CN102493561A - Heat insulation board and processing method thereof - Google Patents

Heat insulation board and processing method thereof Download PDF

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Publication number
CN102493561A
CN102493561A CN2011103725343A CN201110372534A CN102493561A CN 102493561 A CN102493561 A CN 102493561A CN 2011103725343 A CN2011103725343 A CN 2011103725343A CN 201110372534 A CN201110372534 A CN 201110372534A CN 102493561 A CN102493561 A CN 102493561A
Authority
CN
China
Prior art keywords
heat insulation
insulation board
main body
heat insulating
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011103725343A
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Chinese (zh)
Inventor
李金峰
赵永海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2011103725343A priority Critical patent/CN102493561A/en
Publication of CN102493561A publication Critical patent/CN102493561A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a heat insulation board and a processing method for same. The heat insulation board comprises a body, and is characterized in that a reinforcing layer is formed on one side of the body at least, and the reinforcing layer comprises irregular projections and is 3mm in thickness. The reinforcing layer is formed by drying and forming the heat insulation board and using a steel brush to brush one side of the body. The heat insulation board has the advantages that the heat insulation board is easy in mounting, less prone to shedding and fine in heat insulating effect.

Description

Heat insulating board and processing method thereof
Technical field
The present invention relates to a kind of heat insulating board and processing method thereof, be mainly used in the skin of building, play the effect of heat-insulation and heat-preservation.
Background technology
The prior art heat insulating board, along with the condition of outside, like Exposure to Sunlight, wind etc., is not easy well to be fixed on the body of wall because external surface all is smooth contacting use with body of wall when, comes off easily.
Summary of the invention
For overcoming the defective of prior art, the present invention provide a kind of can easy mounting, and do not allow caducous heat insulating board and processing method thereof.Technical scheme of the present invention is: a kind of heat insulating board, comprise main body, and it is characterized in that: the side in said main body forms enhancement layer at least.
Described enhancement layer is irregular convexity.
Described enhancement layer thickness is 3mm.
A kind of processing method of heat insulating board is characterized in that: the warming plate main body through after the drying forming, is carried out wiper through steel brush in a side of main body, form enhancement layer.
Advantage of the present invention: easy mounting, and difficult drop-off, heat insulation and preservation effect is good.
Description of drawings
Fig. 1 is an agent structure sectional view of the present invention.
  
The specific embodiment
Referring to Fig. 1, the present invention relates to a kind of heat insulating board, comprise main body 1; Side in said main body 1 forms enhancement layer 2, can certainly be provided with two sides, and a side contacts with body of wall; Opposite side contacts with decorative layer, and fixed effect is better, and described enhancement layer 2 is the irregular convexities that form later on through the steel brush wiper; The frictional force on the surface of main body is just compared does not like this have protruding warming plate to increase, and the thickness of described enhancement layer 2 is 3mm.
A kind of processing method of heat insulating board; The warming plate main body is mixed by perlite, water glass and the white glue with vinyl weight ratio according to 3:1:1; Be made through common process such as stirring, heating, extruding, oven dry; The warming plate main body through after the drying forming, is carried out wiper through steel brush in a side of main body 1, form enhancement layer 2.

Claims (4)

1. a heat insulating board comprises main body, it is characterized in that: the side in said main body forms enhancement layer at least.
2. heat insulating board according to claim 1 is characterized in that: described enhancement layer is irregular convexity.
3. heat insulating board according to claim 1 and 2 is characterized in that: described enhancement layer thickness is 3mm.
4. the processing method of a heat insulating board is characterized in that: the warming plate main body through after the drying forming, is carried out wiper through steel brush in a side of main body, form enhancement layer.
CN2011103725343A 2011-11-22 2011-11-22 Heat insulation board and processing method thereof Pending CN102493561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011103725343A CN102493561A (en) 2011-11-22 2011-11-22 Heat insulation board and processing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011103725343A CN102493561A (en) 2011-11-22 2011-11-22 Heat insulation board and processing method thereof

Publications (1)

Publication Number Publication Date
CN102493561A true CN102493561A (en) 2012-06-13

Family

ID=46185415

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011103725343A Pending CN102493561A (en) 2011-11-22 2011-11-22 Heat insulation board and processing method thereof

Country Status (1)

Country Link
CN (1) CN102493561A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11256719A (en) * 1998-03-13 1999-09-21 Ig Tech Res Inc Building panel
CN2494850Y (en) * 2001-08-16 2002-06-12 济南大学 Fibre reinforced polymer mortar foamed plastic outer wall thermal insulation board
CN2844257Y (en) * 2005-10-26 2006-12-06 吴世魁 The metope plastic foamboard
CN101054821A (en) * 2007-06-04 2007-10-17 金东升 Heat-insulating external wall panel
CN201521055U (en) * 2009-08-19 2010-07-07 张红国 Acoustic insulation wallboard and light steel keel acoustic insulation wall formed thereby
CN101962972A (en) * 2010-10-26 2011-02-02 战先金 Polyurethane rigid foam board and continuous molding production process thereof
CN201874103U (en) * 2010-08-30 2011-06-22 乌鲁木齐联合恒利建筑节能工程技术有限公司 Supercritical CO2 expanded environmentally friendly polystyrene extrusion insulation board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11256719A (en) * 1998-03-13 1999-09-21 Ig Tech Res Inc Building panel
CN2494850Y (en) * 2001-08-16 2002-06-12 济南大学 Fibre reinforced polymer mortar foamed plastic outer wall thermal insulation board
CN2844257Y (en) * 2005-10-26 2006-12-06 吴世魁 The metope plastic foamboard
CN101054821A (en) * 2007-06-04 2007-10-17 金东升 Heat-insulating external wall panel
CN201521055U (en) * 2009-08-19 2010-07-07 张红国 Acoustic insulation wallboard and light steel keel acoustic insulation wall formed thereby
CN201874103U (en) * 2010-08-30 2011-06-22 乌鲁木齐联合恒利建筑节能工程技术有限公司 Supercritical CO2 expanded environmentally friendly polystyrene extrusion insulation board
CN101962972A (en) * 2010-10-26 2011-02-02 战先金 Polyurethane rigid foam board and continuous molding production process thereof

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Application publication date: 20120613