CN102328249A - Offset deep hole grinding device for grinding machine - Google Patents

Offset deep hole grinding device for grinding machine Download PDF

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Publication number
CN102328249A
CN102328249A CN201110144913A CN201110144913A CN102328249A CN 102328249 A CN102328249 A CN 102328249A CN 201110144913 A CN201110144913 A CN 201110144913A CN 201110144913 A CN201110144913 A CN 201110144913A CN 102328249 A CN102328249 A CN 102328249A
Authority
CN
China
Prior art keywords
ram
grinding
deep hole
offset
grinding machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110144913A
Other languages
Chinese (zh)
Inventor
刘攀
张华卫
李刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weihai Huadong Automation Co Ltd
Original Assignee
Weihai Huadong Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weihai Huadong Automation Co Ltd filed Critical Weihai Huadong Automation Co Ltd
Priority to CN201110144913A priority Critical patent/CN102328249A/en
Publication of CN102328249A publication Critical patent/CN102328249A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an offset deep hole grinding device for a grinding machine, which belongs to the field of the grinding machine. The offset deep hole grinding device is provided with a ram seat, and a ram generates relative movement with the ram seat through a linear guide rail pair. The offset deep hole grinding device is characterized in that a grinding wheel spindle is arranged on the ram and is offset at one side of the ram. The offset deep hole grinding device has the advantages that the processing capability of the vertical grinding machine is greatly improved, the grinding depth is greatly increased, and the reasonable solution is provided for the processing of large and heavy parts.

Description

Grinding machine is with biasing deep Hole device
Technical field
The present invention relates to the grinding machine field, is that a kind of grinding machine is with biasing deep Hole device.
Background technology
As everyone knows, traditional vertical grinder adopts grinding spindle to be installed in the structure on the slide carriage mostly, lathe can grinding the degree of depth receive the grinding spindle quantitative limitation that overhangs, grinding depth generally is no more than 500mm.
Summary of the invention
In order to overcome the deficiency of prior art, the present invention provides a kind of grinding machine with biasing deep Hole device, improves the working ability of vertical grinder greatly, can improve grinding depth significantly, for machining large, heavy part provide rational solution.
The technical solution adopted for the present invention to solve the technical problems is: a kind of grinding machine is with biasing deep Hole device; Be provided with the ram seat; Ram produces relative motion through line slideway auxiliary and ram seat, it is characterized in that grinding wheel spindle is installed on the ram, and is offset to a side of ram.
The invention has the beneficial effects as follows, improve the working ability of vertical grinder greatly, can improve grinding depth significantly, for machining large, heavy part provide rational solution.
 
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is a structural representation of the present invention.
Among the figure: 1. ram seat, 2. ram, 3. grinding wheel spindle, 4. emery wheel.
 
The specific embodiment
Shown in Figure 1; Ram 2 of the present invention produces relative motion through line slideway auxiliary and ram seat 1; Grinding wheel spindle 3 is installed on the ram 2, and is offset to a side of ram 2, and the barycenter that the gusset through reasonable Arrangement ram 2 makes the parts that move both vertically is still in geometric center; Can not produce partial load, grinding wheel spindle 3 ends are equipped with emery wheel 4.Grinding diameter of the present invention is during less than the hole of 600mm, and grinding depth depends on overhanging of grinding wheel spindle 3, promptly is 500mm to the maximum, when grinding diameter during greater than the hole of 600mm, ram 2 whole can below in the workpiece endoporus, maximum grinding depth can reach 900mm.

Claims (1)

1. a grinding machine is provided with the ram seat with biasing deep Hole device, and ram produces relative motion through line slideway auxiliary and ram seat, and it is characterized in that: grinding wheel spindle is installed on the ram, and is offset to a side of ram.
CN201110144913A 2011-06-01 2011-06-01 Offset deep hole grinding device for grinding machine Pending CN102328249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110144913A CN102328249A (en) 2011-06-01 2011-06-01 Offset deep hole grinding device for grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110144913A CN102328249A (en) 2011-06-01 2011-06-01 Offset deep hole grinding device for grinding machine

Publications (1)

Publication Number Publication Date
CN102328249A true CN102328249A (en) 2012-01-25

Family

ID=45480357

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110144913A Pending CN102328249A (en) 2011-06-01 2011-06-01 Offset deep hole grinding device for grinding machine

Country Status (1)

Country Link
CN (1) CN102328249A (en)

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120125