CN102328356A - Main roller for silicon wafer cutting - Google Patents
Main roller for silicon wafer cutting Download PDFInfo
- Publication number
- CN102328356A CN102328356A CN201110166596A CN201110166596A CN102328356A CN 102328356 A CN102328356 A CN 102328356A CN 201110166596 A CN201110166596 A CN 201110166596A CN 201110166596 A CN201110166596 A CN 201110166596A CN 102328356 A CN102328356 A CN 102328356A
- Authority
- CN
- China
- Prior art keywords
- main roller
- home roll
- metal tube
- titanium metal
- titanium pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides a main roller for silicon wafer cutting, and the main roller comprises a main roller body, wherein the periphery of the main roller body is provided with a titanium metal tube, the titanium metal tube and the main roller body are detachably connected into a whole, and the titanium metal tube is provided with a plurality of wiring troughs. The periphery of the main roller body is provided with the titanium metal tube, the titanium metal tube and the main roller body are detachably connected into a whole, and the titanium metal tube is strong in wear resistance and has less possibility of being damaged, so that the service life of the main roller provided by the invention is prolonged; and after the titanium metal tube is worn, the main roller is not required to be completely replaced but only the titanium metal tube is replaced, therefore, the main roller provided by the invention is more convenient to use, and can be used for improving the production efficiency of silicon wafers.
Description
Technical field
The present invention relates to a kind of home roll, particularly a kind of home roll that is used for silicon chip cutting belongs to the technical field of silicon chip cutting equipment.
Background technology
Along with the development of society, the maturation of photovoltaic industry, the use of silicon chip is more and more.Because silicon chip belongs to hard material, its cutting technique occupies very important position in processing technology.Silicon chip cutting is many to have the mortar of abrasive material through the line of cut supply, realizes the cutting of silicon chip through the abrasive wear principle between abrasive material, line of cut and the silicon crystal, and line of cut carries out displacement through home roll; Home roll of the prior art comprises the home roll main body, and the home roll main body is provided with the groove that is used to locate line of cut; The home roll of this structure cuts because silicon chip cutting is worn and torn through mortar and silicon chip, and line of cut is by home roll drive carrying out displacement; Line of cut easily with the home roll wearing and tearing, influences the service life of home roll at the home roll top offset, and home roll will often be changed; Use inconvenience, and influence production efficiency.
Summary of the invention
Technical problem to be solved by this invention provides a kind of home roll of silicon chip cutting, and the home roll of this structure is easy to use, has improved the production efficiency of silicon chip.
In order to solve the problems of the technologies described above, the home roll of a kind of silicon chip cutting of the present invention comprises the home roll body, and home roll body periphery is provided with the titanium pipe, said titanium pipe and dismountable the linking into an integrated entity of said home roll main body, and said titanium pipe is provided with a plurality of wire casings.
The home roll of above-mentioned a kind of silicon chip cutting, wherein, the wall thickness of said titanium pipe is 3mm.
The present invention can realize following beneficial effect: because home roll body periphery is provided with the titanium pipe, and said titanium pipe and dismountable the linking into an integrated entity of said home roll main body, titanium pipe wearability is stronger, is not easy to damage, thereby has prolonged service life of the present invention; And after the titanium pipe wearing and tearing, need only change the titanium pipe, need not the integral replacing home roll, therefore, use more conveniently, and improved the production efficiency of silicon chip; Because the wall thickness of said titanium mesh is 3mm, can guarantee the intensity of titanium pipe.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described further.
As shown in the figure; The home roll of a kind of silicon chip cutting of the present invention; Comprise home roll body 1, home roll body 1 periphery is provided with titanium pipe 2, and said titanium pipe 2 and said home roll main body 1 are through securing member or other modes are dismountable links into an integrated entity; Said titanium pipe 2 is provided with a plurality of wire casings 3, is used for installing line of cut.In order to guarantee the intensity of home roll, be 3mm with the wall thickness of said titanium pipe 2.
Those of ordinary skill in the art will be appreciated that; Above embodiment is used for explaining the object of the invention; And be not with opposing qualification of the present invention; As long as in essential scope of the present invention, all will drop in the scope of claim of the present invention variation, the modification of the above embodiment.
Claims (2)
1. the home roll of a silicon chip cutting comprises the home roll body, it is characterized in that said home roll body periphery is provided with the titanium pipe together, said titanium pipe and dismountable the linking into an integrated entity of said home roll main body, and said titanium pipe is provided with a plurality of wire casings.
2. a kind of according to claim 1 home roll of silicon chip cutting is characterized in that the wall thickness of said titanium pipe is 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110166596A CN102328356A (en) | 2011-06-20 | 2011-06-20 | Main roller for silicon wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110166596A CN102328356A (en) | 2011-06-20 | 2011-06-20 | Main roller for silicon wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102328356A true CN102328356A (en) | 2012-01-25 |
Family
ID=45480454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110166596A Pending CN102328356A (en) | 2011-06-20 | 2011-06-20 | Main roller for silicon wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102328356A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008168374A (en) * | 2007-01-10 | 2008-07-24 | Toyota Gakuen | Wire tool, its manufacturing method, and discharge machining device |
| US20090126712A1 (en) * | 2007-11-15 | 2009-05-21 | Wikus-Sagenfabrik Wilhelm H. Kullmann Gmbh & Co. Kg | Stone Saw Blade |
| JP2009233779A (en) * | 2008-03-26 | 2009-10-15 | Kyocera Corp | Roller member and wire saw apparatus |
| JP2011016184A (en) * | 2009-07-08 | 2011-01-27 | Bando Chemical Industries Ltd | Cylindrical outer layer body of roller |
-
2011
- 2011-06-20 CN CN201110166596A patent/CN102328356A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008168374A (en) * | 2007-01-10 | 2008-07-24 | Toyota Gakuen | Wire tool, its manufacturing method, and discharge machining device |
| US20090126712A1 (en) * | 2007-11-15 | 2009-05-21 | Wikus-Sagenfabrik Wilhelm H. Kullmann Gmbh & Co. Kg | Stone Saw Blade |
| JP2009233779A (en) * | 2008-03-26 | 2009-10-15 | Kyocera Corp | Roller member and wire saw apparatus |
| JP2011016184A (en) * | 2009-07-08 | 2011-01-27 | Bando Chemical Industries Ltd | Cylindrical outer layer body of roller |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120125 |