CN102469693A - Flip chip package structure and portable communication device using same as well as process method of chip sealing compound - Google Patents
Flip chip package structure and portable communication device using same as well as process method of chip sealing compound Download PDFInfo
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- CN102469693A CN102469693A CN2010105467604A CN201010546760A CN102469693A CN 102469693 A CN102469693 A CN 102469693A CN 2010105467604 A CN2010105467604 A CN 2010105467604A CN 201010546760 A CN201010546760 A CN 201010546760A CN 102469693 A CN102469693 A CN 102469693A
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- flexible base
- adhesive layer
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Abstract
The invention relates to a flip chip package structure and a portable communication device using same as well as a process method of a chip sealing compound. The flip chip package structure comprises a soft base plate, a chip, a screening layer, and a sealing compound layer, wherein the chip is electrically connected to the soft base plate; the screening layer is configured around the chip and a gap is formed between the chip and the screening layer; the sealing compound layer is covered above the chip and is filled in the gap between the screening layer and the chip such that the chip is bonded with the soft base plate. The flip chip package structure is applied to the portable communication device, so that the process cost of the existing packaging technology can be saved and the aligning efficiency in chip bonding and the shape accuracy of the whole package can be effectively improved as well.
Description
Technical field
The present invention relates to a kind of portable communication equipment, the portable communication equipment that to relate in particular to a kind of its chip module be composite packing structure.
Background technology
Flourish along with radio communication, various communication equipment and communication products in modern times in people's the life, are played the part of indispensable role gradually.For example, the Portable communication equipment owing to have radio communication concurrently and be beneficial to portable characteristic, becomes the development main flow in market now, and wherein especially with Portable mobile phone (or claim mobile phone) for.
Generally speaking; Common mobile phone is structurally more has an important distinctive mark, its be for user's identity module (Subscriber Identity Module, SIM); Being commonly referred to " SIM ", is the smart card of preserving user's identification data of mobile phone service.After mobile phone has only and loads onto SIM, can produce effectiveness or call; In addition, SIM also can be in order to store news in brief data and telephone number.Generally speaking; SIM mainly is to be used for global mobile communication (Global System for MobileCommunications; GSM) system; But compatible module also can be used for UMTS (Universal Mobile Telecommunications System, UE UMTS) (USIM) and the digital high-efficiency network of integration (Integrated Digital Enhanced Network, phone IDEN).
Mainly be provided with a chip (Integrated Circuit on the SIM; IC); And by CPU (Central Processing Unit, CPU), read-only memory (Read-Only Memory, ROM), random access memory (Random-Access Memory; RAM), the electronics formula of erasing can be made carbon copies read-only memory (Electrically-Erasable Programmable Read-Only Memory; EEPROM) and input and output (Input/Output I/O) waits microcircuit to form, with the media of information exchange and binding between formation user and the mobile phone.Accomplish design at chip, when being engaged on the circuit flexible base plate, mostly its packaged type is the sealing adhesive process implemented again after the wire bonds (Wire Bond).It is to dispose template (Stencil) around the chip, and directly coating sealing on template, attaching chip on the circuit flexible base plate, and reaches the effect of protecting integrated circuit simultaneously.Yet because sealing thickness quality is one of SIM module critical specifications in fact, this kind sealing adhesive process is being coated with sealing qualitatively to chip, and can't reaching the effect of accurate control sealing external form.
Secondly, when adopting the sealing adhesive process of existing flex crystalline substance, be to produce eutectic phase through hot pressing; This technological temperature is up to 400 ℃; The thermal expansion effects that not only can cause flexible base plate to extend, the bit errors when increasing chip join, external form precision after the overall package and yield are also not as expection.
Be with, in sum, how to propose a kind ofly in order to solve above-mentioned existing issue and disappearance, to have the sealing adhesive process method of better quality, be to develop one of research direction important on the evolution now for association area person.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of composite packing structure that is suitable for the portable communication equipment chip, and the process of chip sealing, to solve the existing problem that exists.
The present invention proposes a kind of process of chip sealing, comprises step: a flexible base plate is provided; Dispose a chip on flexible base plate; Form a barrier layer around chip, form a gap between barrier layer and the chip; And cover an adhesive layer on chip.Wherein, adhesive layer is filled out the gap of closing between barrier layer and the chip, makes chip and flexible base plate stick together each other.
The present invention also proposes a kind of composite packing structure, comprising: a flexible base plate, a chip, a barrier layer and an adhesive layer.Wherein, chip is electrically connected at flexible base plate; Barrier layer be disposed at chip around, and and chip between form a gap; Adhesive layer is covered on the chip, and adhesive layer fills out the gap of closing between barrier layer and the chip, makes chip and flexible base plate stick together each other.
According to composite packing structure of the present invention, wherein adhesive layer can be the liquid glue point glue of an epoxy resin and is formed on the chip.
The present invention proposes a kind of portable communication equipment in addition, comprises a main body and a composite packing structure, and wherein composite packing structure is disposed at body interior, carries out a communication function according to this to make portable communication equipment.Composite packing structure comprises: a flexible base plate, a chip, a barrier layer and an adhesive layer.Wherein, chip is electrically connected at flexible base plate; Barrier layer be disposed at chip around, and and chip between form a gap; Adhesive layer is covered on the chip, and adhesive layer fills out the gap of closing between barrier layer and the chip, makes chip and flexible base plate stick together each other.
So the portable communication equipment that proposes according to the present invention, and the process of composite packing structure and chip sealing are the gaps of passing through earlier between barrier layer formation and the chip, are coated with adhesive layer again among this gap, to bind chip and flexible base plate.
The object of the invention comprises, can be under the prerequisite of saving lengthy and tedious program of technology and cost, and preferable when effectively reaching chip join to bit rate, with the external form precision of overall package.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the process according to the sealing of one embodiment of the invention chip, its flow chart of steps;
Fig. 2 A is the schematic top plan view according to the composite packing structure of the embodiment of the invention;
Fig. 2 B is the schematic side view according to the composite packing structure of the embodiment of the invention;
Fig. 3 is the portable communication equipment according to further embodiment of this invention, its structural representation.
Wherein, Reference numeral
12 electrical pins
14 contacts
202 flexible base plates
204 chips
206 barrier layers
208 adhesive layers
300 main bodys
302 flexible base plates
304 SIM chips
310 composite packing structures
Embodiment
Below in execution mode, be described in detail detailed features of the present invention and advantage; Its content is enough to make any those skilled in the art to understand technology contents of the present invention and implements according to this; And according to content, the claim scope and graphic that this specification disclosed, any those skilled in the art can understand purpose and the advantage that the present invention is correlated with easily.
Fig. 1 is the process according to the sealing of one embodiment of the invention chip, its flow chart of steps.Below about description of the present invention, please consult Fig. 2 A and Fig. 2 B in the lump, be respectively overlooking and schematic side view according to the composite packing structure of the embodiment of the invention.
The process of the chip sealing that the present invention proposes comprises step S102, step S104, step S106 to step S108, and it is map 2A and Fig. 2 B separately, is to be respectively flexible base plate 202 is provided; Configuring chip 204 is on flexible base plate 202; Form barrier layer 206 around chip 204; And cover adhesive layer 208 on chip 204.
Wherein, According to embodiments of the invention, flexible base plate 202 can be but be not limited to a flexible circuit board (Flexible Printed Circuit, FPC); Chip 204 can be but be not limited to be suitable for user's identity module (Subscriber Identity Module, SIM) communication chip of card.Shown in Fig. 2 B, dispose a plurality of electrical pins (pin) 12 on the side of flexible base plate 202, and a side of chip 204 corresponding flexible base plates 202 also is provided with the contact 14 that corresponds to these a plurality of electrical pins 12, to accomplish electrically conducting between the two.
Wherein, contact 14 can be the metal coupling that is arranged at a side of chip 204 corresponding flexible base plates 202, through the aluminium pad (not shown) on wiring layer and the chip 204, is connected in the electrical pin 12 on the flexible base plate 202 respectively.In this, can not only promote the compression area of flexible base plate 202, also can make chip 204 be easy to electrically be arranged on the flexible base plate 202.
Fig. 3 is the portable communication equipment according to further embodiment of this invention, its structural representation.Portable communication equipment can be but be not limited to personal mobile phone (Mobile Phone), intelligent mobile phone (Smart Phone), personal digital assistant (Personal digital assistant, PDA), flat computer portable communication equipments such as (Tablet PC).For carrying out following explanation, the portable communication equipment of the embodiment of the invention, be with personal mobile phone as following explanation, yet the kind of portable communication equipment is not as limit.
Portable communication equipment has a main body 300, and main body 300 goes up the configurable input/output devices such as screen, button, audio frequency transmitting-receiving that have in its surface, so that user's application operating.Have a composite packing structure 310 in the main body 300, it is made up of assemblies such as SIM chip 304, flexible base plates 302, carries out its communication function according to this to make portable communication equipment.Wherein, flexible base plate 302, SIM chip 304 are with the formed SIM of the composite packing structure of the last embodiment of the present invention, so no longer repeat at this with the composite packing structure 310 that forms.Therefore, in sum,, not only can form SIM, also can be applied to portable communication equipment according to this, significantly increase its industry applications with communication function according to the composite packing structure of the embodiment of the invention.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1. the process of a chip sealing is characterized in that, comprising:
One flexible base plate is provided;
Dispose a chip on this flexible base plate;
Form a barrier layer around this chip, form a gap between this barrier layer and this chip; And
Cover an adhesive layer on this chip;
Wherein, this adhesive layer fills out should this gap between barrier layer and this chip makes this chip and this flexible base plate stick together each other.
2. the process of chip sealing according to claim 1 is characterized in that, this flexible base plate is a flexible circuit board.
3. the process of chip sealing according to claim 1 is characterized in that, this adhesive layer is the liquid glue of an epoxy resin.
4. a composite packing structure is characterized in that, comprising:
One flexible base plate;
One chip is electrically connected at this flexible base plate;
One barrier layer, be disposed at this chip around, and and this chip between form a gap; And
One adhesive layer is covered on this chip, and this adhesive layer fills out should this gap between barrier layer and this chip makes this chip and this flexible base plate stick together each other.
5. composite packing structure according to claim 4 is characterized in that, this flexible base plate is a flexible circuit board.
6. composite packing structure according to claim 4 is characterized in that, this adhesive layer is the liquid glue of an epoxy resin.
7. a portable communication equipment is characterized in that, comprising:
One main body; And
One composite packing structure is disposed at this body interior, makes this portable communication equipment carry out a communication function according to this, and this composite packing structure comprises: a flexible base plate, a chip, a barrier layer and an adhesive layer, and this chip is electrically connected at this flexible base plate; This barrier layer be disposed at this chip around, and and this chip between form a gap; This adhesive layer is covered on this chip, and this adhesive layer fills out should this gap between barrier layer and this chip makes this chip and this flexible base plate stick together each other.
8. portable communication equipment according to claim 7 is characterized in that, this flexible base plate is a flexible circuit board.
9. portable communication equipment according to claim 7 is characterized in that, this adhesive layer is the liquid glue of an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105467604A CN102469693A (en) | 2010-11-12 | 2010-11-12 | Flip chip package structure and portable communication device using same as well as process method of chip sealing compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105467604A CN102469693A (en) | 2010-11-12 | 2010-11-12 | Flip chip package structure and portable communication device using same as well as process method of chip sealing compound |
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| Publication Number | Publication Date |
|---|---|
| CN102469693A true CN102469693A (en) | 2012-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105467604A Pending CN102469693A (en) | 2010-11-12 | 2010-11-12 | Flip chip package structure and portable communication device using same as well as process method of chip sealing compound |
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| CN (1) | CN102469693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110164302A (en) * | 2018-02-13 | 2019-08-23 | 元太科技工业股份有限公司 | Flexible display device and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138149A (en) * | 1981-02-20 | 1982-08-26 | Shindo Denshi Kogyo Kk | Mounting method for chip |
| US6589802B1 (en) * | 1999-12-24 | 2003-07-08 | Hitachi, Ltd. | Packaging structure and method of packaging electronic parts |
| TW200945453A (en) * | 2008-04-16 | 2009-11-01 | Kenmec Mechanical Engineering Co Ltd | Chip on film molding process |
| CN101636750A (en) * | 2007-03-23 | 2010-01-27 | 富士通株式会社 | Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method |
-
2010
- 2010-11-12 CN CN2010105467604A patent/CN102469693A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138149A (en) * | 1981-02-20 | 1982-08-26 | Shindo Denshi Kogyo Kk | Mounting method for chip |
| US6589802B1 (en) * | 1999-12-24 | 2003-07-08 | Hitachi, Ltd. | Packaging structure and method of packaging electronic parts |
| CN101636750A (en) * | 2007-03-23 | 2010-01-27 | 富士通株式会社 | Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method |
| TW200945453A (en) * | 2008-04-16 | 2009-11-01 | Kenmec Mechanical Engineering Co Ltd | Chip on film molding process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110164302A (en) * | 2018-02-13 | 2019-08-23 | 元太科技工业股份有限公司 | Flexible display device and its manufacturing method |
| CN110164302B (en) * | 2018-02-13 | 2021-08-06 | 元太科技工业股份有限公司 | Flexible display device and manufacturing method thereof |
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Application publication date: 20120523 |