CN102485939A - Plated film member and its preparation method - Google Patents
Plated film member and its preparation method Download PDFInfo
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- CN102485939A CN102485939A CN2010105702661A CN201010570266A CN102485939A CN 102485939 A CN102485939 A CN 102485939A CN 2010105702661 A CN2010105702661 A CN 2010105702661A CN 201010570266 A CN201010570266 A CN 201010570266A CN 102485939 A CN102485939 A CN 102485939A
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Abstract
The invention provides a plated film member, which comprises a matrix, a priming coat which is formed on the surface of the matrix, a gradient film layer which is formed on the surface of the priming coat and a hard coat which is formed on the surface of the gradient film layer, the priming coat is a Ni-Cr alloy layer, the gradient film layer is a Ni-CrC layer, the hard coat is a Hf-C layer. The plated film member has the advantages that the film system of the plated film member possesses good transition layer by layer, the bonding force between films is good, no obvious stress in the film is generated, under the condition of applying external force, the plated film does not fail due to internal stress defect, the service life of the plated film member can be effectively enhanced, the plated film member possesses high hardness. In addition, the invention also provides a method for preparing the plated film member.
Description
Technical field
The present invention relates to a kind of plated film spare and preparation method thereof.
Background technology
Transition metal nitride, carbide and carbonitride have high firmness, high wear resistance and good excellent properties such as chemicalstability.Therefore, usually transition metal nitride, carbide and carbonitride are plated on cutter or die surface with the form of film, improve the work-ing life of cutter and mould with this.
But in the preparation process of this type of plated film spare, because the thermal expansivity between hard film layer and matrix differs bigger, and the composition of the rete of different components and structure have obvious variation; There is inevitable thermal stresses between rete; The internal stress that lattice match is brought, these stress often can not be eliminated after film preparation is accomplished, thereby rete and basal body binding force are relatively poor; Film is in use peeled off easily, thereby has influenced the work-ing life and the range of application thereof of this type of plated film spare.
Summary of the invention
In view of this, be necessary to provide a kind of plated film spare that effectively addresses the above problem.
In addition, also be necessary to provide a kind of method for preparing above-mentioned plated film spare.
A kind of plated film spare; The hard layer that it comprises matrix, is formed at the prime coat of matrix surface, is formed at the gradient film on prime coat surface and is formed at the gradient film surface; This prime coat is the Ni-Cr alloy layer, and this gradient film is the Ni-CrC layer, and this hard layer is the Hf-C layer.
A kind of preparation method of plated film spare, it comprises the steps:
Matrix is provided;
Form prime coat at matrix surface, this prime coat is the Ni-Cr alloy layer;
Surface at prime coat forms gradient film, and this gradient film is the Ni-CrC layer;
Surface at gradient film forms hard layer, and this hard layer is the Hf-C layer.
Plated film spare of the present invention at the surface deposition Ni-Cr of matrix alloy layer as prime coat; Again at the surface deposition Ni-CrC of prime coat layer as gradient film; Again at the surface deposition Hf-C of gradient film layer as hard layer, film is that successively transition is better, good bonding strength between the rete and rete inside do not have obvious stress to produce; Applying under the situation of external force like this; The rete that is plated can not cause losing efficacy because of the good and/or not inner stress defective of bonding force, has improved the work-ing life of plated film spare effectively, and has made plated film spare have higher hardness.
Description of drawings
Fig. 1 is the sectional view of the present invention's one preferred embodiment plated film spare.
The main element nomenclature
Plated film spare 10
Embodiment
See also Fig. 1, the present invention's one preferred embodiments plated film spare 10 comprises matrix 11, be formed at matrix 11 surfaces prime coat 13, be formed at the gradient film 15 on prime coat 13 surfaces and be formed at the hard layer 17 on gradient film 15 surfaces.
This matrix 11 is for containing the stainless steel of at least a element among Ni, the Cr.
This prime coat 13 can magnetron sputtering mode form.This prime coat 13 is the Ni-Cr alloy layer.The thickness of this prime coat 13 can be 100～300nm.
This gradient film 15 can magnetron sputtering mode form.This gradient film 15 is the Ni-CrC layer.The C atom content is by increasing in gradient near prime coat 13 to the direction away from prime coat 13 in the said gradient film 15.The thickness of this gradient film 15 can be 400～500nm.
This hard layer 17 can magnetron sputtering mode form.This hard layer 17 is hafnium carbide (Hf-C) layer.The thickness of this hard layer 17 can be 500～800nm.
The total thickness of said prime coat 13, gradient film 15 and hard layer 17 is 1～2 μ m.
The preparation method of the plated film spare 10 of the present invention's one preferred embodiments, it may further comprise the steps:
Matrix 11 is provided, matrix 11 is put into the ultrasonic cleaner that is loaded with absolute ethyl alcohol and/or acetone soln shake cleaning, to remove the impurity and the greasy dirt on matrix 11 surfaces.Dry for standby after cleaning finishes.
Argon plasma is carried out on the surface of the matrix after above-mentioned processing 11 clean,, and improve matrix 11 surfaces and follow-up coating's adhesion with the greasy dirt on further removal matrix 11 surfaces.Concrete operations and processing parameter that this plasma body cleans are: adopt magnetron sputtering coating equipment (figure does not show), matrix 11 is fixed on the pivoted frame in the coating chamber of this coating equipment, vacuumizing said coating chamber to vacuum tightness is 3.0 * 10
-3Pa, in coating chamber, feeding purity with the flow of 400～600sccm (standard state ml/min) is 99.999% argon gas, and apply-500～-800V be biased in matrix 11, plasma clean is carried out on matrix 11 surfaces, scavenging period is 3～10min.
After matrix 11 is carried out plasma clean, in said coating equipment, adopt the magnetron sputtering embrane method in the said prime coat 13 of matrix 11 surface depositions.This prime coat 13 is a Ni Cr layer.The concrete operations and the processing parameter that form said prime coat 13 are following: be working gas with the argon gas; The flow of regulating argon gas is 200～400s ccm; The power supply that is installed on the Ni-Cr alloys target in the said coating chamber is opened in heating coating chamber to 100～200 ℃ (being that coating temperature is 100～200 ℃), and the power that this Ni-Cr alloys target is set is 2～5kw; To matrix 11 apply-100～-bias voltage of 300V, deposit said prime coat 13.The time that deposits this prime coat 13 is 20～60min.Wherein, the quality percentage composition of Ni is 20～80% in the said Ni-Cr alloys target.
The said gradient film 15 of deposition on said prime coat 13.This gradient film 15 is the Ni-CrC layer.The C atom content is by increasing in gradient near prime coat 13 to the direction away from prime coat 13 in the said gradient film 15.The concrete operations and the processing parameter that form said gradient film 15 are following: be working gas with the argon gas, regulate argon flow amount to 300～500sccm, the purity that in coating chamber, feeds initial flow again and be 20～40sccm is 99.8% reactant gases acetylene; The power that said Ni-Cr alloys target is set is 2～5kw, and it is constant to keep said coating temperature to reach the bias voltage that matrix 11 is applied, sedimentation gradient rete 15.In the process of sedimentation gradient rete 15, every deposition 2～5min increases 15～20sccm with the flow of acetylene, when the flow of acetylene arrives 300sccm, stops to increase the acetylene flow.The time that deposits this gradient film 15 is 20～60min.
Close the power supply of said Ni-Cr alloys target target, open the power supply that has been installed on hafnium (Hf) target in the coating chamber, it is 2～5kw that its power is set; With the argon gas is working gas; The flow of regulating argon gas is 300～500sccm, is reactant gases with acetylene, and it is 30～200sccm that its flow is set; It is constant and coating temperature is constant, the hard layer 17 of deposition Hf-C on said gradient film 15 to keep putting on the bias voltage of matrix 11.The time that deposits this hard layer 17 is 30～120min.Wherein, the purity of said hafnium target is about 99%.
Close the power supply of negative bias and hafnium target, stop to feed argon gas and acetylene, treat 17 coolings of said hard layer after, bubbling air in plated film is opened the coating chamber door, takes out the matrix 11 that plating has prime coat 13, gradient film 15 and hard layer 17.
Preferred embodiments plated film spare 10 of the present invention at the surface deposition Ni-Cr of matrix 11 alloy layer as prime coat 13; Again at the surface deposition Ni-CrC of prime coat 13 layer as gradient film 15; Again at the surface deposition Hf-C of gradient film 15 layer as hard layer 17, film is that successively transition is better, good bonding strength between the rete and rete inside do not have obvious stress to produce; Applying under the situation of external force like this; The rete that is plated can not cause losing efficacy because of the good and/or not inner stress defective of bonding force, has improved the work-ing life of plated film spare 10 effectively, and has made plated film spare 10 have higher hardness.
Claims (10)
1. plated film spare; The hard layer that it comprises matrix, is formed at the prime coat of matrix surface, is formed at the gradient film on prime coat surface and is formed at the gradient film surface; It is characterized in that: this prime coat is the Ni-Cr alloy layer, and this gradient film is the Ni-CrC layer, and this hard layer is the Hf-C layer.
2. plated film spare as claimed in claim 1 is characterized in that: the C atom content is by increasing in gradient near prime coat to the direction away from prime coat in the said gradient film.
3. plated film spare as claimed in claim 1 is characterized in that: said prime coat, gradient film and hard layer form through the magnetron sputtering embrane method respectively.
4. plated film spare as claimed in claim 1 is characterized in that: the thickness of said prime coat is 100～300nm, and the thickness of said gradient film is 400～500nm, and the thickness of said hard layer is 500～800nm.
5. plated film spare as claimed in claim 1 is characterized in that: said matrix is the stainless steel that contains at least a element among Ni, the Cr.
6. the preparation method of a plated film spare, it comprises the steps:
Matrix is provided;
Form prime coat at matrix surface, this prime coat is the Ni-Cr alloy layer;
Surface at prime coat forms gradient film, and this gradient film is the Ni-CrC layer;
Surface at gradient film forms hard layer, and this hard layer is the Hf-C layer.
7. the preparation method of plated film spare as claimed in claim 6 is characterized in that: the step of said formation prime coat adopts following mode to realize: adopt magnetron sputtering method, use the Ni-Cr alloys target; The power of Ni-Cr alloys target is 2～5kw; With the argon gas is working gas, and argon flow amount is 200～400sccm, the bias voltage that puts on matrix is-100～-300V; It is 100～200 ℃ that heating makes the temperature of matrix, and the plated film time is 20～60min.
8. the preparation method of plated film spare as claimed in claim 6 is characterized in that: the step of said formation gradient film adopts following mode to realize: adopt magnetron sputtering method, use the Ni-Cr alloys target, the power of Ni-Cr alloys target is 2～5kw; With the argon gas is working gas; Argon flow amount is 300～500sccm, is reactant gases with acetylene, and the initial flow that acetylene gas is set is 20～40sccm; In the process of sedimentation gradient rete; Every deposition 2～5min increases 15～20sccm with the flow of acetylene, when the flow of acetylene arrives 300sccm, stops to increase the acetylene flow; The bias voltage that puts on matrix is-100～-300V, the temperature of matrix is 100～200 ℃, the plated film time is 20～60min.
9. like the preparation method of claim 7 or 8 described plated film spares, it is characterized in that: the quality percentage composition of Ni is 20～80% in the said Ni-Cr alloys target.
10. the preparation method of plated film spare as claimed in claim 6 is characterized in that: the step of said formation hard layer adopts following mode to realize: adopt magnetron sputtering method, use the hafnium target; With acetylene is reactant gases, and the acetylene flow is 30～200sccm, is working gas with the argon gas; Argon flow amount is 300～500sccm; The bias voltage that puts on matrix is-100～-300V, the temperature of matrix is 100～200 ℃, the plated film time is 30～120min.
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| CN2010105702661A CN102485939A (en) | 2010-12-02 | 2010-12-02 | Plated film member and its preparation method |
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| CN2010105702661A CN102485939A (en) | 2010-12-02 | 2010-12-02 | Plated film member and its preparation method |
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| CN102485939A true CN102485939A (en) | 2012-06-06 |
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| CN2010105702661A Pending CN102485939A (en) | 2010-12-02 | 2010-12-02 | Plated film member and its preparation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103935076A (en) * | 2013-01-23 | 2014-07-23 | 深圳富泰宏精密工业有限公司 | Shell and manufacturing method thereof |
| CN106086800A (en) * | 2016-08-03 | 2016-11-09 | 光驰科技(上海)有限公司 | The technique preparing high-performance antireflective coating on PMMA or PC material substrate |
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| BE795116A (en) * | 1972-02-08 | 1973-05-29 | Cockerill | EVAPORATION BATH FEEDING PROCESS |
| CN1043961A (en) * | 1989-08-21 | 1990-07-18 | 机械电子工业部北京机械工业自动化研究所 | Magnetic control arc ion plating method |
| CN101444985A (en) * | 2007-12-19 | 2009-06-03 | 中国人民解放军装甲兵工程学院 | Amorphous carbon coating and preparation method and application thereof |
| CN101479401A (en) * | 2006-06-27 | 2009-07-08 | 谢夫勒两合公司 | Wear-resistant coating and production method for the same |
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2010
- 2010-12-02 CN CN2010105702661A patent/CN102485939A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE795116A (en) * | 1972-02-08 | 1973-05-29 | Cockerill | EVAPORATION BATH FEEDING PROCESS |
| CN1043961A (en) * | 1989-08-21 | 1990-07-18 | 机械电子工业部北京机械工业自动化研究所 | Magnetic control arc ion plating method |
| CN101479401A (en) * | 2006-06-27 | 2009-07-08 | 谢夫勒两合公司 | Wear-resistant coating and production method for the same |
| CN101444985A (en) * | 2007-12-19 | 2009-06-03 | 中国人民解放军装甲兵工程学院 | Amorphous carbon coating and preparation method and application thereof |
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| 许辉等: "反应磁控溅射碳化铪薄膜的微结构与力学性能", 《表面技术》, no. 01, 28 February 2010 (2010-02-28) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103935076A (en) * | 2013-01-23 | 2014-07-23 | 深圳富泰宏精密工业有限公司 | Shell and manufacturing method thereof |
| CN103935076B (en) * | 2013-01-23 | 2018-04-20 | 深圳富泰宏精密工业有限公司 | Housing and preparation method thereof |
| CN106086800A (en) * | 2016-08-03 | 2016-11-09 | 光驰科技(上海)有限公司 | The technique preparing high-performance antireflective coating on PMMA or PC material substrate |
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Application publication date: 20120606 |