CN102277564A - Process for chemical nickel-phosphorus alloy plating on surface of aluminum and silicon carbide composite material - Google Patents
Process for chemical nickel-phosphorus alloy plating on surface of aluminum and silicon carbide composite material Download PDFInfo
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- CN102277564A CN102277564A CN 201110259096 CN201110259096A CN102277564A CN 102277564 A CN102277564 A CN 102277564A CN 201110259096 CN201110259096 CN 201110259096 CN 201110259096 A CN201110259096 A CN 201110259096A CN 102277564 A CN102277564 A CN 102277564A
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- 238000007747 plating Methods 0.000 title claims abstract description 53
- 239000000126 substance Substances 0.000 title claims abstract description 33
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 26
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910001096 P alloy Inorganic materials 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052782 aluminium Inorganic materials 0.000 title abstract 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000008367 deionised water Substances 0.000 claims abstract description 32
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 32
- 150000002815 nickel Chemical class 0.000 claims abstract description 12
- 239000008139 complexing agent Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000003921 oil Substances 0.000 claims abstract description 5
- 239000003381 stabilizer Substances 0.000 claims abstract description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 16
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000001488 sodium phosphate Substances 0.000 claims description 14
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 14
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 14
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 13
- 229940078494 nickel acetate Drugs 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 11
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 10
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004327 boric acid Substances 0.000 claims description 9
- 235000010338 boric acid Nutrition 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 8
- 230000004913 activation Effects 0.000 claims description 8
- 229960000935 dehydrated alcohol Drugs 0.000 claims description 8
- 239000004310 lactic acid Substances 0.000 claims description 8
- 235000014655 lactic acid Nutrition 0.000 claims description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 8
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 8
- 238000007669 thermal treatment Methods 0.000 claims description 8
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 8
- 239000003153 chemical reaction reagent Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 230000002829 reductive effect Effects 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 5
- 235000019260 propionic acid Nutrition 0.000 claims description 5
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 5
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005034 decoration Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000002203 pretreatment Methods 0.000 claims description 4
- 239000001632 sodium acetate Substances 0.000 claims description 4
- 229960004249 sodium acetate Drugs 0.000 claims description 4
- 235000017281 sodium acetate Nutrition 0.000 claims description 4
- 239000011775 sodium fluoride Substances 0.000 claims description 4
- 235000013024 sodium fluoride Nutrition 0.000 claims description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 239000004115 Sodium Silicate Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- -1 stablizer Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 238000007788 roughening Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- HIRWGWMTAVZIPF-UHFFFAOYSA-N nickel;sulfuric acid Chemical compound [Ni].OS(O)(=O)=O HIRWGWMTAVZIPF-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a process for chemical nickel-phosphorus alloy plating on the surface of an aluminum and silicon carbide composite material, which comprises the following steps: pretreating the surface of a workpiece, removing oil, roughening, activating, plating and performing heat treatment, wherein chemical plating solution consists of a nickel salt, a reducer, a complexing agent, a stabilizer, a brightener and deionized water. The process disclosed by the invention is simple, convenient for operation, low in cost, high in efficiency, widely applicable, environment-friendly and capable of realizing industrial production; and the obtaining plating is bright, flat, uniform and compact.
Description
Technical field
The present invention relates to a kind of chemical plating nickel-phosphorus alloy technology, especially relate to a kind of aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology.
Background technology
Aluminum silicon carbide composite material except that requiring to have high heat conduction and the low thermal coefficient of expansion character, also requires to have weldability when being applied to the Electronic Packaging field; When being applied to optical system and making speculum, except that claimed structure is stable, also require to have thicker coating; Therefore, need be on aluminum silicon carbide composite material metal-coated membrane.
The aluminum silicon carbide composite material chemical nickel phosphorus plating technology of present domestic comparative maturity mainly only is directed to the high-volume fractional aluminum silicon carbide composite material, and at lactic acid system chemical nickel phosphorus plating, pH is controlled at 4.5, and phosphorus content is 5.8%; The plating process that next has when preparing speculum at aluminum silicon carbide composite material adopts and soaks zinc 2 times, behind the alkaline chemical nickel-plating phosphorus, acid chemical plating nickel phosphorus again, pH is controlled at 4～4.5, and phosphorus content reaches more than 11% in the coating, plating increases anti-film again, and technology is complicated, the cost height.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of technology simple, and cost is low, aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology applied widely.
The technical solution adopted for the present invention to solve the technical problems is: a kind of aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology comprises the steps:
(1) workpiece surface pre-treatment to be plated: with workpiece surface polishing to be plated, place the light polishing machine of salic medium, light decorations 15～45min, and clean;
(2) oil removing: will place that to contain massfraction be 8～15% sodium silicate aqueous solution through the workpiece to be plated after step (1) is handled, and clean 20～40min, and clean with deionized water again, and dry up;
(3) alligatoring: will be through the solution soaking of the workpiece to be plated after step (2) processing with hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water composition, in the described soaking solution, the volume ratio of hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water is (0.1～0.4): (1～1.5): (1～1.5): (1～1.5), soak 8～15min, clean with deionized water again, dry up;
(4) activation: the activated solution that workpiece to be plated that will be after step (3) alligatoring is formed with nickel acetate, inferior sodium phosphate, dehydrated alcohol and deionized water soaks, in the described activated solution, the mass ratio of nickel acetate, inferior sodium phosphate and dehydrated alcohol is 1:(0.8～1.2): (12～18), the amount of deionized water is 3～5 times of nickel acetate, soak 10～30min, clean with deionized water again, dry up; Then at 150～200 ℃ of thermal treatment 15～25min;
(5) plating: will place the chemical plating fluid of forming by nickel salt, reductive agent, complexing agent, stablizer, buffer reagent and deionized water through the workpiece to be plated after step (4) activation, in the described chemical plating fluid, nickel salt 20～30g/L, reductive agent is 15～25g/L, complexing agent is to contain boric acid in 15～60ml/L(such as the complexing agent, then the boric acid measure unit is " g/l "), stabiliser content is 1～10mg/L, buffer reagent is 0.5～2g/L; With ammoniacal liquor control chemical plating fluid pH value is 4.0～4.5, heating in water bath to 70～95 ℃, and plating speed is 5～12 μ m/h (plating time is definite according to required thickness of coating);
(6) thermal treatment: will place in the process furnace through the workpiece after step (5) plating, be heated to 200～300 ℃, behind constant temperature 30～90min, cooling.
Further, step (2), described cleaning can be adopted ultrasonic cleaning.
Further, step (5), described nickel salt preferably sulfuric acid nickel or nickel acetate.
Further, step (5), the preferred inferior sodium phosphate of described reductive agent.
Further, step (5), one or more in the preferred lactic acid of described complexing agent, propionic acid, acetate, the boric acid; At least three kinds in lactic acid, propionic acid, acetate, the boric acid more preferably.
Further, step (5), the preferred Pb of described stablizer
2+Or thiocarbamide.
Further, step (5), preferred sodium-acetate of described buffer reagent or Sodium Fluoride.
Technology of the present invention is simple, and is easy to operate, and cost is low, and the efficient height is applied widely, and environmentally safe can be realized suitability for industrialized production, gained coating light, smooth, even, fine and close, and by observation by light microscope, coating does not have foaming, peels off and phenomenons such as crackle.
Embodiment
The invention will be further described below in conjunction with embodiment.
Embodiment 1
At carborundum content is that chemical plating nickel-phosphorus alloy is carried out on 36% aluminum silicon carbide composite material surface, and its step is as follows:
(1) workpiece pre-treatment to be plated: with workpiece to be plated (carborundum content is 36% aluminum silicon carbide composite material workpiece) surface finish, place the light polishing machine of salic medium, light decorations 30min, and clean;
(2) oil removing: will place through the workpiece to be plated after step (1) is handled to contain the aqueous solution that massfraction is 10% water glass, ultrasonic cleaning 25min cleans with deionized water again, dries up;
(3) alligatoring: will be through the solution soaking of the workpiece to be plated after step (2) processing with hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water composition, in the described soaking solution, hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water volume ratio are 0.1:1:1:1, soak 10 min, clean with deionized water again, dry up;
(4) activation: the activated solution that workpiece to be plated that will be after step (3) alligatoring is formed with nickel acetate, inferior sodium phosphate, dehydrated alcohol and deionized water soaks, in the described activated solution, the mass ratio of nickel acetate, inferior sodium phosphate and dehydrated alcohol is 1:1:15, the amount of deionized water is 3 times of nickel acetate, soak 20 min, clean with deionized water again, dry up; At 170 ℃ of following thermal treatment 20min;
(5) plating: will place the chemical plating fluid of forming by single nickel salt, inferior sodium phosphate, lactic acid, boric acid, propionic acid and lead chloride, Sodium Fluoride and deionized water through the workpiece to be plated after step (4) activation, in the described chemical plating fluid, the content of single nickel salt is 25g/L, inferior sodium phosphate 15g/L, lactic acid is 25ml/L, and boric acid is 20g/L, and propionic acid is 10ml/L, lead chloride is 1mg/L, and Sodium Fluoride is 1g/L; With ammoniacal liquor control chemical plating fluid pH value is 4.5, and heating in water bath is 85 ℃, plating 8h;
(6) thermal treatment: will place in the process furnace through the plating piece after step (5) is handled, be heated to 250 ℃, behind the constant temperature 60min, cooling.
The present embodiment thickness of coating is 60 μ m, coating light, smooth, even, fine and close, and by observation by light microscope, coating do not have foaming, peel off the phenomenon with crackle; Carried out the soldering test to plating the back product under 265 ℃, it is smoothly firm that postwelding detects weld seam, satisfies the weldability requirement of Electronic Packaging.
Embodiment 2: at carborundum content is that chemical plating nickel-phosphorus alloy is carried out on 70% aluminum silicon carbide composite material surface, and its step is as follows:
(1) workpiece pre-treatment to be plated: with workpiece to be plated (carborundum content is 70% aluminum silicon carbide composite material workpiece) surface finish, place the light polishing machine of salic medium, light decorations 40min, and clean;
(2) oil removing: will place through the workpiece to be plated after step (1) is handled to contain the aqueous solution that massfraction is 12% water glass, ultrasonic cleaning 35min cleans with deionized water again, dries up;
(3) alligatoring: will be through the solution soaking of the workpiece to be plated after step (2) processing with hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water composition, in the described soaking solution, the volume ratio of hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water is 0.3:1:1:1, soak 12 min, clean with deionized water again, dry up;
(4) activation: the activated solution that workpiece to be plated that will be after step (3) alligatoring is formed with nickel acetate, inferior sodium phosphate, dehydrated alcohol and deionized water soaks, in the described activated solution, the mass ratio of nickel acetate, inferior sodium phosphate and dehydrated alcohol is 1:1:14, the amount of deionized water is 4 times of nickel acetate, soak 30min, clean with deionized water again, dry up; At 180 ℃ of following thermal treatment 16min;
(5) plating: will place the chemical plating fluid of forming by single nickel salt, inferior sodium phosphate, lactic acid, boric acid, acetate, thiocarbamide, sodium-acetate and deionized water through the workpiece to be plated after step (4) activation, in the described chemical solution, the content of single nickel salt is 25g/L, inferior sodium phosphate 25g/L, lactic acid is 25ml/L, and boric acid is 20g/L, and acetate is 10ml/L, thiocarbamide is 1mg/L, and sodium-acetate is 1g/L; With ammoniacal liquor control chemical plating fluid pH value is 4.0, and heating in water bath is 85 ℃, plating 15h;
(6) thermal treatment: will place in the process furnace through the plating piece after step (5) is handled, be heated to 240 ℃, behind the constant temperature 70min, cooling.
The present embodiment thickness of coating is 105 μ m, coating light, smooth, even, fine and close, and by observation by light microscope, coating do not have foaming, peel off the phenomenon with crackle; Carry out thermal shock test to plating the back product, behind 250 ℃ of insulation 60min, take out and put into tap water and cool off, reciprocal 10 times, under opticmicroscope, to observe, coating bubble do not occur, peels off and seminess; Grind the mirror surface image definition to plating the back product; Carried out the soldering test to plating the back product under 265 ℃, it is smoothly firm that postwelding detects weld seam, satisfies the weldability requirement of Electronic Packaging.
Claims (7)
1. an aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology is characterized in that, comprises the steps:
(1) workpiece surface pre-treatment to be plated: with workpiece surface polishing to be plated, place the light polishing machine of salic medium, light decorations 15～45min cleans;
(2) oil removing: will place that to contain massfraction be 8～15% sodium silicate aqueous solution through the workpiece to be plated after step (1) is handled, and clean 20～40min, and clean with deionized water again, and dry up;
(3) alligatoring: will be through the solution soaking of the workpiece to be plated after step (2) processing with hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water composition, in the described soaking solution, the volume ratio of hydrofluoric acid, nitric acid, hydrogen peroxide and deionized water is (0.1～0.4): (1～1.5): (1～1.5): (1～1.5), soak 8～15min, clean with deionized water again, dry up;
(4) activation: the activated solution that workpiece to be plated that will be after step (3) alligatoring is formed with nickel acetate, inferior sodium phosphate, dehydrated alcohol and deionized water, in the described activated solution, the mass ratio of nickel acetate, inferior sodium phosphate and dehydrated alcohol is 1:(0.8～1.2): (12～18), soak 10～30min, clean with deionized water again, dry up; Then at 150～200 ℃ of thermal treatment 15～25min;
(5) plating: will place the chemical plating fluid of forming by nickel salt, reductive agent, complexing agent, stablizer, buffer reagent and deionized water through the workpiece to be plated after step (4) activation, in the described chemical plating fluid, nickel salt 20～30g/L, reductive agent is 15～25g/L, complexing agent is 15～60ml/L, stabiliser content is 1～10mg/L, and buffer reagent is 0.5～2g/L; With ammoniacal liquor control chemical plating fluid pH value is 4.0～4.5, heating in water bath to 70～95 ℃, and plating speed is 5～12 μ m/h;
(6) thermal treatment: will place in the process furnace through the workpiece after step (5) plating, be heated to 200～300 ℃, behind constant temperature 30～90min, cooling.
2. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1, it is characterized in that: step (2), described cleaning are ultrasonic cleaning.
3. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1 and 2, it is characterized in that: step (5), described nickel salt are single nickel salt or nickel acetate.
4. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1 and 2, it is characterized in that: step (5), described reductive agent are inferior sodium phosphate.
5. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1 and 2, it is characterized in that: step (5), described complexing agent are lactic acid, propionic acid, acetate or boric acid.
6. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1 and 2, it is characterized in that: step (5), described stablizer are Pb
2+Or thiocarbamide.
7. described aluminum silicon carbide composite material chemical plating nickel-phosphorus alloy on surface technology according to claim 1 and 2, it is characterized in that: step (5), described buffer reagent are sodium-acetate or Sodium Fluoride.
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| CN 201110259096 CN102277564B (en) | 2011-09-05 | 2011-09-05 | Process for chemical nickel-phosphorus alloy plating on surface of aluminum and silicon carbide composite material |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102732865A (en) * | 2012-04-11 | 2012-10-17 | 中国电子科技集团公司第五十五研究所 | Chemical nickel plating solution and aluminum silicon carbide plating method |
| CN103498156A (en) * | 2013-09-27 | 2014-01-08 | 成都四威高科技产业园有限公司 | Surface coating technology of silicon carbide particle reinforced aluminium-based composite |
| CN104241025A (en) * | 2014-10-05 | 2014-12-24 | 青岛凯瑞电子有限公司 | Multilayer nickel plating process for relay shells |
| CN104313550A (en) * | 2014-11-13 | 2015-01-28 | 湖南航天诚远精密机械有限公司 | Surface modification method of silicon carbide space reflector |
| CN105603396A (en) * | 2016-01-07 | 2016-05-25 | 长沙岱勒新材料科技股份有限公司 | Method for plating surface of diamond with nickel |
| CN106381482A (en) * | 2016-09-13 | 2017-02-08 | 北京理工大学 | Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold |
| CN107304479A (en) * | 2017-06-19 | 2017-10-31 | 长沙博朗思达新材料科技有限公司 | A kind of coating method of silumin |
| CN108588691A (en) * | 2018-05-11 | 2018-09-28 | 西安朗赛精密机械有限公司 | A kind of plating Ni methods of aluminium silicon carbide material |
| CN109267045A (en) * | 2018-11-13 | 2019-01-25 | 北京卫星制造厂有限公司 | Enhancing aluminum-base composite material by silicon carbide particles gold plate preparation method and application |
| CN111690931A (en) * | 2020-06-05 | 2020-09-22 | 中国科学院金属研究所 | Aluminum alloy surface multilayer composite coating and preparation method thereof |
| CN113564594A (en) * | 2021-07-13 | 2021-10-29 | 珠海亿特立新材料有限公司 | Surface treatment method for aluminum silicon carbide |
| CN114150297A (en) * | 2021-10-29 | 2022-03-08 | 北京卫星制造厂有限公司 | Chemical nickel plating method for surface of high-volume aluminum-based silicon carbide composite material |
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