CN102445246A - Thermal mass flow sensor packaging part and manufacturing method thereof - Google Patents
Thermal mass flow sensor packaging part and manufacturing method thereof Download PDFInfo
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- CN102445246A CN102445246A CN2010102984740A CN201010298474A CN102445246A CN 102445246 A CN102445246 A CN 102445246A CN 2010102984740 A CN2010102984740 A CN 2010102984740A CN 201010298474 A CN201010298474 A CN 201010298474A CN 102445246 A CN102445246 A CN 102445246A
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Abstract
The invention relates to a thermal mass flow sensor packaging part and a manufacturing method thereof. The thermal mass flow sensor packaging part comprises a flow sensor chip and a cover cap which is bonded together with the flow sensor chip, wherein a sensor sensitive region is arranged on the flow sensor chip; a micro hot source and a temperature sensor are arranged in the sensor sensitive region; a fluid runner is arranged on the cover cap; and the sensor sensitive region is arranged in the fluid runner of the cover cap. The thermal mass flow sensor packaging part and the manufacturing method thereof related in the invention can effectively improve the consistency, the stability and the reliability of the flow sensor chip performance, and can effectively reduce the packaging cost; simultaneously, the yield and the production efficiency of the product can be effectively improved.
Description
Technical field
The present invention relates to a kind of thermal mass flow sensor package and manufacturing approach thereof, relate in particular to a kind of MEMS (Micro-Electro-Mechanical Systems, MEMS) thermal mass flow sensor package and manufacturing approach thereof.
Background technology
The sensor kind that is used for the measurement gas flow is a lot, and for example closure discharge sensor, impeller flow sensor etc., their majorities are signals such as the temperature of gathering fluid, pressure, are converted into flow again.Because flowing gas state is unstable, and its flow measurement accuracy is affected.The flow sensor that appears as up to the thermal mass flow sensor has brought a revolution, has realized the purpose of direct measurement fluid mass flow, and measured value not Yin Wendu or pressure fluctuation and lose standard.
MEMS thermal mass flow sensor is based on the thermal mass flow sensor of thermal conduction study " energy equilibrium " principle, the quality of fluid and flow velocity directly with sensor on the gradient in temperature field be associated, need not the compensation of temperature and pressure.The distinct advantages that MEMS thermal mass flow sensor is possessed makes it have widely in gas monitor such as medical treatment, automobile, food and field of measurement and uses.
In recent years occurred various mass rate modules on the market in succession, yet the encapsulation of these flow module is all based on traditional method for packing.Usually; The good fluid course of etching in advance on the flow sensor chip is bonded at the flow sensor chip in the pit on the pcb board with bonding agent again, accomplishes because this series of process basic need is manual; The glue amount of bonding agent and the angular deflection of chip all are difficult to effective control; Thereby cause not of uniform size the causing of actual runner of each flow sensor chip package, the performance that this will influence flow module to some extent comprises sensitivity, range, stability and consistance.And a large amount of processing steps rely on manual completion basically in this traditional method for packing, and not only packaging efficiency is lower, and cost is also higher relatively.Above-mentioned defective has a strong impact on the application and the development of flow sensor the most at last.
Summary of the invention
Technical matters to be solved by this invention is to overcome the above-mentioned defective that existing thermal mass flow sensor package exists, and a kind of reliability is high, yield is high, cost is low thermal mass flow sensor package and manufacturing approach thereof are provided.
In order to solve the problems of the technologies described above, technical scheme proposed by the invention is:
A kind of thermal mass flow sensor package; It comprises the flow sensor chip and with flow sensor chip bonding block together; Said flow sensor chip is provided with the sensor sensing district; Said sensor sensing district is provided with low-grade fever source and temperature sensor, on the said block fluid course is set, and said sensor sensing district is positioned at the fluid course of block.
Further, in different embodiments, wherein the width of fluid course is equal to or greater than the width in sensor sensing district, and less than the width of flow sensor chip.
Further, in different embodiments, wherein the height of fluid course is less than the height of block.
Further, in different embodiments, wherein the size of fluid course is confirmed according to the measurement range of said flow sensor.
Further; In different embodiments; Wherein fluid course comprises inlet, outlet and the passage between entrance and exit; Said passage forms opening on three walls of block, wherein two openings are respectively said entrance and exit, and the 3rd opening is positioned on block and the flow sensor chip bonding wall together.
Further, in different embodiments, wherein fluid course is shaped as rectangular parallelepiped.
Further, in different embodiments, wherein the material of block is a rigid material.
Further, another aspect that the present invention relates to provides the method for the thermal mass flow sensor package that a kind of manufacturing the present invention relates to, and it includes following steps:
Earlier by predetermined requirement attenuate flow sensor chip die;
On block, form fluid course by preliminary dimension then;
Again flow sensor chip die and block are bonded together, make the sensor sensing district on the flow sensor chip be positioned at said fluid course;
With packaged wafer scribing, separate obtaining single thermal mass flow sensor package at last.
Further, in different embodiments, wherein on block, form in the step of fluid course, the size of fluid course confirms that according to the measurement range of flow sensor the mode that forms fluid course can be etching or punching press.
Further, in different embodiments, wherein in the step of wafer scribing, adopt the laser scribing mode.
Compared with prior art; The invention has the beneficial effects as follows: thermal mass flow sensor package and the manufacturing approach thereof that the present invention relates to; Be different from traditional technology through employing and guarantee that the actual runner size of each flow sensor chip package is consistent, thereby effectively improve consistance, stability and the reliability of flow sensor chip performance; And this series of process all is to operate completion automatically by machine, not only effectively lowers packaging cost, effectively improves the yield and the production efficiency of product simultaneously.
Description of drawings
Fig. 1 is the stereographic map of the thermal mass flow sensor package that the present invention relates to.
Embodiment
Specify embodiment of the present invention below in conjunction with accompanying drawing.
See also Fig. 1; A kind of thermal mass flow sensor package that the present invention relates to; It comprises flow sensor chip 1 and block 2; Wherein flow sensor chip 1 is provided with sensor sensing district 10, and sensor sensing district 10 is provided with low-grade fever source and temperature sensor (not shown), fluid course 20 is set and block a shot on 2.The material of block 2 is a rigid material, for example silicon chip, glass or polymkeric substance.
In practical application, the thermal mass flow sensor package that the present invention relates to is connected in the corresponding electrical circuits, when fluid 21 flows to passage 23 from entering the mouth,, flow out from exporting 22 at last through sensor sensing district 10, direction of flow is shown in arrow among Fig. 1.When fluid flows through sensor sensitizing range 10, the temperature field of the low-grade fever source (not shown) in the sensor sensing district 10 changes, and the temperature sensor (not shown) measurement of inductance in the sensor sensing district 10 arrives the variation in temperature field, thereby measures fluid flow.
On the other hand, the invention still further relates to a kind of method of making the thermal mass flow sensor package, it includes following steps:
Earlier by predetermined requirement attenuate flow sensor chip die;
On block 2, form fluid course 20 by preliminary dimension then;
Again flow sensor chip die and block 2 are bonded together, make the sensor sensing district 10 on the flow sensor chip 1 be positioned at said fluid course 20;
With packaged wafer scribing, separate obtaining single thermal mass flow sensor package at last.
Wherein in the step that forms fluid course 20; The concrete size of fluid course designs definite according to the measurement range of flow sensor; But the width of fluid course 20 is equal to or greater than the width in sensor sensing district 10, and less than the width of flow sensor chip 1.In addition, the generation type of fluid course 20 can be the technology that other industries such as etching or punching press are known.
In the end in the step of a scribing, what adopt usually is laser scribing, compare with traditional dicing method, laser scribing have speed fast, to the little advantage of microstructure influence.
In sum; Because that the thermal mass flow sensor package that the present invention relates to adopts is similar WLP (Wafer Level Package; Wafer level packaging) method for packing; Fluid course is arranged in the block in advance, guarantees that the actual runner size of each flow sensor chip package is consistent, thereby effectively improves consistance, stability and the reliability of flow sensor chip performance; And this series of process all is to operate completion automatically by machine, not only effectively lowers packaging cost, effectively improves the yield and the production efficiency of product simultaneously.
The above is merely preferred embodiments of the present invention; Protection scope of the present invention is not exceeded with above-mentioned embodiment; In every case those of ordinary skills' equivalence that disclosure is done according to the present invention is modified or is changed, and all should include in the protection domain of putting down in writing in claims.
Claims (10)
1. thermal mass flow sensor package; It is characterized in that: it comprise the flow sensor chip and with flow sensor chip bonding block together; Said flow sensor chip is provided with the sensor sensing district; Said sensor sensing district is provided with low-grade fever source and temperature sensor, on the said block fluid course is set, and said sensor sensing district is positioned at the fluid course of block.
2. thermal mass flow sensor package according to claim 1 is characterized in that: the width of said fluid course is equal to or greater than the width in sensor sensing district, and less than the width of flow sensor chip.
3. thermal mass flow sensor package according to claim 1 is characterized in that: the height of said fluid course is less than the height of block.
4. thermal mass flow sensor package according to claim 1 is characterized in that: the size of said fluid course is confirmed according to the measurement range of said flow sensor.
5. thermal mass flow sensor package according to claim 1; It is characterized in that: said fluid course comprises inlet, outlet and the passage between entrance and exit; Said passage forms opening on three walls of block; Wherein two openings are respectively said entrance and exit, and the 3rd opening is positioned on block and the flow sensor chip bonding wall together.
6. thermal mass flow sensor package according to claim 1 is characterized in that: said fluid course be shaped as rectangular parallelepiped.
7. thermal mass flow sensor package according to claim 1 is characterized in that: the material of said block is a rigid material.
8. method of making the described thermal mass flow sensor package of claim 1, it is characterized in that: it includes following steps:
Earlier by predetermined requirement attenuate flow sensor chip die;
On block, form fluid course by preliminary dimension then;
Again flow sensor chip die and block are bonded together, make the sensor sensing district on the flow sensor chip be positioned at said fluid course;
With packaged wafer scribing, separate obtaining single thermal mass flow sensor package at last.
9. the method for manufacturing thermal mass flow sensor package according to claim 8; It is characterized in that: in the said step that on block, forms fluid course; The size of fluid course confirms that according to the measurement range of flow sensor the mode that forms fluid course can be etching or punching press.
10. the method for manufacturing thermal mass flow sensor package according to claim 8 is characterized in that: in the step of said wafer scribing, adopt the laser scribing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102984740A CN102445246A (en) | 2010-09-30 | 2010-09-30 | Thermal mass flow sensor packaging part and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102984740A CN102445246A (en) | 2010-09-30 | 2010-09-30 | Thermal mass flow sensor packaging part and manufacturing method thereof |
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| CN102445246A true CN102445246A (en) | 2012-05-09 |
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| CN2010102984740A Pending CN102445246A (en) | 2010-09-30 | 2010-09-30 | Thermal mass flow sensor packaging part and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106959140A (en) * | 2012-06-15 | 2017-07-18 | 日立汽车系统株式会社 | Thermal flowmeter |
| CN112630465A (en) * | 2020-11-27 | 2021-04-09 | 上海应用技术大学 | MEMS (micro-electromechanical systems) thermal type flow velocity sensor packaging device |
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|---|---|---|---|---|
| CN1431470A (en) * | 2003-02-28 | 2003-07-23 | 北京大学 | Chip of piezoresistance type miniflowmeter, its preparing method and flowmeter |
| CN1900717A (en) * | 2006-03-01 | 2007-01-24 | 大连理工大学 | Heat distribution type microfluid flow sensor based on silicon cup structure |
| JP2007071687A (en) * | 2005-09-07 | 2007-03-22 | Yamatake Corp | Flow sensor |
| CN101337652A (en) * | 2008-08-11 | 2009-01-07 | 美新半导体（无锡）有限公司 | Packaging of contact surface of sensor element and packaging method thereof |
| CN201787980U (en) * | 2010-09-30 | 2011-04-06 | 美新半导体（无锡）有限公司 | Encapsulation piece for heat type mass and flow sensor |
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2010
- 2010-09-30 CN CN2010102984740A patent/CN102445246A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1431470A (en) * | 2003-02-28 | 2003-07-23 | 北京大学 | Chip of piezoresistance type miniflowmeter, its preparing method and flowmeter |
| JP2007071687A (en) * | 2005-09-07 | 2007-03-22 | Yamatake Corp | Flow sensor |
| CN1900717A (en) * | 2006-03-01 | 2007-01-24 | 大连理工大学 | Heat distribution type microfluid flow sensor based on silicon cup structure |
| CN101337652A (en) * | 2008-08-11 | 2009-01-07 | 美新半导体（无锡）有限公司 | Packaging of contact surface of sensor element and packaging method thereof |
| CN201787980U (en) * | 2010-09-30 | 2011-04-06 | 美新半导体（无锡）有限公司 | Encapsulation piece for heat type mass and flow sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106959140A (en) * | 2012-06-15 | 2017-07-18 | 日立汽车系统株式会社 | Thermal flowmeter |
| CN112630465A (en) * | 2020-11-27 | 2021-04-09 | 上海应用技术大学 | MEMS (micro-electromechanical systems) thermal type flow velocity sensor packaging device |
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Application publication date: 20120509 |