CN102301530A - Phased array cofire antenna structure and method for forming the same - Google Patents

Phased array cofire antenna structure and method for forming the same Download PDF

Info

Publication number
CN102301530A
CN102301530A CN2009801560192A CN200980156019A CN102301530A CN 102301530 A CN102301530 A CN 102301530A CN 2009801560192 A CN2009801560192 A CN 2009801560192A CN 200980156019 A CN200980156019 A CN 200980156019A CN 102301530 A CN102301530 A CN 102301530A
Authority
CN
China
Prior art keywords
antenna
dielectric layer
imd
implantable medical
medical equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801560192A
Other languages
Chinese (zh)
Inventor
J·K·山本
C·S·法洛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Medtronic Inc
Original Assignee
Medtronic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Inc filed Critical Medtronic Inc
Publication of CN102301530A publication Critical patent/CN102301530A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/27Adaptation for use in or on movable bodies
    • H01Q1/273Adaptation for carrying or wearing by persons or animals
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/18Applying electric currents by contact electrodes
    • A61N1/32Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372Arrangements in connection with the implantation of stimulators
    • A61N1/37211Means for communicating with stimulators
    • A61N1/37217Means for communicating with stimulators characterised by the communication link, e.g. acoustic or tactile
    • A61N1/37223Circuits for electromagnetic coupling
    • A61N1/37229Shape or location of the implanted or external antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Electromagnetism (AREA)
  • Acoustics & Sound (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Electrotherapy Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)

Abstract

An antenna structure for an implantable medical device (IMD) is provided that includes an antenna embedded within a structure derived from a plurality of discrete dielectric layers. An array of electrodes are connected to the antenna structure and arranged for applying a bias across selected segments of the dielectric layers for altering the performance characteristics of the antenna. The bias applied by the array of electrodes can be selected to provide desired impedance matching between the antenna and the surrounding environment of the implant location to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment, to provide beam steering functionality for the antenna, or to alter the gain of the signals received by the antenna. IMD is configured to monitor received signal characteristics (e.g., RSSI, EVM or bit error rate) and alter material properties of the dielectric material through biasing to control antenna performance.

Description

Phased array burns antenna structure and forming method thereof altogether
Technical field
The present invention relates generally to implantable medical equipment (IMD), and the invention particularly relates to the remote sensing antenna that is fit to be deployed among the IMD.
Background
Having developed various types of equipment is used for implanting to provide various types of health relevant treatment, diagnosis and/or supervision to human body.The example of these equipment (being commonly referred to as implantable medical equipment (IMD)) comprises cardiac pacemaker, cardioverter/defibrillator, muscle stimulation device, cardiac event monitor, the various physio-stimulators that comprise nerve, muscle and DBS device, various types of physiological monitor and transducer and medicine jettison system, has only enumerated a few examples here.IMD generally comprises cover or the interior functional assembly of shell (being called " jar " sometimes) that is contained in sealing.In some IMD, connector head end or connector block are attached to this shell, and connector block is facilitated the interconnection with the electric medical leads of one or more elongation.This head end (header) piece generally comes mold with hard relatively, dielectric, non-conductive polymer.Head mass comprise with shell cooperate sidewall surfaces conformal and mechanically attach to the installation surface of this cooperation sidewall surfaces.
Between the sealed electrical electronic circuit of IMD and external program designer, monitor or other external medical equipment (" EMD "), provide communication link for order from EMD to IMD down link remote sensing transmission and to allow the up link remote sensing transmission from IMD to EMD of information of storing and/or the physiological parameter that senses be general.Routinely, the communication link between IMD and the EMD is to realize by the transmission of the encoded radio frequency (" RF ") between IMD remote sensing antenna and transceiver and EMD remote sensing antenna and the transceiver.Generally speaking, the IMD antenna is placed in the can.But the shell of typical case's conduction can limit the radiation efficiency of IMD RF remote sensing antenna, the data passes distance limit between programmer head and the IMD RF remote sensing antenna can be several inches routinely thus.Such system can be described as " near field " remote sensing system.For " far field " remote sensing is provided, or promptly from several meters of IMD or several meters distances or even the last remote sensing of bigger distance, made various trials and be in outer and the antenna in head mass of can to provide.RF remote sensing antenna is placed the outer and a lot of snakelike antennas that wire antenna or plane are arranged that utilized of these trials in head mass of can, and such as the antenna of describing in the US patent No. 7,317,946, it is incorporated into this by reference fully.Be used for realizing that at the treatment of implanting and diagnostic device volume that antenna that remote remote sensing is conventional required and head mass are associated has become the remarkable factor of IMD size.
Summary
In one or more embodiment, the antenna structure that is used for implantable medical equipment (IMD) is provided, this antenna structure comprises the antenna that is embedded in the structure that obtains from a plurality of discrete dielectric layers.What a plurality of electrodes were connected to this antenna structure and were arranged to be used to stride at least one dielectric layer applies biasing to small part.These electrodes are connected to the power supply among this IMD.Controller and the coupling of this antenna communication are to be used for sending and receiving remote sensing signal.In operation, IMD some characteristic of being configured to the signal that receiving based on this antenna is measured the performance of this antenna and is made between these a plurality of electrodes and applies biasing to change antenna performance to dielectric layer to small part.In one or more embodiment, but can provide the array of these a plurality of electrodes so that the selections of the dielectric material between the respective electrode can be biased in this array.By this way, just provide and allowed to apply the phased-array antenna of biasing with the operating characteristic that changes this antenna structure.In certain embodiments, can select this biasing, alleviate energy reflection effect in critical point from this antenna structure to surrounding environment with the expectation impedance matching between the surrounding environment that this antenna and implantation position are provided.In certain embodiments, this biasing can be selected to provide beam steering functional to this antenna, so that to being directed to desired orientation alternatively with the signal of passing on from this antenna.In certain embodiments, this biasing can be selected providing beam steering functional to this antenna, thereby decay (that is, otherwise can disturb expectation communication) interference signal.In certain embodiments, this biasing can be selected to change the gain of the signal that is received by this antenna.
In one or more embodiment, IMD can be configured to the expectation biasing of being selected to put on this phased-array antenna by the characteristics of signals of antenna reception by monitoring.For example, the signal strength signal intensity that can measure the signal that receives (for example, RSSI), error vector magnitude (for example, EVM) or bit error rate assess the performance of antenna, the wherein selected biasing that is applied to dielectric material will change to aspiration level to the performance of antenna (for example, signal strength signal intensity or bit error rate).
In one or more embodiment, antenna structure can be formed the common burning single chip architecture that obtains from these a plurality of discrete dielectric layers, and wherein a plurality of layers at these a plurality of dielectric layers have been embedded in antenna conductor.By forming the monolithic antenna structure that obtains from these a plurality of dielectric layers, the dielectric constant of these a plurality of dielectric layers can selected and further be situated between to be suitable for the needs of this specific IMD and/or specific implantation position with effective electricity of controlling between this antenna and the surrounding environment by the biasing control that is applied.In one or more embodiment, these dielectric layers comprise at least one of LTCC (LTCC) material and/or High Temperature Co Fired Ceramic (HTCC) material, and wherein ceramic dielectric layers, antenna and this a plurality of electrodes can be burnt altogether and form the monolithic antenna structure together.
Accompanying drawing
Above-mentioned each feature of the present disclosure and purpose can will become more than you know with reference to following explanation in conjunction with the accompanying drawings, and wherein identical Reference numeral is represented identical key element, and wherein:
Fig. 1 illustrates according to the implantable medical equipment in the implant into body of one or more embodiment of the present disclosure.
Fig. 2 is the schematic block diagram explanation according to the exemplary implantable medical equipment of one or more embodiment of the present disclosure.
Fig. 3 is the perspective exploded view according to the antenna structure that is used for implantable medical equipment of one or more embodiment formation of the present disclosure.
Fig. 4 is the side cross-sectional view according to the antenna structure that is used for implantable medical equipment of one or more embodiment formation of the present disclosure.
Fig. 5 is used to apply the operational flowchart of biasing with the method for the performance of the antenna structure of adjustment implantable medical equipment according to one or more embodiment of the present disclosure.
Fig. 6 is the perspective exploded view that is formed on the antenna structure that covers the electrod-array on (superstrate) dielectric layer according to having of one or more embodiment of the present disclosure.
Fig. 7 is the perspective exploded view that is formed on the antenna structure of the electrod-array on the identical dielectric layer according to having of one or more embodiment of the present disclosure.
Fig. 8 is the perspective exploded view that is formed on down the antenna structure of the electrod-array on lining (substrate) dielectric layer according to having of one or more embodiment of the present disclosure.
Fig. 9 is the schematic block diagram explanation according to another exemplary implantable medical equipment of one or more embodiment of the present disclosure.
Describe in detail
Following detail specifications only is illustrative, is not intended to limit the present invention or application of the present invention and use.And any theory of expressing or implying that has no intention to be represented in aforementioned technical field, background, summary or the following detailed description retrains.
Below describe and mention that assembly or feature are " connected " or " coupled " together.As used herein, unless clearly statement is arranged in addition, " connection " is meant that an assembly/feature is connected to another component/part directly or indirectly, and not necessarily mechanically.Similarly, unless clearly statement is arranged in addition, " coupling " is meant that an assembly/feature is coupled to another assembly/feature directly or indirectly, and not necessarily mechanically.Therefore, although accompanying drawing may have been described the component placement of example, element between two parties, equipment, feature or the assembly that in practical embodiments, can occur adding (supposition the functional of IMD do not influenced unfriendly).
In one or more embodiment, provide IMD with the phased-array antenna structure that obtains from a plurality of discrete dielectric layers.For the sake of brevity, may and not be described in detail herein and RF Antenna Design, IMD remote sensing, RF transfer of data, signaling, IMD operation, the connector of IMD lead-in wire and the relevant routine techniques and the aspect, other functional aspect of system's (and individual operations assembly of these systems).In addition, the connecting line shown in each figure that comprises herein is intended to represent illustrative functions sexual intercourse and/or the physical coupling between the various key elements.Should be noted that and a lot of substituting or additional function sexual intercourse or physical connection in practical embodiment, can occur.
Generally speaking the IMD antenna has two functions: the electromagnetic energy that the down link remote sensing transmission of air (passing bodily tissue then) is passed in the propagation of EMD remote sensing antenna is converted to and can be treated to the order that can be understood by the IMD electronic operating system and the signal (for example, UHF signal or similar signal) of data by the IMD transceiver; And the up link remote sensing signal (for example, UHF signal or similar signal) of IMD transceiver electronic device is converted to passes bodily tissue and airborne electromagnetic energy, thereby one or more EMD remote sensing antenna can receive these signals.
Fig. 1 is the perspective view of the IMD 10 that is implanted into of human body 12, can realize one or more embodiment of the present invention in this IMD 10.IMD 10 comprises can 14 (or " jar ") and is used for IMD 10 is coupled to the connector head end or the piece module 16 of the electrical lead that is arranged in the human body 12 and other biosensors (pacemaker impulse being rendered to the pace-making and the sense lead 18 of the situation of patient's heart 20 and sensing heart 20 to be provided with mode well known in the art such as the each several part that is connected to heart 20).For example, electrically conductive socket, terminals or other conductive features that is positioned at head mass 16 be introduced and physically and electrically be connected to such lead-in wire can at the end of head mass 16.IMD 10 can be adapted for by in the subcutaneous implantation patient's body so that it becomes is enclosed in bodily tissue and the body fluid, bodily tissue and body fluid can comprise epidermal area, subcutaneous layer of fat and/or muscle layer.Although IMD 10 is depicted as and is ICD (implantable cardiac defibrillator) configuration in Fig. 1, be to be understood that this is only used for illustration purpose, IMD 10 can comprise the Medical Devices of any kind that needs the remote sensing antenna.
In certain embodiments, can 14 generally is circular, oval, prismatic or rectilinear, and it has the smooth basically interarea that crosses with sidewall on every side.Shell 14 is formed by the biocompatible metal sheet such as the several piece thin-walled of titanium typically.Can use routine techniques that two half laser seams of shell 12 are welded together to form around the seam of these sidewall extensions on every side.Shell 14 and head mass 16 often are manufactured to two assemblies that separate, and these two assemblies physically and electrically are coupled subsequently.Shell 14 can comprise several functional elements, assembly and feature, comprises (not as restriction): battery; The high pressure output capacitor; Integrated circuit (" IC ") equipment; Processor or controller; Memory component; Treatment module or circuit; RF module or circuit; And antenna-matching circuit.These assemblies can be assembled in the separator before the two dummy joints weldering of shell 14 and place in the internal cavities of shell 14.During manufacture process, between assembly in shell 14 and the element in head mass 16, set up electrical connection.For example, can use IC connector pad, terminals, feed-through element and other features to dispose shell 14 and head mass 16 suitably to be used to set up the electrical connection between the treatment feedthrough connector in internal therapentics module and the head mass 16 and to be used to set up being connected between the part of internal RF module and remote sensing antenna in head mass 16.Being used to set up structure and the technology that such electricity (with physics) feedthrough is connected is known to those skilled in the art, therefore will no longer be described in detail at this paper.For example, the U.S. patent No. 6,414,835 has been described a kind of feedthrough array that is used for the capacitor filtering of implantable medical equipment, and its content is incorporated herein by reference.
Head mass 16 is preferably formed by suitable dielectric material (such as, biocompatible synthetic polymer).In certain embodiments, the dielectric material of head mass 16 may be selected to be and makes and can be passed through by the remote sensing antenna (not shown in figure 1) radiation of encapsulation in the head mass 16 or the RF energy of reception.The concrete material of head mass 16 can be selected in response to the consideration in the expection application of IMD 10, the electrical characteristics that center on the environment of implantation position, expectation operating frequency range, expectation RF antenna range and other practices.
Fig. 2 is that the simplified schematic of IMD 10 and several functional elements that are associated with it is represented.IMD 10 generally comprise can 14 and with the head mass 16 of shell 14 coupling, be included in the treatment module 22 in the shell 14 and be included in RF module 24 in the shell 14.In the practice, IMD 10 also can comprise functional needed several conventional assembly and features of supporting IMD 10 as known in the art, such as controller, memory and as the battery of power supply.This paper may not make complete description to these conventional elements.
Treatment module 22 can comprise the assembly of any number, includes but not limited to: electric equipment, IC, microprocessor, controller, memory, power supply and similar assembly.In brief, treatment module 22 is configured to provide the desired function that is associated with IMD 10, for example, and defibrillation pulse, pacing stimulation, patient monitoring, or similar functions.Given this, treatment module 22 can be coupled to one or more sensing or treatment lead-in wire 18.In the practice, the link of treatment lead-in wire 18 is inserted into head mass 16, and they are set up with the conducting element that is coupled to treatment module 22 and electrically contact herein.Treatment lead-in wire 18 can be inserted in the fairlead of the suitable configuration that forms in the head mass 16.In this example embodiment, IMD 10 comprises feed-through element 26, the critical transitions between these feed-through element 26 bridge joint shells 14 and the head mass 16.Treatment lead-in wire 18 extends to be used for route and placement in patient's body from head mass 16.
RF module 24 can be placed in the inside or the outside assembly that also can comprise any number of shell 14, includes, but are not limited to: electric equipment, IC, amplifier, signal generator, Receiver And Transmitter (or transceiver), modulator, microprocessor, controller, memory, power supply and similar assembly.RF module 24 also can comprise match circuit, and perhaps match circuit can place between RF module 24 and the antenna 28.Match circuit can comprise the assembly of any number, includes but not limited to: such as the electric device of capacitor, resistor or inductor; Filter; Balanced-unbalanced transformer; Tuned cell; Variable capacitance diode; Limiter diode; Or similar assembly, these assemblies all suitably are configured to provide the impedance matching between antenna 28 and the RF module 24, improve the efficient of antenna 28 thus.In brief, RF module 24 supports to be used for the RF remote sensing communication of IMD 10, includes, but are not limited to: produce the RF emitted energy; Provide RF to transmit to antenna 28; The RF remote sensing signal that processing is received by antenna 28, and similar communication.In the practice, the electric conducting material that RF module 24 can be designed to be used for shell 14 is utilized as RF ground plane (for some application), and RF module 24 can design according to the consideration in the expection application of IMD 10, the electrical characteristics that center on the environment of implantation position, expectation operating frequency range, expectation RF antenna range and other practices.
Antenna 28 is coupled to RF module 24 to facilitate the RF remote sensing between IMD 10 and the EMD (not shown).Generally speaking, antenna 28 be configured to aptly be used for RF operation (for example, UHF or VHF operation, 401-406MHz is used for the MICS/MEDS frequency band, 900MHz/2.4GHz and other ISM frequency bands, or the like).In the example embodiment shown in Fig. 2, antenna 28 is positioned at head mass 16 and in the outside of shell 14.But the volume that is associated with antenna 28 realizes that at implanted treatment and diagnostic device remote remote sensing required volume in head mass 16 can be the remarkable factor of IMD 10 sizes with being used for.Antenna 28 can have the characteristic that is similar to unipole antenna, be similar to idol level antenna characteristics, be similar to the co-plane waveguide antenna characteristics, be similar to stripline antenna characteristic, be similar to microstrip antennas and/or be similar to the characteristic of transmission-line aerial.Antenna 28 also can have the radiating doublet of any number, and it can be driven by the different RF signal source of any number.Given this, antenna 28 can have a plurality of radiating doublets that are configured to provide space, directional diagram or polarization diversity.
In one or more embodiment, antenna 28 is coupled to RF module 24 via the RF feedthrough in the feedthrough 26, and feedthrough 26 is with shell 14 and head mass 16 bridge joints.Antenna 28 can comprise the link that is coupled to the RF feedthrough of feedthrough 26 via conductive terminals that is positioned at head mass 16 or feature.In brief, Shi Ji feedthrough 26 comprises the ferrule of non-conductive glass of supporting or ceramics insulator.This insulator support feedthrough pin is also isolated with feedthrough pin and this ferrule electricity.At shell 14 assembly process, this ferrule is soldered to the hole or the opening of the suitable size that forms in the shell 14.RF module 24 is electrically connected to the inner of feedthrough pin then.To the connection of the inner of feedthrough pin can be by this inner being welded to down the lining pad or realizing by this inner being clipped in extend to down on the cable that serves as a contrast pad or connector or the flexible conductor coupler.The outer end of feedthrough pin is used as the tie point of antenna 28 or connects the tie point of socket, terminals or feature as the inside of the link that holds antenna 28.The feedthrough 26 of antenna 28 can be positioned on any desired part that is suitable for particular design of shell 14.
With reference now to Fig. 3,, the perspective exploded view of the antenna structure 100 that forms according to one or more embodiment is shown respectively.Some feature of antenna structure 100 and aspect are with above to combine those features that antenna 28 describes similar with the aspect, and total feature or aspect will no longer be given unnecessary details in the context of antenna structure 100.Antenna structure 100 is included at least one antenna 106 that forms on the dielectric layer 104.One or more additional discrete dielectric layer can place on the antenna 106 as on cover 108 and/or place under the antenna 106 as lining 112 down.In one or more embodiment, antenna structure 100 comprises and is placed to the outermost biocompatible layer of covering on these on dielectric layer 108 110, as the interface between antenna structure 110 and the surrounding environment.In certain embodiments, biocompatible layer 110 can comprise the outermost layer that covers on these in dielectric layer 108.Dissimilar biocompatible materials can be selected based on expection use and the expection surrounding environment of antenna structure 100 and IMD 10.For example, outermost layer 100 can comprise inorganic material, such as aluminium oxide (Al 2O 3), zirconia (ZrO 2), its mixture, perhaps class osseous system [hydroxyapatite-Ca 5(POH) (PO 4) 3], organic material, such as silicone and derivative thereof, and other implantable traditionally biocompatible materials.
Further with reference to figure 4, in one or more embodiment, a plurality of electrodes 120 are connected to the various piece of antenna structure 100 and are arranged to and make and can stride the one deck in dielectric layer 104,108 or 112 or more multi-layered apply voltage bias (electrode 120 is illustrated as being connected to dielectric layer 108 in Fig. 3) to small part between these electrodes 120.Each electrode is connected to power supply among the IMD 10 so that such voltage bias to be provided.Be arranged in RF module 24 otherwise be positioned at the controller of IMD 10 and antenna 106 communicative couplings to be used for sending and receiving remote sensing signal.
In certain embodiments, antenna structure 100 can comprise the screen 114 that places the layer below the antenna 106, this screen 114 is formed by metallization material, its circuitry for can 14 inside provides electromagnetic shielding, and wherein antenna structure 100 is attached to this circuitry of can 14 inside by feedthrough through hole 116.In certain embodiments, screen 114 is placed as the innermost layer of antenna structure 100, understands simultaneously that screen 114 also can place to be placed in the middle of below the antenna 106 another in low liner layer 112.In one or more embodiment, it is following to be used as the electro-magnetic bandgap (that is ground plane) between antenna 106 and the screen 114 that electro-magnetic bandgap material layer 115 can be placed on antenna 106.Generally speaking, when the radiating antenna oscillator is placed on ground plane top and when parallel with it because the reflection coefficient that the ground plane short circuit is brought, the field that causes this antenna oscillator radiation with reflected by this ground plane between 180 ° of out-phase.As a result, when the separation distance between antenna oscillator and the ground plane reduced, total radiation field of aerial trended towards zero, and this is will trend towards cancelling each other out fully with its ground plane reflection because of the field from the antenna oscillator radiation.Electro-magnetic bandgap layer 115 is called the ground connection disturbance of electro-magnetic bandgap or this reduction that high impedance surface prevents antenna radiation efficiency by introducing between antenna 106 and ground plane screen 114.Electro-magnetic bandgap layer 115 prevents the generation that reduces owing to antenna radiation efficiency that antenna conductor 106 next-door neighbour ground planes 114 cause or makes it to minimize.In one aspect, the electro-magnetic bandgap layer 115 of resonance is revealed as the open circuit of reflection coefficient and in-field homophase.For example, electro-magnetic bandgap layer 115 will cause from the field of antenna 106 radiation and by the field of its ground plane mirror image radiation by collaborative directed, keep identical orientation thus and do not cancel each other out.Electro-magnetic bandgap layer 115 further provides high resistance electromagnetic surface impedance, and it allows antenna 106 to be in directly to adjoin ground plane 114 places and not by short circuit.This allows to realize that radiating doublet is restricted to the compact antenna design of the confined space.Therefore, electro-magnetic bandgap layer 115 is reduced to the miniaturization that very little distance is helped the equipment of realizing by allowing the distance between antenna 106 and the ground plane screen 114.In one or more embodiment, can be vacuum moulding machine the lip-deep of one of each layer of equipment 100 or (the describing after a while) that adhere in ceramic multiviscosisty after by epoxy resin so that the material that is brought out by the thermal drift of sintering procedure changes minimize electro-magnetic bandgap layer 115.
In one or more embodiment, dielectric layer 104,108 and 112 can be selected as having respective dielectric constant with the dielectric constant coupling of environment (for example, bodily tissue) around the antenna structure 100 to alleviate the energy reflection effect in the critical point from antenna structure 100 to surrounding environment.Can be by including the coupling of the dielectric constant in each layer that material that can burn altogether, compatible and that have an expectation dielectric constant comes realization equipment 100 in.
In one or more embodiment, for on cover each biocompatible layer that dielectric layer 108 forms and can comprise the polymer that is loaded with the high-k powder, thereby the powder with differing dielectric constant can be loaded on the different polymeric layers, the powder of variable concentrations loads and can carry out on different polymeric layers, perhaps the dielectric constant of each polymeric layer can otherwise make its powder load adjusted generate to make cover the structure that dielectric layer 108 has the effective dielectric constant of expectation.In one or more embodiment, following lining dielectric layers 112 below the conductor 106 can the comprise dielectric radio material higher than the dielectric layer 104 that forms antenna 106 thereon, thereby these higher dielectric radios that are associated with following lining dielectric layer 112 allow the distance between antenna conductors 106 and the ground plane screen 114 to be minimized, and the size that allows thus to reach antenna structure 100 reduces.The high-k K of each layer can reach by including the material (for example, capacitive character material) that can burn altogether with high-k K in.Depend on the material that is used to form down lining dielectric layer 112, dielectric constant values can be in the variation Anywhere of the amplitude of high at least 1-2 the order of magnitude under from the k=5-6 of LTCC layer self to the capacitive character paste situation of using the LTCC compatibility.In addition, be loaded with another embodiment that ceramic printed substrate (PWB) is based on the structure of LTCC.The LTCC material provides passive block comes optimization packaging efficiency and/or performance with customized dielectric constant or electric capacity on space and function the ability that embeds.Because to have high dielectric constant materials generally is not biocompatible, therefore can will serves as a contrast dielectric layer 112 down and separate and make it to isolate from the human body environment that centers on IMD 10 and contact with the potential of this environment by the biocompatible material that is used to form outermost biocompatible layer 110 or covers dielectric layer 108 on other.With low liner layer 112 with isolated to open the possible range of choice that just allows the material that covers dielectric layer 108 on being used for very wide around the physical environment of IMD 10.For example, have hundreds of to thousands of dielectric constant k based on dielectric oxide (for example, barium monoxide titanium (BaTi0 3)) system be possible.
In one or more embodiment, can use any material layer depositions technology known in the art to be formed for forming each layer of antenna structure 100, include but not limited to deposit, spray, sieve (screening), dipping, plating, or the like.In certain embodiments, can use molecular beam epitaxy (MBE), ald (ALD) or other films, vacuum deposition process to deposit each layer, so that these layers are made up each other stackedly, thereby ALD allows thin high dielectric material to be used to form down lining dielectric layer 112 and dielectric layer 108 is covered in thin being used to form than dielectric materials, reaches the performance that reduces also to improve simultaneously with the miniaturization of overall antenna structure 100 antenna structure 100 of size thus.Can pile up these metal levels and form the plane-parallel capacitor structure of piling up to increase the dielectric constant of antenna 106 peripheral regions.
In one or more embodiment, after each layer of antenna structure 100 is formed as shown in Figure 3 or otherwise relative to each other deposits, this each layer can be as shown in Figure 4 burnt altogether is the single chip architecture 102 from this each layer acquisition, and it has the antenna 106 in the single chip architecture 102 that embeds gained as a result.Feedthrough through hole 116 extends through single chip architecture 102 and can be used for (such as by feedthrough) antenna 106 is connected to shell 14.By forming from these a plurality of dielectric layers 104,108 and the 112 monolithic antenna structures 102 that obtain, the dielectric constant that just can select or control these a plurality of dielectric layers 104,108 and 112 is to provide matching properties and can make the minimized in size of overall antenna structure so that the miniature antenna structure to be provided.
In one or more embodiment, these a plurality of dielectric layers 104,108 and 112 at least one the material properties to small part can further be subjected to electric field influence by this type of part that makes dielectric layer 104,108 and 112 and be changed or regulate.By in the selected portion of dielectric layer 104,108 and 112, starting electric field 122 applying voltage bias between the respective electrode 120.Be electrically connected 124 (for example, the paths of bio-compatible electric conducting material) electrode 120 is connected to power supply (not shown among Fig. 4) among the IMD 10.For example, can change or change the dielectric constant and/or the electric capacity to small part of dielectric layer 104,108 and 112 at least one (perhaps in the co-sintering structure 102 dielectric material of gained) as a result by the voltage bias that between each electrode 120, suitably applies expectation.The biasing that applies by using changes the material properties of the selected portion of dielectric material, and the overall performance characteristic of antenna 106 just can be controlled selectively.
In one or more embodiment, can select effective dielectric constant that the biasing of electrode 120 changes the dielectric material around the antenna 106 with the expectation impedance matching between the surrounding environment that antenna 106 and implantation position are provided, and then the energy reflection effect of the critical point of alleviation from antenna structure 102 to surrounding environment.In one or more embodiment, can select the biasing of electrode 120 to change the gain of the signal that receives by antenna 106.Depend on the implantation position of IMD 10 and the particular ambient environment of implantation position (for example, have tissue or the health matter piece or the implantation position degree of depth of different dielectric value, or the like), the operating characteristic of antenna 106 can be by these condition influence of surrounding environment.The setover service behaviour characteristic that allows antenna 106 of electrode 120 is conditioned considering these conditions of surrounding environment, such as by regulating the gain that biasing changes the impedance matching between antenna 106 and the surrounding environment or changes antenna 106.After this allows in implanted patient's 12 bodies of IMD 10 operation of remote sensing communication is finely tuned to realize the optimal antenna performance.
In one or more embodiment, can be selected as the beam steering of antenna 106 biasing of electrode 120 functional, thereby to the signal of passing on from antenna 106 can be by the desired orientation that leads alternatively.With reference to figure 4, antenna 106 can have the radiation radiation direction 126 under the no bias condition, wherein can apply electric field 122 by the section to antenna structure 102 and come each section of offset antenna structure 102 to revise the wave propagation characteristic of signal of communication to introduce phase shift (φ).Therefore, the phase shift of introducing (φ) can be radiated radiation direction and be changed direction 128 into.By this way, can select the biasing of electrode 120 to provide beam steering functional to antenna 106 by introducing the phase shift of being introduced (φ).The functional quality that can be used for improving the remote sensing transmission of this beam steering.Further, when a plurality of external equipments can be communicated by letter with IMD 10 or when having a plurality of IMD that can communicate with a specific external equipment in certain position, can utilize the functional direction of controlling each communication of such beam steering (that is space division multiple access (SDMA)) only to take place between two expection equipment to guarantee communication.In certain embodiments, can select the biasing of electrode 120 to come to provide beam steering functional to antenna 106 so that phase shift (φ) and as a result the antenna directivity of gained attenuate a non-expectation that can make the expectation communications degradation (that is interference) signal.
In operation, with reference to the operational flowchart of figure 5, IMD 10 is configured to the operating characteristic of the algorithm of operation store in its memory with control antenna structure 102.Initially, provide antenna structure 102 (operation 200) as described in this article, this antenna structure 102 comprises the antenna 106 that embeds at least one dielectric materials layer.In operation 202, some characteristic that is monitored of the signal that is receiving based on antenna 106 is measured the performance of antenna 106, and determines in operation 204 whether the performance of antennas 106 can be accepted.For example, can measure the signal that receives signal strength signal intensity (for example, RSSI), error vector magnitude (for example, EVM) or bit error rate assess the performance of antenna 106.If antenna 106 is worked as expected, then can not need adjusting is made in the operation of overall antenna structure, and IMD 10 can not do anything or can continue to monitor the characteristic of the signal that is received by antenna 106.If antenna 106 is not to work as expected, then IMD 10 will make in operation 206 and to apply biasing with material properties that changes dielectric material and the performance that changes antenna 106 thus to antenna structure 102 to small part (that is at least one part in the dielectric layer 104,108 or 112) between each electrode.By this way, can use biasing to control the operating characteristic of this antenna structure 102 to the section of antenna structure 102.Described embodiment only is illustrative, because it is known in the field being used to generate the parser of this biasing, and can use any algorithm in these parsers, such as those algorithms described in the following paper, " Applications of Antenna Arrays to Mobile Communications; Part II:Beam-Forming and Direction-of-Arrival Considerations (to the mobile communication application aerial array; second portion: beam shaping and arrival direction are considered) ", author: Lal C.Godara, Proceedings of the IEEE (IEEE can be reported), reel number: 85, issue: 8, in August, 1997, its full content is incorporated herein by reference.
In one or more embodiment, these a plurality of electrodes 120 are formed the array of electrode 120, these electrodes 120 be arranged to on cover dielectric layer 108 select segment impose electric field 122, as shown in Figure 6.Voltage bias can be chosen as between the particular combinations that is created in each electrode 120 changeably changes the operating characteristic of antenna structure 102 by different way so that the particular segment of dielectric layer 108 is setovered.Electrode 120 can be formed and be placed on the dielectric layer 108, extends through dielectric layer 108 at least in part, is placed on the side of dielectric layer 108 or its any combination, so that produce can be biased different feasible section of dielectric layer 108.By this way, the material properties that covers the select segment of dielectric layer 108 on can be regulated by the selected biasing the path of the radiation of radiating from antenna 106.
In one or more embodiment, the array of electrode 120 can be formed on the identical dielectric layer 104, as shown in Figure 7 with antenna 106.In one or more embodiment, can on the following lining dielectric layer 112 that antenna forms for 106 times, form the array of electrode 120, as shown in Figure 8.
In one or more embodiment, after antenna structure 100 has been formed common burning single chip architecture 102, can be by brazings or otherwise seal with edge 118 sealings with antenna structure 100 in the edge 118 of each of antenna structure 100 layer (that is, the biocompatible layer of dielectric layer 104,108 and 112, electro-magnetic bandgap layer 115, outermost and interior screen 114) or side.By head end antenna conductor 106 being surrounded and seals requiredly usually together with the far field remote sensing antenna that the biocompatible layer 110 of outermost provides the sealing to antenna structure 100 not need to be used for IMD as routine so that it can be directly connected to shell 14 of antenna structure 100 by the lateral edges 118 of brazing.As shown in Figure 9, can use brazing, glass sealing, diffusion-bonded or other will provide the suitable joining technique of sealing that antenna structure 100 is coupled to shell 14, this is that those of ordinary skills are known.Antenna structure 100 has reduced required cumulative volume and the physical size of antenna conductor 106 abundant radiation thus.In certain embodiments, the head mass 16 with the size that reduces still can be used for outside lead is connected to treatment module 16.
In one or more embodiment, form antenna 106 by biocompatible electric conducting material, this biocompatible electric conducting material is such as, but not limited at least one of following material: platinum, iridium, platinumiridio, aluminium oxide, silver, gold, palladium, silver-palladium or its mixture or niobium, molybdenum and/or molybdenum-manganese or other suitable materials.In one or more embodiment, dielectric layer 104,108 and 112 can comprise at least one of ceramic material, semi-conducting material and/or thin-film dielectric material.Comprise among some embodiment of at least a ceramic material at dielectric layer 104, dielectric layer 104,108 and 112 can comprise at least one of LTCC (LTCC) material or High Temperature Co Fired Ceramic (HTCC) material or PWB material, and this makes it possible to include in the material with expectation dielectric constant values.Generally speaking, the fusing point of LTCC material is between about 850 ℃ and 1150 ℃, and the fusing point of HTCC material is between about 1100 ℃ and 1700 ℃.The biocompatible layer 110 of ceramic dielectric layers 104,108 and 112, antenna 106, electro-magnetic bandgap layer 115, outermost and interior screen 114, through hole 116, electrode 120, and with 124 the conductive path of being electrically connected can be sintered or altogether burning form the monolithic antenna structure 102 that comprises flush type antenna conductor 106 together, as shown in Figure 4.Be used for the method that each ceramic material layer burns together altogether with the single chip architecture that is formed for IMD is existed, for example, describe in the U.S. patent No. 6,414,835 and the U.S. patent No. 7,164,572, the two full content is incorporated herein by reference.
According to one or more embodiment, use burning technology altogether with formation comprise the monolithic antenna structure 102 of flush type antenna 106 allow to make low cost, miniaturization, sealing, be suitable for being implanted into and/or directly or indirectly and the antenna structure 100 that contacts of different body fluid at tissue.
In one or more embodiment, comprise each ceramic dielectric layers 104,108 and 112, antenna 106, electrode 120, be electrically connected 124, electro-magnetic bandgap layer 115, the biocompatible layer 110 of outermost is printed with these a plurality of different individual separate materials layers of screen 114 or plate (or segmentation of band) available metal paste and other circuit patterns, pile up each other, stacked together and be subjected to the effect of predetermined temperature and pressure mood, fired in the temperature that raises subsequently, during this fires, (be present in the pottery) the major part evaporation of adhesive material and (being present in the metallization paste) solvent and/or burnouted and all the other materials fusion or sintering.Can select the number of dielectric layer 104,108 and 112 based on the antenna performance of expectation changeably.In certain embodiments, being suitable for use as the material that can burn conductor altogether that forms antenna 106 is biocompatible metal material described herein or the other materials that is applicable to the metallization paste.In one or more embodiment, the duplexer that is stacked subsequently for the LTCC material between about 850 ℃ and 1150 ℃, burnt together altogether for the temperature of HTCC material between about 1100 ℃ and 1700 ℃.
In one or more embodiment, dielectric layer 104,108 and 112 comprises a plurality of planes ceramic layer.Can be shaped to have the layer thickness of expectation to each ceramic layer at green state.Generally speaking, the formation of plane ceramic layer is to begin by the ceramic slurry that ceramic particle, thermoplastic polymer and solvent are formed.This slurry is sprawled into the ceramic wafer of predetermined thickness, and therefrom solvent is volatilized, stays the flexible green plate of self-supporting.Hole in some dielectric layer 104 and 112 is to use any routine techniques such as boring, punching, laser cutting etc. to pass to use the green sheet that forms ceramic layer 104 and 112 to make, and these holes will be filled electric conducting material to form through hole 116 or to be electrically connected 124.But suitable material as common burning porcelain comprises aluminium oxide (Al 2O 3), aluminium nitride, beryllium oxide, silica (SiO 2), zirconia (ZrO 2), the glass or its mixture that suspend in the glass-ceramic material, organic (polymer) adhesive.
A lot of algorithms described herein or method can by operation store in the memory of IMD 10 program or the controller of routine realize.Controller can comprise can execution algorithm various hardware or any configuration in the software arrangements.The exemplary hardware of controller realizes being included in the realization in application specific integrated circuit (ASIC), field programmable gate array (FPGA), programmable logic device, custom-designed nextport hardware component NextPort, one or more processor or its any combination.If realize with software, then can store and to carry out the computer-readable instruction (for example, program code) of realizing one or more kind technology described herein by controller such as the computer-readable medium of the memory among the IMD 10.For example, this memory can comprise random-access memory (ram), read-only memory (ROM), nonvolatile RAM (NVRAM), electric erasable type programmable read only memory (EEPROM), flash memory, or analog.
Although this system and method is described with the form of thinking specific embodiment at present, the disclosure need not to be defined in the disclosed embodiments.It is intended to contain various modifications and similar arrangement in the spirit and scope that are included in claim, and the scope of claim should be awarded the most wide in range deciphering and revise and similar structures to comprise all these classes.The disclosure comprises any of following claim and all embodiment.

Claims (10)

1. an implantable medical equipment (" IMD ") comprising:
Antenna structure from least one dielectric layer and antenna acquisition; And
A plurality of electrodes, described a plurality of electrodes come layout to apply biasing with what be used to stride described at least one dielectric layer to small part with respect to described at least one dielectric layer, and wherein said electrode is connected to the power supply among the described IMD;
Controller is coupled to be used for transmission and reception remote sensing signal, so that described controller is configured to described antenna communication:
Measure the performance of described antenna based on some characteristic of the signal that is just receiving by described antenna; And
Make biasing by described a plurality of electrodes put on described at least one dielectric layer to small part to change the described performance of described antenna.
2. implantable medical equipment as claimed in claim 1 is characterized in that, described at least one dielectric layer and described antenna are the parts of having been burnt monolithic antenna structure together altogether.
3. implantable medical equipment as claimed in claim 1 is characterized in that, described at least one dielectric layer comprises ceramic material.
4. implantable medical equipment as claimed in claim 3 is characterized in that, described ceramic material comprises LTCC (LTCC) material of fusing point between about 850 ℃ and 1150 ℃ and has burnt dose of being total to of high-k.
5. implantable medical equipment as claimed in claim 3 is characterized in that, described ceramic material comprises High Temperature Co Fired Ceramic (HTCC) material of fusing point between about 1100 ℃ and 1700 ℃.
6. implantable medical equipment as claimed in claim 1, it is characterized in that, described antenna structure be from a plurality of dielectric layers obtain so that described antenna is embedded in described a plurality of dielectric layer, further, wherein said a plurality of electrodes form on identical dielectric layer with antenna.
7. implantable medical equipment as claimed in claim 1, it is characterized in that, described antenna structure be from a plurality of dielectric layers obtain so that described antenna is embedded in described a plurality of dielectric layer, further, wherein said a plurality of electrodes and antenna form on the different dielectric layer.
8. implantable medical equipment as claimed in claim 1, its feature also is, described controller also is configured to apply described biasing to provide beam steering functional to described antenna, so that to being amplified alternatively with the signal of passing on from described antenna to described at least one dielectric layer.
9. implantable medical equipment as claimed in claim 1, its feature also is, described controller also is configured to apply described biasing to provide beam steering functional to described antenna, so that to being decayed alternatively with the signal of passing on from described antenna to described at least one dielectric layer.
10. implantable medical equipment as claimed in claim 1, its feature also is, described controller also be configured to apply described biasing with carry out the gain that changes the signal that described antenna receives or realize described antenna with the communication environments of the implantation position that centers on described IMD between impedance matching among at least one.
CN2009801560192A 2008-12-29 2009-12-16 Phased array cofire antenna structure and method for forming the same Pending CN102301530A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/344,980 US8050771B2 (en) 2008-12-29 2008-12-29 Phased array cofire antenna structure and method for operating the same
US12/344,980 2008-12-29
PCT/US2009/068157 WO2010077897A1 (en) 2008-12-29 2009-12-16 Phased array cofire antenna structure and method for forming the same

Publications (1)

Publication Number Publication Date
CN102301530A true CN102301530A (en) 2011-12-28

Family

ID=41820230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801560192A Pending CN102301530A (en) 2008-12-29 2009-12-16 Phased array cofire antenna structure and method for forming the same

Country Status (5)

Country Link
US (1) US8050771B2 (en)
EP (1) EP2389711A1 (en)
JP (1) JP2012514418A (en)
CN (1) CN102301530A (en)
WO (1) WO2010077897A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103856237A (en) * 2012-12-05 2014-06-11 汤姆逊许可公司 Radio frequency device with compensation of permittivity dispersion of the substrate and adjustment method
CN105147292A (en) * 2015-10-08 2015-12-16 邝嘉豪 Medical implantable detector with binding grooves
CN105305024B (en) * 2015-10-08 2016-08-24 福州环亚众志计算机有限公司 A kind of implantable medical detection device
CN107925831A (en) * 2015-08-27 2018-04-17 科利耳有限公司 The configuration of hearing device part
CN110120843A (en) * 2018-02-05 2019-08-13 中兴通讯股份有限公司 A kind of method and device detecting antenna port signal quality
CN110665114A (en) * 2014-05-12 2020-01-10 米克伦设备有限责任公司 Remote RF power system with small size transmit antenna
CN113644405A (en) * 2021-08-10 2021-11-12 苏州无双医疗设备有限公司 Implantable medical device

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8983618B2 (en) * 2008-10-31 2015-03-17 Medtronic, Inc. Co-fired multi-layer antenna for implantable medical devices and method for forming the same
WO2011118379A1 (en) * 2010-03-24 2011-09-29 株式会社村田製作所 Rfid system
TWI488359B (en) * 2011-05-10 2015-06-11 國立中山大學 Communication electronic device and antenna element thereof
JP5972997B2 (en) * 2011-12-13 2016-08-17 カーディアック ペースメイカーズ, インコーポレイテッド Implantable medical device
EP4223362A1 (en) 2011-12-13 2023-08-09 Cardiac Pacemakers, Inc. Implantable device header and method
WO2013111137A2 (en) 2012-01-26 2013-08-01 Rainbow Medical Ltd. Wireless neurqstimulatqrs
US8967472B2 (en) * 2012-05-02 2015-03-03 Disney Enterprises, Inc. High frequency antenna formed on a compound surface
JP6003567B2 (en) 2012-11-19 2016-10-05 富士通株式会社 Plate-shaped inverted F antenna
WO2014087337A1 (en) 2012-12-06 2014-06-12 Bluewind Medical Ltd. Delivery of implantable neurostimulators
CN105744986B (en) * 2013-09-16 2019-02-22 斯坦福大学董事会 The multicomponent coupler generated for electromagnetic energy
US9387332B2 (en) 2013-10-08 2016-07-12 Medtronic, Inc. Implantable medical devices having hollow sleeve cofire ceramic structures and methods of fabricating the same
US9502754B2 (en) 2014-01-24 2016-11-22 Medtronic, Inc. Implantable medical devices having cofire ceramic modules and methods of fabricating the same
US10004913B2 (en) 2014-03-03 2018-06-26 The Board Of Trustees Of The Leland Stanford Junior University Methods and apparatus for power conversion and data transmission in implantable sensors, stimulators, and actuators
WO2015171213A1 (en) 2014-05-09 2015-11-12 The Board Of Trustees Of The Leland Stanford Junior University Autofocus wireless power transfer to implantable devices in freely moving animals
CN107427683B (en) 2015-01-09 2019-06-21 艾克索尼克斯调制技术股份有限公司 For can plant the improvement antenna and application method of nerve stimulator
KR101656723B1 (en) * 2015-06-30 2016-09-12 재단법인 오송첨단의료산업진흥재단 Feedthrough making method
US10105540B2 (en) 2015-11-09 2018-10-23 Bluewind Medical Ltd. Optimization of application of current
GB201522722D0 (en) 2015-12-23 2016-02-03 Sofant Technologies Ltd Method and steerable antenna apparatus
EP3432975B1 (en) 2016-03-21 2024-02-14 Nalu Medical, Inc. Devices for positioning external devices in relation to implanted devices
EP3484577A4 (en) 2016-07-18 2020-03-25 Nalu Medical, Inc. Methods and systems for treating pelvic disorders and pain conditions
US10124178B2 (en) 2016-11-23 2018-11-13 Bluewind Medical Ltd. Implant and delivery tool therefor
WO2018126062A1 (en) * 2016-12-30 2018-07-05 Nalu Medical, Inc. Stimulation apparatus
EP3585475B1 (en) 2017-02-24 2024-04-03 Nalu Medical, Inc. Apparatus with sequentially implanted stimulators
US20180353764A1 (en) 2017-06-13 2018-12-13 Bluewind Medical Ltd. Antenna configuration
US11040210B2 (en) 2018-04-02 2021-06-22 Pacesetter, Inc. All metal enclosed implantable medical device with external BLE antenna for RF telemetry
US11202914B2 (en) * 2018-12-21 2021-12-21 Medtronic, Inc. Passive propagation fractal antenna for intrabody transmissions
US11704996B2 (en) * 2020-04-22 2023-07-18 Medtronic, Inc. Adaptive varactor based flexible matching network to support multiple implant conditions
CN113644406B (en) * 2021-08-10 2024-03-08 苏州无双医疗设备有限公司 Implantable medical equipment
US11400299B1 (en) 2021-09-14 2022-08-02 Rainbow Medical Ltd. Flexible antenna for stimulator

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4706094A (en) * 1985-05-03 1987-11-10 United Technologies Corporation Electro-optic beam scanner
US5023624A (en) 1988-10-26 1991-06-11 Harris Corporation Microwave chip carrier package having cover-mounted antenna element
US5219377A (en) 1992-01-17 1993-06-15 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array package
US5198824A (en) 1992-01-17 1993-03-30 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array packaging
DE69318879T2 (en) 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Ceramic multi-layer substrate for high frequencies
US5620476A (en) 1995-11-13 1997-04-15 Pacesetter, Inc. Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly
US6107227A (en) 1998-08-03 2000-08-22 Cts Corporation Barium neodymium titanate dielectric ceramic composition incorporating samarium oxide for improved electrical performance
US6154176A (en) 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
US6391082B1 (en) 1999-07-02 2002-05-21 Holl Technologies Company Composites of powdered fillers and polymer matrix
US6556169B1 (en) 1999-10-22 2003-04-29 Kyocera Corporation High frequency circuit integrated-type antenna component
US6414835B1 (en) 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device
WO2002085040A1 (en) 2001-04-13 2002-10-24 Comsat Corporation Ltcc-based modular mems phased array
US7916013B2 (en) 2005-03-21 2011-03-29 Greatbatch Ltd. RFID detection and identification system for implantable medical devices
WO2002096166A1 (en) 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
US6580402B2 (en) 2001-07-26 2003-06-17 The Boeing Company Antenna integrated ceramic chip carrier for a phased array antenna
SE0201490D0 (en) 2002-05-17 2002-05-17 St Jude Medical Implantable Antenna
US7072718B2 (en) 2002-12-03 2006-07-04 Cardiac Pacemakers, Inc. Antenna systems for implantable medical device telemetry
US7392015B1 (en) 2003-02-14 2008-06-24 Calamp Corp. Calibration methods and structures in wireless communications systems
EP1508940A1 (en) 2003-08-19 2005-02-23 Era Patents Limited Radiation controller including reactive elements on a dielectric surface
US7416630B2 (en) 2003-11-24 2008-08-26 Northrop Grumman Corporation Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
US7122891B2 (en) 2003-12-23 2006-10-17 Intel Corporation Ceramic embedded wireless antenna
JP4550837B2 (en) * 2004-02-10 2010-09-22 テレフオンアクチーボラゲット エル エム エリクソン(パブル) Adjustable device
US7317946B2 (en) 2004-03-10 2008-01-08 Medtronic, Inc. Telemetry antenna for an implantable medical device
CN1838345A (en) 2005-03-22 2006-09-27 株式会社东芝 Antenna device and method for manufacturing antenna device
US20060247711A1 (en) 2005-04-28 2006-11-02 Verhoef William D Telemetry antennas for implantable medical devices
US7164572B1 (en) 2005-09-15 2007-01-16 Medtronic, Inc. Multi-path, mono-polar co-fired hermetic electrical feedthroughs and methods of fabrication therfor
KR100764105B1 (en) 2006-02-28 2007-10-08 주식회사 손텍 radio frequency identification tag and ceramic patch antenna for radio frequency identification system
US20070236861A1 (en) 2006-04-05 2007-10-11 Burdon Jeremy W Implantable co-fired electrical feedthroughs
US7613522B2 (en) 2006-06-09 2009-11-03 Cardiac Pacemakers, Inc. Multi-antenna for an implantable medical device
GB2440579A (en) * 2006-08-01 2008-02-06 Zarlink Semiconductor Ltd Transceiver for Half-Duplex Communication and Half-Duplex Communication System
US8207894B2 (en) * 2008-09-11 2012-06-26 Google Inc. Multilayer compact antenna
US20100109966A1 (en) * 2008-10-31 2010-05-06 Mateychuk Duane N Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9985602B2 (en) 2012-12-05 2018-05-29 Thomson Licensing Radio frequency device with compensation of permittivity dispersion of the substrate and adjustment method
CN103856237A (en) * 2012-12-05 2014-06-11 汤姆逊许可公司 Radio frequency device with compensation of permittivity dispersion of the substrate and adjustment method
CN110665114B (en) * 2014-05-12 2022-12-06 斯蒂维科技公司 Remote RF power system with small size transmit antenna
CN110665114A (en) * 2014-05-12 2020-01-10 米克伦设备有限责任公司 Remote RF power system with small size transmit antenna
CN107925831A (en) * 2015-08-27 2018-04-17 科利耳有限公司 The configuration of hearing device part
CN107925831B (en) * 2015-08-27 2020-12-01 科利耳有限公司 Configuration of hearing device components
CN105147292A (en) * 2015-10-08 2015-12-16 邝嘉豪 Medical implantable detector with binding grooves
CN105147292B (en) * 2015-10-08 2016-08-17 福州环亚众志计算机有限公司 A kind of medical implanted detector being provided with binding groove
CN105305024B (en) * 2015-10-08 2016-08-24 福州环亚众志计算机有限公司 A kind of implantable medical detection device
CN110120843A (en) * 2018-02-05 2019-08-13 中兴通讯股份有限公司 A kind of method and device detecting antenna port signal quality
CN110120843B (en) * 2018-02-05 2021-05-18 中兴通讯股份有限公司 Method and device for detecting signal quality of antenna feeder port
CN113644405A (en) * 2021-08-10 2021-11-12 苏州无双医疗设备有限公司 Implantable medical device
CN113644405B (en) * 2021-08-10 2023-12-29 苏州无双医疗设备有限公司 Implantable medical equipment

Also Published As

Publication number Publication date
JP2012514418A (en) 2012-06-21
EP2389711A1 (en) 2011-11-30
US20100168817A1 (en) 2010-07-01
US8050771B2 (en) 2011-11-01
WO2010077897A1 (en) 2010-07-08

Similar Documents

Publication Publication Date Title
CN102301530A (en) Phased array cofire antenna structure and method for forming the same
US8497804B2 (en) High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same
US9399143B2 (en) Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same
US8983618B2 (en) Co-fired multi-layer antenna for implantable medical devices and method for forming the same
US20100109966A1 (en) Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same
US8626310B2 (en) External RF telemetry module for implantable medical devices
US8731668B2 (en) Implantable medical device with fractal antenna
EP1362614B1 (en) Implantable patch antenna
US7467014B2 (en) Compact and conformal telemetry antennas for implantable medical devices
US7319901B2 (en) Optional telemetry antenna for implantable medical devices
CN102470248B (en) Co-fired electrical feedthroughs for implantable medical devices
US20060247711A1 (en) Telemetry antennas for implantable medical devices
US6456256B1 (en) Circumferential antenna for an implantable medical device
EP1582235B1 (en) Implantable medical device with slot antenna
US8239026B2 (en) Implantable medical device with a voltage protection circuit
EP3730185B1 (en) Implantable medical device comprising a metal/ceramics composite housing
US11876286B2 (en) Systems and methods for incorporating a patch antenna in an implantable medical device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20111228