CN102431180B - Manufacturing method of partially cured Z-pin - Google Patents
Manufacturing method of partially cured Z-pin Download PDFInfo
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- CN102431180B CN102431180B CN2011102685090A CN201110268509A CN102431180B CN 102431180 B CN102431180 B CN 102431180B CN 2011102685090 A CN2011102685090 A CN 2011102685090A CN 201110268509 A CN201110268509 A CN 201110268509A CN 102431180 B CN102431180 B CN 102431180B
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- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 238000002360 preparation method Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000002513 implantation Methods 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000008014 freezing Effects 0.000 claims abstract description 3
- 238000007710 freezing Methods 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims abstract description 3
- 238000001035 drying Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000004132 cross linking Methods 0.000 abstract description 4
- 239000011208 reinforced composite material Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000011120 plywood Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000007586 pull-out test Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007656 fracture toughness test Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to an implantation method of a partially cured composite material Z-pin. The method is characterized in that: 1. the process consists of manufacturing and implantation of partially cured Z-pin; 2. the manufacturing process includes establishing a preparation parameter database of partially cured Z-pin, and each record of the database includes a Z-pin material, preparation parameters, a curing degree and modulus of the prepared Z-pin; the relation between a smallest Z-pin modulus needed for implantation of a selected prepreg material and the modulus scope of partially cured Z-pin in the above database is calculated so as to choose appropriate manufacturing parameters; 3. freezing treatment is conducted to the Z-pin which does not meet the implantation requirement in terms of rigidity. The Z-pin has a low initial curing degree, and when implanted into the prepreg, the Z-pin and the matrix resin of the prepreg can undergo a crosslinking reaction during curing, and a strong chemical bonding force can enhance the chemical bonding strength between the Z-pin and a panel. Compared with completely cured Z-pin reinforced composite materials, the Z-pin reinforced composite material of the invention has substantially improved mechanical property.
Description
Affiliated technical field
The present invention relates to the manufacture method of composite Z-pin, it is characterized in that not exclusively solidifying, belong to the method for composite material technical field.
Background technology
The Z-pin technology is needle-like thin bar Z-pin to be implanted to spread in the prepreg changed form three-dimensional the enhancing, the overall structure formed through co-curing, referring to list of references " Review of Z-pinned composite laminates " (Mouritz A P, Application Science and Manufacturing, 2007,38/12).This technology can obviously be improved the interlaminal toughness of composite laminated plate, and has simple to operately, and designability is strong and be easy to the characteristics of global formation, and application prospect is extensive, particularly aspect Aero-Space, has the potentiality of alternative metals material.But, according to current reported in literature and evidence, the composite that the Z-pin that utilizes current manufacturing technology to obtain strengthens is when bearing load, usually with the form of Z-pin pull-off from panel material, destroy, therefore, the bond strength of Z-pin and panel is the key factor that restriction Z-pin performance strengthens effect, referring to list of references " Experimental study on Z-pin bridging law by pull-out test " (Dai S C, Yan W Y, Liu H Y, et al, Composite Science and Technology, 2004, 64/16).
Summary of the invention
The object of the invention is to, improve the deficiency of existing Z-pin manufacturing technology and method, a kind of manufacture method of not exclusively solidifying Z-pin is provided, to strengthen Z-pin and to be enhanced the chemical bond between laminate, solves the difficult problem of Z-pin reinforced composite easy pull-off of Z-pin when carrying.
A kind of method for implantation that not exclusively solidifies Z-pin, comprise the preparation process of Z-pin and the implantation process of Z-pin; It is characterized in that:
Above-mentioned Z-pin refers to the not exclusively curing Z-pin that curing degree is 50~80%;
The preparation process of not exclusively solidifying Z-pin is as follows:
(1), according to the material system of prepreg, select Z-pin resin matrix used, set up the preparation parameter database that not exclusively solidifies Z-pin, the curing degree that wherein not exclusively solidifies Z-pin is 50~80%;
Every record of this database comprises: the modulus of the curing degree of Z-pin material, preparation parameter, prepared Z-pin, prepared Z-pin; Above-mentioned preparation parameter comprises: glue groove temperature, mold temperature, drying tunnel temperature, pultrusion speed;
In all records of this database, the maximum meter of prepared Z-pin modulus is made E1, and minimum of a value is calculated E0;
(2), while utilizing the Z-pin testpieces to measure ultrasonic implantations, the resistance F of the prepreg that Z-pin is subject to, the minimum pressure F that definite ultrasonic implanting gun need provide thus
min;
According to one section hold-down support, the strut buckling formula in one section free situation, can calculate the minimum modulus E of the required Z-pin of ultrasonic implantation
min;
In formula; I is the moment of inertia; L is the length that Z-pin is exposed at the carrier foam segment, sees in Fig. 2 and identifies;
(3) E that utilizes (2) step to obtain
mininquire about in the database of setting up in (1) step, according to Query Result, carry out subsequent treatment:
(3-1) as E0<E
minduring<E1, select E in database
minor Z-pin is not exclusively solidified in preparation parameter preparation corresponding to its closest value;
(3-2) work as E
minduring<E0, select the preparation parameter preparation that in database, E0 is corresponding not exclusively to solidify Z-pin;
(3-3) work as E
minduring>E1, select the preparation parameter preparation that in database, E1 is corresponding not exclusively to solidify Z-pin; Then the Z-pin that not exclusively solidifies of preparation carried out to freezing processing.
According to one's analysis, the adhesion of Z-pin and panel comprises physical bond and chemical bond, and the combination between current completely crued Z-pin and panel is that physical bond plays a crucial role, and is mainly frictional force and intermolecular normal form adhesion.And not exclusively solidify between Z-pin and panel main by chemical bond, Z-pin and panel base interlaminar resin generation cross-linking reaction, form covalent bonds in a large amount of molecules, the bond strength that shows as Z-pin and panel on macroscopic view improves greatly, makes Z-pin be difficult to pull-off from panel.
The principle of not exclusively solidifying the Z-pin reinforced composite is as follows, and (1), according to the test experience, the Z-pin that the definition curing degree is 40%-80% is semi-solid preparation Z-pin, and according to different Z-pin resin matrixes, this scope need slightly adjust at the 40%-80% annex.According to the chemical bond theory between Z-pin provided herein and panel, the curing degree of Z-pin is lower, stronger with the chemical bond of panel, if but the setting of curing degree minimum is too low, and cause resin to preserve the part mobility, can not realize the shaping of Z-pin.(1) when co-curing, seepage flow occurs in the large molecule of resin uncured in Z-pin under diffusion, with after the panel base mixed with resin, cross-linking reaction occurs, form covalent bond in a large amount of molecules, make the strong chemical bond effect of generation between Z-pin and panel, to improve both interface bond strengths; (2), the raising of the reduction of each section temperature of pultrusion and pultrusion speed all can reduce the curing degree of Z-pin.In theory, along with the reduction of curing degree, the modulus of not exclusively solidifying Z-pin reduces.When stiffness degradation to a certain extent the time, can guarantee cylindrical outer shape though not exclusively solidify Z-pin, but can not meet the prepreg that vertical implantation is enhanced smoothly, utilize K cryogenic treatment can freeze the macromolecular chain in resin in Z-pin, reduce the movement of strand, improve the rigidity of Z-pin, with carrying out smoothly of guaranteeing to implant.
The advantage of not exclusively solidifying Z-pin is: the temperature that (1) has reduced mould and rear drying tunnel, reduced energy resource consumption, and reduced cost.(2) improved pultrusion speed, improved production efficiency, implanted water operation for the pultrusion of Z-pin possibility is provided.(3) composite that not exclusively solidifies the Z-pin enhancing is compared the composite that solidifies the Z-pin enhancing fully, and performance and interlayer performance in face (comprise I mode Ⅱ fracture toughness, II mode Ⅱ fracture toughness and impact rear compression performance etc.) are significantly improved.
The accompanying drawing explanation
Fig. 1 is Z-pin pultrusion process and equipment schematic diagram;
Fig. 2 is the ultrasonic implantation schematic diagram of Z-pin.
Fig. 3 is the bridge rate test load-displacement curve of 70% and 100% curing Z-pin enhancement layer plywood.
Fig. 4 is the I mode Ⅱ fracture toughness result of the test column diagram of 70% and 100% curing Z-pin enhancement layer plywood;
Number in the figure title: 1, put yarn feeding device, 2, the fibre guide device, 3, gumming device, 4, pultrusion die, 5, rear solidification equipment, 6, draw-gear, 7, wrap-up, 8, the carrier foam, 9, prepreg.
The specific embodiment
This embodiment illustrates preparation method of not exclusively solidifying Z-pin provided by the invention.
(1) T300 silvalin cylinder is installed on to the yarn feeding device of putting in accompanying drawing 1, the yarn cylinder is controlled by tension force, guarantees that impregnation is abundant.Fiber is successively through fibre guide device, gumming device, mould and rear drying tunnel in accompanying drawing 1.Be placed with low viscosity resin in the glue groove, can be heated to reduce resin viscosity to the glue groove.Be soaked with fiber preformed in mould of resin, simultaneously, cross-linking reaction starts to carry out.Rear drying tunnel temperature is the key factor of controlling curing degree, and curing reaction mainly occurs in rear drying tunnel.Final through draw-gear, provide tractive force by two pairs of tangent rubber rollers.
(2) according to choose 70% and 100% curing degree with reference to the pultrusion parameter of FW125 epoxy resin used and the database of corresponding Z-pin curing degree two groups, the pultrusion parameter sees the following form.
(3) organize 1 and not exclusively solidify Z-pin and organize 2 fully curing Z-pin and implant in the prepreg that paving has changed in advance, carry out co-curing, obtain two groups of Z-pin enhancement layer plywood.
Respectively two groups of Z-pin enhancement layer plywood are carried out to the test of bridge rate and the test of I mode Ⅱ fracture toughness according to the method in document " Experimental study on z-pin bridging law by pullout test " and " interlayer faults toughness test method part 1 under carbon fibre composite laminate hygrothermal environment: I mode Ⅱ fracture toughness test method ", obtain the results are shown in Figure 2 and Fig. 3, from Fig. 2, obviously can find out, solidify the required power of Z-pin pull-off from panel by 70% and solidify the required power of Z-pin pull-off higher than 100% far away, show in Fig. 3 that 70% solidifies relatively 100% curing Z-pin enhancement layer plywood I mode Ⅱ fracture toughness value G of Z-pin enhancement layer plywood
iCimprove 39%, strengthen successful.
Claims (1)
1. a method for implantation that not exclusively solidifies Z-pin, comprise the preparation process of Z-pin and the implantation process of Z-pin; It is characterized in that:
Above-mentioned Z-pin refers to the not exclusively curing Z-pin that curing degree is 40~80%;
The preparation process of not exclusively solidifying Z-pin is as follows:
(1), according to the material system of prepreg, select Z-pin resin matrix used, set up the preparation parameter database that not exclusively solidifies Z-pin, the curing degree that wherein not exclusively solidifies Z-pin is 50~80%;
Every record of this database comprises: the modulus of the curing degree of Z-pin material, preparation parameter, prepared Z-pin, prepared Z-pin; Above-mentioned preparation parameter comprises: glue groove temperature, mold temperature, drying tunnel temperature, pultrusion speed;
In all records of this database, the maximum meter of prepared Z-pin modulus is made E
1, minimum of a value is calculated E
0;
(2), while utilizing the Z-pin testpieces to measure ultrasonic implantations, the resistance F of the prepreg that Z-pin is subject to, the minimum pressure F that definite ultrasonic implanting gun need provide thus
min;
According to one section hold-down support, the strut buckling formula in one section free situation, can calculate the minimum modulus E of the required Z-pin of ultrasonic implantation
min;
In formula, I is the moment of inertia; L be Z ?pin be exposed at the length of carrier foam segment;
(3) E that utilizes (2) step to obtain
mininquire about in the database of setting up in (1) step, according to Query Result, carry out subsequent treatment:
(3 ?1) work as E
0<E
min<E
1the time, select E in database
minor Z-pin is not exclusively solidified in preparation parameter preparation corresponding to its closest value;
(3 ?2) work as E
min<E
0the time, select E in database
0z-pin is not exclusively solidified in corresponding preparation parameter preparation;
(3 ?3) work as E
mine
1the time, select E in database
1z-pin is not exclusively solidified in corresponding preparation parameter preparation; Then the Z-pin that not exclusively solidifies of preparation carried out to freezing processing.
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CN2011102685090A CN102431180B (en) | 2011-09-13 | 2011-09-13 | Manufacturing method of partially cured Z-pin |
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CN102431180B true CN102431180B (en) | 2013-11-20 |
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CN102729493B (en) * | 2012-06-20 | 2014-09-24 | 天津工业大学 | Molding method and molding apparatus of composite material toughened thin rod |
CN103009638B (en) * | 2012-12-14 | 2015-12-09 | 航天神舟飞行器有限公司 | For the interlaminar improvement technique of the composite laminated plate of unmanned aerial vehicle body, wing |
GB201306481D0 (en) * | 2013-04-10 | 2013-05-22 | Rolls Royce Plc | A method of manufacturing a composite material including a thermoplastic coated reinforcing element |
CN104029401A (en) * | 2014-05-30 | 2014-09-10 | 南京航空航天大学 | Method for preparing phenolic resin system Z-pin by using twisted carbon fibers |
CN104134227B (en) * | 2014-06-30 | 2017-02-01 | 南京航空航天大学 | Method for generating Z-pin embedding path on free curve surface |
CN104552989B (en) * | 2015-01-23 | 2017-12-12 | 南京航空航天大学 | Microwave heating fast pultrusion prepares glass fiber compound material Z Pin device and method |
US11446900B2 (en) * | 2019-07-10 | 2022-09-20 | The Boeing Company | Filament fastener that cures with composite part |
CN110588014B (en) * | 2019-09-03 | 2023-01-10 | 长春长光宇航复合材料有限公司 | 2.5D composite material spray pipe expansion section and co-curing forming method thereof |
CN112406138A (en) * | 2020-09-24 | 2021-02-26 | 西北工业大学 | Method for reducing in-plane damage of Z-pin reinforced composite material laminated plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919413A (en) * | 1996-05-31 | 1999-07-06 | The Boeing Company | Method for inserting Z-pins |
CN1424287A (en) * | 2001-12-11 | 2003-06-18 | 斯内克马固体推进公司 | Stitched fibre preformed element preparing method for manufacturing composite material element |
EP1736303A2 (en) * | 2005-06-22 | 2006-12-27 | Northrop Grumman Corporation | Technique for automatically analyzing Z-pin dynamic insertion data to determine if an automated acceptable insertion was performed |
CN201040409Y (en) * | 2006-09-07 | 2008-03-26 | 泰山玻璃纤维有限公司 | Hand-operated device for transferring sheet material |
-
2011
- 2011-09-13 CN CN2011102685090A patent/CN102431180B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919413A (en) * | 1996-05-31 | 1999-07-06 | The Boeing Company | Method for inserting Z-pins |
CN1424287A (en) * | 2001-12-11 | 2003-06-18 | 斯内克马固体推进公司 | Stitched fibre preformed element preparing method for manufacturing composite material element |
EP1736303A2 (en) * | 2005-06-22 | 2006-12-27 | Northrop Grumman Corporation | Technique for automatically analyzing Z-pin dynamic insertion data to determine if an automated acceptable insertion was performed |
CN201040409Y (en) * | 2006-09-07 | 2008-03-26 | 泰山玻璃纤维有限公司 | Hand-operated device for transferring sheet material |
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