CN102372899A - Flame-retarding green epoxy molding compound - Google Patents
Flame-retarding green epoxy molding compound Download PDFInfo
- Publication number
- CN102372899A CN102372899A CN2010102507934A CN201010250793A CN102372899A CN 102372899 A CN102372899 A CN 102372899A CN 2010102507934 A CN2010102507934 A CN 2010102507934A CN 201010250793 A CN201010250793 A CN 201010250793A CN 102372899 A CN102372899 A CN 102372899A
- Authority
- CN
- China
- Prior art keywords
- molding compound
- flame
- silicon powder
- epoxy molding
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 0 C*c1ccc(*)cc1CCc1c(*)cc(*Cc2c(C=O)cc(*)cc2)c2ccccc12 Chemical compound C*c1ccc(*)cc1CCc1c(*)cc(*Cc2c(C=O)cc(*)cc2)c2ccccc12 0.000 description 2
- QMBNNSKXBKTIDJ-UHFFFAOYSA-N COC12NC1C2 Chemical compound COC12NC1C2 QMBNNSKXBKTIDJ-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention relates to a flame-retarding green epoxy molding compound comprising flame-retarding epoxy resin, phenol formaldehyde resin, silicon micro mist, an imidazole curing accelerator, a mold releasing agent, a coloring agent, and a silane coupling agent. The adopted epoxy resin comprises a naphthalene ring between every two benzene rings. Alkane groups are on the naphthalene rings. Therefore, free volumes of epoxy resin are greatly reduced, such that heat resistance and water resistance of epoxy resin are improved, water absorption rate of the molding compound is reduced, elasticity modulus is improved, and linear expansion coefficient is reduced. The epoxy molding compound provided by the invention is advantaged in low viscosity, low expansion coefficient, high heat conductivity, and good 260 DEG C reflow soldering resistance. The epoxy molding compound can be used in large scale integrated circuit packaging. The molding compound contains no bromine or antimony flame-retarding agent. No harmful gas is generated during a combustion process. Also, no P series or metal oxide flame-retarding agent is added to the compound, such that a UL-94V-0 grade flame-retardance standard is reached. Further, the fluidity, operability and reliability of the epoxy molding compound satisfy the requirement of packaging.
Description
Technical field
The present invention relates to a kind of unicircuit packaged material that is used for, particularly a kind of fire-retardant green epoxy molding plastic.
Background technology
Be defined in the WEEE of European Union in 2003 issue and two decrees of RoHS in the electric or electronic equipment of depleted; Time limit is banned use of six kinds of hazardous materials; More strict SONY standard is carried out by Japan; China Ministry of Information Industry has has also issued and implemented " electronics and IT products pollution control management way " simultaneously, and the environment protection requirement of electronic product has become a kind of irreversible trend, the raising of Along with people's environmental consciousness; Electronic waste also begins to have caused attention, changes into as the epoxy molding plastic environmental protection of electronic package material to be irreversible trend.Because epoxy molding plastic contains organic high molecular compounds such as epoxy resin, these compounds burn easily, are inflammable so do not add the epoxy molding plastic of fire retardant.Common epoxy molding plastic is to adopt adding halogen and antimony to make epoxy molding plastic reach burning V-0 rank.But the halogen fire retardant can produce toxic and harmful in combustion processes, to human body, all unfavorable to environment.Therefore halogenated flame retardant is replaced by other fire retardants gradually; Using more is phosphorus system and MOX based flame retardant; But the epoxy molding plastic that adds this fire retardant wants to reach the standard of UL-94V-0 level; Must add bigger amount, thereby cause the viscosity of epoxy molding plastic bigger, thereby the flowability of causing and operability can not satisfy the requirement of Electronic Packaging.
Summary of the invention
The technical problem that the present invention will solve is the deficiency to prior art, has proposed that a kind of to have LV, low-expansion coefficient, high thermal conductivity and anti-260 ℃ of Reflow Soldering performances good, can be used for the fire-retardant green epoxy molding plastic of the encapsulation of large-scale integrated circuit.
The technical problem that the present invention will solve realizes through following technical scheme, a kind of fire-retardant green epoxy molding plastic, and be characterized in: the component by following weight part constitutes,
Fire-retarded epoxy resin 5～30
Resol 5～20
Silicon powder 70～90
Imidazoles curing catalyst 0.5～2.5
Releasing agent 0.5～1.0
Tinting material 0.5～2.0
Silane coupling agent 0.5～4.5
Its molecular formula of fire-retarded epoxy resin such as general formula I, wherein R
1, R
2Be-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～100 integer,
Its molecular formula of resol such as general formula I I, wherein R
3, R
4Be-H ,-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～50 integer.
The technical problem that the present invention will solve can also further realize through following technical scheme; Used silicon powder is divided into A part silicon powder and B part silicon powder mixes use; Two kinds of silicon powders all are spheric; Wherein the meta particle diameter d50 of A part silicon powder is 10～15 μ m, and the meta particle diameter d50 of B part silicon powder is 0.2～0.8 μ m.
The technical problem that the present invention will solve can also further realize 75～85% of the shared total amount of A part silicon powder, 2～10% of the shared total amount of B part silicon powder through following technical scheme.
The present invention is a kind of epoxy molding plastic of environment-friendly type.Fire retardants such as this plastic cement is not brominated, antimony; Therefore in the incendiary process, can not produce poisonous gas; Meanwhile do not add P system, MOX fire retardant; Make epoxy molding plastic reach the flame-retardant standard of UL-94V-0 level, make epoxy molding plastic flowability, operability and unfailing performance satisfy the requirement of encapsulation simultaneously.Compared with prior art, the epoxy resin that the present invention is used is the epoxy resin that contains naphthalene nucleus; A naphthalene nucleus is arranged between two phenyl ring, and also have alkyl on the naphthalene nucleus, significantly reduced the free body product of epoxy resin like this; Therefore can improve the thermotolerance and the water tolerance of epoxy resin; Reduce the water-intake rate of moulding compound, improve Young's modulus, reduce linear expansivity.It is good that the present invention has LV, low-expansion coefficient, high thermal conductivity and anti-260 ℃ of Reflow Soldering performances, can be used for the encapsulation of large-scale integrated circuit.
Embodiment
The technical problem that the present invention will solve realizes through following technical scheme, a kind of fire-retardant green epoxy molding plastic, and be characterized in: the component by following weight part constitutes,
Fire-retarded epoxy resin 5～30
Resol 5～20
Silicon powder 70～90
Imidazoles curing catalyst 0.5～2.5
Releasing agent 0.5～1.0
Tinting material 0.5～2.0
Silane coupling agent 0.5～4.5
Its molecular formula of fire-retarded epoxy resin such as general formula I, wherein R
1, R
2Be-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～100 integer,
Its molecular formula of resol such as general formula I I, wherein R
3, R
4Be-H ,-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～50 integer.
Used silicon powder is divided into A part silicon powder and B part silicon powder mixes use, and two kinds of silicon powders all are spheric, and wherein the meta particle diameter d50 of A part silicon powder is 10～15 μ m, and the meta particle diameter d50 of B part silicon powder is 0.2～0.8 μ m.75～85% of the shared total amount of A part silicon powder, 2～10% of the shared total amount of B part silicon powder.
Used silane coupling agent is the mixtinite of several kinds of coupling agents; Be respectively KH560, KBM303, KH570, KH580, KBM803, KBM603; Wherein KH560 is a kind of silane that has epoxy group(ing), and it can well combine with epoxide group, can make filler and resin thorough mixing.The KBM type is a kind of silane that has sulfydryl, it and inorganic materials, and organism all has good cohesive force.The present invention adopts wherein two kinds or several kinds to mix use.Mix and to adopt equal proportion to mix when using.
Described KH560, KBM303, KH570, KH580, KBM803, KBM603 are respectively γ-glycidoxypropyltrime,hoxysilane, γ-(methacryloxy) propyl trimethoxy silicane, γ-thiopropyl triethoxyl silane, γ-mercapto propyl group dimethoxy silane.
The preparation method is following:
In will filling a prescription after the accurate weighing of each component, add in the mixing roll, carry out melting mixing, melting temperature is 100～110 ℃, and mixing time is 2～20 minutes, to be mixed evenly after, cooling is pulverized, and buys cake and carries out performance test.
The physicals test
1. second-order transition temperature (Tg)
Use thermomechanical analyzer (TMA) to measure the second-order transition temperature of said compsn.2. thermal expansivity (α
1, α
2)
Utilize thermomechanical analyzer (TMA) to measure
3. flexural strength and modulus in flexure
Utilize the universal testing machine test.
4. flame retardant resistance test
Carry out flame retardant test through the vertical combustion method according to GB4609-84.
The main performance index table of reference examples
Claims (3)
1. fire-retardant green epoxy molding plastic, it is characterized in that: the component by following weight part constitutes,
Fire-retarded epoxy resin 5～30
Resol 5～20
Silicon powder 70～90
Imidazoles curing catalyst 0.5～2.5
Releasing agent 0.5～1.0
Tinting material 0.5～2.0
Silane coupling agent 0.5～4.5
Its molecular formula of fire-retarded epoxy resin such as general formula I, wherein R
1, R
2Be-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～100 integer,
Its molecular formula of resol such as general formula I I, wherein R
3, R
4Be-H ,-CH
3,-CH
2CH
3,-CH=CH
2In a kind of, n is 1～50 integer.
2. fire-retardant green epoxy molding plastic according to claim 1; It is characterized in that: used silicon powder is divided into A part silicon powder and B part silicon powder mixes use; Two kinds of silicon powders all are spheric; Wherein the meta particle diameter d50 of A part silicon powder is 10～15 μ m, and the meta particle diameter d50 of B part silicon powder is 0.2～0.8 μ m.
3. fire-retardant green epoxy molding plastic according to claim 2 is characterized in that: 75～85% of the shared total amount of A part silicon powder, 2～10% of the shared total amount of B part silicon powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102507934A CN102372899A (en) | 2010-08-11 | 2010-08-11 | Flame-retarding green epoxy molding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102507934A CN102372899A (en) | 2010-08-11 | 2010-08-11 | Flame-retarding green epoxy molding compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102372899A true CN102372899A (en) | 2012-03-14 |
Family
ID=45792154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102507934A Pending CN102372899A (en) | 2010-08-11 | 2010-08-11 | Flame-retarding green epoxy molding compound |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102372899A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104788903A (en) * | 2015-04-08 | 2015-07-22 | 浙江大学 | Nano-modified flame-retardant epoxy molding compound and preparation method thereof |
| CN105273360A (en) * | 2014-07-16 | 2016-01-27 | 合复新材料科技(无锡)有限公司 | Modified epoxy packaging material and preparation method and uses thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000063636A (en) * | 1998-08-19 | 2000-02-29 | Tatsumori:Kk | Epoxy resin composition for semiconductor sealing and semiconductor sealed therewith |
| CN1590498A (en) * | 2003-09-03 | 2005-03-09 | 中国科学院化学研究所 | Liquid epoxy packaging material and its preparation method and application |
| CN1745119A (en) * | 2003-02-18 | 2006-03-08 | 住友电木株式会社 | Epoxy resin composition and semiconductor device |
-
2010
- 2010-08-11 CN CN2010102507934A patent/CN102372899A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000063636A (en) * | 1998-08-19 | 2000-02-29 | Tatsumori:Kk | Epoxy resin composition for semiconductor sealing and semiconductor sealed therewith |
| CN1745119A (en) * | 2003-02-18 | 2006-03-08 | 住友电木株式会社 | Epoxy resin composition and semiconductor device |
| CN1590498A (en) * | 2003-09-03 | 2005-03-09 | 中国科学院化学研究所 | Liquid epoxy packaging material and its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 潘国元: "耐热新型环氧树脂的合成、固化反应及结构性能研究", 《中国博士学位论文全文数据库 工程科技I辑》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273360A (en) * | 2014-07-16 | 2016-01-27 | 合复新材料科技(无锡)有限公司 | Modified epoxy packaging material and preparation method and uses thereof |
| CN105273360B (en) * | 2014-07-16 | 2017-10-31 | 合复新材料科技(无锡)有限公司 | Modified epoxy encapsulating material and its production and use |
| CN104788903A (en) * | 2015-04-08 | 2015-07-22 | 浙江大学 | Nano-modified flame-retardant epoxy molding compound and preparation method thereof |
| CN104788903B (en) * | 2015-04-08 | 2017-12-29 | 浙江大学 | Nano modification flame retardant epoxy molding material and preparation method thereof |
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| PB01 | Publication | ||
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Application publication date: 20120314 |