CN102451912A - Method of manufacturing ultra fine metal powder and ultra fine metal powder manufactured by the same - Google Patents
Method of manufacturing ultra fine metal powder and ultra fine metal powder manufactured by the same Download PDFInfo
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- CN102451912A CN102451912A CN2011100851876A CN201110085187A CN102451912A CN 102451912 A CN102451912 A CN 102451912A CN 2011100851876 A CN2011100851876 A CN 2011100851876A CN 201110085187 A CN201110085187 A CN 201110085187A CN 102451912 A CN102451912 A CN 102451912A
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- China
- Prior art keywords
- sacrifice layer
- metal
- submicron metal
- exemplary embodiment
- submicron
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Abstract
Disclosed are a method of manufacturing ultra fine metal powder used for an electrode for an MLCC and ultra fine metal powder manufactured by the same. The method of manufacturing ultra fine metal powder includes: preparing a master mold in which a pattern is formed; forming a sacrificial layer by applying a polymer material on the pattern; forming a metal layer on the sacrificial layer; and forming individual ultra fine metal powder by removing the sacrificial layer and separating the metal layer from the master mold.
Description
The cross reference of related application
The priority that the korean patent application that the application requires to submit in Korea S knowledge producing region office on October 22nd, 2010 is 10-2010-0103562 number is through with reference to its disclosure is incorporated herein.
Technical field
The present invention relates to submicron metal and manufacturing approach thereof, more particularly, relate to and be used for submicron metal and the manufacturing approach thereof of MLCC with electrode etc.
Background technology
Along with the growth of the propagation of the increase of multifunction electronic product and portable electron device, the parts that assemble these electronic installations are keeping the polyfunctional miniaturization that is able to simultaneously.For example, carry out the exploitation of little, thin and jumbo multilayer ceramic capacitor (MLCC) energetically, said multilayer ceramic capacitor is the critical piece in the electronic product.
In order to increase the capacity of chip product with predetermined thickness, need to increase the dielectric constant of dielectric ceramic material, perhaps under the situation of same material, increase the electrode number of plies in the identical chips product through thinning dielectric layer and electrode layer.
For this purpose, having developed thickness recently is the ceramic green sheet below the 1 μ m, and has correspondingly increased the demand to Thin electrode layers.
In order to make Thin electrode layers, need to make the electrode powder that forms electrode layer and make to have the superfines particle.In association area,, mainly use the physical method of mechanical disintegration powder particle in order to make submicron metal.Yet physical method has limitation in the manufacturing of submicron metal.
Summary of the invention
One aspect of the present invention provides easily to make and has been used for MLCC with the method for the manufacturing submicron metal of the submicron metal of electrode etc. with by the submicron metal of its manufacturing.
According to one aspect of the present invention, the method for making submicron metal is provided, said method comprises: the master mold (master mold) of preparing wherein to have formed pattern; Through said pattern application polymeric material is formed sacrifice layer; On said sacrifice layer, form metal level; And form independent submicron metal through removing said sacrifice layer and said metal level being separated with said master mold.
Said separation can comprise through the solvent that uses the said sacrifice layer of dissolving removes sacrifice layer.
Said separation can comprise through applying ultrasonic wave and remove sacrifice layer being immersed in said sacrifice layer in the said solvent.
Said polymeric material can be ethyl cellulose, polyvinyl butyral resin (PVB) or polyvinyl alcohol (PVA).
The formation of said sacrifice layer can comprise: the polymer solution of said polymeric material has been dissolved in preparation; And said sacrifice layer is coated with said polymer solution.
Said polymeric material can be an ethyl cellulose, and the molecular weight of said polymer solution can be 40,000～200,000.
Said polymeric material can be polyvinyl butyral resin (PVB), and the molecular weight of said polymer solution can be 200,000～400,000.
The coating of said polymeric material can be carried out through spraying process, transfer coated method (tranferapplying method) or contact rubbing method.
The formation of said metal level can be carried out through sputtering method, electrocasting, thermal evaporation or electron-beam vapor deposition method.
The thickness of formed sacrifice layer can be 0.1～2 μ m.
The thickness of formed sacrifice layer can be 1%～20% with respect to the diameter of said submicron metal.
The ratio of the width/thickness of said submicron metal can be 10～200.
Said submicron metal can be nickel (Ni) powder.
Can said pattern be become and have the wherein lattice shape of projection and groove arranged alternate.
Said submicron metal can be by any manufacturing in the method for above-mentioned manufacturing submicron metal.
Description of drawings
From the following detailed description of carrying out together with accompanying drawing, will more be expressly understood above-mentioned and others, characteristic and other advantage of the present invention, wherein:
Fig. 1 is the perspective view of the submicron metal of schematically illustrated exemplary embodiment of the present invention;
Fig. 2 is the photo of the submicron metal of exemplary embodiment of the present invention;
Fig. 3 A～3D illustrates the figure that makes the method for submicron metal according to the process sequence of exemplary embodiment of the present invention separately;
Fig. 4 A is the photo that the pattern plane that exemplary embodiment of the present invention forms in master mold is shown;
Fig. 4 B is the cross-sectional picture along the line A-A ' shooting of the master mold shown in Fig. 4 A;
Fig. 5 is the photo that wherein on master pattern, forms the state of sacrifice layer of exemplary embodiment of the present invention;
Fig. 6 is the flow chart of method that the manufacturing submicron metal of exemplary embodiment of the present invention is shown.
The specific embodiment
Describe exemplary embodiment of the present invention in detail referring now to accompanying drawing.Yet the present invention can implement and not be appreciated that to be limited to embodiments set forth among this paper with many different forms.On the contrary, these embodiments are provided, have made that present disclosure will be thorough and complete, and will fully pass on scope of the present invention to those skilled in the art.In the accompanying drawings, can amplify shape and size, and will use identical Reference numeral to mark same or similar parts from start to finish for clear.
Hereinafter, will be described in detail with reference to the attached drawings exemplary embodiment of the present invention.At this moment, should be noted that Reference numeral similar when understanding accompanying drawing representes similar parts.In addition, for fear of unnecessarily bluring theme of the present invention, with cancellation and well-known function or the relevant detailed description of structure.Based on same cause, should be noted that parts more illustrated in the accompanying drawings are exaggerated, omit or schematically illustrate, and the size of each parts does not accurately reflect its actual size.
Hereinafter, will be described in detail with reference to the attached drawings exemplary embodiment of the present invention.
Fig. 1 is the perspective view of the submicron metal of schematically illustrated exemplary embodiment of the present invention, and Fig. 2 is the photo of the submicron metal of exemplary embodiment of the present invention.
With reference to Fig. 1 and 2, the submicron metal 32 of exemplary embodiment of the present invention formed have the laminar particle of respectively doing for oneself.Fig. 1 and 2 shows wherein submicron metal 32 is formed the situation with rectangle chip shape, but exemplary embodiment of the present invention is not limited thereto.Therefore, in case of necessity, submicron metal 32 can form with different shape, has chip shape as long as can form it into.
In exemplary embodiment of the present invention, the ratio of the width of submicron metal 32 (or diameter)/thickness can be 10～200.
In addition, the submicron metal 32 of exemplary embodiment of the present invention can be to be used to make nickel (Ni) powder of multilayer ceramic capacitor (hereinafter, being called MLCC) with electrode.
As stated,, can be formed uniformly the size or the thickness of submicron metal 32 when submicron metal 32 being formed when having chip shape, thus can solve submicron metal 32 particle agglomeration or form agglomerate.To be described in greater detail in the method for the manufacturing submicron metal 32 that will describe in the back.
Then, will describe the method for the manufacturing submicron metal of exemplary embodiment of the present invention in detail with reference to exemplary embodiment.From the following description of the method for making submicron metal, the configuration of electrode powder will be more obvious.
Fig. 3 A～3D illustrates the figure that makes the method for submicron metal according to the process sequence of exemplary embodiment of the present invention separately, and Fig. 6 is the flow chart of method that the manufacturing submicron metal of exemplary embodiment of the present invention is shown.
At first with reference to figure 3A, the method for the manufacturing submicron metal 32 of exemplary embodiment of the present invention has wherein formed step (S10) beginning of the master mold (not shown) of pattern 12 from preparation on the basis of Fig. 6.
Can form the master mold of exemplary embodiment of the present invention with the cylindrical drum shape, and can form pattern 12 along its peripheral surface.
Exemplary embodiment of the present invention will be described the situation that wherein on the basement membrane (base film) 10 that is attached on the master mold, forms pattern 12 along the master mold peripheral surface of cylindrical drum shape via embodiment.In this case, basement membrane 10 can be processed by PETG (PET), Merlon (PC), polypropylene (PP) etc., but is not limited thereto.
The method that in master mold (that is basement membrane), forms pattern 12 can be various.For example, can use based on the shape of pattern 12 or optical lithography (photoetching) technology of size usability photopolymer resin, and can use nano-imprint lithography (NIL) technology of utilizing ultraviolet curable resin or thermosetting resin.
In addition, the pattern 12 of exemplary embodiment of the present invention can be through using formation such as intaglio printing technology, chemical method for etching.In addition, can directly be processed in formation pattern 12 on the master mold through machinery.
Fig. 4 A is the photo that the pattern plane that exemplary embodiment of the present invention forms in master mold is shown, and Fig. 4 B is the cross-sectional picture along the line A-A ' shooting of the master mold shown in Fig. 4 A.With reference to figure 4A and 4B, form the pattern 12 of the master mold of exemplary embodiment of the present invention with lattice shape, and it is constructed make projection and groove arranged alternate.
Along with forming pattern 12 as stated, rectangle submicron metal 32 is made in the end face that can be through using all projections and the bottom surface of groove.In addition because the shape of pattern 12, the master mold of exemplary embodiment of the present invention can be through using entire area not wasting space make submicron metal 32.
Then, shown in Fig. 3 B, carry out forming on the pattern 12 in being formed at master mold the step (S11) of sacrifice layer 20.
Fig. 5 is the photo that wherein on master pattern, forms the state of sacrifice layer of exemplary embodiment of the present invention.
With reference to figure 5, when submicron metal 32 was separated with master mold, sacrifice layer 20 played the effect that in the shape that keeps submicron metal 32, easily submicron metal 32 is separated with master mold.For this purpose, the method materials used of the manufacturing submicron metal of exemplary embodiment of the present invention is dissolved in the sacrifice layer 20 of specific solvent easily.
For example, the sacrifice layer 20 of exemplary embodiment of the present invention can be processed by polymeric material.In addition, sacrifice layer 20 is by not processing with the material of submicron metal 32 reactions.
In more detail, in polymeric material, the sacrifice layer 20 of exemplary embodiment of the present invention can be processed by for example ethyl cellulose.
Ethyl cellulose has in many solvents the characteristic of decomposing easily, and said solvent such as ethanol, alcohol are like isopropyl alcohol (IPA) etc., acetone, ketone such as MEK (MEK) etc.
In addition, when forming sacrifice layer 20, can use water-soluble resin such as polyvinyl alcohol (PVA) etc.
Yet exemplary embodiment of the present invention is not limited thereto, and can use various polymeric materials, as long as said material can easily decompose in solvent and not react with submicron metal 32.For example, can use polyvinyl butyral resin (PVB), polystyrene (PS), acrylic resin etc.Perhaps, can use various phenol resins such as novolac resin.
Can form sacrifice layer 20 through the pattern 12 that uses solution 50 (polymer solution hereinafter) that solvent will dissolve polymeric material to be applied to master mold.In this case, as solvent material, can use can the dissolve polymer material and do not make the material of pattern 12 distortion that are formed on the basement membrane 10.
In addition, as the method for coated polymeric solution, can use and the physical property of polymer solution or the shape and the corresponding coating process of characteristic of pattern 12.Especially, in order on pattern 12, to be formed uniformly sacrifice layer 20, need design suitable coating process and selective polymer solution.
For example, low relatively and the pattern 12 of master mold formed when having thin size when the viscosity of polymer solution, can use spraying process as coating process.In this case, can obtain the optimal digital of the air pressure etc. of variable such as size, pressure, nozzle, and the drying property of polymer solution, on pattern 12, form sacrifice layer 20 with homogeneous thickness more through experiment.
Yet the method for the coated polymeric solution of exemplary embodiment of the present invention is not limited thereto, but can use various coating processes as using the transfer coated method of nick version typography, uses the contact rubbing method of scraping strip coating machine, roller etc.
Simultaneously, exemplary embodiment of the present invention will be described via embodiment and wherein make the situation of Ni powder as submicron metal 32.In this case, when the size (being diameter) of Ni powder can be 10 μ m when following, the optimum thickness of sacrifice layer 20 can be 0.1～2 μ m.When calculating the thickness of sacrifice layer 20 through the size of submicron metal 32, the ratio that can the thickness of sacrifice layer 20 be formed with respect to the size (diameter) of submicron metal 32 is 1～20%.
In addition, when making polymer solution, influential to the viscosity characteristics of polymer solution as the molecular weight of the polymeric material of sacrifice layer 20.Therefore, under the situation of ethyl cellulose, the molecular weight of the polymer solution of exemplary embodiment of the present invention can be about 40; 000～200,000, under the situation of PVB; The molecular weight of the polymer solution of exemplary embodiment of the present invention can be about 200,000～400,000.Yet exemplary embodiment of the present invention is not limited thereto, and considers the thickness of coating process or sacrifice layer 20, can the concentration of polymer solution be confirmed at proper level.
Simultaneously, importantly on pattern 12, form the sacrifice layer 20 of exemplary embodiment of the present invention, and can sacrifice layer 20 be formed the thickness thicker of the metal level 30 that forms than the back with suitable thickness.When forming sacrifice layer 20 too thin when (for example, 0.1 μ m below), between the separation period of metal level 30, be difficult to solvent is penetrated in the sacrifice layer 20, make to consume suitable great amount of time and energy possibly for separates metal layers 30.On the other hand, when sacrifice layer 20 forms too thickly when (more than the 2 μ m), the shape that forms submicron metal 32 unevenly following defective possibly appear:.
Then, shown in Fig. 3 C, carry out on sacrifice layer 20, forming the step (S12) of metal level 30.
As stated, exemplary embodiment of the present invention will be described via embodiment and wherein make the situation of Ni powder as submicron metal 32.Therefore, on sacrifice layer 20, form nickel (Ni) layer as metal level 30.
The thickness of the final metal level 30 that forms is under the above situation of tens μ m therein, mainly uses electrocasting.Therefore, can electrocasting be used to form the sheet metal that size is thicker than the size of submicron metal 32 or coating.
On the other hand, when forming when having the metal level 30 of minimal thickness of tens nm～a few μ m, can use physical evaporation method such as thermal evaporation, electron beam evaporation, sputter etc. as submicron metal 32.Can the metal level 30 of exemplary embodiment of the present invention be formed the thickness with 10nm～100nm through evaporation.Yet, the invention is not restricted to this.
Then, shown in Fig. 3 D, carry out metal level 30 and master mold separation steps (S 13).
Through removing the sacrifice layer 20 between master mold and metal level 30, the metal level 30 of exemplary embodiment of the present invention is separated with master mold.
For this purpose; The method of the manufacturing submicron metal 32 of exemplary embodiment of the present invention through will be wherein lamination sacrifice layer 20 and metal level 30 master mold (master molder) (hereinafter; Be called metal structure) be immersed in the specific solvent 50 (hereinafter, being called the polymer unwinds solvent) of easy dissolving sacrifice layer 20 and remove said sacrifice layer 20.
For example, when ethyl cellulose was used as polymeric material, ethyl cellulose showed excellent dissolubility in ethanol, toluene or its mixed solvent.Therefore; When metal structure being immersed in the polymer unwinds solvent 50; The sacrifice layer of being processed by ethyl cellulose 20 is easily by 50 dissolvings of polymer unwinds solvent, makes metal level 30 is separated with metal structure and said metal level 30 is as shown in fig. 1 is processed by independent submicron metal 32.
In this case, for separates metal layers 30 reposefully, the method for the formation submicron metal of exemplary embodiment of the present invention can be used ultrasonic wave.That is,, can promote the dissolving of sacrifice layer 20 through the metal structure in the polymer unwinds solvent 50 that is immersed in dissolving sacrifice layer 20 is applied ultrasonic wave.
According to the shape or the size of pattern 12, sonicated possibly be unnecessary, but when using ultrasonic wave, can more easily polymer unwinds solvent 50 be penetrated in the sacrifice layer 20, makes that the rate of dissolution of sacrifice layer 20 is faster.Therefore, in the short relatively time, carry out the step of separates metal layers.
Can apply ultrasonic wave by the ultrasonic vibrator (not shown) of independent setting.Yet, can use various devices, as long as said device can apply ultrasonic wave to the container that has wherein flooded polymer unwinds solvent 50 and metal structure.
In addition, in order easily to extract the submicron metal 32 that separates with metal structure, can use magnet in addition.
Can use the submicron metal 32 of the exemplary embodiment of making through said method of the present invention many-sidedly.
For example, mix with resinoid bond and organic solvent, can make conduction and stick with paste through submicron metal 32 with exemplary embodiment of the present invention.In this case; Can be all the alkyd resins, ethyl cellulose etc. of the organic compound during burning process, removed easily as resinoid bond, and can be with being that the terpinol, acetate of butyl carbitol, kerosene etc. of the organic compound of volatilization are used as organic solvent easily through drying process said paste suitably being given viscosity and being coated to raw cook after all.
(for example, in the time of MLCC), can the conduction of the exemplary embodiment of the present invention of above-mentioned manufacturing be stuck with paste and be used to form electrode (for example, nickel (Ni) electrode) when making electronic installation.
As stated, the submicron metal of exemplary embodiment of the present invention can be that MLCC is with nickel (Ni) electrode powder and be formed and have the uniform flat sheet shape of size.The result; When paste or electromagnetic shielding material are conducted electricity in the submicron metal manufacturing of the application of the invention exemplary embodiment; Because submicron metal has uniform-dimension, so before Technology for Heating Processing such as burning process etc., have high bulk density and the internuncial electrode layer of electrode with forming afterwards.Therefore, according to exemplary embodiment of the present invention, make MLCC form with electrode thinner in, the defective that the electrode connectivity that causes owing to high-temperature shrinkage is descended minimizes.
In addition; Method according to the manufacturing submicron metal of exemplary embodiment of the present invention; Through using pattern to make submicron metal, make it possible to freely control the shape of submicron metal, thereby make submicron metal easily with given shape.
In addition, according to exemplary embodiment of the present invention,, also can easily said submicron metal be separated with master mold through sacrifice layer even made submicron metal with very narrow thickness.As a result, according to exemplary embodiment of the present invention, separating ultra-fine metal dust and do not damage the pattern or the submicron metal of master mold easily.
On the other hand, in association area, be different from spherical powder particle, make that shape or the size of powder particle is inhomogeneous and be difficult to control the thickness of powder particle through only using mechanical processing method possibly obtain shape.This causes the aggegation of powder or the formation of agglomerate.
Yet the method for the manufacturing submicron metal of exemplary embodiment can be made the powder particle with uniform-dimension and shape and from solvent, extract the powder that disperses separately, makes it can minimize above-mentioned defective.
Simultaneously, therefore the method for the manufacturing submicron metal of the invention described above exemplary embodiment and be not limited to said method by the submicron metal of its manufacturing, can carry out various application.For example, the invention described above exemplary embodiment is described the situation that wherein forms pattern with lattice shape via embodiment, but exemplary embodiment of the present invention is not limited thereto.As a result, can form pattern like circle, triangle, rectangular shape etc. with different shape in case of necessity, thereby make corresponding submicron metal.
In addition, above-mentioned exemplary embodiment has been described the situation of wherein making electrode powder via embodiment, but exemplary embodiment of the present invention is not limited thereto.As a result, can easily exemplary embodiment of the present invention be applied to is all situations with chip shape with made wherein.
Although combined exemplary embodiment to illustrate and described the present invention, obvious to one skilled in the art, under the situation that does not deviate from the purport of the present invention that is limited by the accompanying claims and scope, can make amendment and change.
Claims (15)
1. method of making submicron metal, said method comprises:
Prepare wherein to have formed the master mold of pattern;
Through said pattern application polymeric material is formed sacrifice layer;
On said sacrifice layer, form metal level; And
Form independent submicron metal through removing said sacrifice layer and said metal level being separated with said master mold.
2. the process of claim 1 wherein that said separation comprises: the solvent through using the said sacrifice layer of dissolving is removed said sacrifice layer.
3. the method for claim 2, wherein said separation comprises: through applying ultrasonic wave and remove said sacrifice layer being immersed in said sacrifice layer in the said solvent.
4. the process of claim 1 wherein that said polymeric material is ethyl cellulose, polyvinyl butyral resin (PVB) or polyvinyl alcohol (PVA).
5. the process of claim 1 wherein that the formation of sacrifice layer comprises:
The polymer solution of said polymeric material has been dissolved in preparation; And
Said sacrifice layer is coated with said polymer solution.
6. the method for claim 5, wherein said polymeric material is an ethyl cellulose, and the molecular weight of said polymer solution is 40,000～200,000.
7. the method for claim 5, wherein said polymeric material is polyvinyl butyral resin (PVB), and the molecular weight of said polymer solution is 200,000～400,000.
8. the method for claim 5 is wherein carried out the coating of polymeric material through spraying process, transfer coated method or contact rubbing method.
9. the process of claim 1 wherein the formation of carrying out metal level through sputtering method, electrocasting, thermal evaporation or electron-beam vapor deposition method.
10. the process of claim 1 wherein that the thickness of the sacrifice layer that forms is 0.1～2 μ m.
11. the process of claim 1 wherein that the thickness of the sacrifice layer that forms is 1%～20% with respect to the diameter of said submicron metal.
12. the process of claim 1 wherein that the ratio of width/thickness of said submicron metal is 10～200.
13. the process of claim 1 wherein that said submicron metal is nickel (Ni) powder.
14. the process of claim 1 wherein that the pattern that forms has the wherein lattice shape of projection and groove arranged alternate.
15. a submicron metal, its method through the described manufacturing submicron metal of claim 1 makes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100103562A KR20120042076A (en) | 2010-10-22 | 2010-10-22 | Method of manufacturing ultra fine metal powder and ultra fine metal powder manufactured thereby |
| KR10-2010-0103562 | 2010-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102451912A true CN102451912A (en) | 2012-05-16 |
Family
ID=45973181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100851876A Pending CN102451912A (en) | 2010-10-22 | 2011-03-31 | Method of manufacturing ultra fine metal powder and ultra fine metal powder manufactured by the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120100036A1 (en) |
| KR (1) | KR20120042076A (en) |
| CN (1) | CN102451912A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107921533A (en) * | 2015-08-25 | 2018-04-17 | 田中贵金属工业株式会社 | The manufacture method of the excellent metal paste of low-temperature sintering and the metal paste |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101240751B1 (en) * | 2010-11-25 | 2013-03-07 | 삼성전기주식회사 | A method of manufacturing fine metal powder and fine metal powder manufactured thereby |
| US20140349159A1 (en) * | 2013-05-21 | 2014-11-27 | General Electric Company | Electrochemical cells and related devices |
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| DE19635085A1 (en) * | 1996-08-30 | 1998-03-05 | Eckart Standard Bronzepulver | Corrosion-stable aluminum pigments produced by physical vapor deposition and processes for their stabilization |
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2010
- 2010-10-22 KR KR1020100103562A patent/KR20120042076A/en not_active Application Discontinuation
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2011
- 2011-03-30 US US13/075,884 patent/US20120100036A1/en not_active Abandoned
- 2011-03-31 CN CN2011100851876A patent/CN102451912A/en active Pending
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| US20020023894A1 (en) * | 2000-08-23 | 2002-02-28 | Robert Rossi | Surface preparation of substances for continuous convective assembly of fine particles |
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|---|---|---|---|---|
| CN107921533A (en) * | 2015-08-25 | 2018-04-17 | 田中贵金属工业株式会社 | The manufacture method of the excellent metal paste of low-temperature sintering and the metal paste |
| CN107921533B (en) * | 2015-08-25 | 2020-05-08 | 田中贵金属工业株式会社 | Metal paste having excellent low-temperature sinterability and method for producing same |
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| Publication number | Publication date |
|---|---|
| US20120100036A1 (en) | 2012-04-26 |
| KR20120042076A (en) | 2012-05-03 |
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