CN102313191A - Side backlight module - Google Patents

Side backlight module Download PDF

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Publication number
CN102313191A
CN102313191A CN2010102235982A CN201010223598A CN102313191A CN 102313191 A CN102313191 A CN 102313191A CN 2010102235982 A CN2010102235982 A CN 2010102235982A CN 201010223598 A CN201010223598 A CN 201010223598A CN 102313191 A CN102313191 A CN 102313191A
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CN
China
Prior art keywords
backlight
hydraulic pump
mcu
light source
electric hydraulic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102235982A
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Chinese (zh)
Inventor
林健源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL Corp
Shenzhen TCL New Technology Co Ltd
Original Assignee
TCL Corp
Shenzhen TCL New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL Corp, Shenzhen TCL New Technology Co Ltd filed Critical TCL Corp
Priority to CN2010102235982A priority Critical patent/CN102313191A/en
Publication of CN102313191A publication Critical patent/CN102313191A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a liquid-cooled radiating side backlight module and a radiating method thereof. The side backlight module comprises a light-emitting diode (LED) light source and a metal back plate, wherein the metal back plate covers the LED light source and comprises an LED light source area corresponding to the LED light source; and a liquid-cooling device is arranged on the metal back plate. When backlight is switched on, the liquid-cooling device disperses the heat of the LED light source area to the other areas of the back plate, so that the faults of the LED light source area are reduced, and the temperature of the overall metal back plate is uniform.

Description

A kind of side type module backlight
Technical field
The present invention relates to a kind of side type module backlight, particularly a kind of side type module backlight and heat dissipating method thereof that adopts the liquid cooling heat radiation.
Background technology
Liquid crystal indicator is with its low radiation, low-power consumption, and thin thickness, lightweight characteristics have replaced traditional CRT display unit gradually, become the main flow that shows market.
Current, adopt the liquid crystal indicator of side type LED-backlit module to bring ultra-thin experience to the user, also meet the development trend of energy-conserving and environment-protective simultaneously, become the focus in market gradually.Yet; LED light-emitting section regional temperature in the side type LED-backlit module is very high, and other portion temperature of module backlight are relatively low, brought two problems like this: the one, and the too high life-span that can shorten LED of LED light-emitting section regional temperature; The 2nd, the Temperature Distribution of entire backlight differs greatly; Influenced the operate as normal of liquid crystal panel, caused the polarizing axis of polaroid among the LCD to change like the temperature inequality, and then influence the display effect of LCD.In order to solve the heat dissipation problem of LED-backlit module, the solution that generally adopts now is to increase aluminium sheet in LED-backlit light-emitting section zone to dispel the heat, but because radiating effect is limited, still can not well solve heat dissipation problem; In addition, the part heat radiation in LED light-emitting section zone can not solve the problem that the entire aphototropism mould Temperature Distribution differs greatly in the module backlight.
Summary of the invention
For solving in the prior art, the problem that heat radiation of LED-backlit module and entire aphototropism mould Temperature Distribution differ greatly is necessary to provide a kind of radiating effect backlight good and can guarantee the comparatively uniform module backlight of entire aphototropism mould Temperature Distribution.
The object of the present invention is to provide a kind of radiating effect backlight good and can guarantee the comparatively uniform module backlight of entire aphototropism mould Temperature Distribution.
The present invention realizes like this; A kind of side type module backlight; It comprises led light source, covers the metal backing of led light source, and this metal backing comprises corresponding the led light source district of led light source, on this metal backing liquid cooling apparatus is set; Backlight when being in opening, this liquid-cooling heat radiator is disseminated to other zone of metal backing with the heat in led light source district.
More specifically, this liquid-cooling heat radiator comprises the fluid loop that the flat metal pipe constitutes, and is full of the cooling fluid of flat metal pipe and drives the electric hydraulic pump that cooling fluid flows in fluid loop.
More specifically, this flat metal pipe adhere well to this metal backing, covers other zones of led light source district and metal backing.
More specifically; This module backlight comprises the drive circuit that drives this electric hydraulic pump, and this circuit comprises MCU, receives first switch element of this MCU output control and the second switch element that receives this first switch controlled; This second switch element is opened; Then control the work of this electric hydraulic pump, otherwise, this electric hydaulic air pump inoperative.
More specifically, this first switch element is a triode, and this second switch element is a metal-oxide-semiconductor; The base stage of triode is connected to this MCU, and its colelctor electrode connects DC voltage, and its emitter stage is through a resistance eutral grounding; This electric resistance partial pressure is applied to the grid of this metal-oxide-semiconductor; This metal-oxide-semiconductor source ground, drain electrode links to each other with this electric hydraulic pump, this electric hydraulic pump with connect power supply after an electric capacity is parallelly connected.
More specifically, backlight when being in opening, MCU sends a 3.3V DC level, and first switching tube is opened, and 5V+ voltage has been added on the resistive element, second switch pipe conducting this moment, and electric hydraulic pump is started working; Backlight when being in closed condition, MCU sends the low level of a 0V, and first switching tube is closed, and ohmically voltage is 0V, and this second switch pipe is closed, the electric hydaulic air pump inoperative.
The present invention also provides the heat dissipating method of a kind of side type module backlight, and this method comprises the steps:
Step S1, startup comprise the liquid crystal indicator of side type module backlight;
Step S2 judges backlight whether the unlatching;
Step S3, backlight when being in opening, control electric hydaulic pump work.
More specifically, among the step S1, when opening liquid crystal indicator, be the drive circuitry of the driving electric hydraulic pump in the module backlight.
More specifically, among the step S2, the MCU through drive circuit in the module backlight judges backlight whether the unlatching, is divided into two kinds of situation:
First kind of situation when liquid crystal indicator starts, directly judged the opening that whether is in backlight;
Second kind of situation, when liquid crystal indicator is in holding state, the closed condition that is in backlight, MCU judges the opening that whether is in backlight indirectly through judging whether liquid crystal indicator is in holding state.
More specifically, MCU according to backlight open whether, whether the work of control electric hydraulic pump to be: backlight open, then MCU output start signal makes the electric hydaulic pump work; Do not open as backlight, then MCU does not export signal, and electric hydraulic pump is not then worked.
The present invention overcomes the deficiency of prior art, utilizes the liquid cools principle, arrives whole metal backing to the spread heat in the led light source district of side type LED-backlit, thereby reduces metal backing light source region temperature, and the temperature of whole metal backing is evenly distributed.
Description of drawings
Fig. 1 is the structural representation of side type LED-backlit module of the present invention;
Fig. 2 be among Fig. 1 the flat metal pipe along the schematic cross-section of E-E direction;
Fig. 3 is the drive circuit figure of electric hydraulic pump;
Fig. 4 is the liquid cooling heat radiation flow chart of the present invention's module backlight.
The specific embodiment
Technical scheme provided by the invention is: utilize the liquid cools principle; Cooling fluid is full of in the flat metal pipe of fluid loop, this metal tube is fitted tightly at metal backing, backlight when being in opening; Start electric hydraulic pump; Cooling fluid is circulated in the fluid loop that the flat metal pipe constitutes,, reduce the temperature in led light source district all the other zones of heat transferred backboard in led light source district; Also make the temperature of whole metal backing even, thereby make in the liquid crystal indicator temperature of liquid crystal panel even.
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Seeing also Fig. 1, is the structural representation of side type LED-backlit module of the present invention.This module 1 backlight comprises led light source, covers the metal backing 5 of led light source and is arranged on the liquid cooling apparatus on the metal backing 5.
This liquid cooling apparatus comprises the fluid loop 2 that the flat metal pipe constitutes, and is full of the cooling fluid 4 of flat metal pipe and drives the electric hydraulic pump 3 that cooling fluid 4 flows in fluid loop 2.The flat metal pipe of fluid loop 2 adhere well on the metal backing 5; Wherein AB partly is attached to the led light source district C of metal backing 5; This led light source district C be this metal backing 5 corresponding the strip region of led light source, the remainder of flat metal pipe is attached at other zones of metal backing 5.Electric hydraulic pump 3 is arranged on the A end of flat metal pipe, when electric hydraulic pump 3 work, drives cooling fluid 4 and in fluid loop 2, flows; Cooling fluid 4 begins to flow from the A end, through led light source territory C, absorbs this regional heat; Arrive the B end, by the beginning of B end, flow through other zones of metal backing 5 of cooling fluid 4; The heat of led light source C is sent to other zones of metal backing 5, is back to the A end again, cooling fluid 4 is along shown in arrow among Fig. 1, counterclockwise circulating; Certainly, cooling fluid also can flow along clockwise direction.In this module 1 backlight, the size of electric hydraulic pump 3 is determined by concrete LED-backlit size, the hydraulic pump that the use of the big LED-backlit of size is big, and the LED-backlit that size is little uses little hydraulic pump.
The concrete structure of flat metal pipe sees also Fig. 2 in the fluid loop 2, and Fig. 2 is the schematic cross-section of flat metal pipe along the E-E direction.The flat metal tube section is a round rectangle, and its width is L, highly is H, and L can reduce the thickness of module 1 backlight so on the one hand greater than H, can improve the contact area of fluid loop 2 and metal backing 5 on the one hand, improves radiating efficiency.In addition, according to the actual requirements, the pipe thickness of flat metal pipe, width L, height H all can be adjusted.
When being in opening, the led light source district produces local high temperature backlight, and at this moment have only just needs electric hydraulic pump 3 work among Fig. 1, and is backlight when being in closed condition, then need not to start electric hydraulic pump 3.The drive circuit of these electric hydraulic pump 3 work of concrete driving is as shown in Figure 3.This drive circuit comprises MCU, and MCU is connected to the base stage of triode Q1 through resistance R 1, and the colelctor electrode of this triode connects+5V voltage; Emitter stage is also through resistance R 2 ground connection; The dividing potential drop of R2 is applied to the grid of metal-oxide-semiconductor Q2, the source ground of this metal-oxide-semiconductor, and drain electrode is connected to this electric hydraulic pump 3.Electric hydraulic pump 3 is with a capacitor C 1 and connect power Vcc, and connects with metal-oxide-semiconductor Q2.Concrete driving process is following: the opening that is in backlight, and MCU sends a 3.3V DC level, triode Q1 conducting, 5V+ voltage has been added on the R2, metal-oxide-semiconductor Q2 conducting this moment, the circuit that therefore drives electric hydraulic pump 3 is opened, and electric hydraulic pump 3 is started working; Backlight when being in closed condition, MCU sends the low level of a 0V, and this moment, triode Q1 closed, and the last voltage of R2 is 0V, so metal-oxide-semiconductor Q2 also closes, and drives electric hydraulic pump 3 circuit and is in off state, and electric hydraulic pump 3 is not worked.Triode Q1 and metal-oxide-semiconductor Q2 also can adopt other forms of switch element in this drive circuit, are not limited to the switch element of these two kinds of forms.
Seeing also Fig. 4, is the liquid cooling heat radiation flow chart of the present invention's module backlight.
This heat dissipating method may further comprise the steps:
Step S1, the primer fluid crystal device;
Start when comprising the liquid crystal indicator of side type module backlight, be the drive circuitry of the driving electric hydraulic pump in the module backlight.
Step S2 judges the opening that whether is in backlight;
MCU through the electric hydraulic pump drive circuit judges the opening that whether is in backlight, is divided into two kinds of situation:
First kind of situation when liquid crystal indicator starts, directly judged backlight whether the unlatching;
Second kind of situation, when liquid crystal indicator is in holding state, the closed condition that is in backlight, MCU judges the opening that whether is in backlight indirectly through judging whether liquid crystal indicator is in holding state.
Step S3, backlight when being in opening, the work of control liquid-cooling heat radiator;
MCU is according to the opening that whether is in backlight, and whether the work of control electric hydraulic pump 3 to be, as backlight be opening, then MCU output start signal is started working electric hydraulic pump 3; Open as backlight, then MCU does not export signal, and 3 of electric hydraulic pumps are not worked: specifically, like backlight open, then MCU output 3.3V voltage is worked through the driving circuit drives electric hydraulic pump 3 of the described electric hydraulic pump of Fig. 3; Do not open as backlight, then MCU does not export signal, i.e. 0V output, and drive circuit then shown in Figure 3 can't drive electric hydraulic pump 3, and electric hydraulic pump 3 also just can't be worked.
Through above-mentioned liquid cooling heat dissipating method, when being in opening, start electric hydraulic pump 3 backlight; Cooling fluid 4 is circulated in the fluid loop 2 that the flat metal pipe constitutes; With all the other zones of heat transferred backboard in led light source district, reduce the temperature in led light source district, also make the temperature of whole metal backing 5 even; Thereby make in the liquid crystal indicator temperature of liquid crystal panel even, guarantee display effect.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. side type module backlight; It comprises led light source, covers the metal backing of led light source; This metal backing comprises corresponding the led light source district of led light source; It is characterized in that: on this metal backing liquid cooling apparatus is set, backlight when being in opening, this liquid-cooling heat radiator is disseminated to other zone of metal backing with the heat in led light source district.
2. side type as claimed in claim 1 module backlight is characterized in that: this liquid-cooling heat radiator comprises the fluid loop that the flat metal pipe constitutes, and is full of the cooling fluid of flat metal pipe and drives the electric hydraulic pump that cooling fluid flows in fluid loop.
3. side type as claimed in claim 2 module backlight is characterized in that: this flat metal pipe adhere well to this metal backing, covers other zones of led light source district and metal backing.
4. side type as claimed in claim 2 module backlight; It is characterized in that: this module backlight comprises the drive circuit that drives this electric hydraulic pump, and this circuit comprises MCU, receives first switch element of this MCU output control and the second switch element that receives this first switch controlled; This second switch element is opened; Then control the work of this electric hydraulic pump, otherwise, this electric hydaulic air pump inoperative.
5. side type as claimed in claim 4 module backlight is characterized in that: this first switch element is a triode, and this second switch element is a metal-oxide-semiconductor; The base stage of triode is connected to this MCU, and its colelctor electrode connects DC voltage, and its emitter stage is through a resistance eutral grounding; This electric resistance partial pressure is applied to the grid of this metal-oxide-semiconductor; This metal-oxide-semiconductor source ground, drain electrode links to each other with this electric hydraulic pump, this electric hydraulic pump with connect power supply after an electric capacity is parallelly connected.
6. side type as claimed in claim 4 module backlight is characterized in that: backlight when being in opening, MCU sends a 3.3V DC level; First switching tube is opened; 5V+ voltage has been added on the resistive element, second switch pipe conducting this moment, and electric hydraulic pump is started working; Backlight when being in closed condition, MCU sends the low level of a 0V, and first switching tube is closed, and ohmically voltage is 0V, and this second switch pipe is closed, the electric hydaulic air pump inoperative.
7. the heat dissipating method of a side type module backlight is characterized in that this method comprises the steps:
Step S1, startup comprise the liquid crystal indicator of side type module backlight;
Step S2 judges backlight whether the unlatching;
Step S3, backlight when being in opening, control electric hydaulic pump work.
8. module heat dissipating method backlight as claimed in claim 7 is characterized in that: among the step S1, when opening liquid crystal indicator, be the drive circuitry of the driving electric hydraulic pump in the module backlight.
9. module heat dissipating method backlight as claimed in claim 7 is characterized in that: among the step S2, the MCU through drive circuit in the module backlight judges backlight whether the unlatching, is divided into two kinds of situation:
First kind of situation when liquid crystal indicator starts, directly judged the opening that whether is in backlight;
Second kind of situation, when liquid crystal indicator is in holding state, the closed condition that is in backlight, MCU judges the opening that whether is in backlight indirectly through judging whether liquid crystal indicator is in holding state.
10. module heat dissipating method backlight as claimed in claim 7 is characterized in that: MCU according to backlight open whether, whether the work of control electric hydraulic pump to be: backlight open, then MCU output start signal makes the electric hydaulic pump work; Do not open as backlight, then MCU does not export signal, and electric hydraulic pump is not then worked.
CN2010102235982A 2010-07-09 2010-07-09 Side backlight module Pending CN102313191A (en)

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Application Number Priority Date Filing Date Title
CN2010102235982A CN102313191A (en) 2010-07-09 2010-07-09 Side backlight module

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Application Number Priority Date Filing Date Title
CN2010102235982A CN102313191A (en) 2010-07-09 2010-07-09 Side backlight module

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074287A1 (en) * 2013-11-19 2015-05-28 深圳市华星光电技术有限公司 Heat dissipation loop pipe and backlight module using heat dissipation loop pipe
WO2016015428A1 (en) * 2014-07-30 2016-02-04 深圳Tcl新技术有限公司 Heat sink, backlight module and display module
US9366484B2 (en) 2013-11-19 2016-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Heat dissipation pipe loop and backlight module using same
CN106647019A (en) * 2016-10-25 2017-05-10 深圳市华星光电技术有限公司 Water cooling system for LED display module and LED display module
CN107504401A (en) * 2017-08-22 2017-12-22 深圳创维-Rgb电子有限公司 A kind of backlight module, display screen and display device
CN108919564A (en) * 2018-07-19 2018-11-30 东莞市豪顺精密科技有限公司 A kind of compound heat dissipation aluminium extruded and preparation method thereof suitable for high-power backlight module
CN113487963A (en) * 2021-08-04 2021-10-08 业成科技(成都)有限公司 Display device and electronic apparatus
CN115524885A (en) * 2022-08-24 2022-12-27 惠科股份有限公司 Display device and backlight module thereof
CN115774353A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device
CN115774352A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Display device
CN115774353B (en) * 2021-09-06 2024-04-19 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device

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CN1828387A (en) * 2005-03-05 2006-09-06 鸿富锦精密工业(深圳)有限公司 Straight down type backlight module
CN101101404A (en) * 2006-07-05 2008-01-09 建准电机工业股份有限公司 Back light heat radiation module of planar display device
CN101132115A (en) * 2007-08-30 2008-02-27 吉林大学 High power laser diode driver
CN101706078A (en) * 2009-06-08 2010-05-12 艾迪光电(杭州)有限公司 High-power LED street lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1828387A (en) * 2005-03-05 2006-09-06 鸿富锦精密工业(深圳)有限公司 Straight down type backlight module
CN101101404A (en) * 2006-07-05 2008-01-09 建准电机工业股份有限公司 Back light heat radiation module of planar display device
CN101132115A (en) * 2007-08-30 2008-02-27 吉林大学 High power laser diode driver
CN101706078A (en) * 2009-06-08 2010-05-12 艾迪光电(杭州)有限公司 High-power LED street lamp

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074287A1 (en) * 2013-11-19 2015-05-28 深圳市华星光电技术有限公司 Heat dissipation loop pipe and backlight module using heat dissipation loop pipe
US9366484B2 (en) 2013-11-19 2016-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Heat dissipation pipe loop and backlight module using same
WO2016015428A1 (en) * 2014-07-30 2016-02-04 深圳Tcl新技术有限公司 Heat sink, backlight module and display module
CN106647019A (en) * 2016-10-25 2017-05-10 深圳市华星光电技术有限公司 Water cooling system for LED display module and LED display module
CN107504401A (en) * 2017-08-22 2017-12-22 深圳创维-Rgb电子有限公司 A kind of backlight module, display screen and display device
CN108919564B (en) * 2018-07-19 2021-09-03 东莞市豪顺精密科技有限公司 Composite heat-dissipation aluminum extrusion suitable for high-power backlight module and preparation method thereof
CN108919564A (en) * 2018-07-19 2018-11-30 东莞市豪顺精密科技有限公司 A kind of compound heat dissipation aluminium extruded and preparation method thereof suitable for high-power backlight module
CN113487963A (en) * 2021-08-04 2021-10-08 业成科技(成都)有限公司 Display device and electronic apparatus
CN115774353A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device
CN115774352A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Display device
CN115774353B (en) * 2021-09-06 2024-04-19 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device
CN115524885A (en) * 2022-08-24 2022-12-27 惠科股份有限公司 Display device and backlight module thereof
US11822116B1 (en) 2022-08-24 2023-11-21 HKC Corporation Limited Display device and backlight module thereof including radiator with heat absorption part, condensation part, and pipe
CN115524885B (en) * 2022-08-24 2024-04-12 惠科股份有限公司 Display device and backlight module thereof

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Application publication date: 20120111