the media of heat radiation.Therefore, the problem that how is produced to the prior art means is improved, and is fundamental purpose of the present invention.
Summary of the invention
In view of this, the object of the invention just provides a kind of display module, and it is formed with heat dissipation film on the reflecting plate of backlight module, thereby can under the prerequisite of the volume that does not increase display module, increase the area of dissipation of backlight module effectively and improve radiating efficiency.
One embodiment of the invention propose a kind of display module, comprise metal back frame, backlight module, drive circuit board and heat dissipation film.Wherein, metal back frame has the loading end respect to one another and the back side.Backlight module comprises reflecting plate, is disposed on the loading end of metal back frame, and has reflecting surface respect to one another and radiating surface.Drive circuit board is the back side that is attached at metal back frame, and heat dissipation film then is to be formed on the radiating surface of reflecting plate, and the heat dissipation film of at least a portion corresponds to drive circuit board.
In one embodiment of this invention, above-mentioned heat dissipation film attaches or coats on this radiating surface.
In one embodiment of this invention, the coefficient of heat transfer of above-mentioned heat dissipation film is greater than 200W/ (m
2K).
In one embodiment of this invention, the material of above-mentioned heat dissipation film comprises copper or graphite.
In one embodiment of this invention, above-mentioned backlight module also comprises LGP and light source, and wherein LGP is disposed at the reflecting surface top of reflecting plate, and LGP has light entrance face and light-emitting face, and light-emitting face is positioned at the reflecting surface top of reflecting plate.Light source then is to be disposed at by the light entrance face of LGP.
In one embodiment of this invention, above-mentioned drive circuit board is electrically connected to light source.
In one embodiment of this invention, the area of above-mentioned heat dissipation film is less than the area of radiating surface.
In one embodiment of this invention, above-mentioned metal back frame has vacancy section, exposes the heat dissipation film of at least a portion.
The described display module of embodiments of the invention mainly is formed with the heat dissipation film that contacts with metal back frame, and this heat dissipation film at least a portion corresponds to drive circuit board on the reflecting plate of backlight module.Therefore, the display module of embodiments of the invention can pass through heat dissipation film with the heat energy dissipation on the drive circuit board, and can under the prerequisite of the configuration space that does not influence other elements, have bigger area of dissipation, and then obtains preferable radiating effect.
For let above-mentioned and other purposes of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows.
Description of drawings
Fig. 1 is the back side vertical view of display module in the embodiments of the invention.
Fig. 2 is the front cross-sectional view of the display module of Fig. 1 along the AB line.
Fig. 3 is the back side vertical view of display module in the another embodiment of the present invention.
Fig. 4 is the back side vertical view of display module among the another embodiment of the present invention.
Wherein, description of reference numerals is following:
1,1a, 1b: display module
10: metal back frame
11: backlight module
12: drive circuit board
13,13a, 13b: heat dissipation film
14: LGP
15: light source
100: vacancy section
101: loading end
102: the back side
110: reflecting plate
111: reflecting surface
112: radiating surface
121: flexible circuit board
141: light entrance face
142: light-emitting face
Embodiment
See also Fig. 1 and Fig. 2; It develops the synoptic diagram of the embodiment of a kind of display module that for the defective of improving the prior art means and being produced for the present invention; Wherein Fig. 1 is the back side vertical view of the described display module of embodiments of the invention, and Fig. 2 is that the display module of Fig. 1 is by the sectional view of front along the A-B line.For example be to use the thin film transistor (TFT)-LCD (TFT-LCD) on flat computer (Tablet PC) at the display module described in the explanation of present embodiment 1, but the present invention is not as limit.
Can know that by Fig. 1 and Fig. 2 the described display module 1 of present embodiment comprises metal back frame 10, backlight module 11, drive circuit board 12 and heat dissipation film 13.Metal back frame 10 has the loading end 101 respect to one another and the back side 102.Backlight module 11 comprises reflecting plate 110, and reflecting plate 110 for example is to be disposed on the loading end 101 of metal back frame 10, and has reflecting surface 111 respect to one another and radiating surface 112.Drive circuit board 12 for example is the back side 102 that is attached at metal back frame 10.Heat dissipation film 13 is to be formed on the radiating surface 112 of reflecting plate 110, and the heat dissipation film 13 of at least a portion is corresponding to drive circuit board 12.In the present embodiment, the material of heat dissipation film 13 for example is that copper, graphite or other coefficient of heat transfers are greater than 200W/ (m
2K) material.
From the above; Being disposed at the heat energy that the electronic component on the drive circuit board 12 produced when start can be passed on the heat dissipation film 13 through metal back frame 10; And pass through heat dissipation film 13 with heat energy dissipation, to avoid taking place to cause the phenomenon of component wear because of centralized heat energy.In one example, under the environment of 25 ℃ of high temperature about 60 ℃ or room temperatures, display module 1 and the known display module that is not provided with heat dissipation film in comparison, its temperature can reduce about 4.4 ℃.
Below do description further with regard to the detail of the described display module 1 of present embodiment again.
As stated; See also Fig. 2; The described backlight module 11 of present embodiment also includes LGP 14 and light source 15; Wherein LGP 14 is disposed at the top of the reflecting surface 111 of reflecting plate 110, and LGP 14 has light entrance face 141 and light-emitting face 142, and wherein light-emitting face 142 is the tops that are positioned at the reflecting surface 111 of reflecting plate 110.In the present embodiment, backlight module 11 for example is the side direction incident type, that is to say, light entrance face 141 is adjacent one another are with light-emitting face 142, and light source 15 is to be disposed at by the light entrance face 141 of LGP 14, in order to emit beam to LGP 14.Can convert the light that light source 15 is sent into area source through LGP 14, so that the display panel (figure does not show) that the is disposed at the backlight module top required light source of show image to be provided.
As stated; The light source 15 of present embodiment for example is light emitting diode (light emitting diode; LED); And (flexible printed circuit, FPC) 121 drive circuit boards 12 that are electrically connected on the back side 102 of metal back frame 10 are to provide the light source 15 required electric energy that emits beam through drive circuit board 12 through flexible circuit board for it.
See also back side vertical view shown in Figure 1 again, be weight and the volume that alleviates display module 1, the metal back frame 10 of present embodiment for example is to have vacancy section 100, and vacancy section 100 exposes part heat dissipation film 13.In the present embodiment, heat dissipation film 13 is the whole scattering surfaces 112 that cover reflecting plate 110.That is to say that the area of vacancy section 100 is less than the area of heat dissipation film 13.Yet, in other embodiments, like Fig. 3 and shown in Figure 4, the area of the heat dissipation film 13a of display module 1a and the heat dissipation film 13b of display module 1b also can be respectively less than the area of radiating surface 112.For instance, the area of heat dissipation film 13a and heat dissipation film 13b for example be respectively radiating surface 112a area 1/3rd.And heat dissipation film 13a for example is that the mode with horizontal attaching or coating is formed on the radiating surface 112a, and at least a portion is arranged corresponding to drive circuit board 12.On the other hand, heat dissipation film 13b is formed on the radiating surface 112 to the mode that attaches or be coated with straight, and at least a portion is arranged corresponding to drive circuit board 12.
It should be noted that the area ratio between the heat dissipation film 13a described in Fig. 3 and Fig. 4,13b and radiating surface 112 only can change on maneuverability ground in order to the area size that heat dissipation film of the present invention is described, but actual ratio is not limited thereto.
Comprehensive above explanation can know that the described display module of embodiments of the invention is on the radiating surface of reflecting plate, to form heat dissipation film, to be located between reflecting plate and the metal back frame and to correspond to drive circuit board.Thus, the heat energy that electronic component produced on the drive circuit board just can shed on the circuit board from driving through the heat dissipation path that metal back frame and heat dissipation film constituted, and damages the electronic component on the drive circuit board to avoid centralized heat energy.And, because heat dissipation film can use the mode of attaching or the mode of coating to be formed on the radiating surface of reflecting plate, therefore can be when increasing area of dissipation, avoid the configuration space of other elements of display module is caused interference.
Though the present invention discloses as above with preferred embodiment; Right its is not that those skilled in the art are not breaking away from the spirit and scope of the present invention in order to qualification the present invention; Change and change when doing some, thus protection scope of the present invention when look enclose claim defined is as the criterion.
Claims (8)
1. display module comprises:
One metal back frame has a loading end and a back side, and wherein this loading end and this back side are against each other;
One backlight module comprises a reflecting plate, and this reflecting plate is disposed on this loading end of this metal back frame, and has a reflecting surface and a radiating surface, and wherein this reflecting surface is relative with this radiating surface;
The one drive circuit plate is attached at this back side of this metal back frame; And
One heat dissipation film is formed on this radiating surface of this reflecting plate, and this heat dissipation film of at least a portion corresponds to this drive circuit board.
2. display module as claimed in claim 1, wherein this heat dissipation film attaches or coats on this radiating surface.
3. display module as claimed in claim 1, wherein the coefficient of heat transfer of this heat dissipation film is greater than 200W/ (m
2K).
4. display module as claimed in claim 1, wherein the material of this heat dissipation film comprises copper or graphite.
5. display module as claimed in claim 1, wherein this backlight module also comprises:
One LGP is disposed at the top of this reflecting surface of this reflecting plate, and this LGP has a light entrance face and a light-emitting face, and this light-emitting face is positioned at the top of this reflecting surface; And
One light source is disposed at by this light entrance face of this LGP.
6. display module as claimed in claim 5, wherein this drive circuit board is electrically connected to this light source.
7. display module as claimed in claim 1, wherein the area of this heat dissipation film is less than the area of this radiating surface.
8. display module as claimed in claim 1, wherein this metal back frame has a vacancy section, exposes this heat dissipation film of at least a portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100140594 | 2011-11-07 | ||
| TW100140594A TWI460495B (en) | 2011-11-07 | 2011-11-07 | Display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102509523A true CN102509523A (en) | 2012-06-20 |
Family
ID=46221599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110396698XA Pending CN102509523A (en) | 2011-11-07 | 2011-11-29 | Display module |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130114290A1 (en) |
| CN (1) | CN102509523A (en) |
| TW (1) | TWI460495B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102997132A (en) * | 2012-11-19 | 2013-03-27 | 京东方科技集团股份有限公司 | Backlight source and display device |
| CN103592796A (en) * | 2012-08-17 | 2014-02-19 | 华宏新技股份有限公司 | Anisotropic heat dissipation in a backlight unit |
| CN103945675A (en) * | 2013-01-18 | 2014-07-23 | Lg电子株式会社 | Heat discharging sheet and display device including the same |
| CN104913243A (en) * | 2015-05-27 | 2015-09-16 | 武汉华星光电技术有限公司 | Backlight module |
| CN106090837A (en) * | 2016-07-27 | 2016-11-09 | 深圳天珑无线科技有限公司 | A kind of backlight module and display screen |
| CN110398861A (en) * | 2019-09-03 | 2019-11-01 | 东莞市利锦电子有限公司 | A kind of glue iron with reflector plate function |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865505B (en) * | 2012-08-31 | 2014-10-22 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device with same |
| CN109549666A (en) * | 2018-11-19 | 2019-04-02 | 飞依诺科技(苏州)有限公司 | Soakage device and hand-held ultrasound detection device |
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| CN1603890A (en) * | 2003-09-29 | 2005-04-06 | 友达光电股份有限公司 | Liquid crystal display module |
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| JP2009282515A (en) * | 2008-05-20 | 2009-12-03 | Samsung Sdi Co Ltd | Method for manufacturing plasma display device, and plasma display using the same |
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| KR101698754B1 (en) * | 2009-10-19 | 2017-01-24 | 삼성디스플레이 주식회사 | Back-light assembly and liquid crystal display device having the same |
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- 2011-11-07 TW TW100140594A patent/TWI460495B/en not_active IP Right Cessation
- 2011-11-29 CN CN201110396698XA patent/CN102509523A/en active Pending
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2012
- 2012-02-22 US US13/401,929 patent/US20130114290A1/en not_active Abandoned
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| CN1542514A (en) * | 2003-04-30 | 2004-11-03 | 友达光电股份有限公司 | Back light module |
| CN1603890A (en) * | 2003-09-29 | 2005-04-06 | 友达光电股份有限公司 | Liquid crystal display module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103592796A (en) * | 2012-08-17 | 2014-02-19 | 华宏新技股份有限公司 | Anisotropic heat dissipation in a backlight unit |
| CN102997132A (en) * | 2012-11-19 | 2013-03-27 | 京东方科技集团股份有限公司 | Backlight source and display device |
| CN103945675A (en) * | 2013-01-18 | 2014-07-23 | Lg电子株式会社 | Heat discharging sheet and display device including the same |
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| CN106090837A (en) * | 2016-07-27 | 2016-11-09 | 深圳天珑无线科技有限公司 | A kind of backlight module and display screen |
| CN110398861A (en) * | 2019-09-03 | 2019-11-01 | 东莞市利锦电子有限公司 | A kind of glue iron with reflector plate function |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI460495B (en) | 2014-11-11 |
| US20130114290A1 (en) | 2013-05-09 |
| TW201319667A (en) | 2013-05-16 |
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Legal Events
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120620 |