CN102319145A - Method for preparing contact lens electronic chip - Google Patents
Method for preparing contact lens electronic chip Download PDFInfo
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- CN102319145A CN102319145A CN2010102366743A CN201010236674A CN102319145A CN 102319145 A CN102319145 A CN 102319145A CN 2010102366743 A CN2010102366743 A CN 2010102366743A CN 201010236674 A CN201010236674 A CN 201010236674A CN 102319145 A CN102319145 A CN 102319145A
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Abstract
The invention provides a method for preparing a contact lens electronic chip, which comprises the following steps of: evaporating and depositing an organic semiconductor film on the surface of a contact lens material; rolling and integrating a silicon material electronic chip into the organic film by a smooth roller at a higher temperature; and depositing and growing a metal lead-out pin connected with the chip in the film through a hollow mask and completing the preparation for the contact lens electronic chip.
Description
Technical field
The present invention relates to the micro processing field in organic semiconductor, particularly a kind of method and contact lens electronic chip for preparing the contact lens electronic chip through hot pressing.
Technical background
Contact lens is generally used for substituting glasses, brings convenience to daily life.In addition, also carried out the research that makes contact lens become diagnosis, treatment product, discovery can utilize stealthy research to help to treat a series of diseases such as migraine, diabetes.
Discover that the secretions of lachrymal gland can reflect blood sugar level, after blood sugar level changed 30 minutes, the tear glucose level is also corresponding to change.The someone attempts letting contact lens directly reflect the blood glucose degree.Eyesense AG proposes a kind of eye pick off that is used for detecting an at least a analyte of liquid in one Chinese patent application CN101621961A, this pick off is particularly useful for medical diagnosis, as is used for the detection and/or the measures of quantization of concentration of glucose.Said eye pick off can comprise contact lens.
Contact lens can also be used for the treatment of ophthalmic.For example utilize the contact lens dispenser, treat common ophthalmic,, significantly reduce side effects of pharmaceutical drugs simultaneously like xerophthalmia, glaucoma, cataract.For example, common collyrium is when using, and only very small amount can arrive cornea, and all the other then get into blood circulation, can cause side effect.
Recently; STMicw Electronics and Switzerland Sensimed AG company announce to develop a wireless MEMS pick off; This is embedded in unique pick off of contact lens, can more effectively look after the glaucoma sufferer through diagnosing early and being directed against the customized therapeutic scheme of individual.Strain gauge that contact lens is embedded, antenna, miniature dedicated processes circuit and send the radiofrequency launcher of measurement data to receptor.Therefore the electric energy of contact lens need not to connect battery from the radio wave of receiving.Through this pick off, can understand patient's eye situation exactly.
At present, along with the expansion that contact lens is used, need the technology of further development and preparation contact lens electronic chip.
Summary of the invention
The purpose of this invention is to provide a kind of method for preparing the contact lens electronic chip through hot pressing; Elder generation's hydatogenesis one deck organic semiconducting materials on contact lens material; Utilizing roller (for example slick rustless steel roller) that organic film is at high temperature rolled to pressurize then is integrated in the roll extrusion of silicon materials electronic chip in the described organic film; Draw pin through the hollow mask metal that deposition growing is connected with chip in thin film at last, accomplish the preparation of contact lens electronic chip.
In one embodiment of the invention, a kind ofly prepare the method for contact lens electronic chip, comprise the steps: 1, preparation one deck dielectric layer film on contact lens material through hot pressing; 2, hydatogenesis one deck organic semiconductor thin-film on the insulating medium layer film surface; 3, (temperature range for example is 100 to 170 degrees centigrade of scopes, especially 110-150 degree) rolling pressurization at high temperature is integrated in the roll extrusion of silicon materials electronic chip in the described organic film to organic film to utilize slick roller; 4, make the mask plate that the electronic chip metal is drawn pin; 5, the deposition growing metal is drawn pin, accomplishes the preparation of contact lens electronic chip.
Characteristics of the present invention are to utilize the hot pressed method of high temperature will be integrated in the contact lens material, utilize the mask deposition process to prepare metal simultaneously and draw pin, and what be used for the signal of telecommunication reads and test use.The invention provides the method that a kind of technology simply prepares the contact lens electronic chip.
Description of drawings
Fig. 1-1 is to Fig. 1-the 7th, one embodiment of the invention pass through the flow chart that hot pressing prepares the method for contact lens electronic chip.
Fig. 2 is according to a contact lens chip according to the embodiment of the present invention preparation.
The specific embodiment
Below in conjunction with accompanying drawing, through embodiment the present invention is described further, the present invention includes but be not limited to following examples of implementation.
Embodiment of the present invention provide the method for preparing the contact lens electronic chip through hot pressing, comprising: elder generation's hydatogenesis organic semiconductor thin-film on the contact lens material surface; Then at high temperature, utilize slick roller that the roll extrusion of silicon materials electronic chip is integrated in the described organic film; Draw pin through the hollow mask metal that deposition growing is connected with chip in thin film at last, accomplish the contact lens electronic chip.In this embodiment, can comprise that especially by an organic semiconductor thin-film deposition, hot pressing and minor metal deposition obtain to have the contact lens electronic chip that metal is drawn pin, especially may further comprise the steps down:
Hydatogenesis growth organic semiconductor thin-film on the contact lens material surface, the material of organic semiconductor thin-film for example are selected from and gather plug fen ethylene, Benzo[b, gather to give a tongue-lashing and cough up (PPy), gather plug fen (PT), polyaniline (PAn), gather benzene (PPP), polyphenylene ethylene.Organic film for example can adopt the method for thermal oxide growth or chemical vapour deposition (CVD) to obtain.The deposition of organic film can also be selected to use the vacuum thermal evaporation technology to carry out in addition, on contact lens material (dielectric layer), to grow the orderly continuous organic semiconductor thin-film of big crystal grain.
Utilize slick roller to organic film (specifically at the 100-170 degree, under the preferred 110-150 degree) pressurization of rolling at high temperature, thereby electronic chip is pressed in the organic film.
Make the electronic chip metal and draw the mask plate of pin.
The deposition growing metal is drawn pin.Described metal is drawn pin and is adopted for example copper and realizing of evaporation of metal or magnetron sputtering technique plated metal.
Fig. 1 has shown the schematic flow diagram (section in the flow chart is the A-A section among Fig. 1-7) of one embodiment of the invention.
Shown in Fig. 1-1, on the silicon that has prepared, adopt the technology technology of chemical vapour deposition (CVD) (or also can adopt) the preparation thin film of thermal oxide growth, said thin film can for example be a contact lens material, hydrogel etc.In this embodiment, said thin film is contact lens material BalafilconA.
Shown in Fig. 1-2, at said thin film (insulating medium layer) surface vacuum deposition ground floor organic film (gathering plug fen vinyl film).
Shown in Fig. 1-3, utilize slick roller to the organic film pressurization of at high temperature rolling.Described high temperature can suitably be selected according to organic film, in this embodiment, selects about 150 degrees centigrade.
Shown in Fig. 1-4, vacuum moulding machine second layer homogeneity organic film on the process ground floor organic film surface of hot-pressing processing.
Fig. 1-5 has shown the vertical view of formed second layer organic film.
Shown in Fig. 1-6, at organic semiconductor thin-film copper-depositing on surface metal electrode, can produce the metal electrode output and the test port that are connected with chip through hollow mask plate.Vertical view is shown in Fig. 1-7.
The product prototype examples of implementation:
As shown in Figure 2, to implement can produce the contact lens electronic chip through applying electronic chip and organic semiconductor thin-film (like hydrogel) like the described step of Fig. 1, chip can be connected with outside through metal electrode.
Claims (8)
1. a method for preparing the contact lens electronic chip comprises: elder generation's hydatogenesis organic semiconductor thin-film on the contact lens material surface; Then at high temperature, utilize slick roller that the roll extrusion of silicon materials electronic chip is integrated in the described organic film; Draw pin through the hollow mask metal that deposition growing is connected with chip in thin film at last, accomplish the contact lens electronic chip.
2. method according to claim 1 comprises that by an organic semiconductor thin-film deposition, hot pressing and minor metal deposition obtain to have the contact lens electronic chip that metal is drawn pin, and order may further comprise the steps down:
Go up hydatogenesis growth organic semiconductor thin-film at the material (like hydrogel) of contact lens;
Utilize slick roller to the organic film pressurization of at high temperature rolling, thereby electronic chip is pressed in the organic film;
Make the electronic chip metal and draw the mask plate of pin;
The deposition growing metal is drawn pin.
3. method according to claim 1 and 2 is characterized in that, wherein said on chip surface the organic film of deposit be to adopt the method for thermal oxide growth or chemical vapour deposition (CVD) to obtain.
4. according to each method among the claim 1-2, it is characterized in that the deposition of wherein said organic film adopts the vacuum thermal evaporation technology, on contact lens material, to grow the orderly continuous organic semiconductor thin-film of big crystal grain.
5. according to each method among the claim 1-4, it is characterized in that organic semiconductor thin-film utilizes slick roller to its pressurization of at high temperature rolling after vacuum moulding machine, order is integrated in the electronic chip roll extrusion of silicon materials in the described organic film.
6. according to each method among the claim 1-5, it is characterized in that it is to adopt evaporation of metal or magnetron sputtering technique sedimentary that wherein said metal is drawn pin.
7. according to each method among the claim 1-6, it is characterized in that, wherein under the preferred 110-150 degree of 100-170 degree, utilize slick roller that the roll extrusion of silicon materials electronic chip is integrated in the described organic film.
8. according to each method among the claim 1-7, it is characterized in that the material of said organic semiconductor thin-film is selected from and gathers plug fen ethylene, Benzo[b, gathers to give a tongue-lashing and cough up (PPy), gather plug fen (PT), polyaniline (PAn), gather benzene (PPP), polyphenylene ethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102366743A CN102319145A (en) | 2010-07-27 | 2010-07-27 | Method for preparing contact lens electronic chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102366743A CN102319145A (en) | 2010-07-27 | 2010-07-27 | Method for preparing contact lens electronic chip |
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| CN102319145A true CN102319145A (en) | 2012-01-18 |
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| CN2010102366743A Pending CN102319145A (en) | 2010-07-27 | 2010-07-27 | Method for preparing contact lens electronic chip |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989974A (en) * | 1997-05-30 | 1999-11-23 | Nec Corporation | Method of manufacturing a semiconductor device |
| CN101083304A (en) * | 2006-06-02 | 2007-12-05 | 中国科学院微电子研究所 | Method for preparing anisotropic organic field effect transistor by hot pressing |
| CN101086987A (en) * | 2007-05-24 | 2007-12-12 | 上海交通大学 | Integrated small thermal sediment system and its making method |
| CN101687409A (en) * | 2007-06-28 | 2010-03-31 | 伊莫特株式会社 | Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming |
-
2010
- 2010-07-27 CN CN2010102366743A patent/CN102319145A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989974A (en) * | 1997-05-30 | 1999-11-23 | Nec Corporation | Method of manufacturing a semiconductor device |
| CN101083304A (en) * | 2006-06-02 | 2007-12-05 | 中国科学院微电子研究所 | Method for preparing anisotropic organic field effect transistor by hot pressing |
| CN101086987A (en) * | 2007-05-24 | 2007-12-12 | 上海交通大学 | Integrated small thermal sediment system and its making method |
| CN101687409A (en) * | 2007-06-28 | 2010-03-31 | 伊莫特株式会社 | Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming |
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Application publication date: 20120118 |