CN102371659A - Ejector mechanism able to reduce die thickness - Google Patents

Ejector mechanism able to reduce die thickness Download PDF

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Publication number
CN102371659A
CN102371659A CN2010102547876A CN201010254787A CN102371659A CN 102371659 A CN102371659 A CN 102371659A CN 2010102547876 A CN2010102547876 A CN 2010102547876A CN 201010254787 A CN201010254787 A CN 201010254787A CN 102371659 A CN102371659 A CN 102371659A
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CN
China
Prior art keywords
mould
plate
ejector
runner
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102547876A
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Chinese (zh)
Inventor
方固东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Precision Technology Kunshan Ltd
Original Assignee
Mitac Precision Technology Shunde Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitac Precision Technology Shunde Ltd filed Critical Mitac Precision Technology Shunde Ltd
Priority to CN2010102547876A priority Critical patent/CN102371659A/en
Publication of CN102371659A publication Critical patent/CN102371659A/en
Pending legal-status Critical Current

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Abstract

The invention provides an ejector mechanism able to reduce die thickness. The mechanism comprises a runner ejector pin, one end of which passes through a core plate and a core insert, the other end of which is sleeved with an elastic component and is positioned inside an ejector hole on a lower retaining plate of the die, and also fastened between two support plates. One of the support plates is movably disposed below a lower ejector plate of the die, with a spacing distance left between the support plate and the bottom of the lower ejector plate. The ejector mechanism of the invention has a simple structure, and can effectively reduce the ejector stroke of the die through ejection for two times.

Description

A kind of thick ejecting mechanism of mould that reduces
Technical field
The present invention relates to the ejecting mechanism of mould, specifically a kind of thick ejecting mechanism of mould that reduces.
Background technology
Use the mould of the submarine Jiao Kou of cattle horn shape, banana-shaped or other type, tend to runner to be ejected fully, and need to strengthen the ejection stroke of mould because ejection stroke is not enough.Strengthening ejection stroke can increase the thickness of mould, causes the action of mould structure change bigger, and correlated parts such as male model plate, foot pad, thimble all need thicken lengthening, and mould also needs more large-tonnage make-up machine clamping when moulding, causes the waste of the resources of production.
See also Fig. 1, be the mould ejecting mechanism sketch map in the known technology.The runner thimble 10 of traditional moulds directly is sticked in upper and lower liftout plate 20, between 30, ejects simultaneously with product 50, and this just must strengthen ejection stroke of mould, with the complete runner 40 that ejects.Strengthening ejection stroke can increase the thickness of mould, also must change correlated parts such as male model plate 60, thimble 70, foot pad.During shut die, also need more large-tonnage make-up machine clamping.
Summary of the invention
Because above-mentioned problem, use the mould of submarine Jiao Kou, it is thick to need to increase mould, causes the action of mould structure change bigger, and mould also needs more large-tonnage make-up machine clamping, the waste resources of production when moulding.The objective of the invention is to overcome the deficiency and the defective of prior art, a kind of thick ejecting mechanism of mould that reduces is provided.
The invention provides a kind of thick ejecting mechanism of mould that reduces.The runner thimble; The one of which end is arranged in the male model plate and the male model benevolence of this mould, is located at the slag well below of runner, sheathed elastic component on the other end; Be located at ejecting in the hole of this mould bottom plate; And this end is sticked between two gripper shoes, and wherein a gripper shoe such as uses to be located at the following liftout plate below of this mould at high screw activity, and this gripper shoe and this time liftout plate bottom surface be a spacing distance apart.
More excellent, sheathed elastic component is a spring on the said runner thimble.
Compared with prior art, the present invention is simple in structure, adopts the method that ejects for twice, has effectively reduced the ejection stroke of mould.
Description of drawings
Fig. 1 is the mould ejecting mechanism sketch map in the known technology.
Fig. 2 is a kind of structural representation that reduces the thick ejecting mechanism of mould of the present invention.
Fig. 3 is a kind of partial schematic diagram that reduces the thick ejecting mechanism of mould of the present invention.
Fig. 4 ejects the action sketch map a kind of first time that reduces the thick ejecting mechanism of mould for the present invention.
Fig. 5 ejects the action sketch map a kind of second time that reduces the thick ejecting mechanism of mould for the present invention.
The specific embodiment
For specifying technology contents of the present invention, structural feature, explain in detail below in conjunction with embodiment and conjunction with figs..
See also Fig. 2 and Fig. 3, be respectively a kind of structural representation and partial schematic diagram that reduces the thick ejecting mechanism of mould of the present invention.Runner thimble 108 1 ends are arranged in the male model plate 101 and male model benevolence 105 of this mould; Be located at the slag well below of runner 106; Sheathed spring 107 on the other end is located at ejecting in the hole 111 of bottom plate 104, and this end has hanging platform; It is sticked in two gripper shoes 109, between 116; Wherein following liftout plate 103 belows of this mould are located in high screw 112 activities such as a gripper shoe 109 usefulness, and this gripper shoe 109 and this time liftout plate 103 bottom surfaces are a spacing distance apart, and this spacing distance is the ejection stroke first time of this mould.Its medi-spring 107 also can adopt other member with elastic force to substitute, and is not limited thereto.
See also Fig. 4, eject the action sketch map first time that reduces the thick ejecting mechanism of mould for the present invention is a kind of.After product 115 injection mo(u)ldings are accomplished; The male model plate 101 of mould was opened with caster in 114 minutes, and the push rod 113 of injection moulding board stretches into and ejects hole 111 on the bottom plate 104, and props up gripper shoe 116 bottom surfaces; Promote runner thimble 108 runner 106 is ejected, simultaneously spring 107 is carried out precompressed.When gripper shoe 109 end faces move to down liftout plate 103 bottom surfaces, to fit with following liftout plate 103, eject the first time that runner thimble 108 is accomplished runner 106.
See also Fig. 5, the present invention ejects the action sketch map a kind of second time that reduces the thick ejecting mechanism of mould.After ejecting for the first time the action completion; The push rod 113 of injection moulding board continues gripper shoe 109,116 applied thrusts; Promote upper and lower liftout plate 102,103; At this moment, the thimble 110 and the runner thimble 108 that are fixed on the upper and lower liftout plate 102,103 move upward together, and runner 106 and product 115 are pushed up from male model benevolence 105 simultaneously.After accomplishing the ejecting of runner 106 and product 115; Push rod 113 withdrawals of injection moulding board, gripper shoe 109,116 loses thrust, and the spring 107 that is set on the runner thimble 108 recovers elastic deformation; And produce elastic force and promote gripper shoe 109,116 and reset, to recycle.
The above is merely preferred embodiment of the present invention, is not to be used for limiting practical range of the present invention; Every according to equivalence variation and modification that the present invention did, all covered by the scope of claims of the present invention.

Claims (2)

1. one kind reduces the thick ejecting mechanism of mould, it is characterized in that, comprising:
The runner thimble; The one of which end is arranged in the male model plate and the male model benevolence of this mould, is located at the slag well below of runner, sheathed elastic component on the other end; Be located at ejecting in the hole of this mould bottom plate; And this end is sticked between two gripper shoes, and wherein a gripper shoe such as uses to be located at the following liftout plate below of this mould at high screw activity, and this gripper shoe and this time liftout plate bottom surface be a spacing distance apart.
2. a kind of thick ejecting mechanism of mould that reduces according to claim 1, it is characterized in that: sheathed elastic component is a spring on the said runner thimble.
CN2010102547876A 2010-08-17 2010-08-17 Ejector mechanism able to reduce die thickness Pending CN102371659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102547876A CN102371659A (en) 2010-08-17 2010-08-17 Ejector mechanism able to reduce die thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102547876A CN102371659A (en) 2010-08-17 2010-08-17 Ejector mechanism able to reduce die thickness

Publications (1)

Publication Number Publication Date
CN102371659A true CN102371659A (en) 2012-03-14

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Country Status (1)

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CN (1) CN102371659A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103465448A (en) * 2013-08-29 2013-12-25 天津国丰模具有限公司 Ejection mechanism of ejector sleeve pin assembly
CN104708743A (en) * 2013-12-13 2015-06-17 汉达精密电子(昆山)有限公司 Two-stage ejection structure
CN110293660A (en) * 2019-06-21 2019-10-01 宁波公牛电器有限公司 A kind of new stripper mechanism and its control method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131041A (en) * 1982-01-30 1983-08-04 Omron Tateisi Electronics Co Mold injection molding method
JPS5919125A (en) * 1982-07-26 1984-01-31 Nissan Motor Co Ltd Die for injection molding
CN2206195Y (en) * 1994-10-14 1995-08-30 刘志升 Die with automatic ejecting device
CN2770934Y (en) * 2005-03-29 2006-04-12 重庆工学院 Injection mould capable of automatically removing needle-point gate condensed material
JP2007301861A (en) * 2006-05-12 2007-11-22 Matsushita Electric Ind Co Ltd Injection molding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131041A (en) * 1982-01-30 1983-08-04 Omron Tateisi Electronics Co Mold injection molding method
JPS5919125A (en) * 1982-07-26 1984-01-31 Nissan Motor Co Ltd Die for injection molding
CN2206195Y (en) * 1994-10-14 1995-08-30 刘志升 Die with automatic ejecting device
CN2770934Y (en) * 2005-03-29 2006-04-12 重庆工学院 Injection mould capable of automatically removing needle-point gate condensed material
JP2007301861A (en) * 2006-05-12 2007-11-22 Matsushita Electric Ind Co Ltd Injection molding method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103465448A (en) * 2013-08-29 2013-12-25 天津国丰模具有限公司 Ejection mechanism of ejector sleeve pin assembly
CN104708743A (en) * 2013-12-13 2015-06-17 汉达精密电子(昆山)有限公司 Two-stage ejection structure
CN110293660A (en) * 2019-06-21 2019-10-01 宁波公牛电器有限公司 A kind of new stripper mechanism and its control method

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Owner name: HANDA PRECISION ELECTRONIC (KUNSHAN) CO., LTD.

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Effective date of registration: 20130703

Address after: 215300 No. second, 269 Avenue, comprehensive bonded area, Jiangsu, Kunshan

Applicant after: Mitac Precision Technology (Kunshan) Corp.

Address before: 528308 Guangdong Province, Foshan city Shunde District Lunjiao Street Chung Hei Lun Hing Road No. 1

Applicant before: Foshan Shunde District Mitac Precision Technology Co., Ltd.

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Application publication date: 20120314