CN102413669A - Heat dissipation apparatus of large power supply and heat dissipation method - Google Patents

Heat dissipation apparatus of large power supply and heat dissipation method Download PDF

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Publication number
CN102413669A
CN102413669A CN2011103594008A CN201110359400A CN102413669A CN 102413669 A CN102413669 A CN 102413669A CN 2011103594008 A CN2011103594008 A CN 2011103594008A CN 201110359400 A CN201110359400 A CN 201110359400A CN 102413669 A CN102413669 A CN 102413669A
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China
Prior art keywords
power supply
radome
air
front panel
radiator
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Pending
Application number
CN2011103594008A
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Chinese (zh)
Inventor
吕日新
邱常玉
宋藏珍
张琦
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BEIJING SPACEFLIGHT TUOPU HIGH TECHNOLOGY Co Ltd
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BEIJING SPACEFLIGHT TUOPU HIGH TECHNOLOGY Co Ltd
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Priority to CN2011103594008A priority Critical patent/CN102413669A/en
Publication of CN102413669A publication Critical patent/CN102413669A/en
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Abstract

The invention belongs to the heat dissipation field and especially relates to a heat dissipation apparatus of a large power supply and a heat dissipation method. The invention aims at solving a heat dissipation problem of the large power supply. The heat dissipation apparatus comprises: a power supply cabinet, a heat dissipation assembly and an air-distributed device. The air-distributed device is fixed on an inner side of a front panel (10) of the power supply cabinet. The air-distributed device comprises: a shielding cover (8) and a double parallel fan (9). The shielding cover (8) is fixedly connected with the front panel (10). The double parallel fan (9) is connected to a side surface of the shielding cover (8). An installing support (12) and a radiator (13) of the heat dissipation assembly are arranged behind the double parallel fan (9). A power device (1), a driver board (2), a control panel (3) and a power plate (4) are arranged above the installing support (12). By using the apparatus and the method, through reasonably distributing cooling air and arranging an air channel to reduce cooling air losses, a ventilation cooling efficiency can be improved; a mass of the radiator can be reduced; fan usage power can be reduced; a power supply working efficiency can be improved.

Description

A kind of heat abstractor of large power supply and heat dissipating method
Technical field
The invention belongs to the heat radiation field, be specifically related to a kind of heat abstractor and heat dissipating method of large power supply.
Background technology
In large power supply ventilation and heat technology; Adopt big flow, high blast blower fan, increase the diameter of ventilation hole and use the mode of large-scale radiator; Though can solve the ventilation and heat problem, its weak point is: increase weight, the cost of power supply, influence the effectiveness of power supply.
Summary of the invention
The heat abstractor and the heat dissipating method that the purpose of this invention is to provide a kind of brief, practical large power supply.
The technical scheme that the present invention adopted is:
A kind of heat abstractor of large power supply comprises power supply cabinet, radiating subassembly, air register; The power supply cabinet is formed by cover plate, front panel, installation base plate, machine frame, rear board sealing;
Be fixed with air register in power supply case front panel inboard, air register comprises radome, two-in-parallel blower fan composition; Radome is fixedly connected with front panel, and the two-in-parallel blower fan is connected the side of radome;
Be equipped with the mounting bracket and the radiator of radiating subassembly at two-in-parallel blower fan rear, the mounting bracket top is equipped with power device, drive plate, control board, power amplifier board;
Have square hole at radome towards the position of two-in-parallel blower fan; The square hole of the radome of air register, two-in-parallel blower fan and front panel carry out the first time with the case front panel air intake and distribute; Secondary distribution is carried out with an air distribution in the straight-through jetting type air channel that the drive plate of radiating subassembly, control board, power amplifier board, mounting bracket, radiator are formed.
The heat abstractor of aforesaid a kind of large power supply, wherein: the column components and parts with radiating subassembly are provided with turbulator near power device.
The heat abstractor of aforesaid a kind of large power supply, wherein: on said radome, be provided with feed-through filter.
A kind of heat dissipating method of large power supply comprises the steps:
Step 1, at the inboard fixedly air register of power supply case front panel, air register comprises the radome that links to each other with front panel, and the two-in-parallel blower fan that is positioned at the radome side, radome towards the position of two-in-parallel blower fan have square hole; Utilize square hole combination, two-in-parallel blower fan on the radome that the cooling air that front panel gets into is concentrated, cooling air is carried out the first time distribute;
Step 2, be equipped with the mounting bracket and the radiator of radiating subassembly in two-in-parallel horizontal fan direction, the mounting bracket top is equipped with devices such as power device, drive plate, control board, power amplifier board; Utilize drive plate, control board, power amplifier board and the radiator base plate of radiating subassembly to form straight-through jetting type air channel, upper strata; Utilize substrate and radiation tooth, the mounting bracket of radiator to form the straight-through jetting type air channel of lower floor; An air distribution is carried out secondary distribution, dredge cooling airflow to power device and radiator;
Step 3, utilize the column components and parts of radiating subassembly that turbulator is set near power device;
Step 4, feed-through filter is installed on radome, the cable of radome is carried out Filtering Processing.
The heat dissipating method of aforesaid a kind of large power supply, wherein: times axial fan hub diameter of gap c=0.5~2 between said radome and the front panel, minimum is 15mm.
The heat dissipating method of aforesaid a kind of large power supply, wherein: said radiator bottom surface and the assemblage gap of installing between the base plate are 5~15mm; Radiator air inlet inclination angle a=30~60 °; The two-in-parallel blower fan of air register and the gap b=5~20mm between the radiator.
The heat dissipating method of aforesaid a kind of large power supply, wherein: the front panel of said power supply cabinet, the ventilation hole of rear board adopt the combination of φ 3~φ 8mm array of circular apertures; The ventilation hole of the radome of air register adopts 5X5~10X10mm square hole array combination.
The invention has the beneficial effects as follows:
(1) reduce the cooling air loss through reasonable distribution cooling air, layout air channel, improve ventilation and heat efficient, reduce heatsink mass, the reduction blower fan uses power, improves power work efficient.
(2) utilize the double-deck electromagnetic shielding of porous plate, solve the contradiction of ventilation and heat and electromagnetic shielding.Avoid the use of valuable electromagnetic shielding material and device, reduce cost; Reduce the bore size of ventilation hole, improve electromagnet shield effect.
Description of drawings
Fig. 1 is the equal axes axonometric drawing of the heat abstractor of the present invention's a kind of large power supply provided by the invention;
Fig. 2 is the reverse YZ section plan of heat abstractor center X axle;
Fig. 3 is the reverse XZ section plan of heat abstractor center Y axle;
Among the figure: 1. power device, 2. drive plate, 3. control board, 4. power amplifier board, 5. turbulator, 6. cover plate, 7. feed-through filter, 8. radome, 9. the two-in-parallel blower fan, 10. front panel, 11. is installed base plates, 12. mounting brackets, 13. radiators, 14. machine frames, 15. rear boards.
Embodiment
Below in conjunction with accompanying drawing and embodiment the heat abstractor and the heat dissipating method of a kind of large power supply provided by the invention are introduced:
Shown in Fig. 1~3, a kind of heat abstractor of large power supply comprises power supply cabinet, radiating subassembly, air register.The power supply cabinet is formed by cover plate (6), front panel (10), installation base plate (11), machine frame (14), rear board (15) sealing;
Be fixed with air register in power supply case front panel (10) inboard, air register is made up of feed-through filter (7), radome (8), two-in-parallel blower fan (9).Radome (8) is fixedly connected with front panel (10), and two-in-parallel blower fan (9) is connected the side of radome (8), and feed-through filter (7) also is fixed on the radome (8).
Be equipped with the mounting bracket (12) and radiator (13) of radiating subassembly at two-in-parallel blower fan (9) rear, mounting bracket (12) top is equipped with power device (1), drive plate (2), control board (3), power amplifier board (4), turbulator devices such as (5).
Radome (8) towards the position of two-in-parallel blower fan (9) have square hole; Square hole combination, two-in-parallel blower fan (9) and the front panel (10) of the radome (8) through air register carry out distribution first time (air distribution) with case front panel (10) air intake, i.e. the cooling air radiating subassembly that leads; The straight-through jetting type air channel that utilizes the drive plate (2), control board (3), power amplifier board (4), mounting bracket (12), radiator (13) of radiating subassembly to form; An air distribution is carried out secondary distribution (secondary air distribution); Be cooling air with the mode of straight-through jet lead power device (1) and radiator (13), reduce system wind resistance, reduce air loss and raising radiating efficiency; Utilize the column components and parts of radiating subassembly that turbulator (5) is set near power device, to improve its turbulence level and cooling effect; Distance is greater than axial fan hub between the front panel (10) of radome of air register (8) and power supply cabinet; To form air intake wind chamber and shielding isolation cabin; The radome cable adopts feed-through filter (7) to carry out Filtering Processing; And the shielding isolation cabin makes the front portion of power supply have the double layer screen function, has solved the contradiction of power supply air intake percent opening and screening effectiveness.
A kind of heat dissipating method of large power supply comprises the steps:
Step 1, at the inboard fixedly air register of power supply case front panel (10); Air register comprises the radome (8) that links to each other with front panel (10); And the two-in-parallel blower fan (9) that is positioned at radome (8) side, have square hole at radome (8) towards the position of two-in-parallel blower fan (9); Utilize square hole combination, two-in-parallel blower fan (9) on the radome (8) that the cooling air that front panel (10) gets into is concentrated, cooling air is carried out distributing the first time (air distribution); Set the gap c=0.5~2 times axial fan hub diameter between radome (8) and the front panel (10), minimum is 15mm, and maximum can be confirmed according to front panel (10) device depth, forms air intake wind chamber and shielding isolation cabin.
Step 2, at mounting bracket (12) and radiator (13) that two-in-parallel blower fan (9) horizontal direction is equipped with radiating subassembly, mounting bracket (12) top is equipped with power device (1), drive plate (2), control board (3), power amplifier board devices such as (4).Utilize drive plate (2), control board (3), power amplifier board (4) and radiator (13) substrate of radiating subassembly to form straight-through jetting type air channel, upper strata; Utilize substrate and radiation tooth, the mounting bracket (12) of radiator (13) to form the straight-through jetting type air channel of lower floor; An air distribution is carried out secondary distribution; Dredge cooling airflow to power device (1) and radiator (13), avoid the cooling air unnecessary loss, improve the efficient of ventilation and heat.The assemblage gap of setting radiator (13) bottom surface and installing between the base plate (11) is 5~15mm; Radiator (13) air inlet inclination angle a=30~60 °; The two-in-parallel blower fan (9) of air register and the gap b=5~20mm between the radiator (13).
(3) utilize the column components and parts of radiating subassembly that turbulator (5) is set near power device (1), to improve its turbulence level and cooling effect.
(4) at radome (8) feed-through filter (7) go up to be installed, the cable of radome (8) is carried out Filtering Processing.Shielding isolation cabin between radome of air register (8) and the power supply case front panel (10) is at the double-deck electromagnetic shielding of the anterior formation of power supply; Cable through radome (8) adopts feed-through filter (7) to carry out Filtering Processing, can effectively solve the problem that electromagnet shield effect that front panel (10) causes because of indication, display window and ventilation hole reduces.The relative single-layer shield of screening effectiveness improves 20~30dB.The ventilation hole of the front panel of power supply cabinet (10), rear board (15) adopts φ 3~φ 8mm array of circular apertures combination (porous plate); The ventilation hole of the radome of air register (8) adopts 5X5~10X10mm square hole array combination (porous plate).

Claims (7)

1. the heat abstractor of a large power supply comprises power supply cabinet, radiating subassembly, air register; It is characterized in that: the power supply cabinet is formed by cover plate (6), front panel (10), installation base plate (11), machine frame (14), rear board (15) sealing;
Be fixed with air register in power supply case front panel (10) inboard, air register comprises radome (8), two-in-parallel blower fan (9) composition; Radome (8) is fixedly connected with front panel (10), and two-in-parallel blower fan (9) is connected the side of radome (8);
Be equipped with the mounting bracket (12) and radiator (13) of radiating subassembly at two-in-parallel blower fan (9) rear, mounting bracket (12) top is equipped with power device (1), drive plate (2), control board (3), power amplifier board (4);
Have square hole at radome (8) towards the position of two-in-parallel blower fan (9); The square hole of the radome of air register (8), two-in-parallel blower fan (9) and front panel (10) carry out the first time with case front panel (10) air intake and distribute; Secondary distribution is carried out with an air distribution in the straight-through jetting type air channel that the drive plate of radiating subassembly (2), control board (3), power amplifier board (4), mounting bracket (12), radiator (13) are formed.
2. the heat abstractor of a kind of large power supply according to claim 1, it is characterized in that: the column components and parts with radiating subassembly are provided with turbulator (5) near power device.
3. the heat abstractor of a kind of large power supply according to claim 1 is characterized in that: on said radome (8), be provided with feed-through filter (7).
4. the heat dissipating method of a large power supply comprises the steps:
Step 1, at the inboard fixedly air register of power supply case front panel (10); Air register comprises the radome (8) that links to each other with front panel (10); And the two-in-parallel blower fan (9) that is positioned at radome (8) side, radome (8) towards the position of two-in-parallel blower fan (9) have square hole; Utilize square hole combination, two-in-parallel blower fan (9) on the radome (8) that the cooling air that front panel (10) gets into is concentrated, cooling air is carried out the first time distribute;
Step 2, at mounting bracket (12) and radiator (13) that two-in-parallel blower fan (9) horizontal direction is equipped with radiating subassembly, mounting bracket (12) top is equipped with power device (1), drive plate (2), control board (3), power amplifier board devices such as (4); Utilize drive plate (2), control board (3), power amplifier board (4) and radiator (13) substrate of radiating subassembly to form straight-through jetting type air channel, upper strata; Utilize substrate and radiation tooth, the mounting bracket (12) of radiator (13) to form the straight-through jetting type air channel of lower floor; An air distribution is carried out secondary distribution, dredge cooling airflow to power device (1) and radiator (13);
Step 3, utilize the column components and parts of radiating subassembly that turbulator (5) is set near power device (1);
Step 4, feed-through filter (7) go up to be installed, the cable of radome (8) is carried out Filtering Processing at radome (8).
5. the heat dissipating method of a kind of large power supply according to claim 4, it is characterized in that: the gap c=0.5~2 times axial fan hub diameter between said radome (8) and the front panel (10), minimum is 15mm.
6. the heat dissipating method of a kind of large power supply according to claim 4 is characterized in that: said radiator (13) bottom surface and the assemblage gap of installing between the base plate (11) are 5~15mm; Radiator (13) air inlet inclination angle a=30~60 °; The two-in-parallel blower fan (9) of air register and the gap b=5~20mm between the radiator (13).
7. the heat dissipating method of a kind of large power supply according to claim 4 is characterized in that: ventilation hole employing φ 3~φ 8mm array of circular apertures combination of the front panel of said power supply cabinet (10), rear board (15); The ventilation hole of the radome of air register (8) adopts 5X5~10X10mm square hole array combination.
CN2011103594008A 2011-11-14 2011-11-14 Heat dissipation apparatus of large power supply and heat dissipation method Pending CN102413669A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302154A (en) * 2014-08-22 2015-01-21 江苏达胜加速器制造有限公司 Cooling device for high-frequency power oscillator
CN105431023A (en) * 2015-12-30 2016-03-23 北京新能源汽车股份有限公司 Power device assembly of vehicle power source and vehicle with power device assembly
CN107820374A (en) * 2016-09-14 2018-03-20 北京航天计量测试技术研究所 A kind of modularization radiator structure for matching somebody with somebody electric loading device
CN108919932A (en) * 2018-05-31 2018-11-30 合肥同智机电控制技术有限公司 A kind of electromagnetic compatibility processing technique of large power supply

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CN201550386U (en) * 2009-04-22 2010-08-11 技嘉科技股份有限公司 Radiating device with rotary air passage
CN201590983U (en) * 2010-01-04 2010-09-22 山东超越数控电子有限公司 Multi-air duct radiation device for ATR sealed case
CN102073357A (en) * 2010-12-23 2011-05-25 北京中科大洋科技发展股份有限公司 Low-noise machine case for integrated computer server
TW201127270A (en) * 2010-01-28 2011-08-01 Delta Electronics Inc Cooling system

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WO1992015188A1 (en) * 1991-02-13 1992-09-03 L.T.S. I Söderköping Ab Arrangement at a cooling system for cooling of equipment for telecommunication
CN2760644Y (en) * 2004-12-22 2006-02-22 微星科技股份有限公司 Door structure
CN101005745A (en) * 2006-01-20 2007-07-25 刘胜 Micro jet flow cooling system for electronic device
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302154A (en) * 2014-08-22 2015-01-21 江苏达胜加速器制造有限公司 Cooling device for high-frequency power oscillator
CN104302154B (en) * 2014-08-22 2016-07-20 中广核达胜加速器技术有限公司 A kind of chiller for high frequency power oscillator
CN105431023A (en) * 2015-12-30 2016-03-23 北京新能源汽车股份有限公司 Power device assembly of vehicle power source and vehicle with power device assembly
CN105431023B (en) * 2015-12-30 2019-03-12 北京新能源汽车股份有限公司 The power device component of vehicle power supply and vehicle with it
CN107820374A (en) * 2016-09-14 2018-03-20 北京航天计量测试技术研究所 A kind of modularization radiator structure for matching somebody with somebody electric loading device
CN108919932A (en) * 2018-05-31 2018-11-30 合肥同智机电控制技术有限公司 A kind of electromagnetic compatibility processing technique of large power supply
CN108919932B (en) * 2018-05-31 2021-09-07 合肥同智机电控制技术有限公司 Electromagnetic compatibility processing device of high-power supply

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Application publication date: 20120411