CN102433562A - Optical film processing die and manufacturing method thereof - Google Patents

Optical film processing die and manufacturing method thereof Download PDF

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Publication number
CN102433562A
CN102433562A CN2010102968269A CN201010296826A CN102433562A CN 102433562 A CN102433562 A CN 102433562A CN 2010102968269 A CN2010102968269 A CN 2010102968269A CN 201010296826 A CN201010296826 A CN 201010296826A CN 102433562 A CN102433562 A CN 102433562A
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CN
China
Prior art keywords
aluminum oxide
self
oxide film
assembled monolayer
processing mold
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Pending
Application number
CN2010102968269A
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Chinese (zh)
Inventor
许嘉麟
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2010102968269A priority Critical patent/CN102433562A/en
Publication of CN102433562A publication Critical patent/CN102433562A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an optical film processing die, which comprises a die substrate, an alumina film and a fluorinated self-assembly monomolecular film layer, wherein the alumina film is formed on the surface of the die substrate; the fluorinated self-assembly monomolecular film layer is formed on the surface of the alumina film; and the alumina film is a high-hardness film obtained by adopting an atomic layer depositing technology. The die disclosed by the invention has the characteristic of easiness in demolding. The invention further provides a manufacturing method of the optical film processing die.

Description

Blooming piece processing mold and preparation method thereof
Technical field
The present invention relates to a kind of technical field of mold, relate in particular to the making method of a kind of processing mold and said processing mold.
Background technology
Along with the photoelectricity development of science and technology, liquid-crystal display receives human consumer and dealer's attention gradually, on the Absatzvolumen of product, also holds high growth rate.Wherein the imaging mode of liquid-crystal display drives and demonstrates high-quality picture for the switch that utilizes electric field, and liquid crystal panel itself can not emit beam, and must the indicating meter light source be provided by backlight module.
Blooming piece is one of parts of backlight module, and its manufacturing technology also is one of most critical technology in the backlight module manufacturing.The major function of blooming piece is to utilize self surperficial microstructure in the backlight module, changes the travel path of light, increases the target zone angular brightness, is all once improving light source service efficiency, hoisting module.
The technology of preparation blooming piece mainly is to go up coating UV glue at base material (PET etc.) earlier in the industry at present; Embossing then; Promptly use a surface to have the cylinder of microstructure; With the mode of impression with the microstructure transcription of cylinder surface on base material, at last through the UV rayed, make the microstructure typing on blooming piece surface.In this technical process, the release problems after the blooming piece embossing is most important, if the UV glue on blooming piece surface remains in the microstructure of cylinder, can cause the defective of blooming piece outward appearance, also can influence the shape of other membrane surface of follow-up making.In order to make the blooming piece demoulding smoothly, prior art is employed in methods such as adding releasing agent in the employed UV blending of the blooming piece resin formula usually and reaches stripping result, but the interpolation of this releasing agent can reduce the sticking power of UV glue and base material.In addition, the microstructure that the grit in the production also can the scratch cylinder surface in the moving process of cylinder, thereby the work-ing life of having reduced cylinder.
Summary of the invention
In view of this, in fact be necessary to provide the making method of a kind of blooming piece processing mold and processing mold, make blooming piece also effectively demoulding under the situation of not adding remover, and the hardness of cylinder surface is promoted, make cylinder surface difficult by scratch.
A kind of blooming piece processing mold, it comprises a die matrix, one is formed on the aluminum oxide film on die matrix surface, and one be formed at said aluminum oxide film surface fluoridize the self-assembled monolayer layer.Wherein said aluminum oxide film is one deck high firmness aluminum oxide film that utilizes technique for atomic layer deposition to obtain; The said self-assembled monolayer layer of fluoridizing is that said aluminum oxide film links formation with fluorizated lipid acid through dehydration reaction, and said fluorizated self-assembled monolayer layer has high hydrophobicity.
A kind of making method of blooming piece die for processing; It comprises the aluminum oxide film that utilizes technique for atomic layer deposition on die matrix, to form one deck high firmness; And, fluoridize the self-assembled monolayer layer with what form a high hydrophobicity with the binding of dewatering of fluorizated lipid acid and said aluminum oxide film.
Than prior art; Die surface of the present invention is for fluoridizing the self-assembled monolayer layer; It has high hydrophobicity, can make the effective demoulding of blooming piece, more can in the blooming piece processing procedure, not add the also effectively demoulding under the situation of releasing agent; Thereby can prevent the generation of blooming piece defective, can not reduce the sticking power of UV glue and base material again.Simultaneously, the aluminum oxide film that utilizes technique for atomic layer deposition to obtain has higher hardness, can effectively reduce grit infringement to the microstructure of cylinder surface in the moving process of cylinder, promotes the work-ing life of mould.
Description of drawings
Fig. 1 is that the processing mold of first embodiment of the invention is made schema.
Fig. 2 is the processing mold structural representation of second embodiment of the invention.
The main element nomenclature
Processing mold 10
Die matrix 12
Microstructure 120
Aluminum oxide film 14
Fluoridize self-assembled monolayer layer 16
Embodiment
To combine blooming piece processing mold 10 that accompanying drawing provides the present technique scheme and preparation method thereof to do further to specify below.
See also the schema of Fig. 1 and consult Fig. 2 simultaneously, present technique scheme first embodiment provides a kind of making method of blooming piece processing mold 10, and said making method comprises the steps: (1). a die matrix 12 is provided; (2). utilize technique for atomic layer deposition to form the aluminum oxide film 14 of one deck high firmness on said die matrix 12 surfaces; (3). form one deck through fluoride fat acid with said aluminum oxide film 14 reactions and fluoridize self-assembled monolayer layer 16; (4). clean the said self-assembled monolayer layer 16 of fluoridizing.
The die matrix 12 that step (1) is provided can be a copper roller, and certainly, said die matrix 12 also can be the matrix of other shape, other material.The surface of said die matrix 12 can be formed with the microstructure 120 of different shape, be used for transcription on the blooming piece base material to realize various optical functions.
In step (2), the aluminum oxide film 14 of high firmness adopts technique for atomic layer deposition to form, and is specific as follows: at first, die matrix 12 is inserted in the vacuum cavity, in the present embodiment, vacuum tightness is evacuated to 10 in the said cavity -1Torr.The said cavity of even heating is put at 100 degrees centigrade to 400 degrees centigrade the temperature of said cavity.In the present embodiment, the temperature-stable of said cavity is at 250 degrees centigrade; Then, with trimethylaluminium (CH 3) 3(trimethylaluminum, TMA) as precursor, oxygen alternately feeds said cavity and reacts as oxygen source Al, with the aluminum oxide film 14 in the said die matrix 12 surperficial one deck high firmness that form.In the present embodiment, the thickness of aluminum oxide film 14 is at 50nm to 150nm.
Wherein, said precursor can also be other aluminum contained compound, can be AlCl like precursor 3And other aluminum alkyls, other aluminum alkyls can be triethyl aluminum (C 2H 5) 3Al and tri-propyl aluminum (C 3H 7) 3Al etc.; Said oxygen source also can be ozone and H 2O etc.
In step (3), fluoridize the formation of self-assembled monolayer layer 16 and adopt following method:
At first, the die matrix 12 that will be formed with aluminum oxide film 14 places the encloses container of an inert gas environment, and in said container, adds the perfluorination lipid acid (Perfluorinated carboxylic acid) of the long carbochain of tool.Said rare gas element can be nitrogen.The consumption of the perfluorination lipid acid of long carbochain is about 0.2% of said vessel volume.In the present embodiment, the perfluorination lipid acid of growing carbochain is CF 3(CF 2) nCOOH, wherein n equals 3,6,8,10 or 16 natural number.
Then, heat said encloses container to 200 degree centigrade, kept 3 hours; Make the perfluorination lipid acid of said long carbochain gasify; And closely coat said die matrix 12, produce chemisorption between the aluminum oxide film 14 on carboxyl in the perfluorination lipid acid of said gasification and said die matrix 12 surfaces, promptly; The aluminum oxide on carboxyl in the perfluorination lipid acid of gasification and said die matrix 12 surfaces carries out dehydration reaction, on said die matrix 12, forms and fluoridizes self-assembled monolayer layer 16.Because present embodiment adopts perfluorination lipid acid, therefore the formed self-assembled monolayer layer 16 of fluoridizing is a perfluorination self-assembled monolayer layer 16.Said perfluorination lipid acid has the C-F key makes the said self-assembled monolayer layer 16 of fluoridizing have high hydrophobicity.Wherein, said dehydration reaction can also be carried out under the arbitrary temp of the gasification temperature that is higher than said perfluorination lipid acid.
Wherein, the partially fluorinated lipid acid of the long carbochain of all right apparatus of the perfluorination lipid acid of the said long carbochain of this step substitutes, and said partially fluorinated lipid acid is CF 3(CF 2) n(CH 2) mCOOH, n+m=3,6,8,10,16 wherein, n and m are natural number.In addition; For easy to operate; In said step (2) afterwards, can directly in the said cavity of step (2), feed rare gas element, and be adjusted to 200 degrees centigrade to the temperature of said cavity; Then add the perfluorination lipid acid (Perfluorinatedcarboxylic acid) of the long carbochain of said tool again, carry out the reaction of step (3).
At last, slowly cool off said die matrix 12.
In step (4), clean the surface of said processing mold 10 successively with chloroform, acetone, alcohol and deionized water, with the fluoride fat acid of the unnecessary physical adsorption of removing processing mold 10 surfaces.
See also Fig. 2; Second embodiment of present technique scheme provides a kind of blooming piece processing mold 10; Said blooming piece processing mold 10 adopts the method for first embodiment to make; It comprises that a die matrix 12, is formed at die matrix 12 lip-deep aluminum oxide films 14, and one be overlying on said aluminum oxide film 14 surfaces fluoridize self-assembled monolayer layer 16.In the present embodiment, die matrix 12 is a copper roller, and certainly, said die matrix 12 also can be the matrix of other shape.The microstructure 120 that the surface of said die matrix 12 is formed with different shape be used for transcription on the blooming piece base material to realize various optical functions.In the present embodiment, microstructure 120 is an example with the axially extended V-type groove of the copper roller in edge.
Wherein said aluminum oxide film 14 is one deck high firmness aluminum oxide films 14 that utilize technique for atomic layer deposition to obtain, and the thickness of aluminum oxide film 14 is at 50nm to 150nm.The said self-assembled monolayer layer 16 of fluoridizing is said aluminum oxide film 14 and perfluorination lipid acid CF 3(CF 2) nCOOH (n equals 3,6,8,10 or 16 natural number) or partially fluorinated lipid acid CF 3(CF 2) n(CH 2) mCOOH (wherein n+m=3,6,8,10,16, n and m are natural number) forms through dehydration reaction, and the said self-assembled monolayer layer 16 of fluoridizing has high hydrophobicity.
Than prior art; The present technique scheme provides blooming piece processing mold 10, and its surface is for fluoridizing self-assembled monolayer layer 16, and it has high hydrophobicity; Can make the effective demoulding of blooming piece; More can in the blooming piece processing procedure, not add the also effectively demoulding under the situation of releasing agent, simultaneously, the aluminum oxide film 14 that utilizes technique for atomic layer deposition to obtain has higher hardness; Can effectively reduce grit infringement to the microstructure 120 of cylinder surface in the moving process of cylinder, promote the work-ing life of mould.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.

Claims (9)

1. the making method of a blooming piece processing mold, it comprises:
A die matrix is provided;
Utilize technique for atomic layer deposition to form an aluminum oxide film on said die matrix surface; And
Fluoride fat acid is carried out dehydration reaction with said aluminum oxide film, form one on said aluminum oxide film surface and fluoridize the self-assembled monolayer layer.
2. the making method of processing mold as claimed in claim 1 is characterized in that, forms said aluminum oxide film and comprises step:
Die matrix is inserted a vacuum cavity, and the temperature of controlling said cavity places between 100 degrees centigrade-400 degrees centigrade;
In said cavity, alternately feed precursor and oxygen source, to form an aluminum oxide film at said die matrix surface deposition.
3. the making method of processing mold as claimed in claim 1 is characterized in that, fluoridizes the self-assembled monolayer layer in said aluminum oxide film surface formation one and comprises step:
The die matrix that will be formed with aluminum oxide film places the encloses container of an inert gas environment, and in said container, adds the fluoride fat acid of the long carbochain of tool;
Heat said encloses container, make the fluoride fat acid gasization of said long carbochain, the said fluoride fat acid of gasification is carried out dehydration reaction with the aluminum oxide on said die matrix surface, on said die matrix, forms and fluoridizes the self-assembled monolayer layer.
4. the making method of processing mold as claimed in claim 3 is characterized in that, said fluoride fat acid is straight chain perfluorination lipid acid, and its chemical formula is CF 3(CF 2) nCOOH, wherein n=3,6,8,10 or 16.
5. processing mold making method as claimed in claim 3 is characterized in that, said fluoride fat acid is the acid of linear fraction fluoride fat, and its chemical formula is CF 3(CF 2) n(CH 2) mCOOH, n+m=3,6,8,10,16 wherein, n and m are natural number.
6. the making method of processing mold as claimed in claim 1; It is characterized in that; Form said fluoridize the self-assembled monolayer layer after; Also comprise successively with chloroform, acetone, alcohol and the said self-assembled monolayer laminar surface of fluoridizing of deionized water cleaning, the unnecessary absorption of fluoridizing the self-assembled monolayer laminar surface with removal.
7. blooming piece processing mold that the method that adopts claim 1 to provide makes; It comprises a die matrix, be formed at the aluminum oxide film of said film tool matrix surface and be formed at and fluoridize the self-assembled monolayer layer on the said aluminum oxide film, and the said self-assembled monolayer layer of fluoridizing is that said aluminum oxide film links formation with fluorizated lipid acid through dehydration reaction.
8. blooming piece processing mold as claimed in claim 7 is characterized in that, the said self-assembled monolayer layer of fluoridizing is perfluorination self-assembled monolayer layer or partially fluorinated self-assembled monolayer layer.
9. blooming piece processing mold as claimed in claim 7 is characterized in that, the thickness of said aluminum oxide film is 50nm to 150nm.
CN2010102968269A 2010-09-29 2010-09-29 Optical film processing die and manufacturing method thereof Pending CN102433562A (en)

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Application Number Priority Date Filing Date Title
CN2010102968269A CN102433562A (en) 2010-09-29 2010-09-29 Optical film processing die and manufacturing method thereof

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5602671A (en) * 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
US20040245659A1 (en) * 2000-12-29 2004-12-09 Glenn Thomas P. Tool and method for forming an integrated optical circuit
CN1186118C (en) * 1997-08-14 2005-01-26 丹尼尔·萨梅因 Method for treating solid material to make it hydrophobic, material obtained and uses `
CN1675404A (en) * 2002-08-02 2005-09-28 韩国化学研究所 Method for preparation of aluminum oxide thin film
US7303936B2 (en) * 2005-04-13 2007-12-04 Delphi Technologies, Inc. Method for forming anti-stiction bumps on a micro-electro mechanical structure
US20080131623A1 (en) * 2006-11-28 2008-06-05 Wei Zhang Method and apparatus to apply surface release coating for imprint mold

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5602671A (en) * 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
CN1186118C (en) * 1997-08-14 2005-01-26 丹尼尔·萨梅因 Method for treating solid material to make it hydrophobic, material obtained and uses `
US20040245659A1 (en) * 2000-12-29 2004-12-09 Glenn Thomas P. Tool and method for forming an integrated optical circuit
CN1675404A (en) * 2002-08-02 2005-09-28 韩国化学研究所 Method for preparation of aluminum oxide thin film
US7303936B2 (en) * 2005-04-13 2007-12-04 Delphi Technologies, Inc. Method for forming anti-stiction bumps on a micro-electro mechanical structure
US20080131623A1 (en) * 2006-11-28 2008-06-05 Wei Zhang Method and apparatus to apply surface release coating for imprint mold

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Application publication date: 20120502