CN102310509A - Negative pressure scraping device for photosensitive curing forming machine - Google Patents
Negative pressure scraping device for photosensitive curing forming machine Download PDFInfo
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- CN102310509A CN102310509A CN2010102224600A CN201010222460A CN102310509A CN 102310509 A CN102310509 A CN 102310509A CN 2010102224600 A CN2010102224600 A CN 2010102224600A CN 201010222460 A CN201010222460 A CN 201010222460A CN 102310509 A CN102310509 A CN 102310509A
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Abstract
The invention discloses a negative pressure scraping device for a photosensitive curing forming machine, which comprises a positive pressure air source, negative pressure equipment and a scraper, wherein the scraper is provided with a cavity (5), the negative pressure equipment comprises an air inlet pipe (1), a spray nozzle (2), an air outlet pipe (3) and an air suction pipe (4), the air inlet pipe (1), the spray nozzle (2) and the air outlet pipe (3) are sequentially connected, one end of the air suction pipe (4) is vertically connected with the air outlet pipe (3), the other end of the air suction pipe (4) is connected with the cavity (5), and the positive pressure air source is connected with the air inlet pipe (1). The negative pressure scraping device has the advantages that the structure is simple, reasonable and compact, various defects in the prior art are overcome, and the advantages of low cost, high work efficiency and high workpiece finished product rate are realized.
Description
Technical field
The present invention relates to photocureable rapid shaping machine field, particularly, relate to photo-curing make-up machine negative pressure and wipe device off.
Background technology
Rapid shaping technique is a kind of based on material principle of stacking data that CAD 3D mathematical model slicing delamination is obtained successively, through the special equipment manufacturing technology of stack shaping successively.The photo-curing rapid shaping is that ultraviolet light beam forms focal beam spot through beam condenser and light-beam scanner at the resin liquid level; Thereby the sensitization of resin liquid level is solidified; After workpiece solidifies one deck, the work blade layer thickness that descends, application system is coated with the last layer resin with liquid again on the surface of cured layer then; Carry out illumination curing again, process whole work-piece so repeatedly at last.
Because the making of workpiece is vertically to be displaced downwardly to down one deck to accomplish accumulation formation successively, it is very important to keep cured resin liquid level quality, and it directly influences the dimensional accuracy of shaping workpiece in vertical direction, and deviation seriously can cause whole work-piece to be scrapped.
But traditional application system makes solidified surface shortage resin owing to can't carry abundant resin, causes the resurfacing process to lose efficacy.
In order to address the above problem; Common technology adopts following two kinds of technology modes usually: a kind of is to make supporting plate adopt the working method of dive, rise and wait; Another kind is to utilize the negative-pressure adsorption device; At strickle set inside one cavity, the mode through negative-pressure adsorption makes the photosensitive resin that in cavity, has certain altitude.
It mainly is to utilize the levelling of liquid self that supporting plate adopts the working method of dive, rise and wait; But the motion process of supporting plate is consuming time more, and service working time is longer, causes make efficiency to reduce; And when lift height is very little; The strickle edge is easy to run into the making layer that has solidified, thereby damages workpiece, and the product success rate is reduced.
The negative-pressure adsorption device is owing to its use is that the miniature diaphragm vavuum pump directly provides negative pressure, and through voltage regulating module control negative pressure, its supporting cost is than higher.
Summary of the invention
The objective of the invention is to,, propose photo-curing make-up machine negative pressure and wipe device off to the problems referred to above, simple with implementation structure, cost is low, high efficiency, advantage that the product yield rate is high.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
Photo-curing make-up machine negative pressure is wipeed device off, comprises malleation source of the gas, negative pressure equipment, strickle, and said strickle has cavity,
Said negative pressure equipment comprises air inlet pipe, nozzle, escape pipe, air intake duct, and said air inlet pipe, nozzle, escape pipe are continuous in proper order, and an end of said air intake duct is connected with escape pipe is vertical, and the other end links to each other with cavity, and said malleation source of the gas links to each other with air inlet pipe.
During the work of this device, can produce negative pressure in the cavity and draw a certain amount of photosensitive resin, the photosensitive resin that stores through cavity replenishes the part that caves in, and can effectively improve photo-curing resurfacing effect.
Further, said strickle and photosensitive resin liquid level have the spacing of 0.2-0.4mm, so be soft the contact between scraper plate and the photosensitive resin liquid level, can not cause the damage on molded surface, avoid doing the failure of part.
Further, said malleation source of the gas is air compressor machine (small-sized air compressor or with joining air compressor machine), reduces equipment operating cost.
Further, said air intake duct is provided with liquid storage box, is used to store photosensitive resin.
Further, said strickle is provided with the perspective window, can be used for observing the liquid level of resin in the strickle.
Operation principle: the air inlet pipe that photo-curing make-up machine negative pressure is wipeed device off and malleation source of the gas (air compressor machine or with joining air compressor machine) are connected; The high-speed gas that the malleation source of the gas produces sprays at a high speed through air inlet pipe, nozzle, escape pipe; Produce at the connector place of air intake duct and escape pipe and to entrainment mobilely, in the effect of entrainmenting down, make that the interior air of air intake duct is constantly taken away; Pressure in the air intake duct is reduced to below the atmospheric pressure; Produce negative pressure, further cause reaching in the cavity negative pressure state, the mode through negative-pressure adsorption makes the photosensitive resin that in cavity, has certain altitude.
It is simple, reasonable, compact that the quick curing molding machine negative pressure of the present invention is wipeed apparatus structure off, mainly has following several respects advantage compared with prior art:
1. low-cost, need not use higher miniature diaphragm vavuum pump of supporting cost and pressure regulation mould, this malleation source of the gas can adopt small-sized air compressor or with joining air compressor machine, reduce equipment operating cost.
2. high efficiency, service working time is short.
3. high-quality, strickle and liquid level have the spacing of 0.2-0.4mm, so be soft the contact between scraper plate and the photosensitive resin liquid level; Can not damage workpiece; When even lift height is very little, the making layer that has solidified can not run in the strickle edge, and the product success rate is improved greatly.
Description of drawings
Accompanying drawing is used to provide further understanding of the present invention, and constitutes the part of specification, is used to explain the present invention with embodiments of the invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 wipes the negative pressure equipment structural representation of device off for photo-curing make-up machine negative pressure of the present invention;
Fig. 2 wipes the strickle structural representation of device off for photo-curing make-up machine negative pressure of the present invention;
Fig. 3 wipes the user mode sketch map of device off for photo-curing make-up machine negative pressure of the present invention;
In conjunction with accompanying drawing, Reference numeral is following in the embodiment of the invention:
The 1-air inlet pipe; The 2-nozzle; The 3-escape pipe; The 4-air intake duct; The 5-cavity; The 6-liquid storage box; 7-controls computer; The 8-servomotor; The 9-carriage; 10-stainless steel resin storage tank; The 11-workpiece; The 12-photosensitive resin.
The specific embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein only is used for explanation and explains the present invention, and be not used in qualification the present invention.
Embodiment one
Fig. 1-2 is the embodiments of the invention sketch map, wipes device off by figure visible light-sensitive curing molding machine negative pressure, comprises malleation source of the gas, negative pressure equipment, strickle; Said strickle has cavity 5; Negative pressure equipment comprises air inlet pipe 1, nozzle 2, escape pipe 3, air intake duct 4, and said air inlet pipe 1, nozzle 2, escape pipe 3 orders link to each other an end of air intake duct 4 and 3 vertical connections of escape pipe; The other end links to each other with cavity 5, and said malleation source of the gas links to each other with air inlet pipe 1.The malleation source of the gas is a small-sized air compressor, reduces equipment operating cost.
During device work, the cavity 5 interior negative pressure that can produce are drawn certain photosensitive resin, and the photosensitive resin that stores through cavity 5 replenishes the part that caves in, and can effectively improve photo-curing resurfacing effect.
Strickle and photosensitive resin liquid level have the spacing of 0.3mm, so be soft the contact between scraper plate and the photosensitive resin liquid level, can not cause the damage on molded surface, avoid doing the failure of part.Air intake duct 4 is provided with liquid storage box 6, is used to store photosensitive resin.Strickle is provided with the perspective window, can be used for observing the liquid level of resin in the strickle.
Operation principle: the air inlet pipe that photo-curing make-up machine negative pressure is wipeed device off and malleation source of the gas (air compressor machine or with joining air compressor machine) are connected; The high-speed gas that the malleation source of the gas produces is through air inlet pipe 1, nozzle 2, escape pipe 3 ejection at a high speed; Produce at the connector place of air intake duct 4 and escape pipe 3 and to entrainment mobilely, in the effect of entrainmenting down, make that the air in the air intake duct 4 are constantly aspirated; Pressure in the air intake duct 4 is reduced to below the atmospheric pressure; Produce negative pressure, further cause reaching negative pressure state in the cavity 5, the mode through negative-pressure adsorption makes the photosensitive resin that in cavity 5, has certain altitude.
Fig. 3 is the user mode sketch map of invention photo-curing make-up machine negative pressure strickling device, and by visible: invention photo-curing make-up machine comprises control computer 7, servomotor 8; Carriage 9, stainless steel resin storage tank 10, photo-curing make-up machine negative pressure is wipeed device off; Workpiece 11, photosensitive resin 12.
Before workpiece 11 is made; Earlier with filling photosensitive resin 12 in the stainless steel resin storage tank 10; After one deck resin solidification was accomplished, under the control of computer 7, servomotor 8 began to rotate during work; Drive carriage 9 and workpiece 11 bed thickness that in stainless steel resin storage tank 10, descends simultaneously through machine driving, just formed the liquid resin of a bed thickness this moment between cured layer and the liquid level.Utilize the malleation source of the gas of existing air compressor machine to form negative pressure through negative pressure equipment; Because the viscosity and the capillarity of resin; Add in the strickle chamber certain negative pressure is arranged; Make the photosensitive resin 12 that has certain altitude in strickle 7 internal cavities, and between strickle and liquid level, form the very thin resin molding of one deck.
Strickle is wipeed action through the drive of servomotor 8 off to the resin liquid level, and when depression appearred in liquid level, resin began to fall in the strickle cavity 5, and the resin sunk part is effectively applied.Owing to provide stable negative pressure state, so resin height should be kept certain height in the strickle, when resin in the strickle fell, its inner space increased, and it is big that negative pressure becomes, and made resin form the covering action.We carry out Real Time Observation through the perspective window whole action and resin height.
Embodiment two
Photo-curing make-up machine negative pressure is wipeed device off, comprises malleation source of the gas, negative pressure equipment, strickle, and said strickle has cavity 5,
Negative pressure equipment comprises air inlet pipe 1, nozzle 2, escape pipe 3, air intake duct 4; Said air inlet pipe 1, nozzle 2, escape pipe 3 orders link to each other; One end of said air intake duct 4 and 3 vertical connections of escape pipe, the other end links to each other with cavity 5, and said malleation source of the gas links to each other with air inlet pipe 1.
During device work, the cavity 5 interior negative pressure that can produce are drawn certain photosensitive resin, and the photosensitive resin that stores through cavity 5 replenishes the part that caves in, and can effectively improve photo-curing resurfacing effect.Strickle and liquid level have the spacing of 0.2mm, so be soft the contact between scraper plate and the photosensitive resin liquid level, can not cause the damage on molded surface, avoid doing the failure of part.Said malleation source of the gas reduces equipment operating cost for joining air compressor machine.
What should explain at last is: the above is merely the preferred embodiments of the present invention; Be not limited to the present invention; Although the present invention has been carried out detailed explanation with reference to previous embodiment; For a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. photo-curing make-up machine negative pressure is wipeed device off, it is characterized in that, comprises malleation source of the gas, negative pressure equipment, strickle,
Said strickle has cavity (5),
Said negative pressure equipment comprises air inlet pipe (1), nozzle (2), escape pipe (3), air intake duct (4); Said air inlet pipe (1), nozzle (2), escape pipe (3) order link to each other; One end of said air intake duct (4) and vertical connection of escape pipe (3); The other end links to each other with cavity (5), and said malleation source of the gas links to each other with air inlet pipe (1).
2. photo-curing make-up machine negative pressure according to claim 1 is wipeed device off, it is characterized in that said strickle and photosensitive resin liquid level have the spacing of 0.2-0.4mm.
3. photo-curing make-up machine negative pressure according to claim 1 is wipeed device off, it is characterized in that said malleation source of the gas is an air compressor machine.
4. photo-curing make-up machine negative pressure according to claim 1 is wipeed device off, it is characterized in that said air intake duct (4) is provided with liquid storage box (6).
5. photo-curing make-up machine negative pressure according to claim 1 and 2 is wipeed device off, it is characterized in that said strickle is provided with the perspective window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010222460.0A CN102310509B (en) | 2010-07-09 | 2010-07-09 | Negative pressure scraping device for photosensitive curing forming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010222460.0A CN102310509B (en) | 2010-07-09 | 2010-07-09 | Negative pressure scraping device for photosensitive curing forming machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102310509A true CN102310509A (en) | 2012-01-11 |
| CN102310509B CN102310509B (en) | 2015-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010222460.0A Expired - Fee Related CN102310509B (en) | 2010-07-09 | 2010-07-09 | Negative pressure scraping device for photosensitive curing forming machine |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2227285A (en) * | 1988-12-01 | 1990-07-25 | Wardtec Ltd | Fluid flow accelerator |
| CN1775510A (en) * | 2005-12-09 | 2006-05-24 | 西安交通大学 | Recoating device for photocurable quick shaping process |
| CN101024307A (en) * | 2007-01-19 | 2007-08-29 | 中国科学院广州电子技术研究所 | Resin liquid-level control for photo-solidification quick formation and resin coating method and apparatus |
| CN201183035Y (en) * | 2008-04-23 | 2009-01-21 | 中国石油天然气股份有限公司 | Injection device for low-pressure natural gas production and transportation |
| CN201769320U (en) * | 2010-07-09 | 2011-03-23 | 无锡易维模型设计制造有限公司 | Negative-pressure scraping device of photosensitive curing forming machine |
-
2010
- 2010-07-09 CN CN201010222460.0A patent/CN102310509B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2227285A (en) * | 1988-12-01 | 1990-07-25 | Wardtec Ltd | Fluid flow accelerator |
| CN1775510A (en) * | 2005-12-09 | 2006-05-24 | 西安交通大学 | Recoating device for photocurable quick shaping process |
| CN101024307A (en) * | 2007-01-19 | 2007-08-29 | 中国科学院广州电子技术研究所 | Resin liquid-level control for photo-solidification quick formation and resin coating method and apparatus |
| CN201183035Y (en) * | 2008-04-23 | 2009-01-21 | 中国石油天然气股份有限公司 | Injection device for low-pressure natural gas production and transportation |
| CN201769320U (en) * | 2010-07-09 | 2011-03-23 | 无锡易维模型设计制造有限公司 | Negative-pressure scraping device of photosensitive curing forming machine |
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| CN102310509B (en) | 2015-02-25 |
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