CN102435299B - Mini-type vibration sensor array and application thereof to ground target tracking - Google Patents
Mini-type vibration sensor array and application thereof to ground target tracking Download PDFInfo
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- CN102435299B CN102435299B CN201110230882.7A CN201110230882A CN102435299B CN 102435299 B CN102435299 B CN 102435299B CN 201110230882 A CN201110230882 A CN 201110230882A CN 102435299 B CN102435299 B CN 102435299B
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Abstract
The invention relates to a mini-type vibration sensor array and application thereof to ground target tracking. The mini-type vibration sensor array is characterized in that: a plurality of same mini-type MEMS (Micro-electromechanical System) vibration sensor chips are integrated and packaged on a PCB (Printed Circuit Board) and corresponding vibration signal processing circuits are also integrated on the same PCB. The plurality of the vibration sensor chips are distributed as a cross array to form a mini-type array. When a certain ground target is measured, only a sensor is put into the plane and distance and direction of a target can be determined according to coordinates of each array element of the sensor and time correlations of each output signal; and the type of the target can be determined according to frequency spectrum characteristics of each array element output signal, such as whether the type is people or vehicle and the like, so as to realize the comprehensive detection and positioning of the target. The mini-type vibration sensor array provided by the invention can be used for detecting the distance, the direction and the type of a ground moving target at the same time.
Description
Technical field
The present invention relates to a kind of miniature shock sensors array and the application in Ground Target Tracking, the present invention relates to or rather a kind of microsensor array being formed by a plurality of miniature shock sensors, can be used for that ground moving object is implemented to track and localization and measure, detect the shock sensor of distance, orientation and the target type of ground moving object.
Background technology
At present, traditional shock sensor detecting for terrain object generally adopts the mode of single-sensor, shock sensor select the quality test of pile that is generally moving-coil type or MEMS structure.During use, this monomer shock sensor is embedded in underground, by the ground vibration of induction ground moving object excitation, obtains the signal of relevant target.By the signature analysis to echo signal, can further determine the type of target.Thisly take that single-sensor is that main detection system is widely used in seismic survey, mineral products are detected and the anti-intrusion system of security protection etc.
Along with the application of shock sensor, various application have also proposed new requirement to the checkout equipment based on shock sensor, wherein most importantly require to realize multifunction on the basis of the miniaturization of equipment, possess the station-keeping ability to vibroseis.
To the location of vibroseis, can adopt distribution type fiber-optic shock sensor can realize the location to vibrations target, its ultimate principle is to have utilized jerk to act on the variation that optical fiber causes its refractive index, and then causes the variation of phase of light wave.By detecting this variation positioning optical waveguides, be applied a little, thereby survey the position of shaking target.But this mode requires optical fiber must be laid in the position that vibrations target exists, and belongs to contact type sensor, and laying mode is complicated, difficult in maintenance, does not possess movability, the edge sealing that is only applicable to fixed area detects.
Owing to only having adopted single-sensor structure, cannot meet the demand of information such as detecting the distance of terrain object and orientation, as solution, therefore, the another kind of solution of the location of vibroseis is to lay a plurality of separate type vibration sensor unit to form an array, then by many cables, be connected to a signal handling equipment, thereby to reach multichannel collecting signal, obtain distance, the directional information of target, as many vibrations array of mine locating use; Or adopt the mode of wireless network that single shock sensor of a plurality of separation is joined together, realize the detection to target range and orientation, as wireless sensor network.No matter be to adopt wired or wireless mode, the common more complicated of array structure of this discrete combined, hardware cost is high, volume is large, occupation of land scope is wide, consistance between each sensor is also difficult to guarantee in addition, causes between signal difference obvious, and method and hardware requirement that signal is processed have also proposed higher requirement.
Therefore address that need, in conjunction with the recent development of shock sensor, the present invention has intended proposing a kind of miniature shock sensors array for Ground Target Tracking.
Summary of the invention
In order to overcome existing monomer-type shock sensor equipment, only can survey terrain object type and cannot realize the shortcoming to the location of target simultaneously, the object of the present invention is to provide a kind of miniature shock sensors array and the application in Ground Target Tracking.The microsensor array providing can detect the information such as type, distance and orientation of ground moving object simultaneously.
The technical solution adopted for the present invention to solve the technical problems is: the pattern that adopts integration packaging, by a plurality of MEMS shock sensors according to one, center, the equidistant mode of laying of all the other surroundings is arranged on PCB circuit board, and its complementary space of PCB circuit board is corresponding treatment circuit.Treatment circuit partly comprises amplification filtering module, AD modular converter and the algorithm processing module (MCU) of multichannel analog signals.
MEMS shock sensor of the present invention adopts the mode of integration packaging to be arranged on pcb board as shown in Figure 1.
MEMS shock sensor adopts bonding agent to be fixed on pcb board, bonding agent can guarantee the good contact of sensor and pcb board after solidifying, between the signal pins of sensor and circuit chip on circuit board, adopt spun gold lead-in wire to be connected, therefore the output signal of sensor can be directly by signal processing circuit collection, amplification analysis, to realize location, identification and the classification to vibroseis.
Described miniature shock sensors array adopts the shock sensor of making based on MEMS (microelectromechanical systems) technique to form vibrations array, can be as mass production making integrated circuit, consistency of performance is good, , owing to adopting the volume of the shock sensor device of MEMS technique making conventionally to only have several mm in sizes, employing silicon materials are made, utilize the induction such as the structure that becomes capacitance structure or voltage dependent resistor vibration signal, operating voltage can be low to moderate 3-5V, there is good interface compatibility with integrated circuit, therefore can facilitate chip system on integrated making sheet, existing integrated hybrid package technique realizes MEMS sensor and associated processing circuit is integrated in to the technology on same circuit board at present.
Adopt integrated hybrid package technique easily several MEMS shock sensors to be integrated on PCB circuit, form a microminiaturized cross shock sensor array, thereby realize the location of ground moving object, recognition and classification function.
The ultimate principle that cross shock sensor array is realized location is: the mistiming of utilizing vibroseis signal to arrive different sensors in sensor array is determined the distance of vibroseis.Because this cross array size is little, so time difference is also very little, for guaranteeing enough positioning precisioies, to the sampling rate of signal also necessary corresponding raising, and can meet the demands with current circuit engineering.
Shock sensor is to realize by analyzing the spectrum signature in vibration signal source to the recognition and classification function of ground moving object, by comparison frequency distribution feature, can identify different vibrations targets, the technology of this aspect is ripe at present, can be applied in the present invention.
As shown in Figure 2, for sake of convenience, 5 sensors of take illustrate it as example to the basic module of described signal processing circuit.
As shown in Figure 2, five sensors that form cross array will sense that vibration signal is converted to ultra-weak electronic signal output, the shock sensor using is the MEMS shock sensor chip of Chinese Academy of Sciences's Shanghai micro-system development, its frequency response range can be selected > 0-1KHz, and sensitivity is for being about 300mv/cm/S.
Signal amplifies with filtration module the output signal of shock sensor is amplified and filtering noise, and its parameter is generally gain 60-80db, and bandwidth is not less than 10KHz.
Signal after amplification is sampled via multipath high-speed AD chip and is converted to digital signal, and the port number of AD chip is no less than 5, and sampling rate is not less than 10m/S, and resolution is not less than 12bit.
Digital signal after conversion is received and is processed by MCU unit.MCU unit is generally high-speed microprocessor or dsp chip, built-in time difference location algorithm module and spectrum analysis and Classification and Identification module.The positioning function that time difference location algorithm module realized vibroseis for the mistiming one of calculating between a plurality of sensor signals, spectrum analysis and Classification and Identification module are by realizing the Classification and Identification to vibrations target to the spectrum analysis of vibration signal and comparison.
As can be seen here, the present invention adopts the form of integration packaging that the shock sensor of a plurality of microminiaturizations and corresponding treatment circuit are produced on same pcb board, spacing between shock sensor is only the magnitude of several centimetres, both reached the object of miniaturization, give full play to again the advantage of sensor array, reach the function that simultaneously detects target type and target localization.
A kind of miniature shock sensors array for Ground Target Tracking provided by the invention, at least comprise a PCB circuit board, and the miniature shock sensors of placing at PCB circuit board center, other miniature shock sensors of the same type that the surrounding of the miniature shock sensors of placing in center equidistantly places, miniature shock sensors adopts integration packaging form to be arranged on PCB circuit board, vibration signal treatment circuit comprises that multi-channel analog signal amplifies and filtration module, and AD modular converter and algorithm processing module are included on PCB circuit board equally.
Wherein, the arrangement mode that 1. forms the shock sensor of array is cross array element mode or other Central Symmetry mode;
2. the quantity that forms the shock sensor of array can be 3,5, and 5 or greater number;
3. the shock sensor that forms array is microminiaturized, can be velocity profile or the acceleration type sensor chip that adopts MEMS technique to make, and can be also velocity profile or the acceleration type sensor chip that adopts other process conditions to make;
4. forming the shock sensor the center of array placed is a centimetre magnitude with the distance of shock sensor around, is generally 5-6cm left and right.
Generally speaking, miniature shock sensors array provided by the invention is the identical MEMS shock sensor that integration packaging has a plurality of microminiaturizations on a PCB circuit board, and corresponding vibration signal treatment circuit is also integrated on same pcb board.A plurality of shock sensors are laid and are formed a microminiaturized array in the mode of cross battle array.When measuring a certain terrain object, only sensor need be positioned in this plane, according to the coordinate of each array element of sensor self and separately the time correlation of output signal just can determine distance and the direction of target, according to the spectrum signature of each delayed output signals, just can determine the type of target, as whether being people or vehicle etc., thereby realize the comprehensive detecting and locating to target.Also be that it is a kind of miniature shock sensors array that can simultaneously detect distance, orientation and the type of ground moving object.
Accompanying drawing explanation
Fig. 1 MEMS shock sensor provided by the invention is arranged on the schematic diagram on pcb board.
The signal processing circuit module of Fig. 2 MEMS shock sensor provided by the invention array.
Fig. 3 is embodiment of the present invention figure.
In Fig. 3,1 is PCB circuit board, and 2 for being laid in the shock sensor of pcb board center, and 3,4,5,6 for to be equidistantly laid in the shock sensor of surrounding, and 7 is processing circuit module.
Fig. 4 is circuit theory diagrams of the present invention.
In Fig. 4,2,3,4,5,6 for being laid in the shock sensor on pcb board, and 8 for multichannel analog signals amplifies and filtration module, and 9 is multi-channel A/D change-over circuit module, and 10 is algorithm processing module (MCU).
Embodiment
Below in conjunction with drawings and Examples, the present invention is further described.
Refer to Fig. 3, the present embodiment still be take 5 yuan of shock sensor arrays and is described in detail as example for simplicity, and reality can be made shock sensor array that can integrated more array elements as required, and its basic structure is similar.
In figure, 1 is PCB circuit board, 2 for being arranged at the shock sensor of PCB circuit board center, the microminiaturized shock sensor chip of this shock sensor for adopting MEMS technique to make, size is generally 4 * 6mm left and right, Vibration induction direction is perpendicular to PCB circuit board surface, all the other 4 shock sensors are for being equidistantly laid in other microminiaturized shock sensor chips of pcb board surrounding, they are the shock sensor chip of the same specification of same batch of production with the shock sensor in center, each shock sensor chip is identical with the spacing of (2), distance arranges about 5cm left and right, mounting means, Vibration induction direction is all identical with (2).Shock sensor chip forms cross formation formula, and adopts the form sealing closely mounting on the surface of pcb board, to reduce vibration signal, from pcb board, is delivered to the decay vibrating chip process.On pcb board, except installing shock sensor chip, at remainder, be corresponding treatment circuit, its basic composition as shown in Figure 2, comprises multichannel simulating signal amplification and filtration module, multi-channel A/D modular converter and algorithm processing module etc.
Miniature shock sensors array of the present invention is when measuring a certain terrain object, only sensor need be positioned in this plane, according to the coordinate of each array element of sensor self and separately the time correlation of output signal just can determine distance and the direction of target, according to the spectrum signature of each delayed output signals, just can determine the type of target, as whether being people or vehicle etc., thereby realize the comprehensive detecting and locating to target.About how realizing the location of target and sorting algorithm, do not belong to scope of the present invention, at this, do not describe.
Claims (7)
1. a miniature shock sensors array, is characterized in that adopting the form of integration packaging that the shock sensor of a plurality of microminiaturizations and corresponding signal processing circuit are produced on same pcb board; Wherein,
1. the shock sensor of described a plurality of microminiaturizations adopts the pattern of integration packaging, and by a plurality of shock sensors of the same type, according to one, center, the mode that all the other are around equidistantly laid, forms cross array element shock sensor array, is arranged on PCB circuit board;
2. described signal processing circuit comprises that multi-channel analog signal amplifies and filtration module (8), AD modular converter (9) and algorithm processing module (10);
3. the shock sensor that forms cross array element is converted to ultra-weak electronic signal output by the vibration signal sensing, through multi-channel analog signal, amplify and filtration module (8), output signal is amplified and filtering noise, signal after amplification is sampled and is converted to digital signal through AD modular converter (9), and the digital signal after conversion is received and processed by algorithm processing module.
2. by array claimed in claim 1, it is characterized in that described shock sensor adopts cementing agent to be fixed on pcb board, between the signal pins of shock sensor and circuit chip on PCB circuit board, adopt spun gold to go between and be connected.
3. by array claimed in claim 1, it is characterized in that the spacing forming between the center shock sensor of array and the shock sensor of equidistant laying is around centimetre magnitude.
4. by array claimed in claim 1, it is characterized in that in signal processing circuit
A) multi-channel analog signal amplification is 60-80db with the gain of filtration module, and bandwidth is not less than 10kHz;
B) port number in AD modular converter is no less than 5, and sampling rate is not less than 10m/s, and resolution is not less than 12bit;
C) algorithm processing module is high-speed microprocessor or dsp chip, built-in time difference locating module and channel analysis and Classification and Identification module.
5. by the array described in claim 1,2 or 3, it is characterized in that described shock sensor area is 4mm * 6mm, Vibration induction direction is perpendicular to PCB circuit board surface.
6. by array claimed in claim 1, the microminiaturized shock sensor that it is characterized in that forming array is velocity profile or the acceleration type sensor that adopts MEMS technique to make.
7. by array claimed in claim 3, it is characterized in that the spacing forming between the center shock sensor of array and the shock sensor of equidistant laying is around 5-6cm.
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| CN106650680A (en) * | 2016-12-29 | 2017-05-10 | 西安科技大学 | Shake target identification method based on time sequence similarity search |
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| CN103135092A (en) * | 2013-02-05 | 2013-06-05 | 中国科学院上海微系统与信息技术研究所 | Micro aperture acoustic array moving objective orientation method |
| CN103558851A (en) * | 2013-10-10 | 2014-02-05 | 杨松 | Method and device for accurately sensing indoor activities |
| CN103994820B (en) * | 2014-04-21 | 2016-05-11 | 中国科学院上海微系统与信息技术研究所 | A kind of moving target recognition methods based on micropore diameter microphone array |
| CN108313089B (en) * | 2017-01-18 | 2020-07-21 | 扬州立鼎恒新微电子科技有限公司 | Train real-time positioning method based on MEMS vibration sensor |
| CN109212474B (en) * | 2018-09-21 | 2022-09-09 | 华北理工大学 | Underground positioning method based on EIEL electronic tag |
| CN110716490A (en) * | 2019-11-06 | 2020-01-21 | 高晓勇 | Multi-integrated sensor integrated board circuit |
| CN112710989B (en) * | 2020-12-30 | 2022-06-24 | 中国人民解放军32212部队 | Tank armored vehicle sound vibration artificial intelligence detection positioning system |
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| US5269309A (en) * | 1991-12-11 | 1993-12-14 | Fort J Robert | Synthetic aperture ultrasound imaging system |
| GB2428089B (en) * | 2005-07-05 | 2008-11-05 | Schlumberger Holdings | Borehole seismic acquisition system using pressure gradient sensors |
| US8022861B2 (en) * | 2008-04-04 | 2011-09-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for mm-wave imager and radar |
| CN101975949B (en) * | 2010-10-12 | 2012-10-24 | 苏州桑泰海洋仪器研发有限责任公司 | Multi-user underwater ultrashort base line positioning device and method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106650680A (en) * | 2016-12-29 | 2017-05-10 | 西安科技大学 | Shake target identification method based on time sequence similarity search |
| CN106650680B (en) * | 2016-12-29 | 2019-02-01 | 西安科技大学 | Vibration target identification method based on time series similarity |
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