CN102435299B - Mini-type vibration sensor array and application thereof to ground target tracking - Google Patents
Mini-type vibration sensor array and application thereof to ground target tracking Download PDFInfo
- Publication number
- CN102435299B CN102435299B CN201110230882.7A CN201110230882A CN102435299B CN 102435299 B CN102435299 B CN 102435299B CN 201110230882 A CN201110230882 A CN 201110230882A CN 102435299 B CN102435299 B CN 102435299B
- Authority
- CN
- China
- Prior art keywords
- array
- vibration
- vibration sensor
- sensor
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000035939 shock Effects 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 230000001133 acceleration Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 230000003321 amplification Effects 0.000 claims 1
- 238000004458 analytical method Methods 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 8
- 238000001228 spectrum Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 238000010183 spectrum analysis Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Images
Landscapes
- Geophysics And Detection Of Objects (AREA)
Abstract
The invention relates to a mini-type vibration sensor array and application thereof to ground target tracking. The mini-type vibration sensor array is characterized in that: a plurality of same mini-type MEMS (Micro-electromechanical System) vibration sensor chips are integrated and packaged on a PCB (Printed Circuit Board) and corresponding vibration signal processing circuits are also integrated on the same PCB. The plurality of the vibration sensor chips are distributed as a cross array to form a mini-type array. When a certain ground target is measured, only a sensor is put into the plane and distance and direction of a target can be determined according to coordinates of each array element of the sensor and time correlations of each output signal; and the type of the target can be determined according to frequency spectrum characteristics of each array element output signal, such as whether the type is people or vehicle and the like, so as to realize the comprehensive detection and positioning of the target. The mini-type vibration sensor array provided by the invention can be used for detecting the distance, the direction and the type of a ground moving target at the same time.
Description
Technical Field
The invention relates to a micro vibration sensor array and application thereof in ground target tracking, in particular to a micro sensor array consisting of a plurality of micro vibration sensors, which can be used for carrying out tracking, positioning and measurement on a ground moving target and detecting the distance, the direction and the target type of the ground moving target.
Background
At present, the traditional vibration sensor for ground target detection generally adopts a single sensor mode, and the vibration sensor is usually a speed type sensor with a moving coil type or MEMS structure. When the single vibration sensor is used, the single vibration sensor is buried underground, and signals related to a target are acquired by sensing ground surface vibration excited by a ground moving target. The type of the target can be further determined by analyzing the characteristics of the target signal. The detection system mainly based on the single sensor is widely applied to earthquake detection, mineral exploration, security and protection anti-intrusion systems and the like.
With the application and popularization of the vibration sensor, various applications also put new requirements on detection equipment based on the vibration sensor, wherein the most important requirement is that the multifunctional detection equipment is realized on the basis of the miniaturization of the equipment and has the positioning capability on a vibration source.
The vibration source can be positioned by adopting a distributed optical fiber vibration sensor, so that the vibration target can be positioned, and the basic principle is that vibration impact is applied to an optical fiber to cause the change of the refractive index of the optical fiber, so that the change of the phase of light waves is caused. The point to which the optical fiber is applied is located by detecting such a change, thereby detecting the position of the vibration target. However, this method requires that the optical fiber must be arranged at a position where a vibration target exists, and is a contact type sensor, and the arrangement method is complicated, difficult to maintain, has no mobility, and is only suitable for edge sealing detection in a fixed area.
Because only a single sensor structure is adopted, the requirement for detecting information such as distance, direction and the like of a ground target cannot be met, and the single sensor structure is taken as a solving means, so that another solving means for positioning the vibration source is to arrange a plurality of separated vibration sensor units to form an array, and then connect the array to a signal processing device through a plurality of cables so as to acquire signals in a multi-channel manner and obtain distance and direction information of the target, such as a multi-vibration array for mining; or a wireless network mode is adopted to combine a plurality of separated single-vibration sensors to realize the detection of the target distance and the target direction, such as a wireless sensor network. No matter a wired or wireless mode is adopted, the array structure of the discrete combination is complex, the hardware cost is high, the size is large, the occupied area range is wide, in addition, the consistency among the sensors is difficult to guarantee, the difference among signals is obvious, and higher requirements are provided for a signal processing method and hardware requirements.
Therefore, in response to this need, in conjunction with the recent development of seismic sensors, the present invention proposes a micro seismic sensor array for ground target tracking.
Disclosure of Invention
In order to overcome the defect that the existing single-body vibration sensor equipment can only detect the type of a ground target and cannot simultaneously realize the positioning of the target, the invention aims to provide a micro vibration sensor array and application thereof in ground target tracking. The provided micro sensor array can simultaneously detect the information such as the type, the distance, the direction and the like of the ground moving target.
The technical scheme adopted by the invention for solving the technical problems is as follows: and a mode of integrated packaging is adopted, a plurality of MEMS vibration sensors are arranged on the PCB circuit board in a mode that one MEMS vibration sensor is arranged in the center and the rest of the MEMS vibration sensors are arranged at equal intervals around the PCB circuit board, and the rest of the space of the PCB circuit board is provided with corresponding processing circuits. The processing circuit part comprises an amplifying and filtering module of a plurality of paths of analog signals, an AD conversion module and an algorithm processing Module (MCU).
The MEMS shock sensor of the present invention as shown in fig. 1 is mounted on a PCB by means of an integrated package.
The MEMS vibration sensor is fixed on the PCB by adopting an adhesive, the good contact between the sensor and the PCB can be ensured after the adhesive is cured, and a signal pin of the sensor is connected with a circuit chip on the circuit board by adopting a gold wire lead, so that an output signal of the sensor can be directly collected, amplified and analyzed by a signal processing circuit to realize the positioning, identification and classification of a vibration source.
The micro vibration sensor array is produced in batch like producing integrated circuit, and has excellent performance consistency, and the vibration sensor device produced in MEMS process has volume of several mm, is made of silicon material, and has working voltage as low as 3-5V and excellent interface compatibility with integrated circuit, so that it is convenient to integrate chip-on-chip system.
By adopting an integrated hybrid packaging process, a plurality of MEMS vibration sensors can be conveniently integrated on a PCB circuit to form a miniaturized cross vibration sensor array, thereby realizing the functions of positioning, identifying and classifying ground moving targets.
The basic principle of positioning of the cross vibration sensor array is as follows: the distance to the vibroseis is determined by the difference in time that the vibroseis signal reaches different sensors in the sensor array. Because the size of the cross array is small, the time difference value is small, and in order to ensure enough positioning accuracy, the sampling rate of signals must be correspondingly improved, and the current circuit technology can meet the requirements.
The function of recognizing and classifying the ground moving target by the vibration sensor is realized by analyzing the frequency spectrum characteristics of the vibration signal source, different vibration targets can be recognized by comparing the frequency distribution characteristics, the technology in the aspect is mature at present, and the vibration sensor can be applied to the invention.
The basic module of the signal processing circuit is shown in fig. 2, and for convenience of description, 5 sensors are taken as an example for illustration.
As shown in FIG. 2, the five sensors forming the cross array convert the sensed vibration signals into weak electrical signals for output, the used vibration sensor is an MEMS vibration sensor chip developed by Shanghai microsystem of Chinese academy of sciences, the frequency response range of the vibration sensor chip can be more than 0-1KHz, and the sensitivity is about 300 mv/cm/S.
The signal amplifying and filtering module amplifies the output signal of the vibration sensor and filters noise, the parameter of the signal amplifying and filtering module is generally gain 60-80db, and the bandwidth is not less than 10 KHz.
The amplified signals are sampled by a multi-path high-speed AD chip and converted into digital signals, the number of channels of the AD chip is not less than 5, the sampling rate is not less than 10m/S, and the resolution is not less than 12 bits.
The converted digital signal is received and processed by the MCU unit. The MCU unit is usually a high-speed singlechip or a DSP chip, and a time difference positioning algorithm module and a spectrum analysis and classification identification module are arranged in the MCU unit. The time difference positioning algorithm module is used for calculating time differences among a plurality of sensor signals to realize the positioning function of the vibration source, and the frequency spectrum analysis and classification identification module is used for realizing the classification identification of the vibration target through the frequency spectrum analysis and comparison of the vibration signals.
Therefore, the invention adopts an integrated packaging mode to manufacture a plurality of miniaturized vibration sensors and corresponding processing circuits on the same PCB, and the distance between the vibration sensors is only in the magnitude of several centimeters, thereby achieving the purpose of miniaturization, giving full play to the advantages of the array sensor and achieving the functions of simultaneously detecting the type of the target and positioning the target.
The invention provides a micro vibration sensor array for ground target tracking, which at least comprises a PCB (printed circuit board), a micro vibration sensor arranged in the center of the PCB, and other micro vibration sensors of the same type arranged at equal intervals around the micro vibration sensor arranged in the center, wherein the micro vibration sensor is arranged on the PCB in an integrated packaging mode, a vibration signal processing circuit comprises a multi-channel analog signal amplifying and filtering module, and an AD (analog-to-digital) conversion module and an algorithm processing module are also contained on the PCB.
The arrangement mode of the vibration sensors forming the array is a cross array element mode or other centrosymmetric modes;
the number of the vibration sensors forming the array can be 3, 5 or more;
the vibration sensor forming the array is miniaturized, and can be a speed type or acceleration type sensor chip manufactured by adopting an MEMS (micro-electromechanical systems) process, or can be a speed type or acceleration type sensor chip manufactured by adopting other process conditions;
and fourthly, the distance between the vibration sensor arranged at the center of the array and the surrounding vibration sensors is centimeter magnitude, and is generally about 5-6 cm.
In summary, the micro vibration sensor array provided by the invention is formed by integrally packaging a plurality of micro identical MEMS vibration sensors on a PCB, and corresponding vibration signal processing circuits are also integrated on the same PCB. A plurality of vibration sensors are distributed in a cross array mode to form a miniaturized array. When a certain ground target is measured, the sensor is placed in the plane, the distance and the direction of the target can be determined according to the coordinate of each array element of the sensor and the time correlation of each output signal, and the type of the target, such as whether a person or a vehicle is present or not, can be determined according to the frequency spectrum characteristics of each array element output signal, so that the target can be comprehensively detected and positioned. That is, it is a micro vibration sensor array capable of simultaneously detecting the distance, the direction and the type of a ground moving object.
Drawings
FIG. 1 is a schematic view of a MEMS shock sensor provided by the present invention mounted on a PCB board.
FIG. 2 illustrates a signal processing circuit module of the MEMS shock sensor array according to the present invention.
FIG. 3 is a diagram of an embodiment of the present invention.
In fig. 3, 1 is a PCB, 2 is a vibration sensor disposed at the center of the PCB, 3, 4, 5, and 6 are vibration sensors disposed at equal intervals around the PCB, and 7 is a processing circuit module.
Fig. 4 is a circuit schematic of the present invention.
In fig. 4, 2, 3, 4, 5, and 6 are vibration sensors disposed on a PCB, 8 is a multi-channel analog signal amplifying and filtering module, 9 is a multi-channel AD conversion circuit module, and 10 is an algorithm processing Module (MCU).
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Referring to fig. 3 in detail, for convenience, the present embodiment is described in detail by taking a 5-element vibration sensor array as an example, and actually, a vibration sensor array capable of integrating more array elements can be manufactured according to the requirement, and the basic structure is similar.
In the figure, 1 is a PCB, 2 is a vibration sensor arranged at the center of the PCB, the vibration sensor is a miniaturized vibration sensor chip manufactured by MEMS process, the area size is generally about 4 × 6mm, the vibration sensing direction is perpendicular to the surface of the PCB, the other 4 vibration sensors are other miniaturized vibration sensor chips arranged around the PCB at equal intervals, they and the vibration sensor at the center are vibration sensor chips of the same specification produced in the same batch, the interval between each vibration sensor chip and (2) is the same, the distance is about 5cm, the installation mode and the vibration sensing direction are the same as (2). The vibration sensor chip forms a cross array form and is fixedly sealed on the surface of the PCB in a tightly-attached form so as to reduce the attenuation of the vibration signal in the process of transmitting the vibration signal from the PCB to the vibration chip. Except for the vibration sensor chip, the rest parts of the PCB board are corresponding processing circuits, and the basic components of the PCB board are shown in FIG. 2 and comprise a multi-channel analog signal amplifying and filtering module, a multi-channel AD conversion module, an algorithm processing module and the like.
When the micro vibration sensor array is used for measuring a certain ground target, the sensors are placed in the plane, the distance and the direction of the target can be determined according to the coordinates of each array element of the sensors and the time correlation of each output signal, and the type of the target, such as whether a person or a vehicle exists or not, can be determined according to the frequency spectrum characteristics of the output signals of each array element, so that the target can be comprehensively detected and positioned. How to implement the target locating and classifying algorithm is not within the scope of the present invention and will not be described herein.
Claims (7)
1. A micro vibration sensor array is characterized in that a plurality of miniaturized vibration sensors and corresponding signal processing circuits are manufactured on the same PCB in an integrated packaging mode; wherein,
firstly, the plurality of miniaturized vibration sensors adopt an integrated packaging mode, and a plurality of vibration sensors of the same type form a cross array element vibration sensor array in a mode that one vibration sensor is arranged in the center and the rest of the vibration sensors are arranged at equal intervals around the periphery, and the cross array element vibration sensor array is arranged on a PCB (printed circuit board);
the signal processing circuit comprises a multi-channel analog signal amplifying and filtering module (8), an AD conversion module (9) and an algorithm processing module (10);
and the vibration sensor forming the cross array element converts the sensed vibration signals into weak electric signals to be output, the weak electric signals are amplified and filtered to remove noise through a multi-channel analog signal amplification and filtering module (8), the amplified signals are sampled and converted into digital signals through an AD conversion module (9), and the converted digital signals are received and processed by an algorithm processing module.
2. The array of claim 1, wherein said shock sensor is secured to the PCB by an adhesive and the signal pins of the shock sensor are connected to the circuit chips on the PCB by gold wire leads.
3. The array of claim 1 wherein the distance between the centrally located shock sensor and the equally spaced shock sensors disposed thereabout is on the order of centimeters.
4. The array of claim 1, wherein the signal processing circuit includes
a) The gain of the multi-channel analog signal amplifying and filtering module is 60-80db, and the bandwidth is not less than 10 kHz;
b) the number of channels in the AD conversion module is not less than 5, the sampling rate is not less than 10m/s, and the resolution is not less than 12 bits;
c) the algorithm processing module is a high-speed single chip microcomputer or a DSP chip, and a time difference positioning module and a channel analysis and classification identification module are arranged in the algorithm processing module.
5. An array as claimed in claim 1, 2 or 3, wherein the vibration sensor has an area of 4mm x 6mm and the vibration sensing direction is perpendicular to the surface of the PCB board.
6. The array of claim 1 wherein the miniaturized shock sensors comprising the array are velocity or acceleration type sensors fabricated using MEMS technology.
7. An array according to claim 3, wherein the distance between the centrally located shock sensor and the equally spaced shock sensors around the array is 5-6 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110230882.7A CN102435299B (en) | 2011-08-12 | 2011-08-12 | Mini-type vibration sensor array and application thereof to ground target tracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110230882.7A CN102435299B (en) | 2011-08-12 | 2011-08-12 | Mini-type vibration sensor array and application thereof to ground target tracking |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102435299A CN102435299A (en) | 2012-05-02 |
| CN102435299B true CN102435299B (en) | 2014-02-12 |
Family
ID=45983487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110230882.7A Active CN102435299B (en) | 2011-08-12 | 2011-08-12 | Mini-type vibration sensor array and application thereof to ground target tracking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102435299B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650680A (en) * | 2016-12-29 | 2017-05-10 | 西安科技大学 | Shake target identification method based on time sequence similarity search |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103135092A (en) * | 2013-02-05 | 2013-06-05 | 中国科学院上海微系统与信息技术研究所 | Micro aperture acoustic array moving objective orientation method |
| CN103558851A (en) * | 2013-10-10 | 2014-02-05 | 杨松 | Method and device for accurately sensing indoor activities |
| CN103994820B (en) * | 2014-04-21 | 2016-05-11 | 中国科学院上海微系统与信息技术研究所 | A kind of moving target recognition methods based on micropore diameter microphone array |
| CN108313089B (en) * | 2017-01-18 | 2020-07-21 | 扬州立鼎恒新微电子科技有限公司 | Train real-time positioning method based on MEMS vibration sensor |
| CN109212474B (en) * | 2018-09-21 | 2022-09-09 | 华北理工大学 | Underground positioning method based on EIEL electronic tag |
| CN110716490A (en) * | 2019-11-06 | 2020-01-21 | 高晓勇 | Multi-integrated sensor integrated board circuit |
| CN112710989B (en) * | 2020-12-30 | 2022-06-24 | 中国人民解放军32212部队 | Tank armored vehicle sound vibration artificial intelligence detection positioning system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5269309A (en) * | 1991-12-11 | 1993-12-14 | Fort J Robert | Synthetic aperture ultrasound imaging system |
| GB2428089B (en) * | 2005-07-05 | 2008-11-05 | Schlumberger Holdings | Borehole seismic acquisition system using pressure gradient sensors |
| US8022861B2 (en) * | 2008-04-04 | 2011-09-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for mm-wave imager and radar |
| CN101975949B (en) * | 2010-10-12 | 2012-10-24 | 苏州桑泰海洋仪器研发有限责任公司 | Multi-user underwater ultrashort base line positioning device and method thereof |
-
2011
- 2011-08-12 CN CN201110230882.7A patent/CN102435299B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650680A (en) * | 2016-12-29 | 2017-05-10 | 西安科技大学 | Shake target identification method based on time sequence similarity search |
| CN106650680B (en) * | 2016-12-29 | 2019-02-01 | 西安科技大学 | Vibration target identification method based on time series similarity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102435299A (en) | 2012-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102435299B (en) | Mini-type vibration sensor array and application thereof to ground target tracking | |
| KR101946734B1 (en) | Lightning detection system, method and device | |
| CN105318995A (en) | Motion detection using pressure sensing | |
| WO2011091096A3 (en) | Intelligent repeatable arm mounting system | |
| KR20050092050A (en) | Improved sensing arrangement | |
| CN103399298A (en) | Device and method for positioning multiple sensors in room on basis of light intensity | |
| CN101266717A (en) | A car detection recognition system and method based on MEMS sensor | |
| CN109001997B (en) | Anti-interference environment information acquisition system | |
| CN103513273B (en) | The land digital seismoreceivers of four components | |
| IL174411A (en) | Fibre-optic surveillance system | |
| CN102628960B (en) | Velocity and acceleration two-parameter digital geophone | |
| WO2018074721A1 (en) | Wireless vibration measurement system | |
| CN101819285B (en) | Detection device of nuclear and earthquake instrument system | |
| CN104568116A (en) | Optical sensor module | |
| CN103542962A (en) | Pressure testing device | |
| US10634609B2 (en) | Sensor system for measuring a snowpack profile | |
| KR100934988B1 (en) | Cable abnormality detection device | |
| CN111596262A (en) | Vector hydrophone and multi-target direction estimation method based on vector hydrophone | |
| CN107167068B (en) | Test system for acquiring position of moving body | |
| KR100796264B1 (en) | Abnormal state sensing device of cable | |
| CN109283236A (en) | The highly sensitive resonant transducer of integrated CMOS-MEMS | |
| CN204807044U (en) | Great -scale displacement sensor | |
| CN113758508A (en) | Transmission line environment conflagration and external damage monitoring devices | |
| CN104652396B (en) | A kind of three-component roadbed solution cavity detection sensor and detecting system | |
| CN201788282U (en) | Nuclear electric seismic instrumentation system detecting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |