CN102290232A - Metallic thin film for thin film capacitor and manufacturing method thereof - Google Patents
Metallic thin film for thin film capacitor and manufacturing method thereof Download PDFInfo
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- CN102290232A CN102290232A CN 201110150040 CN201110150040A CN102290232A CN 102290232 A CN102290232 A CN 102290232A CN 201110150040 CN201110150040 CN 201110150040 CN 201110150040 A CN201110150040 A CN 201110150040A CN 102290232 A CN102290232 A CN 102290232A
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Abstract
The invention relates to a metallic thin film for a thin film capacitor. The metallic thin film comprises a dielectric layer and a metallic film layer which are combined mutually, wherein one end of the dielectric layer is provided with a misalignment; the metallic film layer is triangular; and the thick side of the metallic film layer is positioned at the metallic end side, combined with the dielectric layer, of the metallic film layer. The invention also relates to a manufacturing method of the metallic thin film for the thin film capacitor, and the method comprises the following steps: coating metal materials on the dielectric layer, and reserving the misalignment at one end of the dielectric layer, thus the metallic film layer is formed, wherein the metallic film layer is triangular, and the thick side of the metallic film layer is positioned at the metallic end side, combined with the dielectric layer, of the metallic film layer. According to the invention, the metallic thin film provided by the invention is simple in manufacturing process, and the thin film capacitor which is manufactured from the metallic thin film has less contact resistance, thus the product property is good.
Description
Technical field
The present invention relates to the metallized film technical field, particularly relate to a kind of film capacitor metallized film and preparation method thereof.
Background technology
Existing metallized film as shown in Figure 1, comprise dielectric layer 1, layer of metallized film 2 and metal thickening layer 3, layer of metallized film 2 mutually combines with dielectric layer 1, and leaves misalignment 11 at dielectric layer 1 one ends, the metallized ends limit after metal thickening layer 3 is arranged on layer of metallized film 2 and dielectric layer 1 combines.This structure is complex process when making, and big with the film capacitor contact resistance of its making, influences product performance.
Summary of the invention
Technical problem to be solved by this invention provides a kind of film capacitor metallized film and preparation method thereof, and processing technology is simple, and little with the film capacitor contact resistance of its making, thereby makes product performance good.
The technical solution adopted for the present invention to solve the technical problems is: a kind of film capacitor metallized film is provided, comprise dielectric layer and layer of metallized film, described layer of metallized film and dielectric layer mutually combine, and leave misalignment, described layer of metallized film shape triangular in shape at described dielectric layer one end; Metallized ends limit after one side of described metalized film bed thickness is positioned at described layer of metallized film and dielectric layer combines.
Side's resistance of described layer of metallized film increases to misalignment gradually from described metallized ends limit.
Described layer of metallized film is divided into is steaming thickness portion and is steaming thin part; Described side's resistance of steaming thickness portion is 5 Ω/; Described side's resistance of steaming thin part is 40～50 Ω/.
Described dielectric layer adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make.
Described layer of metallized film adopts zinc or allumen to make.
The technical solution adopted for the present invention to solve the technical problems is: the manufacture method of a kind of film capacitor with metallized film also is provided, may further comprise the steps: with the metal material plated film on dielectric layer, leave misalignment at described dielectric layer one end, form layer of metallized film, described layer of metallized film shape triangular in shape, wherein, one side the metallized ends limit after being positioned at described layer of metallized film and dielectric layer combines of metalized film bed thickness.
Described dielectric layer adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make.
Described metal material is zinc or allumen.
Beneficial effect
Owing to adopted above-mentioned technical scheme, the present invention compared with prior art has following advantage and good effect: manufacture craft of the present invention is simple, and the resistance of capacitor end surface side is little, and the capacitor contact resistance of making is little, and product performance is good.The capacitor that the capacitor of making is made with conventional films under the situation of equal volume specific capacity mutually is bigger.The resistance of film side to staying the limit gradual change to increase (the metal layer thickness gradual change reduces), reaches the approximate evenly distribution of current density from the edge thickened area, can significantly improve dielectric strength, and self-healing performance and withstand voltage properties all get a promotion.And can reach 40～50 Ω/ steaming the resistance of thin part side.
Description of drawings
Fig. 1 is a metallized film structural representation in the prior art;
Fig. 2 is a metallized film structural representation of the present invention.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Embodiments of the present invention relate to a kind of film capacitor metallized film, as shown in Figure 2, comprise dielectric layer 1 and layer of metallized film 2, described layer of metallized film 2 mutually combines with dielectric layer 1, and leave misalignment 11, described layer of metallized film 2 shapes triangular in shape at described dielectric layer 1 one ends; Metallized ends limit after described layer of metallized film 2 thick one side are positioned at described layer of metallized film 2 and dielectric layer 1 combines.This shows that the present invention compares original metallized film and reduced the metal thickening layer, manufacture craft is more simple, and the capacitor of under the situation of equal volume, making with its capacitor made from conventional films specific capacity is bigger mutually.Wherein, dielectric layer adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make; Layer of metallized film adopts zinc or allumen to make.
Side's resistance of described layer of metallized film 2 increases to misalignment 11 gradually from described metallized ends limit, promptly the gradient thickness along with layer of metallized film 2 reduces, reach the approximate evenly distribution of current density, can significantly improve dielectric strength, self-healing performance and withstand voltage properties all get a promotion.Layer of metallized film 2 is divided into is steaming thickness portion 21 and is steaming thin part 22, steam thickness portion 21 and accounting for 1/3rd of whole layer of metallized film 2 greatly, its side's resistance is 5 Ω/, is steaming thin part 22 so and is accounting for 2/3rds of whole layer of metallized film 2, and its side's resistance is 40～50 Ω/.Can make that so the resistance of capacitor end surface side is little, the capacitor contact resistance of making is little, and product performance is good.
Embodiments of the present invention also relate to the manufacture method of a kind of film capacitor with metallized film, may further comprise the steps: with the metal material plated film on dielectric layer, leave misalignment at described dielectric layer one end, form layer of metallized film, described layer of metallized film shape triangular in shape, wherein, one side the metallized ends limit after being positioned at described layer of metallized film and dielectric layer combines of metalized film bed thickness.Wherein, dielectric layer adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make; The metal material that is used to make layer of metallized film is zinc or allumen.This shows that the present invention only needs can finish once the step, compared with prior art, need not to add the plating thickening layer again after having plated layer of metallized film, technology is very easy.
Claims (8)
1. film capacitor metallized film, comprise dielectric layer (1) and layer of metallized film (2), described layer of metallized film (2) mutually combines with dielectric layer (1), and leave misalignment (11) at described dielectric layer (1) one end, it is characterized in that described layer of metallized film (2) shape triangular in shape; Metallized ends limit after the thick one side of described layer of metallized film (2) is positioned at described layer of metallized film (2) and dielectric layer (1) combines.
2. film capacitor metallized film according to claim 1 is characterized in that, side's resistance of described layer of metallized film (2) increases to misalignment gradually from described metallized ends limit.
3. film capacitor metallized film according to claim 2 is characterized in that, described layer of metallized film (2) is divided into is steaming thickness portion (21) and steaming thin part (22); Described side's resistance of steaming thickness portion (21) is 5 Ω/; Described side's resistance of steaming thin part (22) is 40～50 Ω/.
4. film capacitor metallized film according to claim 1 is characterized in that, described dielectric layer (1) adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make.
5. film capacitor metallized film according to claim 1 is characterized in that, described layer of metallized film (2) adopts zinc or allumen to make.
6. a film capacitor is with the manufacture method of metallized film, it is characterized in that, may further comprise the steps: with the metal material plated film on dielectric layer, leave misalignment at described dielectric layer one end, form layer of metallized film, described layer of metallized film shape triangular in shape, wherein, one side the metallized ends limit after being positioned at described layer of metallized film and dielectric layer combines of metalized film bed thickness.
7. film capacitor according to claim 6 is characterized in that with the manufacture method of metallized film described dielectric layer adopts polypropylene, polyester, polystyrene or polyphenylene sulfide to make.
8. film capacitor according to claim 6 is characterized in that with the manufacture method of metallized film described metal material is zinc or allumen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110150040 CN102290232A (en) | 2011-06-03 | 2011-06-03 | Metallic thin film for thin film capacitor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110150040 CN102290232A (en) | 2011-06-03 | 2011-06-03 | Metallic thin film for thin film capacitor and manufacturing method thereof |
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| CN102290232A true CN102290232A (en) | 2011-12-21 |
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| CN 201110150040 Pending CN102290232A (en) | 2011-06-03 | 2011-06-03 | Metallic thin film for thin film capacitor and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456492A (en) * | 2013-09-06 | 2013-12-18 | 安徽赛福电子有限公司 | High-sheet-resistance aluminum membrane |
| CN103578754A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | Aluminum zinc metallized film with gradually-changing sheet resistance and for capacitor |
| CN103578755A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | High-sheet-resistance metalized film for filter capacitor |
| CN103756128A (en) * | 2013-12-18 | 2014-04-30 | 芜湖万润机械有限责任公司 | Isotactic polyethylene metallized film used for capacitors and preparation method thereof |
| CN104143434A (en) * | 2014-08-06 | 2014-11-12 | 安徽源光电器有限公司 | Small novel capacitor with gradient plating |
| CN112366081A (en) * | 2020-09-24 | 2021-02-12 | 铜陵市超越电子有限公司 | Inclined plane type metallized film and preparation device and processing method thereof |
| CN113345714A (en) * | 2021-07-05 | 2021-09-03 | 广东省塑镕科技有限公司 | Method for manufacturing box-packed metallized film capacitor |
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| CN2262284Y (en) * | 1996-04-30 | 1997-09-10 | 成都皮克电力电子技术研究所 | Medium frequency pulse capacitor |
| CN1208940A (en) * | 1997-04-25 | 1999-02-24 | 东丽株式会社 | Metallized film prodn. method thereof capacitor using it |
| US20060006063A1 (en) * | 2004-07-07 | 2006-01-12 | Tdk Corporation | Method of manufacturing electrode and electrode |
| CN1753114A (en) * | 2004-09-22 | 2006-03-29 | 安徽铜峰电子股份有限公司 | Gradual changing square resistance metallic film and capacitor containing said metallic film |
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2011
- 2011-06-03 CN CN 201110150040 patent/CN102290232A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2262284Y (en) * | 1996-04-30 | 1997-09-10 | 成都皮克电力电子技术研究所 | Medium frequency pulse capacitor |
| CN1208940A (en) * | 1997-04-25 | 1999-02-24 | 东丽株式会社 | Metallized film prodn. method thereof capacitor using it |
| US20060006063A1 (en) * | 2004-07-07 | 2006-01-12 | Tdk Corporation | Method of manufacturing electrode and electrode |
| CN1753114A (en) * | 2004-09-22 | 2006-03-29 | 安徽铜峰电子股份有限公司 | Gradual changing square resistance metallic film and capacitor containing said metallic film |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456492A (en) * | 2013-09-06 | 2013-12-18 | 安徽赛福电子有限公司 | High-sheet-resistance aluminum membrane |
| CN103456492B (en) * | 2013-09-06 | 2016-10-19 | 安徽赛福电子有限公司 | High-sheet-resistancaluminum aluminum membrane |
| CN103578754A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | Aluminum zinc metallized film with gradually-changing sheet resistance and for capacitor |
| CN103578755A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | High-sheet-resistance metalized film for filter capacitor |
| CN103756128A (en) * | 2013-12-18 | 2014-04-30 | 芜湖万润机械有限责任公司 | Isotactic polyethylene metallized film used for capacitors and preparation method thereof |
| CN104143434A (en) * | 2014-08-06 | 2014-11-12 | 安徽源光电器有限公司 | Small novel capacitor with gradient plating |
| CN112366081A (en) * | 2020-09-24 | 2021-02-12 | 铜陵市超越电子有限公司 | Inclined plane type metallized film and preparation device and processing method thereof |
| CN112366081B (en) * | 2020-09-24 | 2022-05-27 | 铜陵市超越电子有限公司 | Inclined-plane type metallized film and preparation device and processing method thereof |
| CN113345714A (en) * | 2021-07-05 | 2021-09-03 | 广东省塑镕科技有限公司 | Method for manufacturing box-packed metallized film capacitor |
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Application publication date: 20111221 |