CN102314027A - Liquid crystal display panel - Google Patents
Liquid crystal display panel Download PDFInfo
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- CN102314027A CN102314027A CN2010102175411A CN201010217541A CN102314027A CN 102314027 A CN102314027 A CN 102314027A CN 2010102175411 A CN2010102175411 A CN 2010102175411A CN 201010217541 A CN201010217541 A CN 201010217541A CN 102314027 A CN102314027 A CN 102314027A
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- common electrode
- electrode layer
- upper substrate
- frame glue
- display panels
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Abstract
According to the liquid crystal display panel, the black matrix layer, the upper substrate common electrode layer and the lower substrate common electrode layer are respectively arranged in the frame glue setting area and the inner sides of the upper substrate and the lower substrate of the closed space of the liquid crystal box, the frame glue is used for protecting the black matrix layer, the upper substrate common electrode layer and the lower substrate common electrode layer, the path of static electricity entering the liquid crystal display panel is cut off, and the static electricity resisting capability of the liquid crystal display panel is effectively improved.
Description
Technical field
The present invention relates to field of liquid crystal display, relate in particular to a kind of display panels and manufacturing approach thereof with electrostatic prevention structure.
Background technology
(Liquid Crystal Display LCD) because of advantages such as it has that external form is frivolous, little power consumption and radiationless pollutions, has been widely used in the products such as TV, notebook computer, mobile phone, personal digital assistant the liquid crystal flat-panel display device at present.Display panels is the key element in the liquid crystal indicator, mainly comprises two substrates and cooperates frame glue to be packaged in the liquid crystal (Liquid Crystal is called for short LC) between these two substrates.The liquid crystal display principle is to apply a voltage to above-mentioned two substrates, and between above-mentioned two substrates, forms electric field, and liquid crystal molecule rotates also passing through to realize that image shows of control bundle under said electric field action.
Fig. 1 is the partial sectional view of the display panels of prior art.The infrabasal plate 102 that this display panels comprises upper substrate 101, is oppositely arranged with said upper substrate 101; Frame glue applying area 110 is around the confined space zone in 100 1 weeks; At frame glue applying area 110 coating frame glue 111, make said upper substrate 101 and infrabasal plate 102 through frame glue 111 be bonded together form a sealing confined space 100 to accommodate a liquid crystal layer 103.Said confined space 100, the zones beyond the 110 said relatively confined spaces 100 of said frame glue setting area are frame glue outer peripheral areas 120.
Said upper substrate 101 sets gradually black matrix layer 104 and upper substrate common electrode layer 105 with respect to the inboard of infrabasal plate 102.Upper substrate common electrode layer 105 is positioned at the below of black matrix layer 104.Said black matrix layer 104 is covered with upper substrate 101 inboards with upper substrate common electrode layer 105 in confined space 100, frame glue setting area 110, frame glue outer peripheral areas 120.
At said confined space 100, also be provided with a plurality of thin film transistor (TFT) 107, insulation course 108 and pixel electrode 109 on the said infrabasal plate 102.Also be provided with infrabasal plate common electrode layer 106 on the infrabasal plate 102, the wiring of infrabasal plate common electrode layer 106 is generally: in pixel region, extend to form infrabasal plate public electrode (not shown) and pixel electrode 109 formation MM CAPs; Outside pel array, each infrabasal plate public electrode is formed the ring-type public electrode wire of ring pixel array, this moment infrabasal plate common electrode layer 106 some be arranged on the frame glue outer peripheral areas 120 of infrabasal plate 102, only covered insulation course 108 on it.Said insulation course 108 is generally silicon nitride, right (1 dust=10 of thickness 2000 Izods
-10Rice).
In the prior art, the method for conducting upper and lower base plate public electrode has two kinds, and a kind of is firing point conducting technology, and another kind is complete all conducting technology.Firing point conducting technology is that firing point is set on infrabasal plate, is arranged on four corners of panel usually.Concrete, the corner that the infrabasal plate public electrode wire is caused panel forms firing point, the insulation course above the firing point is etched away firing point is exposed.On firing point, be provided with the conducting resinl of conducting particles, behind the coating frame glue bond upper and lower base plate, the upper and lower base plate public electrode just can pass through the conducting resinl conducting.Complete all conducting technology are in frame glue setting area firing point to be set, and firing point is electrically connected with the infrabasal plate public electrode, in frame adhesive, add conducting particles, and behind the coating frame glue bond upper and lower base plate, the upper and lower base plate public electrode just can pass through the conducting of frame glue.With firing point conducting compared with techniques, complete all conducting technology are provided with operation with frame adhesive painting process and conducting resinl and are combined into an operation, shortened the processing procedure time, saved equipment and material.More than be techniques well known, do not remake detailed description at this.
Setting in the face of complete all conducting technology is described in detail down; Then with reference to Fig. 1; In frame glue setting area 110, said infrabasal plate 102 is provided with firing point 113, and said firing point 113 is electrically connected with infrabasal plate common electrode layer 106; A plurality of conducting particless 112 are arranged in frame glue 111, and said frame glue 111 makes upper substrate common electrode layer 105 and 106 conductings of infrabasal plate common electrode layer through firing point 113.In frame glue outer peripheral areas 120, infrabasal plate common electrode layer 106 is connected with integrated circuit 121.
Display panels is in manufacture process or after being applied to electronic product; Usually can produce the static of voltage because of friction up to thousands of volts; Because upper substrate common electrode layer 105 of the prior art is to be covered with upper substrate 101 inboard whole; Static is easy to import from the upper substrate common electrode layer 105 of frame glue outer peripheral areas 120; Static can transfer to said integrated circuit 121 via frame adhesive 111, firing point 113 through upper substrate common electrode layer 105, causes integrated circuit 121 to burn easily, and then causes said display panels normally to show; Perhaps static transfers to infrabasal plate common electrode layer 106 via upper substrate common electrode layer 105, frame glue 111, firing point 113, gets into confined space 100 inside thin film transistor (TFT) 107 or other devices are burnt, cause show bad etc.
In the prior art; The structure of display panels has been done some improved, to play the effect of electrostatic prevention, such as display panels shown in Figure 2; Be coated with a circle colloid 114 in frame glue outer peripheral areas 120; Colloid 114 is enclosed in the internal rift external world contact of colloid 114 for what insulate with upper substrate common electrode layer 105, gets into substrate inside thereby block static by upper substrate common electrode layer 105.But this kind method need increase the painting process of colloid 114, and needs to increase special automatic double surface gluer.Under the more frivolous trend of liquid crystal panel, add a circle colloid 114 and can make the display panels thickening, and colloid 114 also is easy to be attached on upper substrate 101 upper stratas, makes the display panels profile not attractive in appearance.
In view of the above, be necessary existing display panels is improved, to remedy above-mentioned deficiency.
Summary of the invention
To above-mentioned technical matters, the present invention provides a kind of improved display panels, can well solve the problem that the high-intensity currrent of generation of static electricity causes display panels normally to show.For reaching above-mentioned purpose; The present invention adopts following technical scheme: a kind of display panels; Comprise upper substrate, infrabasal plate, upper and lower base plate forms a confined space to hold the liquid crystal layer that is positioned at wherein, also to comprise the upper substrate common electrode layer that is positioned at the upper substrate downside through the frame glue bond; And the infrabasal plate common electrode layer that is positioned at the infrabasal plate upside, said upper substrate common electrode layer and infrabasal plate common electrode layer are positioned at frame glue setting area and confined space corresponding region.
Alternatively, upper substrate common electrode layer and infrabasal plate common electrode layer are at least 10 microns apart from the distance away from the edge of confined space of frame glue setting area.
Alternatively, also be provided with black matrix layer between said upper substrate and the upper substrate common electrode layer, said black matrix layer is arranged on frame glue setting area and confined space corresponding region.
Alternatively, said black matrix layer, upper substrate common electrode layer and infrabasal plate common electrode layer are at least 10 microns apart from the distance away from the edge of confined space of frame glue setting area.
Alternatively, the material of said black matrix layer is served as reasons and is comprised the potpourri that carbon dust and mixed with resin are formed.
Alternatively, comprise being positioned at the firing point that infrabasal plate common electrode layer up and down substrate common electrode layer is electrically connected that be provided with conducting resinl between said firing point and the upper substrate common electrode layer, said conducting resinl is electrically connected firing point and upper substrate common electrode layer.
Alternatively, said conducting resinl is conducting particles and the conductive mixture of insulation colloid according to 1: 100~1: 50 mixed of mass ratio composition.
Alternatively, said conducting particles is a gold goal.
Alternatively, said firing point is positioned at frame glue setting area, and said conducting resinl is the frame glue that has conducting particles.
A kind of display panels; Comprise upper substrate, infrabasal plate; Upper and lower base plate forms a confined space to hold the liquid crystal layer that is positioned at wherein through the frame glue bond; Also comprise the black matrix layer that is positioned at the upper substrate downside, and be positioned at black matrix layer below upper substrate common electrode layer, said black matrix layer and upper substrate common electrode layer are positioned at frame glue setting area and confined space corresponding region.
Alternatively, said black matrix layer and upper substrate common electrode layer are at least 10 microns apart from the distance away from the edge of confined space of frame glue setting area.
Alternatively, the material of said black matrix layer is served as reasons and is comprised the potpourri that carbon dust and mixed with resin are formed.
Compared with prior art, the present invention has the following advantages:
1. display panels provided by the invention is arranged at the confined space of liquid crystal cell and the infrabasal plate inboard of frame glue setting area with the infrabasal plate common electrode layer; With frame glue the infrabasal plate common electrode layer is protected; Avoid the insulation course entering liquid crystal panel inside on the electrostatic breakdown infrabasal plate common electrode layer to cause damage perhaps driving circuit to be damaged to display panels; Cut off the path of static from infrabasal plate entering display panels, defence has significant effect to static.
2. display panels provided by the invention is arranged at upper substrate common electrode layer and black matrix layer the confined space and the frame glue setting area of liquid crystal cell; With frame glue black matrix layer is protected; Avoid static to get into liquid crystal panel inside display panels is caused damage from black matrix layer; Cut off the path of static from upper substrate entering display panels, defence has significant effect to static.
Description of drawings
Fig. 1 is a kind of local schematic views of prior art display panels;
Fig. 2 is a kind of prior art electrostatic prevention liquid crystal display panel partial schematic diagram;
Fig. 3 is the first embodiment partial schematic diagram of display panels of the present invention;
Fig. 4 is the second embodiment partial schematic diagram of display panels of the present invention;
Fig. 5 is the synoptic diagram that detects black matrix layer resistance value;
Fig. 6 is the 3rd an embodiment partial schematic diagram of display panels of the present invention;
Fig. 7 is a synoptic diagram of the display panels sample being resisted the electrostatic capacity test;
Fig. 8 is the record that display panels of the present invention carries out the electrostatic test result;
Fig. 9 is the record that the display panels of prior art carries out the electrostatic test result.
Embodiment
Do detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.
A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from other modes described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, and therefore, the present invention does not receive the restriction of following disclosed specific embodiment.Secondly, the present invention utilizes synoptic diagram to be described in detail, when the embodiment of the invention is detailed; For ease of explanation; The sectional view of expression device architecture can be disobeyed general ratio and done local the amplification, and said synoptic diagram is instance, and it should not limit the scope of the present invention's protection at this; The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Just as describing in the background technology; Display panels of the prior art is in manufacture process or after being applied to electronic product; Usually can produce the static of voltage because of friction up to thousands of volts; And said high-pressure electrostatic can be easily through the electrodeposited coating or the conductive pane glue on electronic product surface, and then conduct to integrated circuit or other device of said display panels, and discharge rapidly and produce high-intensity immediate current.In addition, said display panels external static electrification also can make public electrode produce a large amount of induced charges, and these induced charges conduct in said public electrode, also can form high-intensity electric current.These high-intensity currrents transfer to said integrated circuit, cause integrated circuit to burn easily, and then cause said display panels normally to show.Though the structure of the display panels of electrostatic prevention structure is arranged in the prior art, display panels has increased plate thickness against the lightening requirement of display panels in the prior art.
The inventor is because the deficiency of above prior art based on being engaged in panel industry abundant for many years practical experience and professional knowledge, is actively studied innovation, and through constantly studying, exploring, the repetition test demonstration proposes embodiment of the present invention finally.Specify the present invention according to accompanying drawing below.
Fig. 3 comprises upper substrate 101, infrabasal plate 102 for the partial schematic diagram of display panels first embodiment of the present invention.Upper substrate 101 is provided with black matrix layer 104 with respect to the inboard of infrabasal plate 102, and the below of black matrix layer 104 is provided with upper substrate common electrode layer 105.Infrabasal plate 102 has an infrabasal plate common electrode layer 106 with respect to what the inboard of upper substrate 101 was provided with, and the top of infrabasal plate common electrode layer 106 is provided with insulation course 108.Confined space 100 of frame glue 111 bonding formation that said upper and lower substrate is provided with through frame glue setting area 110 is to hold liquid crystal layer 103.Concrete, upper substrate common electrode layer 105 is arranged on upper substrate 101 inboards of confined space 100 and frame glue frame glue setting area 110.Infrabasal plate common electrode layer 106 is arranged on infrabasal plate 102 inboards of confined space 100 and frame glue setting area 110.As preferred embodiment, in the present embodiment, upper substrate common electrode layer 105 and infrabasal plate common electrode layer 106 are at least 10 microns from the distance L 1 away from the edge of confined space 100 1 sides of frame glue setting area 110.
Inventor of the present invention finds under study for action, though the top of infrabasal plate common electrode layer 106 is provided with insulation course 108, insulation course 108 is generally silicon nitride, and thickness is extremely thin to have only right (1 dust=10 of 2000 Izods
-10Rice), be easy to, it caused damage thereby static gets into display panels inside from infrabasal plate common electrode layer 106 by electrostatic breakdown.The frame glue thickness of display panels is bigger, near the thickness of confined space several microns (1 micron=10 is arranged usually
-6Rice); Frame glue 111 thickness are 4 microns in the present embodiment, in firing point conducting technology, do not have conducting particles to insulate fully in the frame glue 111; Static is difficult to get into infrabasal plate common electrode layer 106 from frame glue 111, improved the ability that display panels is resisted static effectively.
Fig. 4 comprises upper substrate 201, infrabasal plate 202 for the partial schematic diagram of display panels second embodiment of the present invention.Upper substrate 201 is provided with black matrix layer 204 with respect to the inboard of infrabasal plate 202, and the below of black matrix layer 204 is provided with upper substrate common electrode layer 205.Infrabasal plate 202 is provided with infrabasal plate common electrode layer 206 with respect to the inboard of upper substrate 201, and the top of infrabasal plate common electrode layer 206 is provided with insulation course 207.Concrete, upper and lower base plate through in frame glue setting area 210 confined spaces 200 of frame glue 211 bonding formation of being provided with to hold the liquid crystal layer 203 that is positioned at wherein.Black matrix layer 204 is arranged on the inboard of the upper substrate 201 of confined space 200 and frame glue setting area 210.Upper substrate common electrode layer 205 is arranged on the inboard of the upper substrate 201 of confined space 200 and frame glue setting area 210, and is positioned at the below of black matrix layer 204.Infrabasal plate common electrode layer 206 is positioned at the inboard of the infrabasal plate 202 of confined space 200 and frame glue setting area 210.As preferred embodiment; In the present embodiment; Black matrix layer 204, upper substrate common electrode layer 205 are arranged on upper substrate 201 inboards of confined space 100 and frame glue setting area 110; Infrabasal plate common electrode layer 206 is positioned at the inboard of the infrabasal plate 202 of confined space 200 and frame glue setting area 210, and black matrix layer 204, upper substrate common electrode layer 205, the distance L 2 away from the edge of a side of confined space 200 is at least 10 microns to infrabasal plate common electrode layer 206 from frame glue setting area 210.Upper substrate common electrode layer 205 is a conductive film, and the material of upper substrate common electrode layer 205 is a tin indium oxide in the present embodiment.
In the present embodiment, black matrix layer 204 is that the potpourri that comprises carbon dust and resin is formed.It also is this area a kind of technological means commonly used that the mixed with resin carbon dust forms black matrix layer; Be that resin and carbon dust mixing are spin-coated on the glass substrate; Form black matrix through over etching again, carbon dust is used for shading, and those skilled in the art thinks that this resin black matrix layer is nonconducting.Usually, the upper substrate common electrode layer is to be covered with upper substrate inboard whole, and static is easy to import from the upper substrate common electrode layer of frame glue outer peripheral areas.Structure as shown in Figure 3; The inside that upper substrate common electrode layer 105 is arranged on confined space 100 is arranged; Cut off the path of static from upper substrate common electrode layer 105 entering display panels; Make the electrostatic protection ability of liquid crystal panel be enhanced, but still can not stop the generation of static damage.This problem never obtains answer.The inventor has carried out many experiments; And a large amount of static wounds defective products and has carried out one by one analyzing in the display panels to prior art; When discovery has only black matrix layer 104 on frame glue outer peripheral areas 120 upper substrates 101; Static also can get into display panels from upper substrate 101 device is caused damage, and the inventor infers that black matrix layer 104 might not insulate.
The idea of the artificial checking of invention oneself; Done a series of experiment, like Fig. 5, the inventor measures the resistance value of the black matrix layer 104 of display panels in the prior art with multimeter; A black matrix layer 104 of probe contact with multimeter; Another probe contact upper substrate common electrode layer 105 is measured multi-group data, obtains resistance between 5.7~9.7 kilo-ohms.This explanation has electric current to flow through between black matrix layer 104 and upper substrate common electrode layer 105, and black matrix layer 104 is conducted electricity.The material of upper substrate common electrode layer 105 is tin indium oxides, and resistance value can be ignored between 0.1~0.15 kilo-ohm, 5.7~9.7 kilo-ohms of resistance values of thinking black matrix layer 104 that can be similar to of the resistance that records.
For the experimental result to oneself finds theoretical the support; The inventor has consulted a large amount of technical literatures, though find that resin insulate, carbon particle conducts electricity; Reduced the impedance of resin behind the mixed with resin carbon particle, made black matrix layer have certain electric conductivity.
Based on above experiment and result of study; The inventor has proposed second embodiment of aforesaid display panels of the present invention; Upper substrate common electrode layer 205 is set in place in upper substrate 201 inboards of confined space 200 and frame glue setting area 210, and black matrix layer 204 also is arranged on the inboard of the upper substrate 201 of confined space 200 and frame glue setting area 210.The display panels of said second embodiment has overcome those skilled in the art and has thought that the black matrix layer of mixed with resin carbon particle is so technological prejudice of insulation; Proposed to deceive the technical scheme of inboard that matrix layer 204 also is arranged on the upper substrate 201 of confined space 200 and frame glue setting area 210; Thoroughly cut off the path of static, improved the ability that display panels is resisted static effectively from 201 pairs of display panels generatings of upper substrate.
Fig. 6 is the structure of display panels the 3rd embodiment of the present invention, has disclosed complete all conducting technology and has been about to the design that firing point is arranged on utilization defence static in the frame glue setting area.Comprise upper substrate 401, infrabasal plate 402, upper and lower base plate forms the liquid crystal layer 403 of a confined space 400 to hold to be positioned at wherein through frame glue 411 bonding upper and lower base plates are set in frame glue setting area 410.Be mixed with the gold goal 412 of conduction in the said frame glue 411, said gold goal 412 is 1: 100~1: 50 with the mass ratio that frame glue 411 mixes.Upper substrate 401 is provided with black matrix layer 404 with respect to the inboard of infrabasal plate 402, and the below of black matrix layer 404 is provided with upper substrate common electrode layer 405.Infrabasal plate 402 is provided with infrabasal plate common electrode layer 406 with respect to the inboard of upper substrate 401; The top of infrabasal plate common electrode layer 406 is provided with insulation course 407; Insulation course 407 tops are provided with firing point 413; Said firing point 413 is electrically connected with infrabasal plate common electrode layer 406, and upper and lower base plate can pass through frame glue 411, firing point 413 is electrically connected.Concrete, upper substrate common electrode layer 405 is set in place in upper substrate 401 inboards of confined space 400 and frame glue setting area 410, and black matrix layer 404 also is arranged on upper substrate 401 inboards of confined space 400 and frame glue setting area 410.As preferred embodiment, in the present embodiment, black matrix layer 404, upper substrate common electrode layer 405 are at least 10 microns from the distance L 4 at the edge of frame glue setting area 410.Infrabasal plate common electrode layer 406 is arranged on infrabasal plate 402 inboards of confined space 400 and frame glue setting area 410.As preferred embodiment; In the present embodiment; Infrabasal plate common electrode layer 406 is arranged on infrabasal plate 402 inboards of confined space 400 and frame glue setting area 410, and infrabasal plate common electrode layer 406 is at least 10 microns from the distance L 5 at the edge of frame glue setting area 410.
In the above-described embodiments; Upper substrate common electrode layer 405 and black matrix layer 404 and infrabasal plate common electrode layer 406 are separately positioned on the inboard of the upper and lower base plate of confined space 400 and frame glue setting area 410; Protect upper substrate common electrode layer 405, black matrix layer 404 and infrabasal plate common electrode layer 406 with frame glue 411; Make itself and isolation; It is inner to import substrate when static only touches the gold goal 412 in the frame glue 411, but this situation only occurs in gold goal 412 when being exposed to the outside of frame glue 411, and probability is very low.Be the static protection effect of checking the foregoing description, the inventor has carried out anti-static ability assessment experiment to it.
As shown in Figure 7; Upper substrate 401 at the display panels of above-mentioned third embodiment of the invention selects 8 points as test point; Point Dot1, Dot3, Dot7, Dot8 are positioned at four corners of display panels; Point Dot2, Dot4, Dot6 are positioned at the edge of display panels, and some D5 is positioned at the center of display panels, and integrated circuit 422 is positioned on the infrabasal plate 402.
One, test condition is:
1, display panels is in normal full screen display state in the test, and the WV of integrated circuit 422 is VDDIO=1.875V, VCI=2.8V;
2, the relative humidity RH of test environment is 30%~60%, and temperature is 25 ℃;
3, test voltage be respectively 3KV, 4KV, 5KV, 5.5KV, 6KV and-3KV ,-4KV ,-5KV ,-5.5KV ,-6KV; Under relevant voltage, each point is applied 10 discharges respectively, and logging test results.
Two: test result classification such as table 1:
Rank | Phenomenon |
Pass | Image recovers automatically, need not circuit switched signal or external reset signal or power supply circulation |
A | Image needs the circuit switched signal just can recover |
B | The circuit switched signal pattern is irrecoverable, and switching external reset signal or power supply chain image can recover |
C | Only just can recover at the situation hypograph that switches cycle signal |
D | Permanent failure, image is irrecoverable |
Table 1
As, test record form filling explanation: the test point of " pass " expression counter plate monomer is tested under relevant voltage, and liquid crystal panel does not occur any bad; Test result " B6 "-expression is tested down in relevant voltage (like 5.5KV) in corresponding test point (like DOT3) monomer, and when carrying out the 6th discharge, it is bad that category-B appears in liquid crystal panel; The hard damage that "/" expression has occurred recovering in test before because of the panel monomer is so no longer measure.
In conjunction with IEC (International Electrotechnical Commission)-61000-4-2 standard, to appearing at 3 times with interior A, B, the C badness is judged to soft damage, is higher than A 3 times, B, the C badness wouldn't count, and for example test result " B2 " is designated as soft damage, and test result " B4 " then is not counted in; The D badness occurs and then be designated as hard damage, this moment, liquid crystal panel occurred irrecoverable bad.
Three: experimental result: done 2 groups of panel monomer tests (3 monomers of every group of sample) altogether, 8 points of test fluid LCD panel are result under different static discharge voltages respectively, according to the label record of rank and point, and the form that the test result record is as shown in Figure 8.
In addition, in order to do contrast, display panels of the prior art has also been made the anti-static ability test experiments according to identical condition, experimental result writes down in the form as shown in Figure 9:
In conjunction with Fig. 8 and test result shown in Figure 9, the soft damage ability of the experimental group of the display panels of third embodiment of the invention can be brought up to 6KV, and damage ability firmly is higher than 6KV; The hard damage ability 4KV of the experimental group of display panels of the prior art, soft damage ability is also suitable with 4KV.The ability that the display panels that can find out display panels and the prior art of third embodiment of the invention is compared electrostatic prevention has tangible raising.
Though the present invention discloses as above with preferred embodiment, the present invention also is defined in this.Any those skilled in the art are not breaking away from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention is as the criterion with claim institute restricted portion.
Claims (12)
1. display panels; Comprise upper substrate, infrabasal plate; Upper and lower base plate forms a confined space to hold the liquid crystal layer that is positioned at wherein through the frame glue bond; Also comprise the upper substrate common electrode layer that is positioned at the upper substrate downside, and the infrabasal plate common electrode layer that is positioned at the infrabasal plate upside, it is characterized in that: said upper substrate common electrode layer and infrabasal plate common electrode layer are positioned at frame glue setting area and confined space corresponding region.
2. display panels as claimed in claim 1 is characterized in that: upper substrate common electrode layer and infrabasal plate common electrode layer are at least 10 microns apart from frame glue setting area away from the distance at the edge of confined space.
3. display panels as claimed in claim 1 is characterized in that: also be provided with black matrix layer between said upper substrate and the upper substrate common electrode layer, said black matrix layer is arranged on frame glue setting area and confined space corresponding region.
4. display panels as claimed in claim 3 is characterized in that: said black matrix layer, upper substrate common electrode layer and infrabasal plate common electrode layer are at least 10 microns apart from the distance away from the edge of confined space of frame glue setting area.
5. display panels as claimed in claim 3 is characterized in that: the material of said black matrix layer is served as reasons and is comprised the potpourri that carbon dust and mixed with resin are formed.
6. display panels as claimed in claim 1; It is characterized in that; Comprise and be positioned on the infrabasal plate common electrode layer and the firing point that is electrically connected with the infrabasal plate common electrode layer; Be provided with conducting resinl between said firing point and the upper substrate common electrode layer, said conducting resinl is electrically connected firing point and upper substrate common electrode layer.
7. display panels as claimed in claim 6 is characterized in that: said conducting resinl is conducting particles and the conductive mixture of insulation colloid according to 1: 100~1: 50 mixed of mass ratio composition.
8. display panels as claimed in claim 7 is characterized in that: said conducting particles is a gold goal.
9. display panels as claimed in claim 6 is characterized in that: said firing point is positioned at frame glue setting area, and said conducting resinl is the frame glue that has conducting particles.
10. a display panels comprises upper substrate, infrabasal plate, and upper and lower base plate forms a confined space to hold the liquid crystal layer that is positioned at wherein through the frame glue bond; Also comprise the black matrix layer that is positioned at the upper substrate downside, and the upper substrate common electrode layer that is positioned at black matrix layer below, it is characterized in that: said black matrix layer and upper substrate common electrode layer are positioned at frame glue setting area and confined space corresponding region.
11. liquid crystal display substrate as claimed in claim 10 is characterized in that: said black matrix layer and upper substrate common electrode layer are at least 10 microns apart from the distance away from the edge of confined space of frame glue setting area.
12. liquid crystal display substrate as claimed in claim 10 is characterized in that: the material of said black matrix layer is served as reasons and is comprised the potpourri that carbon dust and mixed with resin are formed.
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CN2010102175411A CN102314027A (en) | 2010-06-30 | 2010-06-30 | Liquid crystal display panel |
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CN2010102175411A CN102314027A (en) | 2010-06-30 | 2010-06-30 | Liquid crystal display panel |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005049555A (en) * | 2003-07-31 | 2005-02-24 | Optrex Corp | Liquid crystal display panel |
CN1661449A (en) * | 2004-02-26 | 2005-08-31 | Nec液晶技术株式会社 | Liquid crystal display device and method of fabricating the same |
CN1936658A (en) * | 2005-09-19 | 2007-03-28 | 联诚光电股份有限公司 | Liquid crystal displaying panel and its preparing method |
CN101165573A (en) * | 2006-10-18 | 2008-04-23 | 群康科技(深圳)有限公司 | Liquid crystal display panel and method for producing same |
EP1990679A1 (en) * | 2007-05-11 | 2008-11-12 | Samsung SDI Co., Ltd. | Liquid crystal display and manufacturing method thereof |
CN101630078A (en) * | 2008-07-17 | 2010-01-20 | 胜华科技股份有限公司 | Liquid crystal display panel |
-
2010
- 2010-06-30 CN CN2010102175411A patent/CN102314027A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005049555A (en) * | 2003-07-31 | 2005-02-24 | Optrex Corp | Liquid crystal display panel |
CN1661449A (en) * | 2004-02-26 | 2005-08-31 | Nec液晶技术株式会社 | Liquid crystal display device and method of fabricating the same |
CN1936658A (en) * | 2005-09-19 | 2007-03-28 | 联诚光电股份有限公司 | Liquid crystal displaying panel and its preparing method |
CN101165573A (en) * | 2006-10-18 | 2008-04-23 | 群康科技(深圳)有限公司 | Liquid crystal display panel and method for producing same |
EP1990679A1 (en) * | 2007-05-11 | 2008-11-12 | Samsung SDI Co., Ltd. | Liquid crystal display and manufacturing method thereof |
CN101630078A (en) * | 2008-07-17 | 2010-01-20 | 胜华科技股份有限公司 | Liquid crystal display panel |
Cited By (35)
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