CN102359837B - Beam film combined sensor structure - Google Patents

Beam film combined sensor structure Download PDF

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Publication number
CN102359837B
CN102359837B CN 201110253241 CN201110253241A CN102359837B CN 102359837 B CN102359837 B CN 102359837B CN 201110253241 CN201110253241 CN 201110253241 CN 201110253241 A CN201110253241 A CN 201110253241A CN 102359837 B CN102359837 B CN 102359837B
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China
Prior art keywords
resistance layer
pressure
piezo
brace summer
sensitive resistance
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CN 201110253241
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Chinese (zh)
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CN102359837A (en
Inventor
戴兆喜
韩民俊
乔康
程绍龙
范传东
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JIANGSU AOLIWEI SENSING TECH CO LTD
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JIANGSU AOLIWEI SENSING TECH CO LTD
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Abstract

The invention provides a beam film combined sensor structure which comprises a support beam at a bottom. An upper part of the support beam is a pressure-sensitive resistance layer. A surface layer of the pressure-sensitive resistance layer is a passive film. A cross section of the support beam is an upright right angle trapezoid. The upper part of the support beam is provided with a protection strip which has an equal height with the pressure-sensitive resistance layer and the passive film. The protection strip is used for restricting lateral movement of the pressure-sensitive resistance layer and the passive film at the surface of the pressure-sensitive resistance layer, and protecting a side surface of the pressure-sensitive resistance layer. The cross section of the support beam is an upright right angle trapezoid, i.e., a wide edge of the right angle trapezoid is at a lower part, a narrow edge of the right angle trapezoid is at an upper part, thus pressure received by the upper part narrow edge is dispersed in a sector form, and a stress requirement of supporting a shell by the bottom is reduced.

Description

The cantilever beam sensor construction
Technical field
The present invention relates to a kind of pressure sensor structure, specifically the sensor construction that combines with brace summer of passivating film.
Background technology
Most important part is to experience the piezo-resistance of pressure in the MEMS pressure sensor, and structural formula commonly used adopts four piezo-resistances to form the Hui Sitong bridge.So pressure sensor structure commonly used all can relate to one deck piezo-resistance layer.In the process of using owing to need to the piezo-resistance layer be protected; and simultaneously need to be with pressure bearing after experiencing pressure; so just brace summer need to be arranged; brace summer commonly used all is inverted trapezoidal structure; support the pressure of experiencing by trapezoidal narrow limit; and broadside does not need to bear pressure; in order to guarantee enough support strengths; that trapezoidal narrow limit need to be designed is enough wide; so just cause waste of material to a certain degree; and pressure sensor structure commonly used employing all is layer structure; i.e. outside passivating film; piezo-resistance; support beam structure all has independently layering; do not intersect each other; so also just can not play corresponding restriction; so present employed pressure sensor all must be global formation, if adopt a minute body formed structure, then need to design other protection; the structures such as restriction.
Summary of the invention
The purpose of this invention is to provide a kind of cantilever beam sensor construction, the all-in-one-piece brace summer that solves the prior art employing is inverted trapezoidal, its stress tolerance range less, and stress distribution is uneven, is easy to produce the problem that stress is concentrated.
The objective of the invention is to be achieved through the following technical solutions:
The cantilever beam sensor construction; the brace summer that comprises the bottom; brace summer top is the piezo-resistance layer; the top layer of piezo-resistance layer is passivating film; described brace summer cross section is upright right-angled trapezium; and be provided with a ceiling contour with piezo-resistance layer and passivating film on the top of brace summer; described ceiling and described brace summer are one-body molded; described ceiling is positioned at the outside of piezo-resistance layer; the passivating film that ceiling is used for restriction piezo-resistance layer and piezo-resistance layer surface is displaced sideways; and can protect the side of piezo-resistance layer; and the cross section of brace summer is upright right-angled trapezium, and namely the broadside of right-angled trapezium is positioned at the bottom, and the narrow limit of right-angled trapezium is positioned at top; can make so the suffered pressure in narrow limit, top carry out the dispersion of sector shape, can reduce the stress requirement to the bottom support housing.In fact, adopt the upright trapezoidal or trapezium structure that stands upside down no matter be, the suffered pressure of the part that contacts with the piezo-resistance layer can not reduce, the pressure that namely bear at trapezoidal top in two kinds of set-up modes is identical, difference only is that the pressure that bears the bottom changes, by architecture advances of the present invention, can reduce the stress ability to bear of bottom support housing, improve stability.
Description of drawings
The below is described in further detail the present invention with embodiment with reference to the accompanying drawings.
Fig. 1 is the structure chart of the described cantilever beam sensor construction of the embodiment of the invention.
Embodiment
As shown in Figure 1; cantilever beam sensor construction of the present invention; the brace summer 1 that comprises the bottom; brace summer 1 top is piezo-resistance layer 2; the top layer of piezo-resistance layer 2 is passivating film 3; described brace summer 1 cross section is upright right-angled trapezium; and be provided with a ceiling 4 contour with piezo-resistance layer 2 and passivating film 3 on the top of brace summer 1; described ceiling 4 and described brace summer 1 are one-body molded; described ceiling is positioned at the outside of piezo-resistance layer; the passivating film 3 that ceiling 4 is used for restriction piezo-resistance layer 2 and piezo-resistance layer 2 surface is displaced sideways; and can protect the side of piezo-resistance layer 2; and the cross section of brace summer 1 is upright right-angled trapezium; the broadside that is right-angled trapezium is positioned at the bottom; the narrow limit of right-angled trapezium is positioned at top, can make so the suffered pressure in narrow limit, top carry out the dispersion of sector shape, can reduce the stress requirement to the bottom support housing.In fact, adopt the upright trapezoidal or trapezium structure that stands upside down no matter be, the suffered pressure of the part that contacts with piezo-resistance layer 2 can not reduce, the pressure that namely bear at trapezoidal top in two kinds of set-up modes is identical, difference only is that the pressure that bears the bottom changes, by architecture advances of the present invention, can reduce the stress ability to bear of bottom support housing, improve stability.Ceiling 4 and described brace summer 1 are one-body molded, the protective effect that can further improve like this 1 pair of top of brace summer piezo-resistance layer 2, the stability of raising pressure sensor integral body.

Claims (1)

1. cantilever beam sensor construction; the brace summer that comprises the bottom; brace summer top is the piezo-resistance layer; the top layer of piezo-resistance layer is passivating film; it is characterized in that, described brace summer cross section is upright right-angled trapezium, and is provided with a ceiling contour with piezo-resistance layer and passivating film on the top of brace summer; described ceiling and described brace summer are one-body molded, and described ceiling is positioned at the outside of piezo-resistance layer.
CN 201110253241 2011-08-31 2011-08-31 Beam film combined sensor structure Active CN102359837B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110253241 CN102359837B (en) 2011-08-31 2011-08-31 Beam film combined sensor structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110253241 CN102359837B (en) 2011-08-31 2011-08-31 Beam film combined sensor structure

Publications (2)

Publication Number Publication Date
CN102359837A CN102359837A (en) 2012-02-22
CN102359837B true CN102359837B (en) 2013-10-23

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CN 201110253241 Active CN102359837B (en) 2011-08-31 2011-08-31 Beam film combined sensor structure

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206267A (en) * 1985-03-08 1986-09-12 Aisin Seiki Co Ltd Semiconductor pressure sensor
EP0576363B1 (en) * 1992-06-24 1998-01-07 Sumitomo Electric Industries, Ltd. Method of manufacturing a superconducting device having a superconducting channel formed of oxide superconductor material
CN1326214C (en) * 2004-02-20 2007-07-11 中国科学院上海微系统与信息技术研究所 Manufacturing method of nano-line on semiconductor material
US20060286706A1 (en) * 2005-06-21 2006-12-21 Salian Arvind S Method of making a substrate contact for a capped MEMS at the package level
US8211781B2 (en) * 2008-11-10 2012-07-03 Stanley Electric Co., Ltd. Semiconductor manufacturing method
JP5299254B2 (en) * 2009-12-14 2013-09-25 三菱電機株式会社 Semiconductor pressure sensor and manufacturing method thereof
CN202229864U (en) * 2011-08-31 2012-05-23 江苏奥力威传感高科股份有限公司 Beam-film combined sensor structure

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