CN102328155A - Au-Pd-Mo alloy solder for high-temperature soldering - Google Patents
Au-Pd-Mo alloy solder for high-temperature soldering Download PDFInfo
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- CN102328155A CN102328155A CN201110272919A CN201110272919A CN102328155A CN 102328155 A CN102328155 A CN 102328155A CN 201110272919 A CN201110272919 A CN 201110272919A CN 201110272919 A CN201110272919 A CN 201110272919A CN 102328155 A CN102328155 A CN 102328155A
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Abstract
The invention discloses an Au-Pd-Mo alloy solder, which is capable of bearing the corrosion of H2, N2 and NH3 gases at 1200 DEG C, and simultaneously, has higher compatibility on N2H2 liquid. The Au-Pd-Mo alloy solder comprises the following components in percent: 70 percent of Au, 26-29 percent of Pd and 1-4 percent of Mo. The melting temperature of the solder rises along with the increase of the Mo content, and the N2H2 corrosion resistance level of the solder is the first level (the corrosion rate is lower than 0.001mm per year). The solder has good processing plasticity; the cold deformation reaches 80 percent; and the solder can be prepared into 0.04mm foil, and can also be prepared into a 0.2mm wire as needed.
Description
Technical field
The present invention relates in the nonferrous metallurgy field, particularly relates to the method for high temperature brazing with the AuPdMo solder alloy.
Background technology
Structural member at hot operation is higher owing to its work; The particularity of syndeton; Require to connect two kinds of different materials, the method for connection adopts soldering to connect to be the most effectively, method the most reliably, and the weld seam that connects simultaneously has certain shearing strength; Sealing, the ability of heat-resisting circulation and the corrosion of anti-special media.
The high-temp solder kind is more, and commonly used is Ni base alloy, and the fusion temperature of this type of solder all is lower than 1200 ℃, is not suitable for using more than 1200 ℃.Solder can bear H under 1200 ℃ on the one hand
2, N
2, NH
3Gas attack and to N
2H
2Liquid, distilled water, ethanol, isopropyl alcohol have compatibility (corrosion rate is less than 0.001mm/) preferably, and the welding temperature of solder need be adapted at 1400 ℃ of solders that weld does not on the other hand also have.
The AuPdMo solder alloy is to be tightly connected to high-temperature structural material Mo alloy and WRe alloy, utilizes the good corrosion ability of AuPd alloy, through adding an amount of Mo, to improve the wetability of materials to be welded and the intensity of soldered fitting.
The yellow bright awake preparation technology who reports research Au-40Pd-5Mo (Al) alloy of Kunming Institute of Precious Metals; And trace element aluminium is to alloy microstructure and Effect on Performance; Develop the stress coalignment; Be used for the alignment thin wire, prepared that performance technologies is up to standard, the Au-40Pd-5Mo of good straightness degree (Al) wire rod, and mass production applications is in making the gas sensor contact conductor; Sensing element for combustible gas uses Au-40Pd-5Mo alloy electrode lead-in wire the key technical indexes to be: Main Ingredients and Appearance (wt%): Au 55 ± 0.5; Pd 40 ± 0.5, and Mo is a surplus, and total impurities<0.2 (Huang Ping Xing. trace Al is to Au-40Pd-5Mo alloy structure and Effect on Performance " noble metal " 4 phases of .2000).With this project different be in: composition range is inequality, and purposes is also inequality.
Summary of the invention
AuPdMo solder alloy of the present invention can bear H under 1200 ℃
2, N
2, NH
3The corrosion of gas is simultaneously to N
2H
2Liquid has compatibility preferably.
AuPdMo solder composition scope is Au:70%, Pd:26~29%, Mo:1~4%.The fusion temperature of solder increases the anti-N of solder along with the increase of Mo content
2H
2The liquid corrosion rank is one-level (corrosion rate is less than 0.001mm/).Solder has good working plasticity, and the cold deformation amount reaches 80%, can be prepared into the foil of 0.04mm, also can be prepared into the silk material of 0.2mm as required.
The specific embodiment
Embodiment 1: the composition of practical application solder is: Au:70%, Pd:29%, Mo:1%.Fusion temperature: 1384 ℃~1406 ℃.The shearing strength τ of solder welding TZM (molybdenum alloy)/WRe25 (tungsten-rhenium alloy) joint
b>=150Mpa.Angle of wetting to TZM (molybdenum alloy) in the time of 1415 ℃ is: 9.6 °; Angle of wetting to WRe25 (tungsten-rhenium alloy) is: 7.1 °; The air-tightness of soldered fitting, leak rate :≤8 * 10
-8Toorl/s.
Embodiment 2: the composition of practical application solder is: Au:70%, Pd:28%, Mo:2%.Fusion temperature: 1370 ℃~1418 ℃.The shearing strength τ of solder welding TZM (molybdenum alloy)/WRe25 (tungsten-rhenium alloy) joint
b>=154Mpa.Angle of wetting to TZM (molybdenum alloy) in the time of 1430 ℃ is: 7.7 °; Angle of wetting to WRe25 (tungsten-rhenium alloy) is: 6.9 °.
Embodiment 3: the composition of practical application solder is: Au:70%, Pd:26%, Mo:4%.Fusion temperature: 1358 ℃~1426 ℃.The shearing strength τ of solder welding TZM (molybdenum alloy)/WRe25 (tungsten-rhenium alloy) joint
b>=270Mpa.Angle of wetting to TZM (molybdenum alloy) in the time of 1440 ℃ is: 6.0 °; Angle of wetting to WRe25 (tungsten-rhenium alloy) is: 5.7 °.
Claims (5)
1. an AuPdMo solder alloy is characterized in that the percentage by weight of composition composition scope is: Au:70%, Pd:26~29%, Mo:1~4%.
2. AuPdMo solder alloy according to claim 1 is characterized in that: the percentage by weight of said Pd is 29%, and the percentage by weight of said Mo is 1%.
3. AuPdMo solder alloy according to claim 1 is characterized in that: the percentage by weight of said Pd is 28%, and the percentage by weight of said Mo is 2%.
4. AuPdMo solder alloy according to claim 1 is characterized in that: the percentage by weight of said Pd is 26%, and the percentage by weight of said Mo is 4%.
5. the described AuPdMo solder alloy of claim 1 is applied to the welding of molybdenum alloy and tungsten-rhenium alloy.
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CN201110272919A CN102328155A (en) | 2011-09-15 | 2011-09-15 | Au-Pd-Mo alloy solder for high-temperature soldering |
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CN201110272919A CN102328155A (en) | 2011-09-15 | 2011-09-15 | Au-Pd-Mo alloy solder for high-temperature soldering |
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CN102328155A true CN102328155A (en) | 2012-01-25 |
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CN201110272919A Pending CN102328155A (en) | 2011-09-15 | 2011-09-15 | Au-Pd-Mo alloy solder for high-temperature soldering |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110683855A (en) * | 2018-07-05 | 2020-01-14 | 哈尔滨工业大学 | Biocompatible Al2O3Method for diffusion bonding of Ti |
CN112958940A (en) * | 2021-03-23 | 2021-06-15 | 贵研铂业股份有限公司 | Silver-based/copper-based/gold-based solder paste, preparation method and welding process |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2946679A (en) * | 1958-08-06 | 1960-07-26 | Johnson Matthey Co Ltd | Ductile electrical resistance alloy |
CN1900350A (en) * | 2005-07-19 | 2007-01-24 | 黑罗伊斯有限公司 | Enhanced sputter target alloy compositions |
CN101992360A (en) * | 2010-11-09 | 2011-03-30 | 深圳市豪鹏科技有限公司 | Capillary and preparation method thereof |
-
2011
- 2011-09-15 CN CN201110272919A patent/CN102328155A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2946679A (en) * | 1958-08-06 | 1960-07-26 | Johnson Matthey Co Ltd | Ductile electrical resistance alloy |
CN1900350A (en) * | 2005-07-19 | 2007-01-24 | 黑罗伊斯有限公司 | Enhanced sputter target alloy compositions |
CN101992360A (en) * | 2010-11-09 | 2011-03-30 | 深圳市豪鹏科技有限公司 | Capillary and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
黄炳醒: "痕量Al对Au-40Pd-5Mo合金结构与性能的影响", 《贵金属》, vol. 21, no. 4, 31 December 2000 (2000-12-31), pages 6 - 11 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110683855A (en) * | 2018-07-05 | 2020-01-14 | 哈尔滨工业大学 | Biocompatible Al2O3Method for diffusion bonding of Ti |
CN112958940A (en) * | 2021-03-23 | 2021-06-15 | 贵研铂业股份有限公司 | Silver-based/copper-based/gold-based solder paste, preparation method and welding process |
CN112958940B (en) * | 2021-03-23 | 2022-06-28 | 贵研铂业股份有限公司 | Silver-based/copper-based/gold-based solder paste, preparation method and welding process |
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Application publication date: 20120125 |