CN102460667A - Method of producing electronic component mounting structure, and electronic component mounting structure - Google Patents
Method of producing electronic component mounting structure, and electronic component mounting structure Download PDFInfo
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- CN102460667A CN102460667A CN2010800254563A CN201080025456A CN102460667A CN 102460667 A CN102460667 A CN 102460667A CN 2010800254563 A CN2010800254563 A CN 2010800254563A CN 201080025456 A CN201080025456 A CN 201080025456A CN 102460667 A CN102460667 A CN 102460667A
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- circuit substrate
- resin
- electronic unit
- electronic component
- blowing agent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
Disclosed is a method of producing an electronic component mounting structure, provided with a mounting step of mounting an electronic component on a circuit board by soldering terminals connected to the electronic component to electrodes formed on a circuit board surface, a coating step of coating a liquid state curable resin composition so as to cover the soldered section on the surface of the circuit board surface formed by soldering, said liquid state curable resin composition including a curable resin and a foaming agent, a curing step of forming a cured resin by curing the liquid state curable resin composition at a temperature lower than the temperature at which the foaming agent foams, and a foaming step which causes a foaming agent to foam by heating at least a portion of the cured resin.
Description
Technical field
The present invention relates to a kind of manufacturing approach and electronic component mounted structure of electronic component mounted structure.Be specifically, relate to a kind of method that is used to make electronic component mounted structure, this electronic component mounted structure can be controlled the thickness that protection is installed in the resin cured matter of the lip-deep electronic unit of circuit substrate.
Background technology
Up to now; To be installed in the lip-deep electronic unit of circuit substrate and to make it avoid contact wetting, gas, dust, collision etc. in order to protect, known have an outer method that is coated with that coats electronic unit through the resin cured matter of epoxy resin, polyurethane, silicones, acrylic resin etc.
Again; In order to reinforce connect the braze welding joint that electronic unit is installed in the electronic component mounted structure that forms on the circuit substrate surface through upside-down mounting, also known have in the bottom completion method that is formed at the gap-filled resin solidfied material between circuit substrate surface and the electronic unit.
Patent documentation 1 discloses the resin composition for encapsulating that contains curable resin and blowing agent.By patent documentation 1 disclosed resin composition for encapsulating is can the lip-deep electronic unit of circuit substrate easily unloads and the bottom resin for filling composition of place under repair (repair exchange) with being installed in.Specifically, the braze welding joint that is connected at circuit substrate with by upside-down mounting between its surperficial electronic unit is filled the bottom filling of resin composition for encapsulating and is made its curing.And, under the situation that the electronic unit that will be installed on the circuit substrate is pulled down,, make blowing agent foam through being heated to the temperature of the blowing agent foaming in the resin cured matter.And, when the foaming through blowing agent reduces the intensity of resin cured matter,, make that easily pulling down the electronic unit that is mounted becomes possibility through making melt solder.
Again, the electronic unit of being installed on the circuit substrate in being housed in mancarried electronic aid may or sustain damage because of generations such as collision broken string.In order to suppress the damage of such broken string etc., also known have, the method for the protection overlay film that to be purpose and such ratio is easier to produce damage because of collision at the junction surface of circuit substrate surface and electronic unit part formation with the reinforcement be made up of resin cured matter.As an one of which instance, to that kind shown in Figure 3, the electronic unit 52 contain IC (integrated circuit) encapsulation 60 and lead terminal 61 is installed on circuit substrate 13 and the electronic component mounted structure 50 that obtains describes.Electronic unit 52 is inserted into the surface of lead terminal 61 from circuit substrate 13 the through hole H1 that is formed on the circuit substrate 13, is installed on the figure circuit slightly on the back side that is formed on circuit substrate 13 through adopting scolder 55 to carry out soldering afterwards.And, scolder 55 and by soldering the surface of lead terminal 61 be formed with resin cured matter 53 as the protection overlay film.As shown in Figure 3, in the smooth zone of electronic unit 52 (R1), form uniform film thickness and moderately thick resin cured matter 53 than being easier to.On the other hand, in the zone (R2) of the head portion of lead terminal 61 or the marginal portion (R3) of electronic unit 52, because the influence of interfacial tension etc. form relatively difficulty of 53 of uniform film thickness and moderately thick resin cured matters.Therefore, the easy attenuation of thickness of the resin cured matter 53 in such zone.Its result, the insulation characterisitic of the resin cured matter 53 of the part that the thickness of resin cured matter 53 is thin etc. may descend.For example, in the thickness attenuation of the resin cured matter 53 of the head portion that is formed at lead terminal 61 situation under, electric current may leak from thin part.Under the environment that high temperature wets more, the leakage of such electric current takes place especially easily.
In order to solve such problem; Also expect following such method; Promptly; After resin cured matter 53 forms, through at the such zone of the head portion (R2) of lead terminal 61 or such overlapping further other resin cured matter in zone of edge part (R3) of electronic unit 52, and make the method for thickness thickening.But in the head portion or the such fine zone of edge part of lead terminal, accurately forming overlay film through other operation is the comparison difficulty on operation, and causes productivity ratio to descend owing to having increased operation.Further, under the situation of overlapping other resin cured matter,, therefore consider it also is unfavorable from light-weighted viewpoint because weight correspondingly increases.
Patent documentation 1: Japanese Patent Laid is opened the 2007-131820 communique
Summary of the invention
The problem that invention will solve
The object of the present invention is to provide a kind of hardening resin composition that contains blowing agent in employing to coat and be installed under the situation of the lip-deep electronic unit of circuit substrate, can easily control the manufacturing approach of electronic component mounted structure of the thickness of protection overlay film.
The means of dealing with problems
One aspect of the present invention is a kind of manufacturing approach of electronic component mounted structure, and it comprises: be formed on the lip-deep electrode of circuit substrate and electronic unit is installed in the installation procedure on the circuit substrate through the terminal soldering that will be connected with electronic unit; Coating contains the liquid curing property resin combination of curable resin and blowing agent to coat the working procedure of coating of the lip-deep braze welding joint of circuit substrate that forms through soldering; Through making liquid curing property resin combination form the curing process of resin cured matter in the low temperature-curable of temperature than the blowing agent foaming; With the foamed process that makes the blowing agent foaming through at least a portion that heats resin cured matter.
Again; Other aspects of the present invention are a kind of electronic component mounted structures; It contains circuit substrate and is installed at least one electronic unit on the electrode through soldering, and said electrode is formed on the circuit substrate surface, by soldering part coated by resin cured matter; Resin cured matter is the solidfied material that contains the hardening resin composition of blowing agent and curable resin, and the blowing agent of at least a portion of resin cured matter has foamed.
Again; Another aspect of the present invention is a kind of electronic component mounted structure; It is characterized in that it comprises circuit substrate and be installed at least one electronic unit on the 1st of circuit substrate, electronic unit has the electronic unit main body and the through hole that is connected with the electronic unit main body is installed a plurality of lead terminals of usefulness; Circuit substrate has the circuit on every side of being located at each through hole from a plurality of through holes of 2 of the 1st perforations to the with on the 2nd surface; Each lead terminal is inserted into each through hole, by soldering on circuit, the 2nd surface by soldering part with and coated by resin cured matter on every side; Resin cured matter is the solidfied material that contains the hardening resin composition of blowing agent and curable resin, and the blowing agent of at least a portion of resin cured matter has foamed.
The effect of invention
Adopt the present invention, easily the controlling packet thickness of resin cured matter of the bonding part that is installed in the electronic unit on the circuit substrate of covering.
The object of the invention, characteristic, situation and advantage can be clearer through following detailed description and accompanying drawing.
Description of drawings
Figure 1A is used for the schematic section that the installation procedure to the manufacturing approach of the electronic component mounted structure 10 of this example describes.
Figure 1B is used for the schematic section that the working procedure of coating to the manufacturing approach of the electronic component mounted structure 10 of this example describes.
Fig. 1 C is used for the schematic section that the curing process to the manufacturing approach of the electronic component mounted structure 10 of this example describes.
Fig. 1 D is used for the schematic section that the foamed process to the manufacturing approach of the electronic component mounted structure 10 of this example describes.
Fig. 2 is the longitdinal cross-section diagram that is used for the effect formation that describe, schematically illustrated electronic component mounted structure 20 of the manufacturing approach of the electronic component mounted structure of this example.
Fig. 3 is the longitdinal cross-section diagram of the formation of the schematically illustrated protection overlay film that forms with the resin cured matter electronic component mounted structure in the past 50 that coats the electronic unit that is installed on circuit substrate.
Embodiment
At first, the employed liquid curing property resin combination of manufacturing approach to the electronic component mounted structure of this example is elaborated.
Liquid curing property resin combination be contain curable resin and blowing agent, be liquid hardening resin composition at normal temperatures.In addition, at normal temperatures for liquid hardening resin composition is meant, with the liquid resin of no-solvent type, or at normal temperatures with the resin dissolves of solid in solvent and the resin varnish that obtains is main component and the composition that contains blowing agent.
As the instantiation of curable resin, heat-curing resin, light-cured resin, electronic beam curing property resin etc. are arranged for example.As such curable resin, employing be the curable resin of all knowing up to now, specifically, for example form by such resinous principles such as silicones, polyurethane, acrylic resin, polyolefin, epoxy resin.From after the foamed process the stated viewpoint of controlling foamed state easily consider that the silicones of the Thermocurable in these resinous principles, the polyolefin of Thermocurable etc. are especially desirable.
As heat-curing resin, the viewpoint of the foaming from can suppress hot curing the time considers, can than after the resin of the low temperature-curable of the gas occurrence temperature of the blowing agent stated comparatively desirable.Specifically, for example, can be than the low temperature, comparatively desirable at the resin of low temperature-curable more than 20 ℃ further more than 10 ℃ of the gas occurrence temperature of blowing agent.Specifically, for example, in room temperature～100 ℃, the heat-curing resin of the low temperature curing type of ℃ such low-temperature setting is more satisfactory in room temperature～80 further.Under these circumstances, through being heated to the curing temperature lower, foam on one side can suppress blowing agent, Yi Bian make the curing of heat-curing resin carry out than the gas occurrence temperature of blowing agent.In addition, in order to make the blowing agent foaming in the resin cured matter, employed heat-curing resin also has elasticity after being preferably in curing.Specifically, the glass transition temperature of resin cured matter (Tg) is preferably than makes the low temperature of temperature of blowing agent foaming.Specifically, for example, the Tg that resin cured matter has below 100 ℃ is comparatively desirable.
As blowing agent, thereby what adopted is to produce the organic decomposition property blowing agent that gas can make the resin cured matter foaming through the temperature that is heated to regulation.Instantiation as such blowing agent; For example have for example; Celogen Az (the gas occurrence temperature: about 208 ℃, below identical), N; N '-dinitrosopentamethylene tetramine (about 205 ℃), 4, two (benzene sulfonyl hydrazide) (about 159 ℃) of 4 '-oxo, sodium acid carbonate (about 150 ℃), barium azodicarboxylate (about 245 ℃), toluene-p-sulfonyl acetone hydrazone (ア セ ト Application one パ ラ ト Le エ Application ス Le ホ two Le ヒ De ラ ゾ Application) (about 135 ℃), p-toluene sulfonylsemicarbazide (パ ラ ト Le エ Application ス Le ホ two Le セ ミ カ Le バ ジ De) (about 220 ℃), and composition thereof etc.
The gas occurrence temperature of blowing agent for example can adopt differential scanning calorimetry (DSC) to measure.Specifically, the blowing agent of weighing ormal weight is as sample, the movement of the heat of the blowing agent when utilizing dsc measurement to heat the blowing agent of institute's weighing with the programming rate of regulation.Usually, on the curve of the relation that caloric receptivity and temperature are shown, observe endothermic peak.Here, to become maximum temperature be the gas occurrence temperature to caloric receptivity.
Such organic decomposition property blowing agent produces foamed gas through decomposing in the temperature of regulation, specifically, for example produces nitrogen (N
2), carbonic acid gas (CO
2) etc.The gas occurrence temperature is not special to be limited, but the temperature of fusing point of scolder that is no more than the installation that is used for electronic unit is comparatively desirable, specifically, for example is preferably 110～210 ℃, further is preferably 120～180 ℃ scope.
The proportional total amount with respect to liquid heat-curing resin and blowing agent that contains of the blowing agent in the liquid curing property resin combination is that 0.05～45 quality % is more satisfactory, is that 1～40 quality % is desirable more, is that 5～25 quality % are especially desirable.Containing under the proportional too high situation of blowing agent in the liquid curing property resin combination, containing of curable resin proportionally relatively reduces, and therefore has the tendency that the characteristic of the adaptation etc. of resulting resin cured matter descends.On the other hand, containing under the proportional low excessively situation of the blowing agent in liquid curing property resin combination has resin cured matter and can't pass through foaming and the tendency of abundant thick filmization.
Liquid curing property resin combination also can contain additive as required.Instantiation as additive; For example have for example and solidify with catalyst, surfactant, emulsifying agent, fire retardant (phosphorus compound, halogen compounds etc.), oxidation inhibitor, antiaging agent, ultra-violet absorber, plasticizer, filling material (talcum, clay, calcium carbonate, silicon dioxide powder, aluminium oxide, carbon black, titanium oxide, iron oxide etc.), dyestuff, pigment etc.Additive can use a kind of separately or combination is used two or more.
Liquid curing property resin combination can be through mixes liquid equably curable resin and blowing agent and carry out deaeration and prepare out.In addition, in order to adjust the viscosity of liquid curing property resin combination, liquid curing property resin combination also can contain diluent.Using under the situation of diluent, considering from the viewpoint of operability, screening characteristics, levelling (レ ベ リ Application グ) property etc., more satisfactory is dilution material to contain proportional be 40～90 quality %, that better is 50～80 quality %.
Solution viscosity as liquid curing property resin combination it is desirable to 1000～100mPasec, and that better is 400～200mPasec.Under the situation of such solution viscosity, can apply as the outer underfill that is coated with material and installs on the surface of overlay electronic parts as flip-chip, therefore, can apply outer be coated with material and underfill simultaneously through an operation.In addition, solution viscosity is the value of measuring through according to the method for the lowering time of flow cup.
Then, with reference to Figure 1A～Fig. 1 D the manufacturing approach of the electronic component mounted structure of the liquid curing property resin combination that used above-mentioned that kind is carried out detailed explanation.
The manufacturing approach of the electronic component mounted structure of this example comprises: the terminal soldering through being connected with electronic unit is installed in the installation procedure on the circuit substrate being formed at the lip-deep electrode of circuit substrate with electronic unit; Coating contains the liquid curing property resin combination of curable resin and blowing agent to coat the working procedure of coating of the lip-deep braze welding joint of circuit substrate that forms through soldering; Through making liquid curing property resin combination form the curing process of resin cured matter in the low temperature-curable of temperature than the blowing agent foaming; With the foamed process that makes the blowing agent foaming through at least a portion that heats resin cured matter.
Installation procedure at the circuit substrate surface mounted electronic parts; Shown in Figure 1A, be the operation of installing for example through at the terminal of the assigned position soldered joint electronic unit 2a that is formed at the lip-deep electrode 1a of circuit substrate 3,1b, 1c, 2b, 2c as the installation region.
As the instantiation of circuit substrate, the various printed base plates that contain rigid substrates, flexible base, board etc. are arranged for example.Rigid substrates is exactly to adopt the known circuit method of formationing of photoetching process etc. on substrate surface, to form the printed circuit board of the circuit that is made up of Copper Foil etc., and the range upon range of a plurality of prepreg that fiber base material contained be dipped in the curable resin of epoxy resin etc. and form of this substrate surface are also carried out the heating and pressurizing shaping to it and obtained.Again, flexible base, board is the substrate that is formed with circuit on the surface of the heat-resistant resin film of polyimide film etc.
As the manufacturing approach of the electronic component mounted structure of this example the instantiation of the electronic unit that can use, various IC encapsulation, various resistance, various light-emitting diode, various capacitor, various connectors etc. are for example arranged for example.The quantity that is installed in the lip-deep electronic unit of circuit substrate can be one, also can be a plurality of.Usually, according to purposes a plurality of electronic units are installed.
In the not special qualification of the method for circuit substrate surface mounted electronic parts, can adopt known surface mounting method or through hole that method is installed.Specifically, following such method is for example arranged for example.The wire-bonded that the lip-deep a plurality of electrodes 7 that have fine rule through metal wire etc. will be formed on electronic unit 2a for example are connected with the lip-deep electrode 1a that is formed on circuit substrate 3 connects.Again; There is flip-chip to install for example; Promptly; The solder projection s1 of formed a plurality of overshooting shapes on the lip-deep figure that the is formed on electronic unit 2b electrode slightly carried put, make it pass through reflow soldering, engage thus being formed at accordingly on the electrode 1b on surface of circuit substrate 3 with each solder projection s1.Also there is through hole to install for example, that is, will has through hole and the lead terminal L of electronic unit 2c of a plurality of lead terminal L of usefulness is installed inserts and be formed on the through hole H2 on the circuit substrate, each lead terminal is brazed in the electrode 1c that is formed on its back side.
Then, the liquid curing property resin combination that coating is contained blowing agent describes with the working procedure of coating that coats the lip-deep braze welding joint of circuit substrate that forms through soldering.
For example; Shown in Figure 1B; Working procedure of coating is the operation that applies the liquid curing property resin combination 4 that contains blowing agent for the resin cured matter that forms the protection braze welding joint with the mode that coats braze welding joint; Said braze welding joint is through circuit substrate 3 and electronic unit 2a, 2b, and the soldering of 2c forms.In addition, at this moment, be installed in circuit substrate 3 lip-deep electronic unit 2a with embedding at coating liquid curing property resin combination 4; 2b; After the 2c, solidify, can be formed for protecting electronic unit 2a simultaneously through making liquid curing property resin combination 4; 2b, 2c avoid the resin cured matter of external environment influence.In addition, in this operation, the gap v that the electronic unit 2b that is installed by flip-chip passes through at electronic unit 2b and circuit substrate 3 is filling liquid hardening resin composition 4 further, and is supplied to the underfill that flip-chip connects.Thus, being coated with material and underfill outward all is applied on the electronic unit 2b an operation simultaneously.The coating method of liquid curing property resin combination is not special to be limited, and specifically, for example, the coating method of use coater (discharger) is arranged for example.Again; For protect the electronic unit 2c that installed by through hole by the lead terminal L of soldering; Braze welding joint through at the back side of circuit substrate 3 applies liquid curing property resin combination 4, the overlay film that the electronic unit 2c that also can form installing based on through hole and the junction surface formation of electrode 1c be made up of resin cured matter.
The coating amount of liquid curing property resin combination is not special to be limited.Specifically, for example, be preferably 10～80 μ m, more preferably 20～50 μ m.Under situation about applying to such thickness; Foamed process after solidifying can obtain the overlay film of the resin cured matter of following such thickness, promptly; Thickness in the par is preferably 20～160 μ m; 40～100 μ m more preferably are preferably 10～40 μ m at the thickness of the edge part of electronic unit or the top ends of lead terminal etc., more preferably 20～30 μ m.
Then, thus the curing process that forms resin cured matter through the temperature-curable that liquid curing property resin combination coated as above-mentioned is not foamed at blowing agent is described.
For example shown in Fig. 1 C; In this operation, be installed in circuit substrate 3 lip-deep electronic unit 2a, 2b through making coating; The braze welding joint of 2c, electronic unit 2a; 2b, the temperature-curable that the liquid curing property resin combination 4 around the installation region of each electronic unit on the outer surface of 2c and circuit substrate 3 surfaces does not foam at blowing agent forms resin cured matter 5 thus.Curing does, contains at liquid curing property resin combination 4 under the situation of heat-curing resin, makes its temperature-curable below the gas occurrence temperature that blowing agent does not foam.Again, contain at liquid curing property resin combination 4 under the situation of light-cured resin, irradiates light solidifies the light of required sufficient amount.Further, contain at liquid curing property resin combination 4 under the situation of electron beam curing resin, the electron beam of required sufficient amount is solidified in irradiating electron beam.Through such method, coated liquid curing property resin combination 4 is cured, and forms resin cured matter 5.
Then, at least a portion the foamed process of blowing agent foaming is described through heating resin cured matter 5 of formation as above-mentioned.
For example shown in Fig. 1 D; At foamed process; Through to the resin cured matter 5 that forms at curing process want increase the part of thickness, promptly heat by dotted line B area surrounded; Blowing agent that resin cured matter 5 the contained foaming in the zone that has been heated and form pore 6, resin cured matter 5 forms foaming structures.Thus, formed electronic component mounted structure 10.Because the pressure of the gas when forming pore 6, the thickness of resin cured matter 5 is increased.Like this; Under the situation of the part of wanting thick filmization that optionally only heats resin cured matter 5; Can be easily in the part of wanting reinforcement especially; Specifically, the part that forms thick overlay film in being difficult to as the top ends of the bight of electronic unit or lead terminal also can form thick protection overlay film.Thus, for the part of wanting reinforcement, or the part of wanting to form thick protection overlay film of that kind such as top ends of lead terminal, need not to apply and realize thick filmization, can form thick film portion through coating work once through other operation.
The effect of the manufacturing approach of this example here, further is described particularly.With shown in Figure 2, the electronic unit 52 that contains IC encapsulation 60 and lead terminal 61 is installed on circuit substrate 13 and the electronic component mounted structure 20 that obtains is example, be elaborated with electronic component mounted structure in the past 50 shown in Figure 3 with comparing.
The thickness of the resin cured matter 53 of the conduct protection overlay film of the electronic component mounted structure in the past 50 that the Film Thickness Ratio of the resin cured matter 12 of the conduct protection overlay film of electronic component mounted structure 20 is shown in Figure 3 is thick; In addition, electronic component mounted structure 20 is identical with in the past electronic component mounted structure 50.For electronic component mounted structure 20, the thickness thickening of the resin cured matter 12 of the zone through making resin cured matter 12 foaming, make the head portion that is formed on lead terminal 61 and the marginal portion of electronic unit 52.Thus, make that preferentially the thickness in the zone of attenuation can thickening easily owing to the influence of the interfacial tension that applies liquid curing property resin combination afterwards.Like this, after solidifying, want to increase the part of thickness, can control the thickness of resin cured matter 12 through heating.Adopt such method, do not need overlapping other protection overlay film to guarantee thick thickness.In addition; Owing to only heat established part; What for example adopt is, make heater with smaller radiator near the top of established part come direct heating established part method, or through heater overheated air is sprayed onto the method that heats on the established part etc.
Heating-up temperature in the foamed process is preferably, more than the gas occurrence temperature of blowing agent but be no more than the temperature of electronic unit and the fusing point that engages employed scolder of circuit substrate.Specifically, for example, be preferably 110～210 ℃, more preferably 120～180 ℃ scope.Again, come suitably adjustment according to the expansion ratio as purpose heating time, for example, is preferably 1～10 minute, more preferably 3～7 minutes scope.In addition, can control foamed state through heating-up temperature and heating time are changed.And expansion ratio is high more, and resin cured matter is just got over thick filmization.Though the thickness of the resin cured matter after the foaming also depends on the thickness of the resin cured matter before the foaming; But the thickness of its par is preferably 20～100 μ m; 20～95 μ m more preferably; Thickness at the top ends of lead terminal, the edge part of electronic unit etc. is preferably 20～40 μ m, more preferably 20～35 μ m.
2～8 times of apparent volume before apparent volume after being preferably foamed process by the variation of the apparent volume of the resin cured matter of the part that foamed before and after foamed process is foamed process are more preferably about 3～5 times.
In addition, in this example, only specified optionally to resin cured matter want increase the situation that the part of thickness heats, but also can heat resin cured matter integral body.Under the situation that resin cured matter integral body is heated, the circuit substrate that will be formed with resin cured matter contains at heating furnace of the temperature that is set to regulation etc. and puts hour getting final product of regulation.Under these circumstances, the whole thickness of formed resin cured matter increases through foamed process.
Embodiment
Then, specify the present invention, but the present invention is not limited by following embodiment according to embodiment.
[embodiment 1～8]
(preparation of liquid curing property resin combination)
In the present embodiment; As liquid heat-curing resin; Use be solvent-free be liquid silicone resin (trade name of DOW CORNING east beautiful (strain) system: SE-9187L, below, be called Resin A), or with the lysed solid, shaped polyolefin of diluent (special diluting agent 904 (trade name)) (trade name of Chase Inc. system: Humiseal1B51NS; Below, be called resin B).In addition, in the solution of resin B, the solid, shaped polyolefin is 1: 1 (weight ratio) with the ratio that cooperates of diluent.
And, with the ratio shown in the table 1 with the solution of Resin A or resin B and blowing agent (4,4 '-oxo two (benzene sulfonyl hydrazide); The gas occurrence temperature is about 170 ℃) mix, and implement deaeration and handle, make liquid curing property resin combination thus.In addition, the blowing agent in the table 1 to contain proportional be part by weight with respect to the blowing agent of the total amount of curable resin (solid state component conversion) and blowing agent.
(to the installation of the circuit substrate of electronic unit)
The length that will have a metal lead wire portion of terminal through erection unit is that 10mm, width are 10mm, highly carry for the IC encapsulation of 5mm and put on the circuit substrate of FR-4 type, adopts the reflow soldering of 240 ℃ of maximum temperatures to install.What adopt during joint in addition, is the scolder of Sn-3Ag-0.5Cu (fusing point 217-219 ℃).
(working procedure of coating, curing process and foamed process)
Adopt coater liquid curing property resin combination is coated to the IC encapsulation outer surface, junction surface and circuit substrate surface the zone that the IC encapsulation is installed around, to bury the IC encapsulation that is installed on the circuit substrate underground.In addition, as shown in table 1, in embodiment 1,2,5 and 7, use Resin A as curable resin, in embodiment 3,4,6 and 8, use resin B as curable resin.
And, through utilizing the heating furnace be set at 40 ℃ the circuit substrate heating of coated liquid curing property resin combination was formed resin cured matter in 60 minutes.Then, through utilizing the heating furnace that has been set at 170 ℃ that the circuit substrate heating that has formed resin cured matter was made the blowing agent foaming in the resin cured matter in 5 minutes.So, obtained electronic component mounted structure A～H that IC encapsulates on the interarea that is installed in circuit substrate, the IC encapsulation is covered by the solidfied material of foaming structure.
(evaluation)
Estimate resulting electronic component mounted structure A～H through following method.
[variation of thickness]
About the manufacturing of electronic component mounted structure A～H, measured the thickness of foamed process front and back.In addition, the thickness of solidfied material is to measure at the flat of circuit substrate and these two positions, marginal portion of IC encapsulation.
[marginal portion insulating properties]
About electronic component mounted structure A～H, on one side whether confirm through the visual generation of being fuming the when direct current that on the solidfied material of the marginal portion that is formed at the IC encapsulation, flows through on one side 50V is dripped water droplet.
[adaptation]
Carried out being formed on the gridiron pattern belt stripping test of the last solidfied material of electronic component mounted structure A～H.Specifically, adopt cutting knife and cutting knife guide rail on the overlay film that constitutes by resin cured matter of the flat of circuit substrate, to mark to have 1mm * gridiron pattern of 100 grid in 1mm four directions.And, make cellophane tape be crimped on being divided into after the tessellated zone of overlay film powerfully, the quantity of peeling off of the grid when drawing stripping adhesive tape end hastily with 45 ° angle is counted.
[table 1]
As shown in table 1, in embodiment 1～8, all be to adopt the resin cured matter constitute by the liquid resin composition that contains blowing agent to make the blowing agent foaming after sealing, thus with foamed process before thickness compare all increases to some extent of thickness behind the foamed process.
Again, use blowing agent contain proportional be the embodiment 1～4 of liquid resin composition of 1～40 quality % through making the blowing agent foaming in the solidfied material, the thickness of the solidfied material of marginal portion is the above thickness of 20 μ m.Therefore, the insulating properties of edge part is especially good.On the other hand, be that the thickness of marginal portion does not increase among the embodiment 5 and embodiment 6 of liquid resin composition of 0.01 quality % using blowing agent to contain proportional.Therefore, the insulating properties of edge part is a bit weaker.Be that the increment rate of the thickness of marginal portion is high, so the good insulating of edge part among the embodiment 7 and embodiment 8 of liquid resin composition of 50 quality % using blowing agent to contain proportional again.But because containing of blowing agent is proportional too high, so adaptation reduces slightly.
Utilizability on the industry
Adopt the manufacturing approach of electronic component mounted structure of the present invention, under the situation of the protection overlay film at the junction surface that forms protective circuit substrate and electronic unit, can easily control its thickness.Through using such manufacturing approach, can form the high protection overlay film of protective feature to be easy to operation.The protection of the electronic component mounted structure that therefore, obtains on circuit substrate, the electronic unit of IC encapsulation, resistance, light-emitting diode, capacitor, connector etc. being installed is useful.
Symbol description
1a, 1b, 1c ... Be formed on the lip-deep electrode of circuit substrate
2a, 2b, 2c, 52 ... Electronic unit
3,13 ... Circuit substrate
4 ... Liquid curing property resin combination
5,12,53 ... Resin cured matter
6 ... Pore
7 ... Be formed on the electrode on the electronic unit
10 ... Circuit substrate
20,50 ... Electronic component mounted structure
55 ... Scolder
60 ... The IC encapsulation
61 ... Lead terminal
V ... The gap of electronic unit 2b and circuit substrate 3
H1, H2 ... Through hole.
Claims (12)
1. the manufacturing approach of an electronic component mounted structure is characterized in that, comprising:
Be formed on the lip-deep electrode of circuit substrate and electronic unit is being installed in the installation procedure on the circuit substrate through the terminal soldering that will be connected with electronic unit;
Coating contains the liquid curing property resin combination of curable resin and blowing agent to coat the working procedure of coating of the lip-deep braze welding joint of said circuit substrate that forms through said soldering;
Through making said liquid curing property resin combination form the curing process of resin cured matter in the low temperature-curable of temperature than said blowing agent foaming; With
Make the foamed process of said blowing agent foaming through at least a portion that heats said resin cured matter.
2. the manufacturing approach of electronic component mounted structure as claimed in claim 1 is characterized in that, said installation procedure is that said electronic unit is surface mounted in the operation that is formed on the lip-deep electrode of said circuit substrate.
3. the manufacturing approach of electronic component mounted structure as claimed in claim 2; It is characterized in that; Said mounted on surface is to be formed at the operation that the lip-deep electrode flip-chip of said circuit substrate is installed said electronic unit, said working procedure of coating be with around outer surface that coats said electronic unit integratedly and the said braze welding joint and the mode of filling the gap of said electronic unit and said circuit substrate apply the operation of said liquid curing property resin combination.
4. the manufacturing approach of electronic component mounted structure as claimed in claim 1 is characterized in that, said installation procedure is that said electronic unit through hole is installed in the operation that is formed on the lip-deep electrode of said circuit substrate.
5. the manufacturing approach of electronic component mounted structure as claimed in claim 1 is characterized in that, said liquid curing property resin is can be at the heat-curing resin that hangs down the temperature-curable more than 20 ℃ than the blowing temperature of said blowing agent.
6. the manufacturing approach of electronic component mounted structure as claimed in claim 1 is characterized in that, after the said foamed process pass through heating and the thickness of the curable resin of the part that foamed is more than the 20 μ m.
7. the manufacturing approach of electronic component mounted structure as claimed in claim 1; It is characterized in that; Containing of the said blowing agent that said liquid curing property resin combination is comprised proportionally do, is the scope of 0.05～45 quality % with respect to the total amount of said curable resin and said blowing agent.
8. electronic component mounted structure, it contains circuit substrate and is installed at least one electronic unit on the said circuit substrate through soldering, it is characterized in that,
Said by soldering part coated by resin cured matter,
Said resin cured matter is the solidfied material that contains the hardening resin composition of blowing agent and curable resin,
The blowing agent of at least a portion of said resin cured matter has foamed.
9. electronic component mounted structure as claimed in claim 8; It is characterized in that; Said electronic unit is installed through flip-chip and is installed on the lip-deep electrode that is formed at said circuit substrate, and said resin cured matter also is filled in the gap that between said electronic unit and said circuit substrate, forms.
10. electronic component mounted structure as claimed in claim 8 is characterized in that, said electronic unit is connected with the lip-deep electrode that is formed on said circuit substrate through wire-bonded.
11. electronic component mounted structure as claimed in claim 8 is characterized in that, said electronic unit is installed on the lip-deep electrode that is formed at said circuit substrate by through hole.
12. an electronic component mounted structure, it comprises circuit substrate and is installed at least one electronic unit on the 1st of said circuit substrate, it is characterized in that,
Said electronic unit has the electronic unit main body and with the through hole that is connected with the electronic unit main body a plurality of lead terminals of usefulness is installed; Said circuit substrate has the circuit on every side of being located at said each through hole from a plurality of through holes of 2 of the 1st perforations to the with on the 2nd surface
Said each lead terminal is inserted into said each through hole, by soldering on said circuit,
Said the 2nd surface by soldering part with and coated by resin cured matter on every side,
Said resin cured matter is the solidfied material that contains the hardening resin composition of blowing agent and curable resin,
The blowing agent of at least a portion of said resin cured matter has foamed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-137230 | 2009-06-08 | ||
| JP2009137230 | 2009-06-08 | ||
| PCT/JP2010/003707 WO2010143379A1 (en) | 2009-06-08 | 2010-06-03 | Method of producing electronic component mounting structure, and electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
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| CN102460667A true CN102460667A (en) | 2012-05-16 |
| CN102460667B CN102460667B (en) | 2014-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201080025456.3A Expired - Fee Related CN102460667B (en) | 2009-06-08 | 2010-06-03 | Method of producing electronic component mounting structure, and electronic component mounting structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5523454B2 (en) |
| CN (1) | CN102460667B (en) |
| WO (1) | WO2010143379A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390693A (en) * | 2013-07-29 | 2013-11-13 | 宁晋阳光新能源有限公司 | Method for recycling main roller for solar cell slicing |
| CN103681521A (en) * | 2012-09-25 | 2014-03-26 | 英飞凌科技股份有限公司 | Semiconductor housing for smart cards |
| CN110799321A (en) * | 2017-06-26 | 2020-02-14 | 麦克赛尔控股株式会社 | Method for manufacturing circuit component and circuit component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5787148B2 (en) * | 2011-08-19 | 2015-09-30 | 日立工機株式会社 | Electric tool |
| KR101461041B1 (en) * | 2012-11-30 | 2014-11-13 | 유니콘 주식회사 | Power suppling apparatus of light emitted diode |
| JP5773976B2 (en) * | 2012-12-27 | 2015-09-02 | 三菱電機株式会社 | refrigerator |
| KR102177502B1 (en) * | 2013-11-20 | 2020-11-11 | 삼성에스디아이 주식회사 | Integrated silicone for protecting electronic devices, circuit module using the same, and the method thereof |
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- 2010-06-03 CN CN201080025456.3A patent/CN102460667B/en not_active Expired - Fee Related
- 2010-06-03 JP JP2011518276A patent/JP5523454B2/en not_active Expired - Fee Related
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| JPS63244747A (en) * | 1987-03-31 | 1988-10-12 | Toshiba Corp | Resin sealed integrated circuit device and manufacture thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103681521A (en) * | 2012-09-25 | 2014-03-26 | 英飞凌科技股份有限公司 | Semiconductor housing for smart cards |
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| CN110799321B (en) * | 2017-06-26 | 2022-06-17 | 麦克赛尔株式会社 | Method for manufacturing circuit component and circuit component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102460667B (en) | 2014-11-12 |
| JPWO2010143379A1 (en) | 2012-11-22 |
| JP5523454B2 (en) | 2014-06-18 |
| WO2010143379A1 (en) | 2010-12-16 |
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