CN102338763B - Device for detecting microelectronic packaging structure defects by infrared thermal imaging method - Google Patents
Device for detecting microelectronic packaging structure defects by infrared thermal imaging method Download PDFInfo
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- CN102338763B CN102338763B CN 201110147793 CN201110147793A CN102338763B CN 102338763 B CN102338763 B CN 102338763B CN 201110147793 CN201110147793 CN 201110147793 CN 201110147793 A CN201110147793 A CN 201110147793A CN 102338763 B CN102338763 B CN 102338763B
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Abstract
The invention discloses a device for detecting microelectronic packaging structure defects by an infrared thermal imaging method, and belongs to the field of nondestructive inspection of the electronic package industry. A base 1 consists of two grounding pins at two ends and a load-bearing beam in the middle, wherein the load-bearing beam is provided with two through round holes, and the lower end of an upright column 7 is arranged in the through round holes in an interference fit mode. A lower cross beam 2, an upper cross beam 6, a screw drive bearing 9 and a supporting ring 13 are arranged on the upright column 7 respectively, wherein the front end of the lower cross beam 2 is connected with a sample platform 16 by using a small bolt 12, and the lower end of the lower cross beam 2 is connected with a screw sleeve 3 by using a bolt; and a sodium lamp 13 is fixed on the upright column 7 through a connecting block 4, a connecting frame 5 and a ring clip 4. The screw drive bearing is arranged at the upper end of the upright column, a handle is arranged on the screw drive bearing, and the position of the lower cross beam on the upright column can be changed by rotating the handle to realize high-low position changes of the sample platform. The device is simple in structure, smooth and steady, and convenient to operate, and can realize infrared nondestructive detection.
Description
Technical field
The present invention relates to the device of THERMAL IMAGING NONDESTRUCTIVE TESTING electron package structure initial imperfection, it can check the initial imperfection of encapsulating structure very easily, belongs to Electronic Packaging industry field of non destructive testing.
Background technology
Ultrasonic scanning is generally adopted in existing encapsulating structure Non-Destructive Testing, this method is in electronics industry, especially be widely used in encapsulation technology research. because having, ultrasound wave need not remove the ability of setting up outer enclosure and detecting the encapsulating structure defective, therefore can effectively detect in IC encapsulation the destruction of causing because of steam or heat energy, such as: layering, pore and crack etc.Ultrasonic internal radiography principle is that electric energy produces the ultrasound wave striking on article to be measured via focusing on conversion mirror, sound wave is reflected or penetrate signal to receive rear image processing on distinct interface, then analyzed with image and signal.This lossless detection method spent time cycle is longer, is unfavorable for dispatching from the factory fast of encapsulating products.
Summary of the invention
For the lossless detection method spent time cycle that solves present existence longer, be unfavorable for that the problem of dispatching from the factory fast of encapsulating products, the present invention are a kind of stable, experimental provision reliably of Electronic Packaging Non-Destructive Testing invention.
The present invention adopts following technical scheme:
A kind of device for detecting microelectronic packaging structure defects by infrared thermal imaging method is comprised of base 1, sill 2, screw sleeve 3, contiguous block 4, link 5, entablature 6, column 7, screw rod 8, screw drive bearing 9, thermal imaging system 10, saddle 11, stove bolt 12, sodium vapor lamp 13, annulus clip 14, filler ring 15, sample bench 16, fastening bolt 17.Base 1 is by two grounding legs at two ends, and a middle bearing beam forms, and bearing beam has the circular hole of two perforations. and the lower end of column 7 is assembled in the circular hole of perforation in the mode of interference fit.assembled respectively sill 2 on column 7, entablature 6, screw drive bearing 9 is connected the front end of sill 2 and has been connected a sample bench 16 with stove bolt 12 with filler ring, contiguous block 4 is passed through with bolt connecting screw rod cover 3. sodium vapor lamps 13 in the rear end, link 5 and annulus clip 14 are fixed on column 7, wherein contiguous block 4 is fixed on filler ring 13 by stove bolt 12, link 5 is fixed on contiguous block 4 by register pin, and can freely rotate around register pin, one side of link 5 has been opened a circular hole, one side of annulus clip 14 is provided with a pin, and be fixed on by pin, on circular hole on link 5, and can freely rotate around pin.the both sides of entablature 6 have threaded hole, be bolted on column 7 by tightening, the front end of entablature 6 is fixed with saddle 11, have a circular hole slightly larger than video camera diameter of lens in the middle of saddle 11, the video camera camera lens is downward, camera lens is put into circular hole. and the screw drive bearing assemble is in the upper end of column, on the screw drive bearing, handle is housed, can change the position of sill on column by swing handle, thereby realize the variation of sample bench high and low position, screw actuator is by screw sleeve 3, screw rod 8, the handle of screw drive bearing 9 and 8 motions of drive screw rod forms, effect due to screw actuator, swing handle can make screw rod 8 along screw rod axle center rotation, thereby the variation of sample bench 16 high and low positions is realized in the position of change sill 2 on column 7.Screw actuator is directly buied on market.
One end of screw rod 8 is fixed on the bearing beam of base 1. and screw sleeve 3 is fixed on screw rod 8, and screw rod 8 drives screw sleeve 3 and moves up and down along the screw rod center rotating, and screw sleeve 3 drives moving up and down of sill 2 and sample bench 16 again.The lower surface of described sample bench 16 is with two floors, and sample bench 16 is connected to the front of sill 2 by stove bolt 12.Be connected with entablature 6 through hole below of column 7 is provided with the filler ring 15 that prevents that entablature from trying to shirk responsibility, and the internal diameter of filler ring 15 is identical with the diameter of column 7; The side of filler ring 15 is equipped with and can controls the fastening bolt 17 that filler ring 15 slides up and down by adjusting elasticity on column 7.
First the fastening bolt 17 at entablature 6 two ends is tightened during use, thus the position of stationary gantry 11.For preventing that entablature 6 from trying to shirk responsibility, regulate the position of filler ring 15, filler ring 15 is contacted with entablature 6, then tighten fastening bolt 17.Again thermal imaging system 10 is placed on saddle 11, makes its camera lens pass the through hole of saddle 11.Regulate again the position of sill 2 by the handle on rotating screw bolt drive bearing 9, thereby drive moving up and down of sample bench 16, to adjust the distance of thermal imaging system camera lens and detected sample.After being placed on sample on sample bench 16, tumbler ring clip 14 just can be regulated the position of thermal source, thereby tests.
The present invention has the following advantages: simple in structure, device steadily, and is easy to operate, can realize Infrared Non-destructive Testing.
Description of drawings
Fig. 1 is the wiring layout of this experimental provision
Fig. 2 is the wiring layout (without thermal imaging system) of this experimental provision
Fig. 3 is the left view of this experimental provision
Fig. 4 is the rear view of this experimental provision
Wherein 1, base, 2, sill, 3, screw sleeve, 4, contiguous block, 5, link, 6, entablature, 7, column, 8, screw rod, 9, the screw drive bearing, 10, thermal imaging system, 11, saddle, 12, stove bolt, 13, sodium vapor lamp, 14, the annulus clip, 15, filler ring, 16, sample bench, 17, fastening bolt.
Embodiment:
Mainly formed by base 1, sill 2, screw sleeve 3, contiguous block 4, link 5, entablature 6, column 7, screw rod 8, screw drive bearing 9, thermal imaging system 10, saddle 11, sodium vapor lamp 13, annulus clip 14, filler ring 15, sample bench 16, fastening bolt 17.Base 1 is by two grounding legs at two ends, and bearing beam and two root posts form in the middle of one, and bearing beam has the circular hole of two perforations. and the lower end of column 7 is assembled in the circular hole of perforation in the mode of interference fit.assembled respectively sill 2 on column 7, entablature 6, screw drive bearing 9 is connected the front end of sill 2 and has been connected a sample bench 16 with stove bolt 12 with filler ring, the rear end has connected a screw sleeve 3. sodium vapor lamps 13 by contiguous block 4 with bolt, link 5 and annulus clip 14 are fixed on column 7, wherein contiguous block is bolted on filler ring 13, link is fixed on contiguous block 4 by register pin, and can freely rotate around register pin, one side of link has been opened a circular hole, one side of annulus clip 14 is provided with a pin, and be fixed on circular hole on contiguous block by pin, and can freely rotate around pin. the both sides of entablature 6 have threaded hole, be bolted on column 7 by tightening, the front end of entablature is fixed with saddle 11, have one and the slightly large circular hole of video camera diameter of lens in the middle of saddle 11, the video camera camera lens is downward, camera lens is put into circular hole. and the screw drive bearing assemble is in the upper end of column, on the screw drive bearing, handle is housed, can change the position of sill on column by swing handle, thereby realize the variation of sample bench high and low position, screw actuator is by screw sleeve 3, screw rod 8, the handle of screw drive bearing 9 and 8 motions of drive screw rod forms, effect due to screw actuator, swing handle can make screw rod 8 along screw rod axle center rotation, thereby the variation of sample bench 16 high and low positions is realized in the position of change sill 2 on column 7, one end of screw rod 8 is fixed on the bearing beam of base 1. and screw sleeve 3 is fixed on screw rod 8, the lower surface of sample bench 16 is with two floors, sample bench 16 is connected to the front of sill 2 by stove bolt 12.Be connected with entablature 6 through hole below of column 7 is provided with the filler ring 15 that prevents that entablature from trying to shirk responsibility, and the internal diameter of filler ring 15 is identical with the diameter of column 7; The side of filler ring 15 is equipped with fastening bolt 17.Experimental procedure:
First the fastening bolt at entablature two ends is tightened, thus the position of fixed cross beam on column.For preventing that entablature from sliding, regulate the position of filler ring, filler ring is contacted with entablature, then tighten fastening bolt.Thermal imaging system is placed on saddle, makes its camera lens pass the through hole of saddle.Again the fastening bolt of sill is unscrewed, regulated the position of sill by the handle on the rotating screw bolt drive bearing, thereby drive moving up and down of sample bench, adjust the distance of thermal imaging system camera lens and detected sample.Treat that distance adjusts, then the fastening bolt at sill two ends is tightened.At last sample is placed on sample bench, adjusts the position of thermal source by the position of adjusting saddle 11, thereby the initial temperature of sample is evenly distributed.Adjust the focal length of camera lens, taking and during document image, just can see electron package structure surface temperature distribution image clearly, by the analysis temperature distributed image can judge encapsulate defective existence whether.
Claims (4)
1. a device that is used for detecting microelectronic packaging structure defects by infrared thermal imaging method, be comprised of base (1), sill (2), screw sleeve (3), contiguous block (4), link (5), entablature (6), column (7), screw rod (8), screw drive bearing (9), thermal imaging system (10), saddle (11), stove bolt (12), sodium vapor lamp (13), annulus clip (14), filler ring (15), sample bench (16), fastening bolt (17); It is characterized in that: base (1) is by two grounding legs at two ends, and a middle bearing beam forms, and bearing beam has the circular hole of two perforations, and the lower end of column (7) is assembled in the circular hole of perforation in the mode of interference fit; Assembled respectively sill (2) on column (7), entablature (6), screw drive bearing (9) and filler ring (15); The front end of sill (2) has connected a sample bench (16) with stove bolt (12), rear end bolt connecting screw rod cover (3); Sodium vapor lamp (13) is by contiguous block (4), link (5) and annulus clip (14) are fixed on column (7), wherein contiguous block (4) is fixed on filler ring (15) by stove bolt (12), link (5) is fixed on contiguous block (4) by register pin, and can freely rotate around register pin, a side of link (5) has been opened a circular hole, annulus clip (14) one side be provided with a pin, and be fixed on circular hole on link (5) by pin, and can freely rotate around pin; The both sides of entablature (6) have threaded hole, be bolted on column (7) by tightening, the front end of entablature (6) is fixed with saddle (11), has a circular hole slightly larger than video camera diameter of lens in the middle of saddle (11), the video camera camera lens is downward, and camera lens is put into circular hole; Screw actuator is by screw sleeve (3), screw rod (8), and screw drive bearing (9) and the handle that drives screw rod (8) motion form, and screw drive bearing (9) is assemblied in the upper end of column (7), and the screw drive bearing is equipped with handle on (9);
One end of screw rod (8) is fixed on the bearing beam of base (1), screw sleeve (3) is fixed on screw rod (8), screw rod (8) drives screw sleeve (3) and moves up and down along the screw rod center rotating, and screw sleeve (3) drives moving up and down of sill (2) and sample bench (16) again.
2. a kind of device for detecting microelectronic packaging structure defects by infrared thermal imaging method according to claim 1, it is characterized in that: the lower surface of described sample bench (16) is with two floors.
3. a kind of device for detecting microelectronic packaging structure defects by infrared thermal imaging method according to claim 1, it is characterized in that: sample bench (16) is connected to the front of sill (2) by stove bolt (12).
4. a kind of device for detecting microelectronic packaging structure defects by infrared thermal imaging method according to claim 1, it is characterized in that: column (7) be connected with entablature (6) through hole below is provided with the filler ring (15) that prevents entablature and try to shirk responsibility, and the internal diameter of filler ring (15) is identical with the diameter of column (7); The side of filler ring (15) is equipped with and can controls the fastening bolt (17) that filler ring (15) slides up and down by adjusting elasticity on column (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110147793 CN102338763B (en) | 2011-06-02 | 2011-06-02 | Device for detecting microelectronic packaging structure defects by infrared thermal imaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110147793 CN102338763B (en) | 2011-06-02 | 2011-06-02 | Device for detecting microelectronic packaging structure defects by infrared thermal imaging method |
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| Publication Number | Publication Date |
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| CN102338763A CN102338763A (en) | 2012-02-01 |
| CN102338763B true CN102338763B (en) | 2013-06-12 |
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| CN 201110147793 Expired - Fee Related CN102338763B (en) | 2011-06-02 | 2011-06-02 | Device for detecting microelectronic packaging structure defects by infrared thermal imaging method |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101458123A (en) * | 2008-12-30 | 2009-06-17 | 中国科学院地理科学与资源研究所 | Emissivity two-dimensional distribution and dimension conversion measuring instrument and measurement method thereof |
| CN101806629A (en) * | 2010-04-13 | 2010-08-18 | 常州亿晶光电科技有限公司 | Special device for thermal infrared imager test of laminate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5808303A (en) * | 1997-01-29 | 1998-09-15 | Art Aerospace Research Technologies Inc. | Infrared screening and inspection system |
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2011
- 2011-06-02 CN CN 201110147793 patent/CN102338763B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101458123A (en) * | 2008-12-30 | 2009-06-17 | 中国科学院地理科学与资源研究所 | Emissivity two-dimensional distribution and dimension conversion measuring instrument and measurement method thereof |
| CN101806629A (en) * | 2010-04-13 | 2010-08-18 | 常州亿晶光电科技有限公司 | Special device for thermal infrared imager test of laminate |
Non-Patent Citations (2)
| Title |
|---|
| 万九卿，李行善.印制电路板（PCB）的红外热像诊断技术.《电子测量与仪器学报》.2003,第17卷(第2期),19-25. * |
| 班兆伟,秦飞.电子封装中裂纹缺陷对温度场的影响.《北京力学会第17届学术年会论文集》.2011,553-554. * |
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| CN102338763A (en) | 2012-02-01 |
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