CN102407706A - Hot stamping foil and method for fabricating the same - Google Patents
Hot stamping foil and method for fabricating the same Download PDFInfo
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- CN102407706A CN102407706A CN2011102136093A CN201110213609A CN102407706A CN 102407706 A CN102407706 A CN 102407706A CN 2011102136093 A CN2011102136093 A CN 2011102136093A CN 201110213609 A CN201110213609 A CN 201110213609A CN 102407706 A CN102407706 A CN 102407706A
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Abstract
The embodiment of the invention discloses a hot stamping foil and a method for fabricating the same. The hot stamping foil comprises a substrate layer (11), a color layer (12), a metal layer (13), a first bonder layer (14), a radio frequency identification layer (15), a second bonder layer (16) and a protection layer (17); the color layer (12), the metal layer (13), the first bonder layer (14), the radio frequency identification layer (15) and the second bonder layer (16) are arranged between the substrate layer (11) and the protection layer (17); the color layer (12) and the metal layer (13) are arranged between the substrate layer (11) and the first bonder layer (14); the second bonder layer (16) is located between the radio frequency identification layer (15) and the protection layer (17); and the radio frequency identification layer (15) comprises at least one radio frequency identification chip. The scheme provided by the embodiment of the invention is favorable for realizing product with low cost as much as possible and has anti-channel conflict and anti-theft functions.
Description
Technical field
The present invention relates to the manufacturing technology field, be specifically related to a kind of stamping systems and stamping systems preparation method.
Background technology
At present, on the market some product has anti-falsifying function, certain other some product have certain anti-theft feature.
And based on product function diversified demand day by day, businessman possibly hope that its product can have anti-falsifying function and anti-theft feature simultaneously.Therefore, realization product that how can relatively low cost has anti-falsifying and anti-theft feature simultaneously, is technical task with market prospects of industry.
Summary of the invention
The embodiment of the invention provides a kind of stamping systems and stamping systems preparation method, in the hope of realize that cheaply product has anti-falsifying and anti-theft feature simultaneously as far as possible.
For solving the problems of the technologies described above, the embodiment of the invention provides following technical scheme:
The embodiment of the invention provides a kind of stamping systems on the one hand, comprising:
Basalis, color layers, metal level, first adhesion agent layer, RF identification layer, second adhesion agent layer and protective layer;
Wherein, Said color layers, metal level, first adhesion agent layer, RF identification layer and second adhesion agent layer are arranged between said basalis and the protective layer; Said second adhesion agent layer is between said RF identification layer and protective layer, and said RF identification layer comprises a slice RF identification chip at least.
Optional, said stamping systems also comprises:
Be arranged at the separating layer between said basalis and the color layers.
Optional, also include the pattern that forms through the laser mold pressing on said color layers or the metal level.
Optional, said protective layer is polythene PE film or polyethylene terephtalate film.
Optional, said RF identification layer comprises the multi-disc RF identification chip, and equates in the spacing of any two adjacent RF identification chips of stamping systems in-plane.
The embodiment of the invention provides a kind of stamping systems preparation method on the one hand, comprising:
Evenly be coated with mould release to form separating layer on the basalis surface;
Be coated with colouring agent to form color layers in said separating layer;
On said color layers, electroplate to form metal level;
The coating solid is to form first adhesion agent layer on said metal level;
On said first adhesion agent layer, paste a slice RF identification chip at least, on said first adhesion agent layer, to form the RF identification layer, wherein, said RF identification chip and said metal level, color layers, separating layer and basalis form an integral body;
The coating solid is to form second adhesion agent layer on said RF identification layer;
Overlay film is to form protective layer on said second adhesion agent layer.
Optional, the said plating on the said color layers with before forming metal level also comprises:
On said color layers, form pattern through the laser mold pressing.
Optional, saidly also comprise with before forming first adhesion agent layer: on said metal level, form pattern through the laser mold pressing at coating solid on the said metal level.
Optional, said on said color layers, the plating to form metal level is specially:
On said color layers, pass through vacuum plating to form metal level.
The embodiment of the invention provides a kind of stamping systems preparation method on the other hand, comprising:
At basalis surface coated colouring agent to form color layers;
On said color layers, electroplate to form metal level;
The coating solid is to form first adhesion agent layer on said metal level;
On said first adhesion agent layer, paste a slice RF identification chip at least, on said first adhesion agent layer, to form the RF identification layer, wherein, said RF identification chip and said metal level, color layers, separating layer and basalis form an integral body;
The coating solid is to form second adhesion agent layer on said RF identification layer;
Overlay film is to form protective layer on said second adhesion agent layer.
Therefore the embodiment of the invention is provided with the RFID chip in stamping systems, and then comes to realize simultaneously the anti-falsifying anti-theft feature to commodity for employing RFID technology and lay a good foundation, and realizes that cost is relatively low; After this stamping systems is applied to the packing of product, just can come fast, discern easily, read and understand corresponding product information through the RFID chip in this stamping systems; Simultaneously,, thereby avoided the anti-falsifying information of record such as existing use bar code and the drawback that can't change, can further practice thrift the operating cost of enterprise and the risk cost of use RFID chip because canned data can be edited repeatedly in this RFID chip.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1-a is the sketch map of a kind of each layer of the stamping systems position relation that provides of the embodiment of the invention;
Fig. 1-b is the sketch map of another kind of each layer of the stamping systems position relation that provides of the embodiment of the invention;
Fig. 2-a is the schematic appearance of a kind of stamping systems of providing of the embodiment of the invention;
Fig. 2-b is the A-A tangent plane sketch map of stamping systems shown in Fig. 2-a of providing of the embodiment of the invention;
Fig. 3 is the schematic flow sheet of a kind of stamping systems preparation method of providing of the embodiment of the invention;
Fig. 4 is the schematic flow sheet of the another kind of stamping systems preparation method that provides of the embodiment of the invention.
The specific embodiment
The embodiment of the invention provides a kind of stamping systems and stamping systems preparation method, in the hope of realize that cheaply product has anti-falsifying and anti-theft feature simultaneously as far as possible.
For make goal of the invention of the present invention, characteristic, advantage can be more obvious and understandable; To combine the accompanying drawing in the embodiment of the invention below; Technical scheme in the embodiment of the invention is carried out clear, intactly description; Obviously, the embodiments described below only are the present invention's part embodiment, but not whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Below be elaborated respectively through specific embodiment.
Referring to Fig. 1-a, a kind of stamping systems that the embodiment of the invention provides can comprise: basalis 11, color layers 12, metal level 13, first adhesion agent layer 14, RF identification layer 15, second adhesion agent layer 16 and protective layer 17;
Wherein, Color layers 12, metal level 13, first adhesion agent layer 14, RF identification layer 15 and second adhesion agent layer are arranged between basalis 11 and the protective layer 17; Second adhesion agent layer 16 is between RF identification layer 15 and protective layer 17; RF identification (RFID, Radio Frequency Identification) layer 16 comprises at least 1 RF identification chip.Color layers 12 and metal level 13 can be arranged between the basalis 11 and first adhesion agent layer 14.Wherein, first adhesion agent layer 14 can be used for RF identification layer 15 and metal level 13, color layers 12 and basalis 11 firm adhesions to form an integral body.And under the effect of second adhesion agent layer 16, thereby protective layer 17 is pasted on the RF identification layer 15 RF identification chip in the radio frequency identification layer 15 is protected.
In practical application, basalis 11 for example can be PET (Polyethylene Terephthalate, PETG) film, OPP (Oriented Polypropylene, oriented polypropylene (OPP)) film or also can be other similar material.Protective layer 17 for example can be PE (Polyethylene, a polyethylene) film, and the PET film also can be other similar material perhaps.
Optional, referring to Fig. 1-b, stamping systems for example also can comprise: be arranged at the separating layer 18 between basalis 11 and the color layers 12, separating layer 18 comprises mould release etc.Under this scene, first adhesion agent layer 14 can be with RF identification layer 15 and metal level 13, color layers 12, separating layer and basalis 11 firm adhesions to form an integral body.Certainly, if basalis 11 is selected suitable material for use, then also can need not to be provided with the separation function that separating layer 18 just can realize mould release.
In practical application; For example shown in Fig. 2-a; If the RF identification layer 15 of stamping systems can comprise multi-disc RF identification chip (Fig. 2-a exemplified shows 5 RF identification chips); The spacing of any two adjacent RF identification chips on the in-plane of stamping systems can equate or approximately equal, and on the thickness direction of stamping systems, can have only a slice RF identification chip, promptly do not have the RF identification chip of stack.
In addition, in order to strengthen visual effect, on color layers 12 or metal level 13, also can form pattern (can comprise figure and/or literal etc. in this pattern) through the laser mold pressing.Wherein, metal level 13 can improve the brightness of pattern, strengthens aesthetic feeling and visual effect.
Referring to Fig. 2, Fig. 2-b is a kind of stamping systems tangent plane sketch map of giving an example of Fig. 2-a.Stamping systems shown in Fig. 2-b comprises: basalis 11, separating layer 18 (optional), color layers 12, metal level 13, first adhesion agent layer 14, RF identification layer 15, second adhesion agent layer 16 and protective layer 17.
Preferably, the gross thickness of basalis 11, separating layer 18, color layers 12, metal level 13 can be between 10～20 μ m, and the thickness of RF identification layer 15 is about 80～200 μ m, and the film thickness of protective layer 17 is at 15～50 μ m.
In the present embodiment; Having RFID chip in the stamping systems of anti-falsifying anti-theft feature looks packing instructions and can be read-only chip or read-write chip; The anti-falsifying information of product; Other information relevant with product of reaching all is recorded on the RFID chip, and can together be transferred to the article surface of undertaking the printing of through pattern and the RFID chip that cold wave technology (or other technology) will have on the stamping systems, thereby realizes giving the function that packaged product has anti-falsifying antitheft.
Referring to Fig. 3, the embodiment of the invention also provides a kind of stamping systems preparation method, can comprise:
301, evenly be coated with mould release to form separating layer on the basalis surface;
In practical application, basalis for example can be PET film, OPP film, perhaps also can be other similar material.
302, be coated with (for example evenly coating) colouring agent in separating layer to form color layers;
303, on color layers, electroplate to form metal level;
In practical application, for example can on color layers, carry out vacuum plating (perhaps carrying out the plating of alternate manner) to form metal level.For example can be on color layers Electroplating Aluminum or electrodeposited chromium to form metal level, certainly under specific demand, also can on color layers, electroplate other metal material.
304, coating on metal level (for example evenly coating) solid is to form first adhesion agent layer;
In one embodiment, before electroplating on the color layers, also can comprise: on color layers, form pattern through the laser mold pressing with the formation metal level.
In another embodiment, for example also can comprise before forming first adhesion agent layer at coating solid on the metal level: on metal level, form pattern through the laser mold pressing.
Wherein, metal level can improve the brightness of the pattern on the color layers, strengthens aesthetic feeling and visual effect.
305, on first adhesion agent layer, paste a slice RF identification chip at least, on first adhesion agent layer, to form the RF identification layer, wherein, RF identification chip and metal level, color layers, separating layer and basalis form an integral body;
306, coating on the RF identification layer (for example evenly coating) solid is to form second adhesion agent layer;
307, on second adhesion agent layer overlay film to form protective layer.
In practical application, protective layer for example can be PET film, PE film or also can be other similar material.
In practical application, mould release, colouring agent and solid for example can form according to suitable component ratio allotment through different resins and solvent.
Referring to Fig. 4, the embodiment of the invention also provides another kind of stamping systems preparation method, can comprise:
401, at basalis surface coated (for example evenly coating) colouring agent to form color layers;
In practical application, basalis for example can be PET film, OPP film, perhaps also can be other similar material.
402, on color layers, electroplate to form metal level;
In practical application, for example can on color layers, carry out vacuum plating (perhaps carrying out the plating of alternate manner) to form metal level.For example can be on color layers Electroplating Aluminum or electrodeposited chromium to form metal level, certainly under specific demand, also can on color layers, electroplate other metal material.
403, coating on metal level (for example evenly coating) solid is to form first adhesion agent layer;
In one embodiment, before electroplating on the color layers, also can comprise: on color layers, form pattern through the laser mold pressing with the formation metal level.
In another embodiment, for example also can comprise before forming first adhesion agent layer at coating solid on the metal level: on metal level, form pattern through the laser mold pressing.
Wherein, metal level can improve the brightness of the pattern on the color layers, strengthens aesthetic feeling and visual effect.
404, on first adhesion agent layer, paste a slice RF identification chip at least, on first adhesion agent layer, to form the RF identification layer, wherein, RF identification chip and said metal level, color layers, separating layer and basalis form an integral body;
405, coating on the RF identification layer (for example evenly coating) solid is to form second adhesion agent layer;
406, on second adhesion agent layer overlay film to form protective layer.
In practical application, protective layer for example can be PET film, PE film or also can be other similar material.
In practical application, mould release, colouring agent and solid for example can form according to suitable component ratio allotment through different resins and solvent.
At last, if need, then can promptly obtain several stamping systems Dan Pin (stamping systems list article are promptly used on the product) with being laminated with stamping systems itemize or the roll-leaf that obtains behind the diaphragm.
In the embodiment of the invention; Has the RFID chip in the stamping systems of anti-falsifying anti-theft feature; Look packing instructions and can be read-only chip or read-write chip; And the anti-falsifying information of product and out of Memory multiple all can be recorded in this RFID chip on relevant with product, but and can the pattern on this stamping systems and RFID chip together to be transferred to the article of undertaking the printing of through cold wave technology (or other technology) surperficial, have the function that anti-falsifying is guarded against theft thereby give packaged product.
During cold wave; Position printing one deck UV (ultraviolet light) curing adhesive that for example can need thermoprint prior to the article of undertaking the printing of; Pass through one group of applying pressure roller again (in practical application; The up-down rollers of applying pressure roller is general, and to adopt hard metallic roll be that generally to select hardness for use be the rubber rollers of HS80-90 for bottom roller, its pressure roller) that this stamping systems with anti-falsifying anti-theft feature is pressed on the article of undertaking the printing of is surperficial; Under the effect of UV drying device, the moisture in the UV curing adhesive reduces, and forms the full-bodied extremely thin viscose of one deck.Because the cohesion between adhesive and the stamping systems is big; So the position that stamping systems contacts with adhesive adheres to the article surface of undertaking the printing of; To be whole stamping systems be stripped from each layer that includes the RFID chip that gets off and the article of undertaking the printing of from color layers becomes one; Basalis finally utilizes canned data in this RFID chip then by waste discharge, can realize the anti-falsifying theft management to packaged product.
Be appreciated that the stamping systems with anti-falsifying anti-theft feature provided by the invention for example can be applicable to plastic packaging film material, sheet material, paper material and other packaging material.
Therefore the embodiment of the invention is provided with the RFID chip in stamping systems, and then comes to realize simultaneously the anti-falsifying anti-theft feature to commodity for employing RFID technology and lay a good foundation; After this stamping systems is applied to the packing of product, just can come fast, discern easily, read and understand corresponding product information through the RFID chip in this stamping systems; Simultaneously,, thereby avoided the anti-falsifying information of record such as existing use bar code and the drawback that can't change, further practiced thrift the operating cost of enterprise and the risk cost of use RFID chip because canned data can be edited repeatedly in this RFID chip.
Need to prove; For aforesaid each method embodiment, for simple description, so it all is expressed as a series of combination of actions; But those skilled in the art should know; The present invention does not receive the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, do not have the part that details among certain embodiment, can be referring to the associated description of other embodiment.
More than a kind of stamping systems and stamping systems preparation method that the embodiment of the invention provided have been carried out detailed introduction; Used concrete example among this paper principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on the specific embodiment and range of application, all can change, to sum up, this description should not be construed as limitation of the present invention.
Claims (10)
1. a stamping systems is characterized in that, comprising:
Basalis, color layers, metal level, first adhesion agent layer, RF identification layer, second adhesion agent layer and protective layer;
Wherein, Said color layers, metal level, first adhesion agent layer, RF identification layer and second adhesion agent layer are arranged between said basalis and the protective layer; Said second adhesion agent layer is between said RF identification layer and protective layer, and said RF identification layer comprises a slice RF identification chip at least.
2. stamping systems according to claim 1 is characterized in that,
Said stamping systems also comprises: be arranged at the separating layer between said basalis and the color layers.
3. stamping systems according to claim 2 is characterized in that, also includes the pattern that forms through the laser mold pressing on said color layers or the metal level.
4. according to each described stamping systems of claim 1 to 3, it is characterized in that,
Said protective layer is polythene PE film or polyethylene terephtalate film.
5. according to each described stamping systems of claim 1 to 3, it is characterized in that,
Said RF identification layer comprises the multi-disc RF identification chip, and equates in the spacing of any two adjacent RF identification chips of stamping systems in-plane.
6. a stamping systems preparation method is characterized in that, comprising:
Evenly be coated with mould release to form separating layer on the basalis surface;
Be coated with colouring agent to form color layers in said separating layer;
On said color layers, electroplate to form metal level;
The coating solid is to form first adhesion agent layer on said metal level;
On said first adhesion agent layer, paste a slice RF identification chip at least, on said first adhesion agent layer, to form the RF identification layer, wherein, said RF identification chip and said metal level, color layers, separating layer and basalis form an integral body;
The coating solid is to form second adhesion agent layer on said RF identification layer;
Overlay film is to form protective layer on said second adhesion agent layer.
7. method according to claim 6 is characterized in that, the said plating on the said color layers with before forming metal level also comprises:
On said color layers, form pattern through the laser mold pressing.
8. method according to claim 6 is characterized in that, said on the said metal level coating solid with before forming first adhesion agent layer, also comprise:
On said metal level, form pattern through the laser mold pressing.
9. according to each described method of claim 6 to 8, it is characterized in that said on said color layers, the plating to form metal level is specially:
On said color layers, pass through vacuum plating to form metal level.
10. a stamping systems preparation method is characterized in that, comprising:
At basalis surface coated colouring agent to form color layers;
On said color layers, electroplate to form metal level;
The coating solid is to form first adhesion agent layer on said metal level;
On said first adhesion agent layer, paste a slice RF identification chip at least, on said first adhesion agent layer, to form the RF identification layer, wherein, said RF identification chip and said metal level, color layers, separating layer and basalis form an integral body;
The coating solid is to form second adhesion agent layer on said RF identification layer;
Overlay film is to form protective layer on said second adhesion agent layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102136093A CN102407706A (en) | 2011-07-28 | 2011-07-28 | Hot stamping foil and method for fabricating the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102136093A CN102407706A (en) | 2011-07-28 | 2011-07-28 | Hot stamping foil and method for fabricating the same |
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| CN102407706A true CN102407706A (en) | 2012-04-11 |
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| CN2011102136093A Pending CN102407706A (en) | 2011-07-28 | 2011-07-28 | Hot stamping foil and method for fabricating the same |
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Cited By (4)
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| CN105243417A (en) * | 2015-11-19 | 2016-01-13 | 山东泰宝防伪技术产品有限公司 | RFID printed antenna hot stamped electronic tag and manufacturing method thereof |
| CN105279549A (en) * | 2015-11-19 | 2016-01-27 | 山东泰宝防伪技术产品有限公司 | Gold-stamped RFID tag and preparation method thereof |
| CN106042451A (en) * | 2016-05-20 | 2016-10-26 | 山东泰宝防伪制品有限公司 | Production process for radio frequency identification packing box |
| CN113195187A (en) * | 2018-11-15 | 2021-07-30 | 山勝实验室有限公司 | Method for preparing unsintered polytetrafluoroethylene film and porous film thereof |
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| CN113195187A (en) * | 2018-11-15 | 2021-07-30 | 山勝实验室有限公司 | Method for preparing unsintered polytetrafluoroethylene film and porous film thereof |
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Application publication date: 20120411 |