CN102296342B - Water sealing plating bath - Google Patents
Water sealing plating bath Download PDFInfo
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- CN102296342B CN102296342B CN201110240908.6A CN201110240908A CN102296342B CN 102296342 B CN102296342 B CN 102296342B CN 201110240908 A CN201110240908 A CN 201110240908A CN 102296342 B CN102296342 B CN 102296342B
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- sealed tank
- electroplating bath
- water sealed
- groove lid
- bath
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Abstract
The invention discloses a kind of Water sealing plating bath. This device comprises electroplating bath, water sealed tank and groove lid; Described electroplating bath is rectangle, installs the U-shaped water sealed tank of a circle additional in the position of 1 centimetre of the notch inner side lower than electroplating bath; The groove lid of a pyramid is placed in described U-shaped water sealed tank top. The present invention can reduce environmental pollution, keeps the concentration stabilize of electroplate liquid, and the manufacturing cost that can also save electroplating assembly line.
Description
Technical field:
The present invention relates to a kind of electroplating bath, particularly a kind of Water sealing plating bath.
Background technology:
Current, electroplate the electroplating bath of use, prior art mainly: oblique one, lid above rectangle cell bodyTransparent panel composition. The defect of aforesaid way is:
1, because electroplate liquid generally all can have certain chemical industry smell, above-mentioned electroplating bath cover plate can not be tightWith cell body laminating, can cause the smell of electroplate liquid to think for a long time to distribute in working environment, pollute operating environment,Injury operation employee is healthy;
2, in order to reduce the impact of polluting workshop, this kind of electroplating bath need to be equipped with air exhauster, is equipped withAir exhauster causes a large amount of wastes, can not eradicate the problem of pollution simultaneously, and the thing of just transferring the pollution, by workDusty gas drain in outdoor atmosphere, overall situation is polluted.
3, electroplate liquid generally need to be heated, and steams so generally can take a large amount of water out of in getting rid of gasGas, taking out of in a large number of steam can cause electroplate liquid to reduce, and the concentration of electroplate liquid promotes, and affects electroplating processStable.
Summary of the invention:
In view of above-mentioned technical problem, the invention provides a kind of Water sealing plating bath. This device can reduce environmentPollute, keep the concentration stabilize of electroplate liquid, and the manufacturing cost that can also save electroplating assembly line.
For realizing described technical purpose, technical scheme of the present invention is:
Water sealing plating bath, comprises electroplating bath, water sealed tank and groove lid; Described electroplating bath is rectangle, lower thanInside the notch of electroplating bath, the position of 1 centimetre installs the U-shaped water sealed tank of a circle additional; Described U-shaped water sealed tank topPlace a groove lid.
In such scheme, described groove lid becomes pyramid.
Beneficial effect of the present invention is as follows:
1,, when after injected water in U-shaped water sealed tank, electroplating bath and groove lid are because the reason of water seal will form oneThe space of sealing, the gas that cuts off inner electroplate liquid is loose outward, can not cause environmental pollution.
2, because the steam in the connection-related electricity use coating bath of water seal is tending towards saturated very soon, do not have steam and leak,Electroplate liquid can not be reduced, the concentration stabilize of electroplate liquid.
3, steam condenses into the globule in the time of the groove lid of contact pyramid, flow to U along the inside of groove lidIn type groove, make to be filled with all the time water in U-shaped water sealed tank, simultaneously because U-shaped water sealed tank is lower than groove lid, work as waterWater in sealing groove can be spilled in electroplate liquid while expiring automatically, makes electroplate liquid balance.
4,, owing to there is no gas overflowing, so do not need to use exhaust equipment, save the system of electroplating assembly lineCause this also greatly to reduce the space of plating line. Save plant area.
Brief description of the drawings:
Further illustrate the present invention below in conjunction with the drawings and specific embodiments.
Fig. 1 is the main TV structure figure of Water sealing plating bath of the present invention.
Fig. 2 is the side-looking structure chart of Water sealing plating bath of the present invention.
Fig. 3 is the plan structure figure of Water sealing plating bath of the present invention.
Detailed description of the invention:
For technological means, creation characteristic that the present invention is realized, reach object and effect is easy to understand,Below in conjunction with concrete diagram, further set forth the present invention.
As shown in Figure 1 to Figure 3, Water sealing plating bath of the present invention, main body is rectangular electroplating bath 1,Position 1 centimetre of the notch inner side lower than electroplating bath 1 installs the U-shaped water sealed tank of a circle 2 additional. U-shaped water sealThe groove lid 3 of a pyramid is placed in groove 2 tops, when after the interior injected water of U-shaped water sealed tank 2, and electroplating bath 1, cut off outside the gas of inner electroplate liquid because the reason of water seal is by forming the space of a sealing with groove lid 3Loose.
More than show and described general principle of the present invention and principal character and advantage of the present invention. The industryTechnical staff should understand, the present invention is not restricted to the described embodiments, in above-described embodiment and descriptionThat describes just illustrates principle of the present invention, without departing from the spirit and scope of the present invention, and the present inventionAlso have various changes and modifications, these changes and improvements all fall in the claimed scope of the invention. ThisInventing claimed scope is defined by appending claims and equivalent thereof.
Claims (1)
1. Water sealing plating bath, comprises electroplating bath, water sealed tank and groove lid; Described electroplating bath is rectangle, lowInside the notch of electroplating bath, the position of 1 centimetre installs the U-shaped water sealed tank of a circle additional; Described U-shaped water sealed tank topPlace a groove lid; Described groove lid becomes pyramid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110240908.6A CN102296342B (en) | 2011-08-22 | 2011-08-22 | Water sealing plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110240908.6A CN102296342B (en) | 2011-08-22 | 2011-08-22 | Water sealing plating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102296342A CN102296342A (en) | 2011-12-28 |
| CN102296342B true CN102296342B (en) | 2016-05-18 |
Family
ID=45357013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110240908.6A Active CN102296342B (en) | 2011-08-22 | 2011-08-22 | Water sealing plating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102296342B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103820830B (en) * | 2014-02-13 | 2016-08-17 | 德清县佳伟线缆有限公司 | A kind of wire material electroplating equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391277A (en) * | 1994-04-22 | 1995-02-21 | Weng; Evans | Structure of electro-plating barrel |
| CN2335979Y (en) * | 1998-03-16 | 1999-09-01 | 王树岩 | Saline electrolyzer |
| US5994782A (en) * | 1999-04-09 | 1999-11-30 | Chu; Chin Shin | Surface treatment equipment for treating circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202193871U (en) * | 2011-08-22 | 2012-04-18 | 无锡鼎亚电子材料有限公司 | Water seal electroplating bath |
-
2011
- 2011-08-22 CN CN201110240908.6A patent/CN102296342B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391277A (en) * | 1994-04-22 | 1995-02-21 | Weng; Evans | Structure of electro-plating barrel |
| CN2335979Y (en) * | 1998-03-16 | 1999-09-01 | 王树岩 | Saline electrolyzer |
| US5994782A (en) * | 1999-04-09 | 1999-11-30 | Chu; Chin Shin | Surface treatment equipment for treating circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102296342A (en) | 2011-12-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Water sealed electroplating tank Effective date of registration: 20221216 Granted publication date: 20160518 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Huishan branch Pledgor: WUXI DINGYA ELECTRONIC PARTS Co.,Ltd. Registration number: Y2022980027309 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |