CN102296205A - Electroplated nickel-copper alloy lead - Google Patents
Electroplated nickel-copper alloy lead Download PDFInfo
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- CN102296205A CN102296205A CN2011102702503A CN201110270250A CN102296205A CN 102296205 A CN102296205 A CN 102296205A CN 2011102702503 A CN2011102702503 A CN 2011102702503A CN 201110270250 A CN201110270250 A CN 201110270250A CN 102296205 A CN102296205 A CN 102296205A
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- copper alloy
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- electronickelling
- copper
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Abstract
The invention discloses an electroplated nickel-copper alloy lead. The electroplated nickel-copper alloy lead is characterized by comprising the following elements in percentage by weight: 0.27 to 0.69 percent of Si, 0.12 to 0.73 percent of Zr, 0.04 to 0.193 percent of Mn, 0.24 to 0.97 percent of Ti, 0.08 to 0.13 percent of Mo, and the balance of copper and inevitable impurities. According to a nickel plating process, the nickel plating solution contains 100 to 200 g/L of nickel aminosulfonate, 20 to 30 g/L of boric acid, and 1.1 to 1.5 g/L of sodium hypophosphite; and the process conditions comprise that: the pH is 5 to 6, the temperature is 40 to 45 DEG C, stirring is performed in the air, and the density of current is 5 to 8A/cm<2>. The electrical conductivity of the lead is 63.8 percent ACS, and the tensile strength of the lead is 490MPa. A cable with relatively high strength and relatively high electrical conductivity is selected by multiple times of test, so that severe outdoor environment is resisted, the frequency of breakage is reduced, the maintenance expense is reduced and the cost is lowered.
Description
Technical field
The present invention relates to cable, especially relate to a kind of electronickelling copper alloy wire.
Background technology
Copper alloy with high strength and high conductivity is widely used in fields such as lead frame, welding electrode, switch contact, electric power train aerial condutor, also can be used for not having in the heat exchange environment of direct relation with electroconductibility; At present, copper alloy with high strength and high conductivity mainly is alloy and matrix materials thereof such as Cu-Zr, Cu-Cr, Cu-Cd, Cu-Ni, Cu-Fe, Cu-Ag, Cu-Nb, in the timeliness type copper alloy high-strength highly-conductive process, the matter of utmost importance that runs into is that a spot of alloying element strengthening effect is not obvious, and a large amount of alloying elements can worsen the conductivity of alloy; At present, mainly take solution strengthening, precipitation strength, dispersion-strengthened and partially coazevation metallurgical enhancement method such as go out, the high strength copper alloy that metallurgical enhancement method obtains because excessive alloying element is to the deterioration of conductivity, so its application is very limited.
Simultaneously, require the lead top layer to have certain solidity to corrosion and wear resistance in some field, and prior art does not see that for the electronickelling copper alloy wire report is arranged.
Summary of the invention
At the deficiencies in the prior art, one of purpose of the present invention is to provide a kind of electronickelling copper alloy wire that overcomes above-mentioned prior art defective.
The prepared a kind of electronickelling copper alloy wire of the present invention is to comprise the element of following weight per-cent:
Si 0.07-0.09％
Zr 0.12-0.73％
Mn 0.04-0.193％
Ti 0.24-0.97％
Mo 0.08-0.13％
Surplus is copper and unavoidable impurities, and wherein said electronickelling is to adopt following technology:
Nickel-plating liquid is: nickel sulfamic acid 100-200g/L, boric acid 20-30g/L, inferior sodium phosphate 1.1-1.5g/L;
Processing condition: pH5-6,40-45 ℃, pneumatic blending, current density 5～8A/cm
2。
Outstanding beneficial effect of the present invention one of is: the optimization of alloying element itself has overcome the alloying and the heat treated problem of prior art; Each optimizing components proportioning is important; The present invention does not simultaneously add qualification for its manufacture method, and the concrete manufacture method of preferred a kind of specification sheets, more importantly be to study for the electronickelling liquid of this composition, general electronickelling liquid can not directly use, because the excessive concentration of its main salt or low excessively, causes deposition loose or cover bad, find after deliberation, have only nickel sulfamic acid, and in predetermined electric current density, as 5～8A/cm
2Down, electroplating effect is better, this with directly apply mechanically existing nickel-plating liquid and can a great difference be arranged galvanized idea.
Embodiment
Embodiment one
A kind of electronickelling copper alloy wire is to comprise the element of following weight per-cent:
Si 0.09％
Zr 0.73％
Mn 0.193％
Ti 0.97％
Mo 0.13％
Surplus is copper and unavoidable impurities.
Nickel-plating liquid is: nickel sulfamic acid 200g/L, boric acid 30g/L, inferior sodium phosphate 1.5g/L;
Processing condition: pH6,45 ℃, pneumatic blending, current density 8A/cm
2
Embodiment two
A kind of electronickelling copper alloy wire is to comprise the element of following weight per-cent:
Si 0.07％
Zr 0.12％
Mn 0.04％
Ti 0.24％
Mo 0.08％
Surplus is copper and unavoidable impurities.
Nickel-plating liquid is: nickel sulfamic acid 100g/L, boric acid 20g/L, inferior sodium phosphate 1.1g/L;
Processing condition: pH5,40 ℃, pneumatic blending, current density 5A/cm
2
Embodiment three
A kind of electronickelling copper alloy wire is to comprise the element of following weight per-cent:
Si 0.09％
Zr 0.44％
Mn 0.126％
Ti 0.61％
Mo 0.11％
Surplus is copper and unavoidable impurities.
Method copper embodiment 1
Embodiment three
A kind of electronickelling copper alloy wire is to comprise the element of following weight per-cent:
Si 0.09％
Zr 0.51％
Mn 0.108％
Ti 0.50％
Mo 0.098％
Surplus is copper and unavoidable impurities.
Electro-plating method is with embodiment 2
Through the copper alloy cable detection to above embodiment, its electric conductivity is 63.8%IACS, and tensile strength is 490Mpa, and 3.5%60 days no changes of salt water resistance draw and draw mill on the grinding machine 1000 times, do not have obviously to come off.
Above-mentioned alloy is to adopt following prepared: adopt mixed smelting, founding becomes copper alloy casting ingot; Ingot casting is carried out solution treatment, and solid solubility temperature is 800-850 ℃, and solution time is 3-5h; At room temperature the copper alloy to solution treatment waits channel deformation, and rolling pass is 6 or 10 times, and sample is not all rotated in every time distortion, and mould interior angle φ is 100-110 °, and mould exterior angle ψ is 15-25 °; (4) alloy behind the reciprocity channel deformation carries out drawing and is processed into line and carries out ageing treatment again, and aging temp is 500-520 ℃, and aging time is 0.1-0.4h.Copper alloy wire after the timeliness carries out Nickel Plating Treatment.
Applicant's statement, the present invention illustrates detailed composition of the present invention and technical process by the foregoing description, but the present invention is not limited to above-mentioned detailed composition and technical process, does not mean that promptly the present invention must rely on above-mentioned detailed composition and technical process could be implemented.The person of ordinary skill in the field should understand, any improvement in the present invention to the interpolation of the equivalence replacement of each raw material of product of the present invention and ancillary component, the selection of concrete mode etc., all drops within protection scope of the present invention and the open scope.
Claims (4)
1. electronickelling copper alloy wire is characterized in that comprising the element of following weight per-cent:
Zr 0.12-0.73%, Mn 0.04-0.193%, Ti 0.24-0.97%, Mo 0.08-0.13%, Si0.07-0.09%, surplus is copper and unavoidable impurities, wherein said electronickelling is to adopt following technology:
Nickel-plating liquid is: nickel sulfamic acid 100-200g/L, boric acid 20-30g/L, inferior sodium phosphate 1.1-1.5g/L;
Processing condition: pH5-6,40-45 ℃, pneumatic blending, current density 5～8A/cm
2
2. a kind of electronickelling copper alloy wire according to claim 1 is characterized in that:
Zr?0.32-0.58％。
3. a kind of electronickelling copper alloy wire according to claim 1 is characterized in that:
Ti?0.53-0.79％。
4. a kind of electronickelling copper alloy wire according to claim 1 is characterized in that:
Mo?0.096-0.104％。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102702503A CN102296205A (en) | 2011-09-13 | 2011-09-13 | Electroplated nickel-copper alloy lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102702503A CN102296205A (en) | 2011-09-13 | 2011-09-13 | Electroplated nickel-copper alloy lead |
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| CN102296205A true CN102296205A (en) | 2011-12-28 |
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| CN2011102702503A Pending CN102296205A (en) | 2011-09-13 | 2011-09-13 | Electroplated nickel-copper alloy lead |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913900A (en) * | 2016-05-11 | 2016-08-31 | 江苏华威铜业有限公司 | Hard copper busbar and preparation method thereof |
| CN106086514A (en) * | 2016-08-27 | 2016-11-09 | 郭云琴 | A kind of dispersion strengthening copper-based alloy of Dineodymium trioxide and preparation method thereof |
| CN106282737A (en) * | 2016-08-30 | 2017-01-04 | 芜湖楚江合金铜材有限公司 | A kind of electronickelling wire copper alloy wire and preparation method thereof |
| CN107119291A (en) * | 2017-05-24 | 2017-09-01 | 江苏金坤科技有限公司 | A kind of nickel-plating liquid and the efficient nickel plating technology based on the nickel-plating liquid |
| CN113106505A (en) * | 2020-01-13 | 2021-07-13 | 深圳市业展电子有限公司 | Surface treatment process for improving high-temperature anti-oxidation performance of resistor body and resistor body thereof |
-
2011
- 2011-09-13 CN CN2011102702503A patent/CN102296205A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913900A (en) * | 2016-05-11 | 2016-08-31 | 江苏华威铜业有限公司 | Hard copper busbar and preparation method thereof |
| CN106086514A (en) * | 2016-08-27 | 2016-11-09 | 郭云琴 | A kind of dispersion strengthening copper-based alloy of Dineodymium trioxide and preparation method thereof |
| CN106086514B (en) * | 2016-08-27 | 2017-12-05 | 泰州永盛包装股份有限公司 | A kind of neodymia dispersion-strengthened Cu based alloy and preparation method thereof |
| CN106282737A (en) * | 2016-08-30 | 2017-01-04 | 芜湖楚江合金铜材有限公司 | A kind of electronickelling wire copper alloy wire and preparation method thereof |
| CN107119291A (en) * | 2017-05-24 | 2017-09-01 | 江苏金坤科技有限公司 | A kind of nickel-plating liquid and the efficient nickel plating technology based on the nickel-plating liquid |
| CN113106505A (en) * | 2020-01-13 | 2021-07-13 | 深圳市业展电子有限公司 | Surface treatment process for improving high-temperature anti-oxidation performance of resistor body and resistor body thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111228 |