CN102330930A - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
CN102330930A
CN102330930A CN201110330056A CN201110330056A CN102330930A CN 102330930 A CN102330930 A CN 102330930A CN 201110330056 A CN201110330056 A CN 201110330056A CN 201110330056 A CN201110330056 A CN 201110330056A CN 102330930 A CN102330930 A CN 102330930A
Authority
CN
China
Prior art keywords
light emitting
bearer bar
emitting diode
backlight module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110330056A
Other languages
Chinese (zh)
Inventor
沈冬明
汪玲玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AU Optronics Suzhou Corp Ltd
AU Optronics Corp
Original Assignee
AU Optronics Suzhou Corp Ltd
AU Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AU Optronics Suzhou Corp Ltd, AU Optronics Corp filed Critical AU Optronics Suzhou Corp Ltd
Priority to CN201110330056A priority Critical patent/CN102330930A/en
Publication of CN102330930A publication Critical patent/CN102330930A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a backlight module. The backlight module comprises a substrate, light emitting diodes arranged on the substrate and a protective frame arranged on one side of the substrate, wherein the protective frame is provided with a plurality of openings for accommodating the light emitting diodes; the thickness of the protective frame is greater than that of the light emitting diodes. By the thick protective frame, the light emitting diodes arranged in the openings of the protective frame are effectively protected and prevented from being shifted or damaged due to the impact of external force.

Description

Backlight module
Technical field
The present invention relates to a kind of backlight module, relate in particular to a kind of backlight liquid crystal display module.
Background technology
LCD (Liquid Crystal Display; LCD) have that high image quality, volume are little, in light weight, low voltage drive, low consumpting power and advantages of wide application range; So be widely used in Portable TV, mobile phone, shot with video-corder projector, in consumer electronics such as mobile computer and desktop display or the computer product, become the main flow of display.
Consist predominantly of liquid crystal panel and backlight module two large divisions in the LCD.Wherein backlight module comprises assemblies such as light source, LGP, blooming piece again.Because whether the contraposition between light source and the LGP is accurate, will influence the quality of backlight module, therefore, how to keep the relative position between light source and the LGP, and prevent to cause the light source displacement or damage because of factor such as falling to falling, just become an important problem.
Summary of the invention
Therefore the object of the invention is exactly that a kind of backlight module with bearer bar is being provided, and is arranged in the light emitting diode of bearer bar in order to protection, avoids light emitting diode to receive external force collision and squints or damage.
According to one aspect of the present invention, a kind of backlight module is proposed, comprise LGP, be positioned at LGP one side substrate, be arranged at the light emitting diode on the substrate, and bearer bar.The light-emitting area of light emitting diode is in the face of LGP.Bearer bar is arranged at the side of real estate to LGP, and bearer bar has a plurality of openings, and with ccontaining light emitting diode, wherein the spacing between bearer bar and the LGP is less than the spacing between light emitting diode and the LGP.
Preferably, opening can be one to one or the ccontaining light emitting diode in one-to-many ground.
Preferably, the thickness of bearer bar is greater than the thickness of light emitting diode.
Preferably, the bearer bar surface can be provided with the reflecting layer.
According to another aspect of the present invention a kind of backlight module is provided, comprises substrate, be arranged at the light emitting diode on the substrate, and the bearer bar that is arranged at substrate one side.Bearer bar has a plurality of openings, and with ccontaining light emitting diode, wherein the thickness of bearer bar is greater than the thickness of light emitting diode.
Preferably, opening can be one to one or the ccontaining light emitting diode in one-to-many ground.
Preferably, the bearer bar surface can be provided with the reflecting layer.
Another aspect of the present invention provides a kind of backlight module, and comprise substrate, be arranged at the bearer bar of substrate one side, and light emitting diode.Bearer bar has a plurality of openings.Light emitting diode is arranged on the side of substrate and is positioned at opening.Light emitting diode has light-emitting area, and wherein light-emitting area is lower than the surface of bearer bar.
Preferably, opening can be one to one or the ccontaining light emitting diode in one-to-many ground.
Preferably, the bearer bar surface can be provided with the reflecting layer.
Adopt advantage of the present invention to be: through the thicker bearer bar of thickness, effectively protection is arranged at the light emitting diode in its opening, avoid light emitting diode receive because of fall to falling, LGP dilatancy or the external force collision when colliding squint or damage.
Description of drawings
The reader with reference to advantages after the specific embodiment of the present invention, will become apparent various aspects of the present invention.Wherein,
Fig. 1 illustrates the explosive view according to backlight module one embodiment of the present invention.
Fig. 2 illustrates the sketch map after the backlight module assembling completion among Fig. 1.
Fig. 3 illustrates the explosive view of another embodiment of backlight module of the present invention.
Fig. 4 illustrates the sketch map after the backlight module assembling completion among Fig. 3.
Fig. 5 illustrates the profile of another embodiment of backlight module of the present invention.
[primary clustering symbol description]
100: backlight module
110: substrate
120: light emitting diode
122: light-emitting area
130: bearer bar
132: opening
140: adhesion layer
150: light source bracket
160: heat-conducting glue
170: LGP
The specific embodiment
Below will clearly demonstrate spirit of the present invention with graphic and detailed description; Has common knowledge the knowledgeable under any in the technical field after understanding preferred embodiment of the present invention; When can be by disclosed technology, change and modification, it does not break away from spirit of the present invention and scope.
Fig. 1 illustrates the explosive view according to backlight module one embodiment of the present invention.With reference to Fig. 1, backlight module 100 includes substrate 110, a plurality of light emitting diode 120, bearer bar 130, and in order to bearer bar 130 is attached to the adhesion layer 140 on the substrate 110.Bearer bar 130 has a plurality of openings 132, in order to ccontaining light emitting diode 120.The light-emitting area 122 of light emitting diode 120 exposes to the opening 132 of bearer bar 130.The thickness W1 of bearer bar 130 in wherein, avoids light emitting diode 120 to receive the direct bump of external force with protection light emitting diode 120 greater than the thickness W2 of light emitting diode 120.
In the present embodiment, the opening 132 of bearer bar 130 is ccontaining light emitting diode 120 one to one, i.e. each opening 132 ccontaining light emitting diode 120 respectively.Adhesion layer 140 can be two-sided tape, and the shape of adhesion layer 140 can make bearer bar 130 firmly be attached on the substrate 110 according to the profile cutting of bearer bar 130.Substrate 110 can be printed circuit board (PCB), flexible printed wiring board, or copper base.
The material of bearer bar 130 can be metal or plastics.The color on the surface of bearer bar 130 can be a light color system, for example can be white, grey or other light plastics, being concentrated toward LGP through reflection by the light that light emitting diode 120 sends, promotes the utilization rate of light.Perhaps, bearer bar 130 can be processed by the plastics or the metal of random color, is provided with the reflecting layer again on the surface of bearer bar 130, can promote the utilization rate of light equally.
Backlight module 100 more includes light source bracket 150 and heat-conducting glue 160.Light source bracket 150 can be the aluminium extruded support, in order to supporting substrate 110 and the light emitting diode 120 on it, with ease of assembly.Heat-conducting glue 160 except in order to substrate 110 is cemented on the light source bracket 150; More can the heat that light emitting diode 120 is produced be sent to light source bracket 150, make heat that light emitting diode 120 produced to carry out heat exchange and reach the effect of heat radiation with extraneous via light source bracket 150.
With reference to Fig. 2, it illustrates the sketch map after the backlight module 100 assembling completion among Fig. 1.Light emitting diode 120 be contained in one to one bearer bar 130 opening 132 in, the light-emitting area 122 of light emitting diode 120 is exposed to the opening 132 of bearer bar 130.The thickness of bearer bar 130 is greater than the thickness of light emitting diode 120.Through bearer bar 130 protection light emitting diode 120 wherein, avoid light emitting diode 120 directly to receive external force collision and squint or the situation of damaging.
With reference to Fig. 3, it illustrates the explosive view of another embodiment of backlight module of the present invention.Backlight module 100 includes substrate 110, a plurality of light emitting diode 120, bearer bar 130, and in order to bearer bar 130 is attached to the adhesion layer 140 on the substrate 110.Bearer bar 130 has at least one opening 132, in order to ccontaining light emitting diode 120.The light-emitting area 122 of light emitting diode 120 exposes to the opening 132 of bearer bar 130.The thickness W1 of bearer bar 130 in wherein, avoids light emitting diode 120 to receive the direct bump of external force with protection light emitting diode 120 greater than the thickness W2 of light emitting diode 120.In other words, after light emitting diode 120 was assembled in opening 132, the light-emitting area 122 of light emitting diode 120 can be lower than the surface of bearer bar 130.
The opening 132 of bearer bar 130 is the ccontaining light emitting diode 120 in one-to-many ground, i.e. the ccontaining a plurality of light emitting diodes 120 of each opening 132 difference.Adhesion layer 140 can be two-sided tape.Substrate 110 can be printed circuit board (PCB), flexible printed wiring board, or copper base.The material of bearer bar 130 can be metal or plastics.The color on the surface of bearer bar 130 can be a light color system, and perhaps, bearer bar 130 can be processed by the plastics or the metal of random color, and the surface of bearer bar 130 is provided with the reflecting layer again, to promote the utilization rate of light.
Backlight module 100 more includes light source bracket 150 and heat-conducting glue 160.Light source bracket 150 can be the aluminium extruded support; Heat-conducting glue 160 is in order to be cemented at substrate 110 on the light source bracket 150; And the heat that light emitting diode 120 is produced is sent to light source bracket 150, makes heat that light emitting diode 120 produced to carry out heat exchange and reach the effect of heat radiation with extraneous via light source bracket 150.
With reference to Fig. 4, it illustrates the sketch map after the backlight module 100 assembling completion among Fig. 3.Be provided with a plurality of light emitting diodes 120 in the opening 132 of each bearer bar 130, the light-emitting area 122 of light emitting diode 120 is exposed to the opening 132 of bearer bar 130.The thickness of bearer bar 130 is greater than the thickness of light emitting diode 120.Through bearer bar 130 protection light emitting diode 120 wherein, avoid light emitting diode 120 directly to receive external force collision and squint or the situation of damaging.
With reference to Fig. 5, it illustrates the profile of another embodiment of backlight module of the present invention.Backlight module 100 comprises substrate 110, be arranged at light emitting diode 120 on the substrate 110, bearer bar 130, in order to the fixing adhesion layer 140 of bearer bar 130 on substrate 110; Light source bracket 150, in order to substrate 110 being fixed in the heat-conducting glue 160 on the light source bracket 150, and LGP 170.
Substrate 110 is positioned at LGP 170 1 sides with light emitting diode 120, and the light-emitting area 122 of light emitting diode 120 is in the face of LGP 170.Bearer bar 130 is arranged at the side of substrate 110 in the face of LGP 170, has opening 132 on the bearer bar 130, to expose the light emitting diode 120 that is positioned at wherein.The thickness of bearer bar 130 is greater than the thickness of light emitting diode 120.Spacing d1 between bearer bar 130 and the LGP 170 is less than the spacing d2 between light emitting diode 120 and the LGP 170.Avoid LGP 170 because of directly clashing into light emitting diode 120 in expanded by heating or the assembling process by this, cause light emitting diode 120 displacements or the situation of damage.
LGP 170 can be resisted against as present embodiment on the bearer bar 130, makes closely to contact between bearer bar 130 and the LGP 170, perhaps, can have minim gap between LGP 170 and the bearer bar 130, visual actual demand design.
The material of bearer bar 130 can be metal or plastics.The color on the surface of bearer bar 130 can be a light color system, and perhaps, bearer bar 130 can be processed by the plastics or the metal of random color, and the surface of bearer bar 130 is provided with the reflecting layer again, to promote the utilization rate of light.
Can know by the invention described above preferred embodiment, use the present invention and have advantage.Through the thicker bearer bar of thickness, effectively protection is arranged at the light emitting diode in its opening, avoid LGP because of expanded by heating or because of fall to falling, factor such as collision makes light emitting diode receive to clash into and squints or damage.
In the preceding text, illustrate and describe the specific embodiment of the present invention.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also specific embodiments of the invention do various changes and replacement.These changes and replacement all drop in claims restricted portion of the present invention.

Claims (10)

1. backlight module comprises:
One LGP;
One substrate is positioned at said LGP one side;
A plurality of light emitting diodes are arranged on the said substrate, and the light-emitting area of said a plurality of light emitting diodes is in the face of said LGP; And
One bearer bar; Be arranged at the side of said real estate to said LGP; Said bearer bar has a plurality of openings, and with ccontaining said light emitting diode, the spacing between wherein said bearer bar and the said LGP is less than the spacing between said a plurality of light emitting diodes and the said LGP.
2. backlight module as claimed in claim 1, wherein said a plurality of openings are one to one or the ccontaining said a plurality of light emitting diodes in one-to-many ground.
3. backlight module as claimed in claim 1, the thickness of wherein said bearer bar is greater than the thickness of said a plurality of light emitting diodes.
4. backlight module as claimed in claim 1, wherein said bearer bar surface is provided with a reflecting layer.
5. backlight module comprises:
One substrate;
A plurality of light emitting diodes are arranged on the said substrate; And
One bearer bar is arranged at said substrate one side, and said bearer bar has a plurality of openings, and with ccontaining said a plurality of light emitting diodes, the thickness of wherein said bearer bar is greater than the thickness of said a plurality of light emitting diodes.
6. backlight module as claimed in claim 5, wherein said a plurality of openings are one to one or the ccontaining said a plurality of light emitting diodes in one-to-many ground.
7. backlight module as claimed in claim 5, wherein said bearer bar surface is provided with a reflecting layer.
8. backlight module comprises:
One substrate;
One bearer bar is arranged at a side of said substrate, and said bearer bar has an opening;
A plurality of light emitting diodes are arranged on the side of said substrate and are positioned at said opening, and each said light emitting diode has a light-emitting area, and wherein said light-emitting area is lower than the surface of said bearer bar.
9. backlight module as claimed in claim 8, wherein said a plurality of openings are one to one or the ccontaining said a plurality of light emitting diodes in one-to-many ground.
10. backlight module as claimed in claim 8, wherein said bearer bar surface is provided with a reflecting layer.
CN201110330056A 2011-10-24 2011-10-24 Backlight module Pending CN102330930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110330056A CN102330930A (en) 2011-10-24 2011-10-24 Backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110330056A CN102330930A (en) 2011-10-24 2011-10-24 Backlight module

Publications (1)

Publication Number Publication Date
CN102330930A true CN102330930A (en) 2012-01-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110330056A Pending CN102330930A (en) 2011-10-24 2011-10-24 Backlight module

Country Status (1)

Country Link
CN (1) CN102330930A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103629597A (en) * 2012-08-20 2014-03-12 三星显示有限公司 Backlight assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101191944A (en) * 2006-11-28 2008-06-04 李东明 Liquid crystal display backlight LED concave type trough backlight strip-shaped lamp production method
CN101430064A (en) * 2008-12-08 2009-05-13 厦门光莆显示技术有限公司 LED back light source structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101191944A (en) * 2006-11-28 2008-06-04 李东明 Liquid crystal display backlight LED concave type trough backlight strip-shaped lamp production method
CN101430064A (en) * 2008-12-08 2009-05-13 厦门光莆显示技术有限公司 LED back light source structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103629597A (en) * 2012-08-20 2014-03-12 三星显示有限公司 Backlight assembly
CN103629597B (en) * 2012-08-20 2017-12-12 三星显示有限公司 Backlight assembly

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Application publication date: 20120125