CN102425967A - Thinned composite capillary texture and molding method and application thereof - Google Patents
Thinned composite capillary texture and molding method and application thereof Download PDFInfo
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- CN102425967A CN102425967A CN2011103964556A CN201110396455A CN102425967A CN 102425967 A CN102425967 A CN 102425967A CN 2011103964556 A CN2011103964556 A CN 2011103964556A CN 201110396455 A CN201110396455 A CN 201110396455A CN 102425967 A CN102425967 A CN 102425967A
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Abstract
The invention discloses a thinned composite capillary texture and a molding method and application thereof. The texture comprises a metal net body and a powder sintering layer; the powder sintering layer has the thickness of between 0.1 and 0.7mm; and the thinned composite capillary texture has the total thickness of between 0.2 and 0.8mm and has a flexural property. The molding method comprises the following steps of: preparing the metal net body and metal powder respectively; attaching a liquid medium on the surface of the metal net body by methods of spraying, brushing or soaking and the like; uniformly adhering the metal powder on the surface of the metal net body by using the liquid medium; and sintering and fixing the metal powder by a sintering method to form the powder sintering layer on the surface of the metal net body. The thinned composite capillary texture formed by the method is particularly suitable to be applied in a heat pipe product structure, and a plurality of practical progressive and better industry utilization benefits of enlarging steam flow channel space, contributing to deflection processing of coping pipe walls, making the texture manufactured and molded easily and the like can be achieved.
Description
Technical field
The present invention relates to a kind of capillary structure, be meant a kind of innovative design of structure, forming method and application thereof of compound capillary structure especially.
Background technology
In existing heat pipe structure design,, can import compound capillary structure structure for reaching preferable heat conduction efficiency; Yet; The heat conduction efficiency of heat pipe though existing compound capillary structure can gain really along with the difference of heat pipe spatial shape, still exists some problem points and remains to be improved breakthrough.
Be that in response to the compactization designs trend of computer, electronic equipment at present heat pipe structure relatively must flat thereupon thinning and miniaturization, but thus; Originally be arranged at the compound capillary structure in the inside heat pipe space, will therefore produce some problems, Gai Yin; Compound capillary structure in the existing heat pipe is with regard to the processing procedure aspect, and the part of its sintered powder must adopt a plug to insert earlier in the heat pipe space as a tool usually, in the gap of this plug and thermotube wall, insert then metal dust more in addition sintering finalize the design; Right this kind existing structure is found in actual manufacturing experience; Its metal dust also can't reach the state requirement of slimming, and cross the young pathbreaker as if the gap in the powder process and be difficult to reach because of filling out, and along with heat pipe length is long more; Also there is the problem of powder consolidation difficulty to exist; And the thickness of sintered powder is in a single day blocked up, will cause the problem of steam flow channel insufficient space relatively, and this problem is under the enough condition of the sectional area of heat pipe and unlikely highlighting; But along with the flat thin miniaturization of the sectional area of heat pipe to a certain degree the time; Because the shared sectional area ratio of sintered powder is excessive relatively, the problem of said steam flow channel insufficient space promptly highlights, and is difficult to improve and overcomes.
Another problem of existing heat pipe combined capillary structure; Then be its sintered powder and dictyosome in a single day be sintered be fixed in the heat pipe space after; Its flexibility will be close to forfeiture, and so when heat pipe must be pressed into flat tube or bend pipe form in response to demand, the bent pairing compound capillary structure in position that becomes of its tube wall often was difficult to produce conforming bent change state; Cause the phenomenon that breaks away from each other between compound capillary structure and the thermotube wall; And the situation that this phenomenon can cause the steam flow channel space to get clogged, block simultaneously, and then have a strong impact on the mobile smoothness of working solution vapor state, make the heat dissipation of heat pipe have a greatly reduced quality.
Therefore,, how to develop a kind of innovative design that can have more desirable practicality, real target and the direction that must make great efforts to think breakthrough for relevant industry again to the above-mentioned existing existing problem of heat pipe combined capillary structure.
In view of this, the inventor this in manufacturing development and the design experiences of being engaged in Related product for many years, to above-mentioned target, in detail after design and the scrupulous assessment, eventually the present invention of a true tool practicality.
Summary of the invention
The present invention provides the compound capillary structure of a kind of thin typeization and forming method and application, and its purpose is primarily aimed at and how develops a kind of new-type heat pipe combined capillary structure that has more desirable practicality is that target is innovated breakthrough.
For achieving the above object; The technical scheme that the compound capillary structure structure of thin typeization of the present invention adopts is: the compound capillary structure of a kind of thin typeization; Comprise: a metal dictyosome, be the planar dictyosome form that constitutes by the staggered unit metal line of track and column braiding, this metal dictyosome includes two side surfaces; At least one powder sintered layer, for being formed by the metal powder sintered at least one side surface that is fixed in this metal dictyosome, this powder sintered layer thickness is between between the 0.1mm to 0.7mm; Wherein, this metal dictyosome and the powder sintered layer compound capillary structure gross thickness of thin typeization that the two was configured to altogether are between between the 0.2mm to 0.8mm; And wherein, this metal dictyosome and the powder sintered layer compound capillary structure of thin typeization that the two was configured to altogether have the deflection characteristic.
For achieving the above object; The technical scheme that the compound capillary structure forming method of thin typeization of the present invention adopts is: the forming method of the compound capillary structure of a kind of thin typeization; Especially refer to that a kind of gross thickness between between the 0.2mm to 0.8mm and have the forming method of the compound capillary structure of thin typeization of deflection characteristic, comprising: prepare a metal dictyosome; And the metal dust for preparing a confession sintering; Adhere to a liquid medium through spraying or brushing or dipping method at least one side surface of this metal dictyosome; The metal dust that utilizes this liquid medium will the desire sintering shape that is evenly distributed is built-up at least one side surface of this metal dictyosome; Through a sintering method with said the metal powder sintered fixing of wire netting surface that be built-up in, to form thickness at least one side surface of this metal dictyosome between the powder sintered layer between the 0.1mm to 0.7mm.
Related content in the technique scheme is explained as follows:
1. in the such scheme, said liquid medium is selected water for use or is sticked together liquid or organic solvent.
2. in the such scheme, when carrying out said sintering method, more be aided with and utilize tool or mould or pressure method, to increase the associativity and the flatness of this powder sintered layer.
For achieving the above object; The technical scheme that application has the heat pipe structure of the compound capillary structure of thin typeization of the present invention to adopt is: a kind of heat pipe; It is combined with the compound capillary structure of the described thin typeization of claim 1; This heat pipe is the hollow closed body of two end involutions, is equipped with working solution in its inner space, this in advance sintering have the compound capillary structure of thin typeization of metal dust to be arranged in this inner space.
Related content in the technique scheme is explained as follows:
1. in the such scheme, said thermotube wall fracture morphology is circle or flat or form circular and that flat has concurrently.
2. in the such scheme, the setting of the compound capillary structure of said thin typeization is zone of full week, section or the regional area that is distributed in this thermotube wall, the form of section.
3. in the such scheme, be the state of being sintered to fix between compound capillary structure of said thin typeization and the thermotube wall.
4. in the such scheme, the integrating step of compound capillary structure of said thin typeization and heat pipe comprises: with this heat pipe end elder generation involution wherein, the other end then stays establishes an opening; Preparation one imports plug, stretches in the inside heat pipe space for being inserted by said opening; Compound capillary structure dependence of this thin typeization or bag are against this importing plug; Utilize this importing plug to insert and stretch into the action in the inside heat pipe space, so that the compound capillary structure of this thin typeization is brought in this inside heat pipe space in the lump; Utilize this importing plug that the compound capillary structure of thin typeization is resisted against thermotube wall; Should import plug and extract out, and constitute the compound capillary structure of this thin typeization whereby and be arranged at the state in the inside heat pipe space.
5. in the such scheme, said importing plug more comprises a sintering step after the compound capillary structure of thin typeization is resisted against thermotube wall, so that combine fixing between the compound capillary structure of this thin typeization and the thermotube wall.
The principle of the invention and advantage are following:
1, the present invention a kind of by metal dictyosome and powder sintered layer constitute and gross thickness between the compound capillary structure structure of 0.2mm to 0.8mm; Because its ultra-thin shape thickness form and deflection characteristic; When making it be applied to the heat pipe product structure; The heat pipe steam flow channel space sectional area that can further increase is to promote the flow of vapor efficient of heat pipe.
2, the compound capillary structure of thin typeization of the present invention is more conducive to process in response to bent change of tube wall between ultra-thin shape thickness form and deflection characteristic between the 0.2mm to 0.8mm, makes between compound capillary structure and the heat pipe keeping splendid bonding state.
3, the present invention utilizes liquid medium that metal dust is built-up in the forming method that the wire netting surface is sintered to fix again earlier, can reach the advantage that is easy to make moulding and can obtains the powder sintered layer structure of slimming.
Description of drawings
Accompanying drawing 1 is the exploded perspective view of the compound capillary structure of thin typeization of the present invention;
Accompanying drawing 2 is one of embodiment fractography structure chart of the compound capillary structure of thin typeization of the present invention;
Accompanying drawing 3 is two of the embodiment fractography structure chart of the compound capillary structure of thin typeization of the present invention;
Accompanying drawing 4 is the forming method of the compound capillary structure of thin typeization of the present invention;
Accompanying drawing 5 is the forming method sketch map of the compound capillary structure of thin typeization of the present invention;
Accompanying drawing 6 for the compound capillary structure of thin typeization of the present invention in the distributed areas of thermotube wall one of sketch map;
Accompanying drawing 7 is two of the compound capillary structure of thin typeization of the present invention sketch map in the distributed areas of thermotube wall;
Accompanying drawing 8 is three of the compound capillary structure of thin typeization of the present invention sketch map in the distributed areas of thermotube wall;
Accompanying drawing 9 is four of the compound capillary structure of thin typeization of the present invention sketch map in the distributed areas of thermotube wall;
Accompanying drawing 10 is five of the compound capillary structure of thin typeization of the present invention sketch map in the distributed areas of thermotube wall;
Accompanying drawing 11 is the integrating step of compound capillary structure of thin typeization of the present invention and heat pipe;
Accompanying drawing 12 is the integrating step sketch map of compound capillary structure of thin typeization of the present invention and heat pipe;
Accompanying drawing 13 is another enforcement illustration of metal dust adhering mode of the compound capillary structure of thin typeization of the present invention.
In the above accompanying drawing: the compound capillary structure of A. thin typeization; 03. heat pipe; 031. tube wall; 032. inner space; 04. importing plug; 10. metal dictyosome; 11. metal wire; 20. powder sintered layer; 21. metal dust; 30. liquid medium; 40. tool; W1. thickness; W2. thickness.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described:
Embodiment: see also accompanying drawing 1, shown in 2, the compound capillary structure of a kind of thin typeization and forming method and application; At first, with regard to the structural plane of the compound capillary structure A of this thin typeization, comprising:
One metal dictyosome 10 is the planar dictyosome form that is made up of the staggered unit metal line 11 of track and column braiding, and this metal dictyosome 10 includes two side surfaces;
At least one powder sintered layer 20 forms (as shown in Figure 2 for being sintered to fix by metal dust 21 at least one side surface of this metal dictyosome 10; Shown in Figure 3 in addition then is the example that the equal sintering of two side surfaces has metal dust 21), these powder sintered layer 20 thickness W1 are between (as shown in Figure 2) between the 0.1mm to 0.7mm;
Wherein, as shown in Figure 2, this metal dictyosome 10 and the compound capillary structure A of powder sintered layer 20 the two thin typeization that is configured to altogether gross thickness are between the thin type thickness W2 of 0.2mm to 0.8mm form;
And wherein, this metal dictyosome 10 and the compound capillary structure A of powder sintered layer 20 the two thin typeization that is configured to altogether have the deflection characteristic.
Then, with regard to the forming method of the compound capillary structure A of said thin typeization, comprise the steps: like Fig. 4, shown in 5
A, preparation one metal dictyosome 10;
B, preparation one supply the metal dust 21 of sintering;
C, through spraying or brush or dipping (shown in figure 13) method is adhered to a liquid medium 30 in 10 at least one side surfaces of this metal dictyosome;
D, the powder 21 that utilizes this liquid medium 30 will the desire sintering shape that is evenly distributed is built-up at least one side surface of this metal dictyosome 10;
E, through a sintering method the said metal dusts 21 that are built-up in metal dictyosome 10 surface are sintered to fix in these metal dictyosome 10 surfaces, to form thickness between the powder sintered layer 20 between the 0.1mm to 0.7mm in these metal dictyosome 10 at least one side surfaces.
Wherein, these liquid medium 30 optional waters perhaps stick together liquid or organic solvent (like methyl alcohol, ethanol, acetone etc.).
As shown in Figure 5, wherein, when carrying out these sintering means, more be aided with and utilize tool 40 (or mould or pressure method), can increase the associativity and the flatness of this powder sintered layer 20 with this.
As shown in Figure 6; The compound capillary structure A of thin typeization according to the invention; It is particularly suitable for as the capillary structure in heat pipe 03 product structure on using; The hollow closed body that this heat pipe 03 is two end involutions is equipped with working solution in its inner space 032, this in advance sintering have the compound capillary structure A of thin typeization of metal dust 21 then to be arranged in this inner space 032.
Shown in Fig. 7～10, wherein, this heat pipe 03 tube wall fracture morphology can be circle or flat or form circular and that flat has concurrently.
Shown in Fig. 7～10, wherein, the setting of the compound capillary structure A of this thin typeization is zone of full week, section or the regional area that is distributed in this heat pipe 03 tube wall 031, the form of section.
Wherein, the compound capillary structure A of this thin typeization more can and this heat pipe 03 tube wall 031 between be the state of being sintered to fix.
Like Figure 11, shown in 12, the integrating step of compound capillary structure A of this thin typeization and heat pipe 03 comprises:
A, with this heat pipe 03 end elder generation involution wherein, the other end then stays establishes an opening;
B, preparation one import plug 04, stretch in heat pipe 03 inner space 032 for being inserted by this opening;
C, the compound capillary structure A of this thin typeization is relied on or bag is against this importing plug 04;
D, utilize this importing plug 04 to insert to stretch into the action in heat pipe 03 inner space 032, the compound capillary structure A of this thin typeization is brought in the lump in this heat pipe 03 inner space into 032;
E, this importing plug 04 of utilization are resisted against heat pipe 03 tube wall 031 with the compound capillary structure A of thin typeization;
F, should import plug 04 and extracted out, and constitute the compound capillary structure A of this thin typeization with this and be arranged at the state in heat pipe 03 inner space 032.
Wherein, said importing plug more can comprise a sintering step after the compound capillary structure A of thin typeization is resisted against heat pipe 03 tube wall 031, so that combine fixing between the compound capillary structure A of this thin typeization and heat pipe 03 tube wall 031.
Advantage of the present invention:
1, the present invention a kind of by metal dictyosome and powder sintered layer constitute and gross thickness between the compound capillary structure structure of 0.2mm to 0.8mm; Because its ultra-thin shape thickness form and deflection characteristic; When making it be applied to the heat pipe product structure; The heat pipe steam flow channel space sectional area that can further increase is to promote the flow of vapor efficient of heat pipe.
2, the compound capillary structure of thin typeization of the present invention is more conducive to process in response to bent change of tube wall between ultra-thin shape thickness form and deflection characteristic between the 0.2mm to 0.8mm, makes between compound capillary structure and the heat pipe keeping splendid bonding state.
3, the present invention utilizes liquid medium that metal dust is built-up in the forming method that the wire netting surface is sintered to fix again earlier, can reach the advantage that is easy to make moulding and can obtains the powder sintered layer structure of slimming.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to let the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (10)
1. compound capillary structure of thin typeization is characterized in that: comprising:
One metal dictyosome is the planar dictyosome form that is made up of the staggered unit metal line of track and column braiding, and this metal dictyosome includes two side surfaces;
At least one powder sintered layer, for being formed by the metal powder sintered at least one side surface that is fixed in this metal dictyosome, this powder sintered layer thickness is between between the 0.1mm to 0.7mm;
Wherein, this metal dictyosome and the powder sintered layer compound capillary structure gross thickness of thin typeization that the two was configured to altogether are between between the 0.2mm to 0.8mm;
And wherein, this metal dictyosome and the powder sintered layer compound capillary structure of thin typeization that the two was configured to altogether have the deflection characteristic.
2. the forming method of the compound capillary structure of thin typeization refers to that especially a kind of gross thickness between between the 0.2mm to 0.8mm and have the forming method of the compound capillary structure of thin typeization of deflection characteristic, is characterized in that: comprising:
Prepare a metal dictyosome; And
Preparation one supplies the metal dust of sintering;
Adhere to a liquid medium through spraying or brushing or dipping method at least one side surface of this metal dictyosome;
The metal dust that utilizes this liquid medium will the desire sintering shape that is evenly distributed is built-up at least one side surface of this metal dictyosome;
Through a sintering method with said the metal powder sintered fixing of wire netting surface that be built-up in, to form thickness at least one side surface of this metal dictyosome between the powder sintered layer between the 0.1mm to 0.7mm.
3. forming method according to claim 2 is characterized in that: said liquid medium is selected water for use or is sticked together liquid or organic solvent.
4. forming method according to claim 2 is characterized in that: when carrying out said sintering method, more be aided with and utilize tool or mould or pressure method, to increase the associativity and the flatness of this powder sintered layer.
5. heat pipe; Its application compound capillary structure of requirement 1 described thin typeization of having the right; It is characterized in that: this heat pipe is the hollow closed body of two end involutions; Be equipped with working solution in its inner space, this in advance sintering have the compound capillary structure of thin typeization of metal dust to be arranged in this inner space.
6. heat pipe according to claim 5 is characterized in that: said thermotube wall fracture morphology is circle or flat or form circular and that flat has concurrently.
7. heat pipe according to claim 5 is characterized in that: the setting of the compound capillary structure of said thin typeization is zone of full week, section or the regional area that is distributed in this thermotube wall, the form of section.
8. heat pipe according to claim 5 is characterized in that: be the state of being sintered to fix between compound capillary structure of said thin typeization and the thermotube wall.
9. heat pipe according to claim 5 is characterized in that: the integrating step of compound capillary structure of said thin typeization and heat pipe comprises:
With this heat pipe end elder generation involution wherein, the other end then stays establishes an opening;
Preparation one imports plug, stretches in the inside heat pipe space for being inserted by said opening;
Compound capillary structure dependence of this thin typeization or bag are against this importing plug;
Utilize this importing plug to insert and stretch into the action in the inside heat pipe space, so that the compound capillary structure of this thin typeization is brought in this inside heat pipe space in the lump;
Utilize this importing plug that the compound capillary structure of thin typeization is resisted against thermotube wall;
Should import plug and extract out, and constitute the compound capillary structure of this thin typeization whereby and be arranged at the state in the inside heat pipe space.
10. heat pipe according to claim 9 is characterized in that: said importing plug more comprises a sintering step after the compound capillary structure of thin typeization is resisted against thermotube wall, so that combine fixing between the compound capillary structure of this thin typeization and the thermotube wall.
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| CN2011103964556A CN102425967A (en) | 2011-12-05 | 2011-12-05 | Thinned composite capillary texture and molding method and application thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776742A (en) * | 2015-04-17 | 2015-07-15 | 广东新创意科技有限公司 | Composite liquid sucking core for ultrathin heat pipe and manufacturing method of composite liquid sucking core |
| CN106152844A (en) * | 2015-04-27 | 2016-11-23 | 索士亚科技股份有限公司 | Phase-change type radiator and the method making this radiator |
| CN106643240A (en) * | 2017-01-13 | 2017-05-10 | 深圳市汉华热管理科技有限公司 | Method for manufacturing heat pipe core |
| CN106871675A (en) * | 2017-03-22 | 2017-06-20 | 广东工业大学 | A kind of MULTILAYER COMPOSITE liquid-sucking core flat-plate type micro heat pipe and preparation method thereof |
| CN107052730A (en) * | 2017-03-27 | 2017-08-18 | 江苏大学 | A kind of composite trench pipe manufacturing method |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| WO2020228073A1 (en) * | 2019-05-10 | 2020-11-19 | 苏州铜宝锐新材料有限公司 | Capillary structure, manufacturing method therefor, and heat sink |
| CN114251965A (en) * | 2021-12-27 | 2022-03-29 | 飞荣达科技(江苏)有限公司 | Low-thermal-resistance composite layered capillary structure for high power and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106871675A (en) * | 2017-03-22 | 2017-06-20 | 广东工业大学 | A kind of MULTILAYER COMPOSITE liquid-sucking core flat-plate type micro heat pipe and preparation method thereof |
| CN107052730A (en) * | 2017-03-27 | 2017-08-18 | 江苏大学 | A kind of composite trench pipe manufacturing method |
| WO2020228073A1 (en) * | 2019-05-10 | 2020-11-19 | 苏州铜宝锐新材料有限公司 | Capillary structure, manufacturing method therefor, and heat sink |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| CN114251965A (en) * | 2021-12-27 | 2022-03-29 | 飞荣达科技(江苏)有限公司 | Low-thermal-resistance composite layered capillary structure for high power and manufacturing method |
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Application publication date: 20120425 |