CN102480054B - Semi-fluid meta-material and preparation method thereof - Google Patents
Semi-fluid meta-material and preparation method thereof Download PDFInfo
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- CN102480054B CN102480054B CN 201110296179 CN201110296179A CN102480054B CN 102480054 B CN102480054 B CN 102480054B CN 201110296179 CN201110296179 CN 201110296179 CN 201110296179 A CN201110296179 A CN 201110296179A CN 102480054 B CN102480054 B CN 102480054B
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Abstract
The invention provides a semi-fluid meta-material, which comprises a plurality of arranged meta-material functional plates, wherein each meta-material functional plate consists of a dielectric substrate and a plurality of artificial microstructures arranged on the dielectric substrate; the plurality of meta-material functional plates are encapsulated in an organic resin colloid; the periphery of the organic resin colloid is in a solid state; and the inside of the organic resin colloid is in a fluid state. Meanwhile, the invention further provides a preparation method for changing a fluid meta-material. A novel design way is provided for the encapsulation of the meta-material, i.e., an organic resin in the fluid state is filled among the plurality of meta-material functional plates. A design method disclosed by the invention has more flexible material selectivity, and has outstanding advantages on certain application occasions requiring reducing electromagnetic reflection and electromagnetic loss.
Description
[technical field]
The present invention relates to super Material Field, relate to particularly super encapsulation of the materials technology.
[background technology]
Super material, English " Metamaterial " are a new academic vocabulary of 21 century physics field appearance, often appear in recent years all kinds of scientific literatures.Think that all metamaterial is " artificial composite structure or composite material with the not available extraordinary physical property of natural material " in the general document, by the structurally ordered design on the key physical yardstick of material, can break through the restriction of some apparent natural law, thereby obtain to exceed the meta-materials function of the intrinsic common character of nature.
Super material is generally folded by one or more super material function flaggies or is formed by other rule array combination, super material function plate comprises medium substrate and the array a plurality of artificial micro-structural on medium substrate, the medium substrate of existing super material is generally the organic resin substrate, such as FR4, TP1 etc., its processing technology generally is to adopt the processing technology of existing pcb board.For super material, accurately design and control by structure and arrangement regulation to artificial micro-structural, and then realize electric field or magnetic field are produced specific electromagnetic response.
Existing super encapsulation of the materials generally be with a plurality of super material function plates by machinery fix, the method such as injection molding packaging is fixed as one, between a plurality of super material function plates or be spatial joint clearance or for various fillers, can control the dielectric constant of super material monolithic as filler by selecting air (spatial joint clearance) or various dielectric material, thereby satisfy the designing requirement of various electromagnetic propertys, the material Choice and design approach more flexibly of therefore how obtaining becomes the developing direction of super material package technology.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of new Semi-fluid meta-material and preparation method thereof, for super material provides more flexibly material Choice and design approach, and the application-specific needs of satisfied super material electromagnetic property.
The present invention realizes that the technical scheme that goal of the invention adopts is, a kind of Semi-fluid meta-material, the super material function plate that comprises a plurality of arrays, a plurality of artificial micro-structural on medium substrate forms super material function plate by medium substrate and array, described a plurality of super material function plate is encapsulated in the organic resin colloid, described organic resin colloid periphery is solid-state, and inside is fluid state.
Preferably, described organic resin colloid is the thermosetting resin colloid, and described thermosetting resin colloid is epoxy resin colloid, brominated epoxy resin colloid or epoxy phenolics colloid.
Preferably, described medium substrate is the epoxy resin fiberglass plate, and described epoxy resin fiberglass plate is gone into battle and shown the artificial micro-structural of a plurality of metallic coppers.
The present invention also provides a kind of preparation method of Semi-fluid meta-material, may further comprise the steps:
A., one mould is set, is used for the organic resin glue body of moulding;
B. the inwall at described mould applies one deck organic resin curing agent, and a plurality of super material function plate arrays are fixed in the mould;
C. organic resin is injected in the described mould, the organic resin that control contacts with described organic resin curing agent solidifies, and obtains Semi-fluid meta-material after the demoulding.
Better, described a step also comprises, at inwall coating one deck release agent of described mould.
Better, described release agent is vaseline or talcum powder.
Better, in the described b step, described a plurality of super material function plates are stacked gradually be fixed in the described mould, have the interval rule of preset distance between the described super material function plate.
Better, in the described b step, in described organic resin curing agent, add organic solidified resin promoter.
Better, in the described c step, control the organic resin that contacts with described organic resin curing agent by the method for heating and solidify.
The invention has the beneficial effects as follows: for super encapsulation of the materials provides a kind of new design approach, namely adopt the organic resin of fluid state to be filled between a plurality of super material function plates, this method for designing has the following advantages:
1, common, for the material of fluid state, it has a higher dielectric constant than solid-state, and this has more flexibly selectivity for material selection of super material, namely can realize the change of its dielectric constant when not changing material itself;
2, because the packing material of super material internal is the organic resin of fluid state, the fault of construction that this is conducive to reduce super material internal makes more homogeneous of packed layer;
3, the periphery of super material and internal structure are connected more continuous, and the solid-state structure of periphery and inner fluid attitude are the same material medium, for the electromagnetic property of super material, has better matching, the continually varying dielectric constant can obtain good impedance matching, this need to lower ELECTROMAGNETIC REFLECTION at some, and the application scenario of reducing electromagnetic consumable has outstanding advantage.
[description of drawings]
Fig. 1, the external structure of mould.
Fig. 2, the cut-away view of mould.
Fig. 3, the structure cutaway view of Semi-fluid meta-material.
[embodiment]
Embodiment 1
A kind of preparation method of Semi-fluid meta-material may further comprise the steps:
A., one mould is set, be used for the molding epoxy resin colloid, the external structure of mould is referring to accompanying drawing 1, comprise mold shell 1, organic resin inlet 2 and vacuum port 3, organic resin inlet 2 is by pipeline connection epoxide-resin glue liquid container, and vacuum port 3 is communicated with pumped vacuum systems, on the one hand the air in the mold shell 1 is extracted out by pumped vacuum systems, on the other hand epoxy resin adhesive liquid is pumped in the mould, take at in-mold molding as the epoxy resin colloid;
In the present embodiment, epoxy resin adhesive liquid is mixed dimethyl formamide and EGME by following one-tenth assignment system, is made into mixed solvent, adds epoxy resin, and stirring and dissolving namely obtains epoxy resin adhesive liquid after mixing;
B. the inwall at mould applies one deck dicyandiamide as curing agent, a plurality of super material function plate arrays are fixed in the mould, the cut-away view of mould is referring to accompanying drawing 2, a plurality of super material function plate 4 stacked being fixed in the mould, form the space interval of preset distance between the super material function plate 4, the distance of this space interval can design arbitrarily according to the function of super material;
C. open pumped vacuum systems, epoxy resin adhesive liquid is injected in the mould, mould is heated, temperature is controlled at 80-130 ℃, the epoxy resin adhesive liquid that control contacts with dicy-curing agent solidifies, the epoxy resin adhesive liquid of mould inside still keeps fluid state owing to do not mix with curing agent, obtains Semi-fluid meta-material after the demoulding.
The structure cutaway view of the Semi-fluid meta-material that is made by said method is referring to accompanying drawing 3, the super material function plate 4 that comprises a plurality of arrays, a plurality of artificial micro-structural 42 on medium substrate forms super material function plate 4 by medium substrate 41 and array, a plurality of super material function plates 4 are encapsulated in the epoxy resin colloid, and the epoxy resin colloid is comprised of solid-state part 5 and the inner fluid state part 6 of periphery.As the medium substrate 41 of super material, its material can be selected the epoxy resin fiberglass plate, and super material function plate 4 can by covering copper at medium substrate 41, then be prepared the artificial micro-structural 42 with specific configuration rule and shape by etching method.
A kind of preparation method of Semi-fluid meta-material may further comprise the steps:
A., one mould is set, be used for moulding brominated epoxy resin colloid, the external structure of mould is referring to accompanying drawing 1, comprise mold shell 1, organic resin inlet 2 and vacuum port 3, organic resin inlet 2 is by pipeline connection brominated epoxy resin glue solution container, and vacuum port 3 is communicated with pumped vacuum systems, on the one hand the air in the mold shell 1 is extracted out by pumped vacuum systems, on the other hand the brominated epoxy resin glue is pumped in the mould, take at in-mold molding as the brominated epoxy resin colloid;
In the present embodiment, the brominated epoxy resin glue as solvent, adds brominated epoxy resin with acetone by following one-tenth assignment system, and stirring and dissolving namely obtains the brominated epoxy resin glue after mixing;
B. the inwall at mould at first applies one deck vaseline as release agent, and then apply one deck diaminodiphenyl-methane as curing agent, for obtaining faster curing rate, can in curing agent, add again curing accelerator triethanolamine or triethylamine or dimethylaniline, a plurality of super material function plate arrays are fixed in the mould, the cut-away view of mould is referring to accompanying drawing 2, a plurality of super material function plate 4 stacked being fixed in the mould, form the space interval of preset distance between the super material function plate 4, the distance of this space interval can design arbitrarily according to the function of super material;
C. open pumped vacuum systems, epoxy resin adhesive liquid is injected in the mould, mould is heated, temperature is controlled at 80-130 ℃, control is solidified with the brominated epoxy resin glue that the diaminodiphenyl-methane curing agent contacts with curing accelerator, the brominated epoxy resin glue of mould inside still keeps fluid state owing to do not mix with curing agent, obtains Semi-fluid meta-material after the demoulding.
The structure cutaway view of the Semi-fluid meta-material that is made by said method is referring to accompanying drawing 3, the super material function plate 4 that comprises a plurality of arrays, a plurality of artificial micro-structural 42 on medium substrate forms super material function plate 4 by medium substrate 41 and array, a plurality of super material function plates 4 are encapsulated in the brominated epoxy resin colloid, and the brominated epoxy resin colloid is comprised of solid-state part 5 and the inner fluid state part 6 of periphery.As the medium substrate 41 of super material, its material can be selected the epoxy resin fiberglass plate, and super material function plate 4 can by covering copper at medium substrate 41, then be prepared the artificial micro-structural 42 with specific configuration rule and shape by etching method.
The present invention namely adopts the organic resin of fluid state to be filled between a plurality of super material function plates for super encapsulation of the materials provides a kind of new design approach, and this method for designing has the following advantages:
1, because the organic resin glue of fluid state has higher dielectric constant than solid-state organic resin material, for this material for super material is selected, have more flexibly selectivity, namely when not changing material itself, can realize the change of its dielectric constant;
2, because the packing material of super material internal is the organic resin of fluid state, this is conducive to reduce the fault of construction of super material internal, make more homogeneous of packed layer, the solid-state organic resin of super material periphery can be realized super encapsulation of the materials simultaneously, the practical application of convenient super material;
3, the periphery of super material and internal structure are connected more continuous, and the solid-state structure of periphery and inner fluid attitude are the same material medium, for the electromagnetic property of super material, has better matching, the continually varying dielectric constant can obtain good impedance matching, this need to lower ELECTROMAGNETIC REFLECTION at some, and the application scenario of reducing electromagnetic consumable has outstanding advantage.
In the above-described embodiments, only the present invention has been carried out exemplary description, but those skilled in the art can carry out various modifications to the present invention after reading present patent application in the situation that does not break away from the spirit and scope of the present invention.
Claims (10)
1. Semi-fluid meta-material, the super material function plate that comprises a plurality of arrays, a plurality of artificial micro-structural on medium substrate forms super material function plate by medium substrate and array, it is characterized in that: the space interval that forms preset distance between the described super material function plate; Described a plurality of super material function plate is encapsulated in the organic resin colloid, and described organic resin colloid periphery is solid-state, and inside is fluid state.
2. Semi-fluid meta-material according to claim 1, it is characterized in that: described organic resin colloid is the thermosetting resin colloid.
3. Semi-fluid meta-material according to claim 2, it is characterized in that: described thermosetting resin colloid is epoxy resin colloid, brominated epoxy resin colloid or epoxy phenolics colloid.
4. according to Semi-fluid meta-material according to claim 1, it is characterized in that: described medium substrate is the epoxy resin fiberglass plate, and described epoxy resin fiberglass plate is gone into battle and shown the artificial micro-structural of a plurality of metallic coppers.
5. the preparation method of a Semi-fluid meta-material is characterized in that, may further comprise the steps:
A., one mould is set, is used for the organic resin glue body of moulding;
B. the inwall at described mould applies one deck organic resin curing agent, and a plurality of super material function plate arrays are fixed in the mould, forms the space interval of preset distance between the described super material function plate;
C. organic resin is injected in the described mould, the organic resin that control contacts with described organic resin curing agent solidifies, and obtains Semi-fluid meta-material after the demoulding.
6. the preparation method of Semi-fluid meta-material according to claim 5 is characterized in that, described a step also comprises, at inwall coating one deck release agent of described mould.
7. the preparation method of Semi-fluid meta-material according to claim 6 is characterized in that, described release agent is vaseline or talcum powder.
8. the preparation method of Semi-fluid meta-material according to claim 5 is characterized in that, in the described b step, described a plurality of super material function plates are stacked gradually is fixed in the described mould, has the interval rule of preset distance between the described super material function plate.
9. the preparation method of Semi-fluid meta-material according to claim 5 is characterized in that, in the described b step, adds organic solidified resin promoter in described organic resin curing agent.
10. the preparation method of Semi-fluid meta-material according to claim 5 is characterized in that, in the described c step, controls the organic resin that contacts with described organic resin curing agent by the method for heating and solidifies.
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Citations (4)
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|---|---|---|---|---|
| CN101276806A (en) * | 2006-05-24 | 2008-10-01 | 国际整流器公司 | Bond wireless power module with double-sided single device cooling and immersion bath cooling |
| CN102109685A (en) * | 2009-12-29 | 2011-06-29 | 中国科学院物理研究所 | Multilayer electromagnetism modulating structure and preparation method thereof |
| CN102124382A (en) * | 2008-06-19 | 2011-07-13 | 雷文布里克有限责任公司 | Optical metapolarizer device |
| JP2011158665A (en) * | 2010-01-29 | 2011-08-18 | Sony Corp | Method for manufacturing meta-material member and meta-material member |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276806A (en) * | 2006-05-24 | 2008-10-01 | 国际整流器公司 | Bond wireless power module with double-sided single device cooling and immersion bath cooling |
| CN102124382A (en) * | 2008-06-19 | 2011-07-13 | 雷文布里克有限责任公司 | Optical metapolarizer device |
| CN102109685A (en) * | 2009-12-29 | 2011-06-29 | 中国科学院物理研究所 | Multilayer electromagnetism modulating structure and preparation method thereof |
| JP2011158665A (en) * | 2010-01-29 | 2011-08-18 | Sony Corp | Method for manufacturing meta-material member and meta-material member |
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