CN102403255B - Mechanical chuck and etching machine - Google Patents

Abstract

The invention relates to a mechanical chuck and an etching machine using the mechanical chuck, wherein the mechanical chuck includes a tray and a chuck, a fluid chamber is arranged between the tray and the chuck, and the mechanical chuck also It includes a flow control structure for preventing the temperature-regulating fluid from directly flowing out of the fluid chamber; the flow control structure is arranged around the circumference of the tray and the chuck, and is connected to the tray and the chuck respectively. In this embodiment, through the flow control structure provided in the mechanical chuck to prevent the temperature-regulating fluid from flowing out of the fluid chamber, the temperature-regulating fluid can fully contact the back of the wafer placed on the tray to improve the thermal stability. The exchange efficiency and speed are improved, and the outflow of helium gas from the fluid chamber into the process chamber is reduced, which is beneficial to improving the purity of the process chamber where the mechanical chuck is located.

Description

Mechanical Chuck and Etching Machine

technical field

The invention relates to semiconductor manufacturing technology, in particular to a mechanical chuck and an etching machine. the

Background technique

In semiconductor processes such as integrated circuit manufacturing and LED manufacturing, processes such as etching, sputtering, and chemical vapor deposition rely on mechanical chucks to fix and support wafers. In addition to fixing and supporting the wafer to prevent it from shifting and vibrating during the process, the mechanical chuck is also an important function of the mechanical chuck to control the temperature of the wafer. A mechanical chuck is installed in the process chamber to keep the surface of the wafer free from contamination. the

FIG. 1 is a schematic structural diagram of an existing mechanical chuck. As shown in Figure 1, the existing mechanical chuck comprises a tray 101, a chuck 102 and a pressure ring 108, wherein a fluid chamber 109 is provided between the tray 101 and the chuck 102, and the pressure ring 108 is located on the top of the tray 101 and along its Circumference setting, the tray 101 can support the wafer 107 through the gasket 106 arranged on its circumference so that a small gap 111 is formed between the tray 101 and the wafer 107, and the wafer 107 can be firmly fixed on the tray 101 by the pressure ring 108, and the chuck 102 is set There is at least one conductive hole 112 communicated with the tiny gap 111; and the chuck 102 is provided with a through hole 103 communicated with the fluid chamber 109, through which a temperature-regulating fluid (such as helium) can pass into the fluid chamber 109 inside, and enter the tiny gap 111 through the conduction hole 112 . the

When using the existing mechanical chuck, the temperature-regulating fluid enters the fluid chamber 109 between the tray 101 and the chuck 102 from the 103 provided on the chuck 102, and the temperature-regulating fluid passes through the conduction hole 112 on the tray 101 to reach the hole of the wafer 107 The lower surface is used for heat exchange with the wafer 107; but due to the pressure difference, most of the temperature-regulating fluid flows out of the fluid chamber 109 through a straight path parallel to the lower surface of the tray 101 and the upper surface of the chuck 102, so that a considerable part of the helium does not Participate in heat exchange and just leave fluid chamber 109 and enter process chamber, cause the temperature control effect of mechanical chuck to wafer 107; 107, but this treatment method will cause more temperature-regulating fluid to enter the process chamber, which not only causes a serious waste of temperature-regulating fluid, but also pollutes the surface of the wafer 107 and damages the process quality of the wafer 107. the

Contents of the invention

The purpose of this embodiment is to provide a mechanical chuck and an etching machine, which are used to solve the technical problems in the prior art that the mechanical chuck has poor effect on controlling the temperature of the wafer and the waste of helium is serious. the

In order to solve the above problems, this embodiment provides a mechanical chuck, including a tray, a chuck and a pressure ring, a fluid chamber is arranged between the tray and the chuck, the pressure ring is located on the upper part of the tray and along the The surrounding setting of the tray also includes a flow control structure for preventing the temperature-regulating fluid from flowing out of the fluid chamber;

The flow control structure is arranged around the circumference of the tray and the chuck, and is connected with the tray and the chuck respectively. the

Wherein, the flow control structure includes two protruding pieces arranged alternately on the tray and the chuck respectively, the sum of the heights of the two protruding pieces is greater than the distance between the tray and the chuck, and the The flow control channel formed by the two protrusions is used to prevent the temperature regulating fluid from directly flowing out of the fluid chamber. the

Wherein, the flow control structure includes a matching protrusion and a groove, and the height of the protrusion is greater than the distance between the tray and the chuck; the protrusion is arranged on the tray, and the recess The groove is arranged on the chuck, and the flow control channel formed by the protrusion and the groove is used to prevent the temperature-regulating fluid from flowing out of the fluid cavity. the

Wherein, the flow control structure includes a matching protrusion and a groove, and the height of the protrusion is greater than the distance between the tray and the chuck; the groove is arranged on the tray, and the protrusion The member is arranged on the chuck, and the flow control channel formed by the protrusion and the groove is used to prevent the temperature-regulating fluid from directly flowing out of the fluid cavity. the

Wherein, the flow control structure includes a matching protrusion and a right-angle notch, and the height of the protrusion is greater than the distance between the tray and the chuck; the protrusion is arranged on the tray, and the right-angle The notch is arranged on the chuck, and the flow control channel formed by the protrusion and the right-angle notch is used to prevent the temperature-regulating fluid from flowing out of the fluid cavity. the

Wherein, the flow control structure includes a matching protrusion and a right-angle notch, and the height of the protrusion is greater than the distance between the tray and the chuck; the right-angle notch is arranged on the tray, and the protrusion The member is arranged on the chuck, and the flow control channel formed by the protrusion and the right-angle notch is used to prevent the temperature-regulating fluid from directly flowing out of the fluid cavity. the

Wherein, the flow control structure includes a matching arc-shaped protrusion and an arc-shaped notch, and the height of the arc-shaped protrusion is greater than the distance between the tray and the chuck; the arc-shaped protrusion is arranged on the On the tray, the arc-shaped notch is arranged on the chuck, and the flow control channel between the arc-shaped protrusion and the arc-shaped notch prevents the temperature-regulating fluid from flowing out of the fluid cavity. the

Wherein, the flow control structure includes a matching arc-shaped protrusion and an arc-shaped notch, the height of the arc-shaped protrusion is greater than the distance between the tray and the chuck; the arc-shaped notch is arranged on the On the tray, the arc-shaped protrusion is arranged on the chuck, and the flow control channel between the arc-shaped protrusion and the arc-shaped notch prevents the temperature-regulating fluid from directly flowing out of the fluid cavity. the

Wherein, the flow control structure includes two arc structures nested with each other, and the flow control channel formed by the two arc structures is used to prevent the temperature regulating fluid from directly flowing out of the fluid chamber. the

Wherein, the arc structure is C-shaped. the

Wherein, the protrusion and the groove are respectively matching arc-shaped protrusions and arc-shaped grooves. the

Wherein, the arc-shaped protrusion and the arc-shaped groove are respectively a C-shaped arc-shaped protrusion and a C-shaped arc-shaped groove. the

This embodiment also provides an etching machine, which includes a process chamber, a vacuum pump, an upper electrode, a lower electrode, and the mechanical chuck described in any one of the above, and the mechanical chuck is arranged in the process chamber Used to carry the wafers to be processed. the

The mechanical chuck and etching machine provided by the present invention, through the flow control structure provided in the mechanical chuck to prevent the temperature-regulating fluid from flowing directly out of the fluid chamber, the temperature-regulating fluid can be combined with the fluid placed on the tray. The back of the wafer is fully contacted to improve the efficiency and speed of heat exchange, and reduces the outflow of helium from the fluid chamber into the process chamber, which is beneficial to improving the purity of the process chamber where the mechanical chuck is located. the

Description of drawings

Fig. 1 is the structural representation of existing mechanical chuck;

Fig. 2 is the structural representation of the first specific embodiment of the mechanical chuck provided by the present invention;

Fig. 3 is the structural representation of the second specific embodiment of the mechanical chuck provided by the present invention;

Fig. 4 is the structural representation of the third specific embodiment of the mechanical chuck provided by the present invention;

Fig. 5 is the structural representation of the fourth specific embodiment of the mechanical chuck provided by the present invention;

Fig. 6 is the structural representation of the fifth specific embodiment of the mechanical chuck provided by the present invention;

Fig. 7 is the structural representation of the sixth specific embodiment of the mechanical chuck provided by the present invention;

Fig. 8 is the structural representation of the seventh specific embodiment of the mechanical chuck provided by the present invention;

Fig. 9 is the structural representation of the eighth specific embodiment of the mechanical chuck provided by the present invention;

Fig. 10 is the structural representation of the ninth specific embodiment of the mechanical chuck provided by the present invention;

FIG. 11 is a schematic structural view of a specific embodiment of an etching machine provided by the present invention. the

Detailed ways

The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and embodiments. the

Fig. 2 is a schematic structural view of the first specific embodiment of the mechanical chuck provided by the present invention. As shown in Figure 2, the mechanical chuck of this embodiment includes a tray 101, a chuck 102 and a flow control structure. The temperature-regulated helium gas is sent to the fluid cavity 109 between the tray 101 and the chuck 102, and the components of the flow control structure are respectively arranged on the fixed tray 101 and the chuck 102, and surround the circumference of the tray 101 and the chuck 102 for Change the direction when the helium flows out of the fluid chamber 109, thereby preventing the helium from directly flowing out of the fluid chamber 109; in this embodiment, the flow control structure includes two protrusions 104, and the protrusions 104 are respectively fixed on the tray 101 and the chuck 102 , and around the circumference of the tray 101 and the chuck 102, the positions between the two protrusions 104 are staggered, and the protrusions 104 on the tray 101 are arranged outside the protrusions 104 on the chuck 102, wherein the protrusions on the tray 101 The height of 104 is H, the height of the protrusion 104 on 102 is H, the sum of the heights of the two protrusions 104 is greater than the height of the fluid chamber 109 between the tray 101 or the chuck 102, and the gap between the two protrusions 104 For the flow control channel 105, the flow control channel 105 changes the outflow direction of helium from the fluid cavity 109, prevents the helium from flowing out of the fluid cavity 109 on a straight path parallel to the surface of the tray 101 or chuck 102, and makes the helium gas It can fully contact the back of the wafer 107 placed on the tray 101, avoiding the rapid outflow of helium from the fluid chamber 109, so as to improve the efficiency of heat exchange, realize the purpose of effectively controlling the temperature of the wafer 107, and reduce the flow of helium from the fluid chamber. The flow rate of cavity 109 into the process chamber is beneficial to improve the purity of the process chamber where the mechanical chuck is located. the

Fig. 3 is a schematic structural view of a second specific embodiment of the mechanical chuck provided by the present invention. As shown in FIG. 3 , the difference with the structure of the mechanical chuck shown in FIG. 2 is that in this embodiment, the protruding part 104 on the tray 101 is arranged on the inner side of the protruding part 104 on the chuck 102, two The sum of the heights of the protrusions 104 is greater than the height of the fluid cavity 109 . the

Fig. 4 is a schematic structural view of a third specific embodiment of the mechanical chuck provided by the present invention. The difference from Figure 2 or Figure 3 is that the flow control structure in this embodiment includes two mutually nested arc structures 110, and the flow control channel 105 formed by the two arc structures 110 prevents the temperature-regulating fluid helium from flowing out directly The fluid chamber 109 and the arc structure 110 can be C-shaped, or other curved shapes, such as wave-shaped or more complex looping curves. the

Fig. 5 is a schematic structural view of a fourth specific embodiment of the mechanical chuck provided by the present invention. As shown in Figure 5, the protruding piece 104 is fixed on the tray 101, the height H of the protruding piece 104 is greater than the height of the fluid chamber 109, and a right-angle notch matching the protruding piece 104 is provided on the circumference of the chuck 102, and the protruding piece 104 Form a flow control structure with a right-angle notch, and the gap between the right-angle concave and the convex piece 104 is the flow control channel 105. In practical applications, the chuck 102 can also be fixed on the convex piece 104, and the circumference of the tray 101 is provided with The right-angle notch matched with the protrusion 104 usually sets the width L of the flow control channel 105 at the order of 0.1 mm. The flow control channel 105 can prevent the helium from flowing out of the fluid chamber 109 on a straight path parallel to the surface of the tray 101 or the chuck 102, so as to avoid the helium from flowing out rapidly along the fluid chamber 109, thereby enabling the helium to be connected to the wafer 107 The back surface is fully in contact with the wafer 107 to achieve effective temperature control, and reduces the outflow of helium from the fluid chamber 109 into the process chamber, which is beneficial to improving the purity of the process chamber where the mechanical chuck is located. the

Fig. 6 is a schematic structural view of a fifth specific embodiment of the mechanical chuck provided by the present invention. As shown in Figure 6, different from Figure 5, the flow control structure in this embodiment is composed of an arc-shaped protrusion 104 and an arc-shaped notch, for example, it may be composed of a C-shaped protrusion 104 and a C-shaped notch, and the C-shaped The protruding piece 104 is arranged on the circumference of the tray 101, and the C-shaped notch is arranged on the circumference of the chuck 102, so as to extend the length of the flow control channel 105 formed by the protruding piece 104 and the C-shaped notch to further prevent the helium from flowing parallel to the tray. 101 or the surface of the chuck 102 directly flows out of the fluid cavity 109 on the straight path of the surface. In practical applications, the C-shaped protrusion 104 can also be arranged on the circumference of the chuck 102, and the C-shaped notch is arranged on the circumference of the tray 101. the

Fig. 7 is a schematic structural view of a sixth specific embodiment of the mechanical chuck provided by the present invention. As shown in Figure 7, in the mechanical chuck of this embodiment, the protruding piece 104 is fixed on the tray 101, and a groove matching the protruding piece 104 is arranged on the chuck 102, and the groove is fixed on the chuck. Two protrusions 104 on the surface of the disc 102 are formed, the sum of the heights of the protrusions 104 on the tray 101 and the heights of the protrusions 104 on the chuck 102 is less than the height of the fluid cavity 109, so that the protrusions 104 are nested in the groove, The protrusion 104 and the groove form a flow control structure, and the gap between the groove and the protrusion 104 is a flow control channel 105; in practical applications, the groove can also be arranged on the tray 101, and the matched The protrusion 104 is disposed on the chuck 102 . the

Fig. 8 is a schematic structural diagram of a seventh specific embodiment of the mechanical chuck provided by the present invention. As shown in Figure 8, the difference from Figure 7 is that the groove of the flow control structure of the mechanical chuck in this embodiment is recessed into the surface of the chuck 102, and the protrusion 104 and the groove form the flow control structure, and the protrusion 104 The height is greater than that of the fluid cavity 109 , and the gap between the groove and the protrusion 104 is the flow control channel 105 . the

Fig. 9 is a schematic structural view of the eighth specific embodiment of the mechanical chuck provided by the present invention. As shown in FIG. 9, the mechanical chuck in this embodiment is different from FIG. 8 in that the convex piece 104 is arranged on the chuck 102, the groove is recessed into the surface of the tray 101, and the groove and the convex piece 104 form a control. Flow structure, the height of the protrusion 104 is greater than the height of the fluid cavity 109, so that the protrusion 104 is nested in the groove, and the gap between the groove and the protrusion 104 is the flow control channel 105. the

Fig. 10 is a structural schematic diagram of a ninth specific embodiment of the mechanical chuck provided by the present invention. In practical application, as shown in Figure 10, the mechanical chuck in this embodiment is different from Figure 7, Figure 8 or Figure 9 in that the protrusion 104 in this embodiment is an arc protrusion, and the groove For the corresponding arc-shaped groove, the convex piece 104 is nested in the groove, for example, it may be composed of a C-shaped convex piece 104 and a C-shaped groove. The C-shaped convex piece 104 is arranged on the tray 101, and the C-shaped groove is set On the circumference of the chuck 102, the length of the flow control channel 105 formed by extending the C-shaped protrusion 104 and the C-shaped groove can further prevent helium from going straight on the straight path parallel to the surface of the tray 101 or the chuck 102. out of the fluid chamber 109 ; in practical applications, the C-shaped protrusion 104 can also be arranged on the chuck 102 , and the C-shaped groove can be arranged on the circumference of the tray 101 . the

In practical applications, thermometers, barometers and flowmeters can also be installed in the fluid chamber to obtain the temperature, pressure and flow of helium in real time, which is beneficial to adjust the flow according to the temperature, pressure and flow of helium, etc. To more precisely adjust and control the temperature of the wafer. the

The mechanical chuck provided by each of the above embodiments, through its flow control structure for preventing the temperature-regulating fluid from flowing out of the fluid chamber, allows the temperature-regulating fluid to fully contact the back of the wafer placed on the tray, so as to Improve the efficiency and speed of heat exchange, and reduce the outflow of helium from the fluid chamber into the process chamber, which is conducive to improving the purity of the process chamber where the mechanical chuck is located. the

FIG. 11 is a schematic structural view of a specific embodiment of an etching machine provided by the present invention. As shown in Figure 11, the etching machine in this embodiment includes a process chamber 50, a vacuum pump 60, an upper electrode and a mechanical chuck, and the mechanical chuck can adopt any structure of the above-mentioned mechanical chuck embodiment, the mechanical chuck It is arranged in the process chamber 50 to carry the wafer to be processed, and to control the temperature of the wafer to be processed. In this embodiment, the mechanical chuck adopts the structure shown in FIG. 3 . During the process of etching the wafer 107, the vacuum pump 60 extracts the gas in the process chamber 50 to maintain the vacuum of the process chamber 50 and prevent the wafer 107 from being polluted by impurity gases. the

In this embodiment, the flow control channel in the flow control structure of the mechanical chuck prevents the helium from flowing directly out of the fluid cavity, so that the helium can fully contact the wafer placed on the tray, so as to improve the efficiency and speed of heat exchange, and realize For the purpose of controlling the temperature of the wafer, and reducing the flow of helium from the fluid chamber into the process chamber, it is beneficial to improve the purity of the process chamber where the mechanical chuck is located, and avoid contamination of the wafer surface. the

It can be understood that the above implementations are only exemplary implementations used to illustrate the origin of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention. the

Claims (13)

1. a mechanical chuck, comprise pallet, chuck, pressure ring and for the pad of support wafer to be processed, between this pallet and chuck, be provided with fluid cavity, described pressure ring is positioned at the top of described pallet and along the setting of described pallet circumference, described pad is placed in the top of described pallet and is positioned at the inner side of described pressure ring, so that when support wafer to be processed, between described pallet and wafer to be processed, form slight void, and in described pallet, be provided with the conduction hole that is communicated with described slight void and fluid cavity, it is characterized in that, also comprise for stoping temperature adjustable fluid to flow out straight the flow control structure of described fluid cavity,

Described flow control structure ring is around the circumference of described pallet and described chuck and arrange, and is connected with described chuck with described pallet respectively.

2. mechanical chuck according to claim 1, it is characterized in that, described flow control structure comprises two male members that are crisscross arranged respectively on described pallet and chuck, the height sum of described two male members is greater than the distance between described pallet and chuck, and the flow control road that described two male members form is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

3. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable male member and groove, and the height of described male member is greater than the distance between described pallet and chuck; Described male member is arranged on described pallet, and described groove is arranged on described chuck, and the flow control road that described male member and groove form is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

4. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable male member and groove, and the height of described male member is greater than the distance between described pallet and chuck; Described groove is arranged on described pallet, and described male member is arranged on described chuck, and the flow control road that described male member and groove form is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

5. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable male member and right-angle notch, and the height of described male member is greater than the distance between described pallet and chuck; Described male member is arranged on described pallet, and described right-angle notch is arranged on described chuck, and the flow control road that described male member and right-angle notch form is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

6. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable male member and right-angle notch, and the height of described male member is greater than the distance between described pallet and chuck; Described right-angle notch is arranged on described pallet, and described male member is arranged on described chuck, and the flow control road that described male member and right-angle notch form is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

7. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable arc male member and arc notch, and the height of described arc male member is greater than the distance between described pallet and chuck; Described arc male member is arranged on described pallet, and described arc notch is arranged on described chuck, and the flow control road between described arc male member and arc notch stops described temperature adjustable fluid to flow out straight described fluid cavity.

8. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises suitable arc male member and arc notch, and the height of described arc male member is greater than the distance between described pallet and chuck; Described arc notch is arranged on described pallet, and described arc male member is arranged on described chuck, and the flow control road between described arc male member and arc notch stops described temperature adjustable fluid to flow out straight described fluid cavity.

9. mechanical chuck according to claim 1, is characterized in that, described flow control structure comprises two mutually nested arcuate structures, and the flow control road that described in two, arcuate structure forms is for stoping described temperature adjustable fluid to flow out straight described fluid cavity.

10. mechanical chuck according to claim 9, is characterized in that, described arcuate structure is C shape.

11. according to the mechanical chuck described in claim 3 or 4, it is characterized in that, described male member and groove are respectively suitable arc male member and arc groove.

12. mechanical chuck according to claim 11, is characterized in that, described arc male member and arc groove are respectively the arc male member of C shape and the arc groove of C shape.

13. 1 kinds of etching machines, is characterized in that comprising the mechanical chuck described in processing chamber, vacuum pump, top electrode and claim 1-12 any one, and described mechanical chuck is arranged in described processing chamber for carrying wafer to be processed.