CN102340559A - Combined circuit board of mobile terminal and assembly method - Google Patents
Combined circuit board of mobile terminal and assembly method Download PDFInfo
- Publication number
- CN102340559A CN102340559A CN2011100432088A CN201110043208A CN102340559A CN 102340559 A CN102340559 A CN 102340559A CN 2011100432088 A CN2011100432088 A CN 2011100432088A CN 201110043208 A CN201110043208 A CN 201110043208A CN 102340559 A CN102340559 A CN 102340559A
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- module
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- motherboard
- circuit board
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Abstract
The invention discloses a combined circuit board of a mobile terminal and an assembly method. The assembly method comprises the following steps of: surface-mounting components and parts which adopt buried blind hole wiring and are relatively closer to a center on a module adopting a high density interconnect (HDI) board, surface-mounting peripheral components and parts on a mother board adopting a through hole board, and arranging the module on the mother board. In the assembled circuit board, only the area of the module adopts the HDI board, and the other area adopts the through hole plate, so cost is greatly decreased.
Description
Technical field
The present invention relates to mobile terminal circuit plate field, particularly a kind of portable terminal combined circuit plate and assemble method thereof.
Background technology
The present main body core components and parts that portable terminal adopted; Such as CPU (central processing unit), DSP (Digital Signal Processing), MEMORY chips such as (internal memories) is to adopt BGA (BGA) encapsulation mostly; So the PIN of some chip (pin) spacing has only 0.5 millimeter; And quantity is a lot, and this has to adopt HDI (high density interconnect) plate of 6 layers even 8 layers with regard to the circuit board that has caused present portable terminal.
And because the existence of the blind buried via hole technology of HDI plate makes the cost of HDI plate be higher than ventilating hole plate far away, the cost that so just makes the entire circuit plate mount has also been followed up.So just press for the circuit board assembling scheme that a kind of lower cost is provided.
Summary of the invention
The purpose of this invention is to provide a kind of portable terminal combined circuit plate and assemble method thereof, realize that the cost of mobile terminal circuit plate reduces.
The present invention provides a kind of assemble method of mobile terminal circuit plate, may further comprise the steps: will adopt the components and parts of blind buried via hole cabling to be mounted on the module, and peripheral component is mounted on the motherboard, and then said module will be installed on the said motherboard.
Said module adopts the HDI plate, and the number of plies of said HDI plate is 6 layers.
Said motherboard adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers.
The components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
On the other hand, the present invention also provides a kind of portable terminal combined circuit plate, comprising:
One module mounts the components and parts that adopt blind buried via hole cabling on it;
One motherboard, said module are installed on the said motherboard, and said motherboard mounts peripheral component.
Said module adopts the HDI plate, and the number of plies of said HDI plate is 6 layers.
Said motherboard adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers.
The components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
Adopt a kind of portable terminal combined circuit plate of the present invention and assemble method thereof; The components and parts than core that adopt blind buried via hole cabling are mounted on the module that adopts the HDI plate; Peripheral component is mounted on the motherboard that adopts ventilating hole plate, at last said module is arranged on the said motherboard.So, in the circuit board after assembling, have only said module region to adopt the HDI plate, ventilating hole plate has been adopted in other zones, greatly reduces cost.
Description of drawings
Fig. 1 is the structure chart of circuit board according to the invention;
Fig. 2 is the structure chart of one embodiment of the invention.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and embodiment.
The present invention provides a kind of assemble method of mobile terminal circuit plate; Referring to Fig. 1; May further comprise the steps: will adopt the components and parts of blind buried via hole cabling to be mounted on the module 110; And peripheral component is mounted on the motherboard 120, then said module 110 is installed on the said motherboard 120, so just formed the circuit board 100 of a portable terminal.As an embodiment, what said module 110 adopted is the HDI plate, and the number of plies of said HDI plate is 6 layers; Said motherboard 120 adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers; The components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
On the other hand, the present invention also provides a kind of portable terminal combined circuit plate, comprises module 110, mounts the components and parts that adopt blind buried via hole cabling on it; Motherboard 120, said module 110 are installed on the said motherboard 120, and said motherboard 120 mounts peripheral component.As an embodiment, what said module 110 adopted is the HDI plate, and the number of plies of said HDI plate is 6 layers; Said motherboard 120 adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers; The components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
Referring to Fig. 2, as an embodiment,, in design, still to do as two projects though module of the present invention and motherboard finally are the circuit boards that is combined into a mobile phone, respectively module and motherboard are called 6900 and 6924.After design is accomplished, with the device of module 6900, adopt the mode of SMT to be attached on the motherboard 6924 as motherboard 6924, a complete cell phone mainboard just has been born.In design motherboard 6924, module 6900 is as a device, and the PIN of motherboard 6924 is strict corresponding with the PIN of module 6900, comprises definition and size and position.In addition, the placement of PIN can not be too intensive in the corner of module 6900, so that the mounting of 6900 modules.
In the definition of PIN signal,, a plurality of GND PIN (grounding pin) need be set in order to guarantee leading fully being connected of ground of module 6900 and motherboard 6924.Meanwhile, RF (radio frequency) and AUDIO sensitive signals such as (audio frequency) also need protection, so can GND PIN be placed on the limit of these signals.
The assemble method that it is pointed out that a kind of mobile terminal circuit plate of the present invention is identical and similar on principle and embodiment with a kind of portable terminal combined circuit plate of the present invention, so its repeating part repeats no more.
Those of ordinary skill in the art will be appreciated that; Above embodiment is used for explaining the present invention; And be not to be used as qualification of the present invention; As long as in connotation scope of the present invention, all will drop in claims scope of the present invention variation, the modification of above embodiment.
Claims (8)
1. the assemble method of a mobile terminal circuit plate is characterized in that, may further comprise the steps: will adopt the components and parts of blind buried via hole cabling to be mounted on the module, and peripheral component is mounted on the motherboard, and then said module will be installed on the said motherboard.
2. the method for claim 1 is characterized in that, said module adopts the HDI plate, and the number of plies of said HDI plate is 6 layers.
3. method as claimed in claim 2 is characterized in that, said motherboard adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers.
4. method as claimed in claim 3 is characterized in that, the components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
5. a portable terminal combined circuit plate is characterized in that, comprising:
One module mounts the components and parts that adopt blind buried via hole cabling on it;
One motherboard, said module are installed on the said motherboard, and said motherboard mounts peripheral component.
6. circuit board as claimed in claim 5 is characterized in that, said module adopts the HDI plate, and the number of plies of said HDI plate is 6 layers.
7. circuit board as claimed in claim 6 is characterized in that, said motherboard adopts ventilating hole plate, and the number of plies of said ventilating hole plate is 4 layers.
8. circuit board as claimed in claim 7 is characterized in that, the components and parts of the blind buried via hole cabling of said employing comprise central processing unit, memory chip, Bluetooth chip and radio frequency chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100432088A CN102340559A (en) | 2010-07-20 | 2011-02-23 | Combined circuit board of mobile terminal and assembly method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010231903 | 2010-07-20 | ||
| CN201010231903.2 | 2010-07-20 | ||
| CN2011100432088A CN102340559A (en) | 2010-07-20 | 2011-02-23 | Combined circuit board of mobile terminal and assembly method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102340559A true CN102340559A (en) | 2012-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100432088A Pending CN102340559A (en) | 2010-07-20 | 2011-02-23 | Combined circuit board of mobile terminal and assembly method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102340559A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491723A (en) * | 2013-09-18 | 2014-01-01 | 深圳市同洲电子股份有限公司 | Manufacturing method of combined printed circuit board and combined printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080202802A1 (en) * | 2007-02-28 | 2008-08-28 | Innocom Technology (Shenzhen) Co., Ltd. | Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively |
| CN101299426A (en) * | 2007-04-30 | 2008-11-05 | 华为技术有限公司 | Module and electronic device |
| CN101365291A (en) * | 2007-03-23 | 2009-02-11 | 华为技术有限公司 | Printed circuit board, design method thereof and terminal product main board |
-
2011
- 2011-02-23 CN CN2011100432088A patent/CN102340559A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080202802A1 (en) * | 2007-02-28 | 2008-08-28 | Innocom Technology (Shenzhen) Co., Ltd. | Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively |
| CN101365291A (en) * | 2007-03-23 | 2009-02-11 | 华为技术有限公司 | Printed circuit board, design method thereof and terminal product main board |
| CN101299426A (en) * | 2007-04-30 | 2008-11-05 | 华为技术有限公司 | Module and electronic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491723A (en) * | 2013-09-18 | 2014-01-01 | 深圳市同洲电子股份有限公司 | Manufacturing method of combined printed circuit board and combined printed circuit board |
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Application publication date: 20120201 |