CN102270731A - Formwork with frame, its manufacturing method and application - Google Patents
Formwork with frame, its manufacturing method and application Download PDFInfo
- Publication number
- CN102270731A CN102270731A CN2011102563568A CN201110256356A CN102270731A CN 102270731 A CN102270731 A CN 102270731A CN 2011102563568 A CN2011102563568 A CN 2011102563568A CN 201110256356 A CN201110256356 A CN 201110256356A CN 102270731 A CN102270731 A CN 102270731A
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- Prior art keywords
- template
- framework
- component
- tool framework
- dry film
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000009415 formwork Methods 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 59
- -1 pottery Substances 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 32
- 239000011230 binding agent Substances 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 238000004020 luminiscence type Methods 0.000 claims description 19
- 229920003023 plastic Polymers 0.000 claims description 17
- 239000004033 plastic Substances 0.000 claims description 17
- 239000000178 monomer Substances 0.000 claims description 15
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- 229920002521 macromolecule Polymers 0.000 claims description 12
- 239000003086 colorant Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 2
- 238000001459 lithography Methods 0.000 abstract 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- 238000002360 preparation method Methods 0.000 description 16
- 239000003292 glue Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
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- 238000010586 diagram Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000004386 diacrylate group Chemical group 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000001261 hydroxy acids Chemical group 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- KEVMYFLMMDUPJE-UHFFFAOYSA-N 2,7-dimethyloctane Chemical group CC(C)CCCCC(C)C KEVMYFLMMDUPJE-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 2
- BFCSDUSGSAKFRM-UHFFFAOYSA-N 7a-ethyl-4,5,6,7-tetrahydro-3ah-2-benzofuran-1,3-dione Chemical compound C1CCCC2C(=O)OC(=O)C21CC BFCSDUSGSAKFRM-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical class COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000005937 allylation reaction Methods 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 150000003931 anilides Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000006266 etherification reaction Methods 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229940117969 neopentyl glycol Drugs 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- XDOKTFVKMCURIN-UHFFFAOYSA-N (2-amino-4-methylphenyl)-(4-methylphenyl)methanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=C(C)C=C1N XDOKTFVKMCURIN-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- RLYNGYDVXRKEOO-XQHVRGAUSA-N (e)-but-2-enoic acid Chemical compound C\C=C\C(O)=O.C\C=C\C(O)=O RLYNGYDVXRKEOO-XQHVRGAUSA-N 0.000 description 1
- HCITUYXHCZGFEO-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.N=C1NC(=N)NC(=N)N1 HCITUYXHCZGFEO-UHFFFAOYSA-N 0.000 description 1
- JMFCAIUTSABFDU-UHFFFAOYSA-N 1,6-diisocyanatohexane Chemical compound O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O JMFCAIUTSABFDU-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- LOBSVGRXQAHJDT-UHFFFAOYSA-N 1-morpholin-4-ylpropan-2-one Chemical compound CC(=O)CN1CCOCC1 LOBSVGRXQAHJDT-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- UECGJSXCVLTIMQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxycarbonyl)cyclohexane-1-carboxylic acid Chemical compound OC(=O)C1CCCCC1C(=O)OCCOC(=O)C=C UECGJSXCVLTIMQ-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FIQBJLHOPOSODG-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]benzoic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=CC=C1C(O)=O FIQBJLHOPOSODG-UHFFFAOYSA-N 0.000 description 1
- GWFCWZQFUSJPRE-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]cyclohexane-1-carboxylic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1CCCCC1C(O)=O GWFCWZQFUSJPRE-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LNGIIXGLYTUUHJ-UHFFFAOYSA-N 2-methylbut-2-enoic acid methyl 2-methylprop-2-enoate Chemical compound COC(=O)C(C)=C.CC=C(C)C(O)=O LNGIIXGLYTUUHJ-UHFFFAOYSA-N 0.000 description 1
- LARNQUAWIRVQPK-UHFFFAOYSA-N 2-methyloxiran-2-amine Chemical compound NC1(CO1)C LARNQUAWIRVQPK-UHFFFAOYSA-N 0.000 description 1
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical group COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 1
- CVKGSDYWCFQOKU-UHFFFAOYSA-N 2-n-butyl-1,3,5-triazine-2,4,6-triamine Chemical compound CCCCNC1=NC(N)=NC(N)=N1 CVKGSDYWCFQOKU-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- NAORGNSYBDQEPT-UHFFFAOYSA-N 3-phenylprop-2-enoic acid Chemical compound OC(=O)C=CC1=CC=CC=C1.OC(=O)C=CC1=CC=CC=C1 NAORGNSYBDQEPT-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- RWHRFHQRVDUPIK-UHFFFAOYSA-N 50867-57-7 Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O RWHRFHQRVDUPIK-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- RIRLUHWQUCXKAC-UHFFFAOYSA-N 7a-ethyl-4,5-dihydro-3ah-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21CC RIRLUHWQUCXKAC-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
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Images
Abstract
The invention provides a template with a frame, which comprises a substrate and at least 2 frames positioned on one side of the substrate, wherein the frames are formed by one lithography process, the thickness of each frame is 75-500 micrometers, and the width of each frame is 50-500 micrometers. The invention also provides a method for manufacturing the template and application thereof. The invention can easily realize the design of the light-emitting component with high integration degree, and further can provide higher luminous power.
Description
Technical field
The invention relates to a kind of template and manufacture method thereof of tool framework, refer to a kind of template of the luminous power that improves luminescence component and the luminescence component of manufacture method and manufacturing thereof thereof especially.
Background technology
Luminescence component is light-emitting diode component (LED) particularly, compared to traditional cathode fluorescent tube (CCFL), belong to the solid-state semiconductor material and be difficult for infringement, and itself is not mercurous so do not have an environmental issue of mercury pollution, in addition, light-emitting diode component also has power saving, lightly reaches characteristics such as long service life.Moreover, light-emitting diode component has the technical characterictic that can utilize local control switch, therefore can show better light and shade contrast (contrast), and light-emitting diode component has broader color saturation (color saturation), and light-emitting diode component can switch out and close faster, so be applied in the problem that can reduce ghost in the dynamic performance of display, so light-emitting diode component has begun in recent years to be widely used on the lamp source of billboards, display or room lighting.
The be designed to single chips of tradition light-emitting diode component on the lamp source independently becomes a LED lamp source, but the design of this mode and can't satisfying is applied on the display on the lightening or room lighting demand to high luminous efficiency, in order to address the above problem, one of prior art solves the problem of luminous efficiency deficiency with the light extraction efficiency that improves light-emitting diode chip for backlight unit, but this kind mode can be spread out again and stretched out the luminous problem that thermal source is concentrated that can produce simultaneously.
Therefore, the design of a plurality of light-emitting diode chip for backlight unit on single substrate is a kind ofly can satisfy solution lightening and that improve luminous efficiency simultaneously, prior art is with the applying processing mode of the thermoplastic resin framework as light-emitting diode component, but this kind mode also can't reach the required high-resolution demand of highdensity light-emitting diode chip for backlight unit, in addition, the made framework of applying processing mode of above-mentioned thermoplastic resin has thickness inequality and the not good problem of flatness, and the production cost that the speed of processing procedure also makes slowly improves.
Summary of the invention
In view of this, main purpose of the present invention is for providing a kind of template of tool framework, described template comprises at least 2 frameworks that a base material and is positioned at a side of described base material, wherein said framework is to form by a micro-photographing process, the thickness of described framework be between between 75 microns to 500 microns and the width of described framework be between 50 microns to 500 microns.
The present invention proposes a kind of manufacture method of template of tool framework in addition, comprises: a substrate is provided; Form at least 2 frameworks on described substrate; Wherein said at least 2 frameworks are to utilize a micro-photographing process to form, and described micro-photographing process comprises: at least one dry film photoresist layer of pressing is arranged at described dry film photoresist layer top with a photomask on described base material; The irradiation energy ray solidifies and graphical described dry film photoresist layer, with the not zone development removal of irradiation energy ray, to form at least 2 frameworks.
The present invention proposes a kind of luminescence component in addition, and described assembly comprises at least 2 chips; Packaging plastic; And as above-mentioned template, wherein said chip is positioned at described framework, and described packaging plastic coats described chip.
The invention has the beneficial effects as follows: the template that the invention provides a kind of tool framework, utilize the formed framework of micro-photographing process one time, have meticulousr thickness and width, be applied to the characteristic that luminescence component has high integration, and then can provide higher luminous power, in addition, template of the present invention can be utilized simpler and easy and form than the manufacture method of environmental protection, can improve the uniformity of luminescence component middle frame and the problem of flatness.
Description of drawings
Fig. 1 is the schematic diagram of a preferred embodiment of the template of tool framework of the present invention.
Fig. 2 is the schematic diagram according to the template of one group of preferred implementation of the present invention.
Fig. 3 is the schematic diagram according to the template of another group preferred implementation of the present invention.
Fig. 4 is the schematic diagram according to the template of another group preferred implementation of the present invention.
Fig. 5 is the schematic diagram according to the template processing procedure of a preferred implementation of the present invention.
Fig. 6 is the schematic diagram of a preferred implementation of luminescence component of the present invention.
Fig. 7 is the schematic diagram of another preferred implementation of luminescence component of the present invention.
Fig. 8 is the template figure according to the tool framework of a preferred implementation of the present invention.
[primary clustering symbol description]
H1: thickness
L1: the length of side
L2: the length of side
L3: diameter
W1: width
W2: width
W3: width
11: base material
12: framework
121: the dry film photoresistance
22: framework
32: framework
42: framework
51: base material
52A: dry film photoresistance
52B: dry film photoresistance
53: framework
61: chip
62: packaging plastic
63: template
631: base material
632: framework
71: chip
721: packaging plastic
722: fluorescent glue
73: template
731: base material
732: outside framework
733: inner frame
Embodiment
Please refer to Fig. 1, be the schematic diagram of a preferred embodiment of the template of a kind of tool framework of the present invention.As shown in Figure 1, described template comprises a base material 11, and a side surface of this base material has at least 2 frameworks 12.Above-mentioned base material 11 can be metal, pottery, silicon wafer, plastics, Bo Li Fiber Victoria base material or its combination and can comprise active or the passive type drive circuit.Above-mentioned metal base is such as but not limited to Copper Foil.The adoptable resin kind of described plastic base, for example can be but be not limited to: mylar (polyester resin), as polyethylene terephthalate (polyethylene terephthalate, PET) or Polyethylene Naphthalate (polyethylene naphthalate, PEN); Polyacrylate resin (polyacrylate resin), as polymethyl methacrylate (polymethyl methacrylate, PMMA); Vistanex (polyolefin resin) is as polyethylene (PE) or polypropylene (PP); Poly-cyclic olefin resins (polycycloolefin resin); Polyimide resin (polyimide resin); Polycarbonate resin (polycarbonate resin); Polyurethane resin (polyurethane resin); Triafol T (triacetyl cellulose, TAC); PLA (polylactic acid), or its combination.Be preferably mylar, polycarbonate resin or its combination.
The shape of described framework 12 there is no particular restriction, for example can be square, rectangle, rhombus (rhombus), circle, oval (elliptical) etc., is preferably square, rectangle, rhombus or circle.According to one group of preferred implementation of the present invention, as shown in Figure 2, when described framework 22 is square, the outermost length of side L1 of framework is preferably 150 microns (μ m) to 2000 microns (μ m), and the width W 1 of described framework is between 50 microns to 500 microns, according to another group preferred implementation of the present invention, as shown in Figure 3, when described framework 32 is rectangle, the outermost minimum length of side L2 of framework is between 150 microns to 2000 microns, and the width W 2 of described framework is between 50 microns to 500 microns, according to another group preferred implementation of the present invention, as shown in Figure 4, when described framework 42 was circular, the width W 3 that the outermost diameter L3 of framework is preferably 150 microns to 2000 microns and described framework was between 50 microns to 500 microns.Described framework can be transparent or white according to circumstances.
The thickness h 1 of described framework 12 there is no particular restriction, the present invention generally is between 75 microns to 500 microns, be preferably between 75 microns to 425 microns, better is between 75 microns to 300 microns, if then the thickness of formwork integral is too big greater than 500 microns for thickness, do not meet slimming and light-weighted characteristic when being applied to light-emitting diode component, less than 75 microns, follow-up packaging effect is not good when then being applied to light-emitting diode as if thickness.The width of described framework 12 there is no particular restriction, and the present invention generally is between 50 microns to 500 microns, is preferably between 100 microns to 350 microns.
Described framework 12 is to comprise one deck dry film photoresistance 121 at least, is preferably 2 to 5 layers of dry film photoresistance, is example as if the dry film photoresistance 121 with 2 layers of structure, and the thickness of described dry film photoresistance 121 can be and is about 100 microns to 200 microns.Described dry film photoresistance 121 is made up of light resistance composition, and described light resistance composition comprises a) at least one photo curable monomer or oligomer or its mixture; B) macromolecule binder; C) light trigger; And d) thermoinitiators.
Component a) is preferably and is selected from the group that acrylic ester monomer, methacrylate ester monomer, acrylic ester oligomer, methacrylate ester oligomer and composition thereof are formed, according to a preferred implementation of the present invention, the component of photoresistance composition of the present invention a) is selected from the group that acrylic ester monomer, methacrylate ester monomer and composition thereof are formed for having at least two.Be applicable to monomer in the present composition be selected from by, acrylic acid ethoxy ethoxy ethyl ester (ethoxyethoxyethyl acrylate), diacrylate tripropylene glycol fat (Tripropylene Glycol Diacrylate), diisoamyl tetrol six acrylate (Dipentaerythritol hexacrylate), 1,4-butanediol diacrylate (1,4-butanediol diacrylate), 1,4-butanediol dimethylacrylate (1,4-butanediol dimethacrylate), 1,6-hexanediyl ester (1,6-hexanediol diacrylate), 1,6-hexanediol dimethacrylate (1,6-hexanediol dimethacrylate), neopentyl glycol diacrylate (neopentylglycol diacrylate), neopentyl ethylene glycol dimethacrylate (neopentylglycol dimethacrylate), polyethyleneglycol diacrylate (polyethyleneglycol diacrylate), polyethylene glycol dimethacrylate (polyethyleneglycol dimethacrylate), neopentyl ethylene glycol bisthioglycolate acrylic acid adipate ester (neopentylglycol dipate diacrylate), neopentyl ethyleneglycol dimethacrylate adipate ester (neopentylglycol dipate dimeth acrylate), neopentyl ethylene glycol bisthioglycolate acrylic acid 3-hydroxypivalic acid ester (neopentylglycol diacrylate hydroxypivalate), neopentyl ethyleneglycol dimethacrylate 3-hydroxypivalic acid ester (neopentylglycol dimethacrylate hydroxypivalate), diacrylate bicyclopentadiene ester (dicyclopentdienyl diacrylate), dimethacrylate bicyclopentadiene ester (dicyclopentdienyl dimetacrylate), the diacrylate bicyclopentadiene ester of caprolactone upgrading, the dimethacrylate bicyclopentadiene ester of caprolactone upgrading, the diacrylate cyclohexyl of allylation (allylated cyclohexyl diacrylate), the dimethacrylate cyclohexyl of allylation (allylated cyclohexyl dimethacrylate), diacrylate chlorinated isocyanurates (isocyanurate diacrylate), dimethacrylate chlorinated isocyanurates (isocyanurate dimethacrylate), trimethylolpropane triacrylate (trimethylol propane triacrylate), trimethylol-propane trimethacrylate (trimethylol propane trimethacrylate), two pentaerythrityl triacrylates (dipentaerythriol triacrylate), two pentaerythrityl trimethyl acrylic esters (dipentaerythriol trimethacrylate), the pentaerythrityl triacrylate, the pentaerythrityl trimethyl acrylic ester, trimethyl three methyl acrylates, trimethyl trimethyl methyl acrylate, three (propylene oxygen ethyl) isocyanide uraturia ester (tris (acryloxyethyl) isocyanurate), two pentaerythrityls, five acrylate, two pentaerythrityl pentamethyl acrylate, two pentaerythrityls, six acrylate, the group that two pentaerythrityl hexamethyl acrylate and composition thereof are constituted.
In 100 parts by weight of component, component content a) is 10 to 40 weight portions, is preferably 20 to 30 weight portions.
Components b) in the middle of light resistance composition of the present invention, plays the part of the role of solid (binder), can give dry film photoresistance of the present invention good film forming and flexibility, via forming framework behind the exposure imaging with even pattern, can improve luminous uniformity when being applied to light-emitting diode, and then promote luminous efficiency.According to a preferred implementation of the present invention, the macromolecule binder is to contain acrylic monomers, methacrylic acid or its mixture polyacrylic binder as polymerized unit, because it has carboxyl (COOH), so can promote the developing powder of light resistance composition, and can increase the crosslink density of light resistance composition via thermmohardening.The weight average molecular weight of this polyacrylic binder (Mw) is generally Mw=15000 to 60000, be preferably weight average molecular weight and be (Mw) Mw=25000 to 40000, the acid value scope of polyacrylic binder is generally 130 to 280mg KOH/g, and being preferably the acid value scope is 160 to 260mg KOH/g.
Can be used for the polyacrylic binder in the light resistance composition of the present invention, contain unsaturated carboxylic acid monomer as polymerized unit.The unsaturated carboxylic acid monomer that is fit to there is no particular restriction, it for example, but be not limited to, acrylic acid (acrylic acid), methacrylic acid (methacrylic acid), crotonic acid (crotonic acid), cinnamic acid (cinnamic acid), 2-metering system anilide oxygen ethyl succinate (2-methacryloyloxyethyl succinate), 2-propylene anilide oxygen ethyl succinate (2-acryloyloxyethyl succinate), 2-metering system anilide oxygen ethyl six hydrogen phthalate esters (2-methacryloyloxyethyl hexahydrophthalate), 2-propylene anilide oxygen ethyl six hydrogen phthalate esters (2-acryloyloxyethyl hexahydrophthalate), 2-metering system anilide oxygen ethyl phthalate ester (2-methacryloyloxyethyl phthalate), 2-propylene anilide oxygen ethyl phthalate ester (2-acryloyloxyethyl phthalate) or its mixture are preferably acrylic or methacrylic acid or its mixture; And other does not contain the monomer of acid, it for example, but be not limited to methyl acrylate (methyl acrylate), ethyl acrylate (Ethyl Acrylate), hydroxy ethyl methacrylate (Hydroxyethyl Acrylate), butyl acrylate (Butyl Acrylate), hydroxypropyl acrylate (2-Hydroxypropyl Acrylate), methyl methacrylate (Methyl MethAcrylate), EMA (Ethyl methacrylate), butyl methacrylate (Butyl methacrylate), methacrylic acid-2-hydroxy methacrylate (2-Hydroxyethyl methacrylate), styrene (Styrene), methacrylic acid glycidic acid (Glycidyl methacrylate), methacrylic acid phenylester (Benzyl methacrylate).
According to a preferred implementation of the present invention, the side chain of macromolecule binder can further comprise (methyl) polyacrylic binder of photo curable group, above-mentioned macromolecule binder acid value scope is generally 70 to 130mg KOH/g, and being preferably the acid value scope is 80 to 110mg KOH/g.Above-mentioned macromolecule binder can improve the crosslink density of light resistance composition, can improve the not good phenomenon of flatness of the dry film photoresistance that is applied to light-emitting diode, and can improve the weather-proof character of dry film photoresistance, for example be applicable to (methyl) polyacrylic binder that side chain of the present invention has a photo curable group, but be not limited to
In 100 parts by weight of component a), components b) content is 40 to 70 weight portions, is preferably 50 to 60 weight portions.
The amount of component b of light resistance composition of the present invention) be light trigger (photo initiator), it can provide free radical (free radical) after rayed, sees through the transmission of free radical, initiated polymerization.The kind of light trigger is known by those skilled in the art, being applicable to that light of the present invention rises makes agent for example, but be not limited to, diphenylhydroxyethanone (benzoin), diphenylhydroxyethanone alkyl ether (benzoin alkyl ether), two phenylglyoxals (benzil), ketal (ketals), acetophenone compound (acetophenones), benzophenone (benzophenone), 4,4 '-dimethyl-amido-benzophenone (4,4 '-dimethyl-amino-benzophenone), thioxanthones (thioxanthones), horse forint-acetonide (morpholino-propanone) or its mixture.According to the present invention, amount of component b) consumption of light trigger there is no particular restriction, can be optionally according to the contained component of inorganic agent a) monomer or the kind and the consumption thereof of oligomer adjust.Generally speaking, in component a) and b) totally 100 weight portions, amount of component b) content be 0.5 to 8.0 weight portion, be preferably 1.5 to 5.0 weight portions.
The formed dry film photoresistance of light resistance composition of the present invention is applied in the light-emitting diode, need accept the light source photograph that exposes to the sun for a long time, cause the dry film photoresistance to produce the problem of xanthochromia easily, therefore light resistance composition of the present invention can optionally comprise the light trigger c2 of the type of anti-the xanthochromia), according to a preferred implementation of the present invention, the light trigger of the type of anti-xanthochromia the of the present invention (c2) is a benzene first anilide phosphinoxides light trigger, the light trigger that is applicable to the type of anti-xanthochromia the of the present invention for example, but be not limited to 2,4,6-trimethylbenzene first anilide-diphenyl phosphine oxide (2,4,6-Trimethylbenzoyl-diphenyl-phosphineoxide), (Phenylbis (2 for two benzene first anilide phenyl phosphine oxides, 4,6-trimethylbenzoyl)-phosphineoxide), 2,6-two fluoro-3-pyrroles phenyl two luxuriant titaniums (Bis (2,6-difluoro-3-(1-hydropyrrol-1-yl) phenyl) titanocene).According to a preferred implementation of the present invention, in component a) and b) totally 100 weight portions, amount of component b 2) content be less than 8.0 weight portions, be preferably 1.5 to 3.0 weight portions.
The component d of light resistance composition of the present invention) thermoinitiators (thermo-curing agent), being meant is heated can harden or reach in the permanent sclerosis person of a certain temperature meeting.Be applicable to that curing agent of the present invention can be acid anhydrides, epoxy resin, melamine or methyl isocyanate (isocyanate) or its mixture.Spendable acid anhydrides there is no particular restriction, it for example, but be not limited to maleic anhydride (maleic anhydride), phthalate anhydride (phthalic anhydride), tetrahydrochysene phthalate anhydride (tetrahydrophthalic anhydride), hexahydrophthalic acid anhydride (hexahydrophthalic anhydride), methyl tetrahydrochysene phthalate anhydride (methyltetrahyrophthalic anhydride), ethyl tetrahydrochysene phthalate anhydride (ethyltetrahydrophthalic anhydride), methyl hexahydrophthalic acid anhydride (methylhexahydrophthalic anhydride), ethyl hexahydrophthalic acid anhydride (ethylhexahydrophthalic anhydride), succinyl oxide (succinic anhydride) or itaconicacid acid anhydride (itaconic anhydride) or its mixture.Can use the epoxy resin as curing agent is to know in those skilled in the art, it for example, but be not limited to, bisphenol-type epoxy resin (bisphenol type epoxy resin), phenolic resin varnish (phenol novolac type epoxy resin), cresol novolak epoxy (cresol novolac type epoxy resin), naphthalene are that epoxy resin (naphthalene type epoxy resin), epoxy propyl ester (gylcidyl ester) are that resin or epoxy propylamine (glycidyl amine) are resin or its mixture.Can use melamine (melamine) and derivative thereof as curing agent is to know in those skilled in the art, it for example, but be not limited to, high degree of etherification falling methyl-etherified amino resins (Hexamethoxymethyl-melamine-formaldehyde), high degree of etherification falling methyl ether/n-butyl ether amino resins (Hexamethoxymethyl/n-butyl-melamine), n-butyl ether-2,4-two amidos-6-phenyl-s-three nitrogen land surrounds (n-butylated benzoguanamine).Can use methyl isocyanate (isocyanate) and derivative thereof as curing agent is to know in those skilled in the art, it for example, but be not limited to, 1, hexamethylene-diisocyanate (1,6-diisocyanatohexane), two isocyanic acid isophorones (Isophorone diisocyanate), 4,4 '-methyl diphenylene diisocyanate (4,4 '-diphenylmethanediisocyanate), toluene di-isocyanate(TDI) (Tolylene diisocyanate).
Light resistance composition of the present invention optionally can add component e) filler (filler), it for example but is not limited to silicon dioxide, barium sulfate, talcum powder, feldspar, silicon sand, sandstone, crystalline lime stone, bead, synthesis type resin bead or its mixture.Be preferably silicon dioxide, add filler and can make dry film photoresistance of the present invention have good film forming,, can improve luminous uniformity when being applied to light-emitting diode, and then promote luminous efficiency via forming framework behind the exposure imaging with even pattern.
Generally speaking, in component a) and b) totally 100 weight portions, component e) content of filler is 3 to 10 weight portions, is preferably 5 to 8 weight portions.
Light resistance composition of the present invention optionally can add component f) colorant, the colorant that can give color is for known to those of ordinary skills, it can be organic toner or inorganic color.Inorganic color generally is the mineral material, comprising: titanium dioxide, iron oxide, chromium system, black titanium, carbon black, silver slurry etc., organic toner mainly comprises: azo material, cyanines class material etc.According to an embodiment of the present invention for adding white colorant, increase the reflectivity of framework to light source, can improve the luminous efficiency of light source, spendable white colorant its for example, but be not limited to titanium dioxide, calcium carbonate, zinc sulphide, zinc oxide or its mixture.
Generally speaking, in component a) and b) totally 100 weight portions, component f) content of white colorant is 50 to 100 weight portions.
Light resistance composition of the present invention can further add chain-transferring agent g) (chain transfr agent), when radiation curing, can increase the dry film photoresistance than the circuit adhesive force of degree of solidifying in the depths and base of frame, and then reduce the situation of lateral erosion (under cut) when developing.For example be applicable to chain-transferring agent of the present invention, sulphur compound, unsaturated or saturated halogenated hydrocarbon, aldehydes, acetals etc.Generally speaking, in component a) and b) totally 100 weight portions, chain-transferring agent g) content be less than 0.5 weight portion, be preferably 0.09 to 0.2 weight portion.
Light resistance composition of the present invention optionally can add the known component h of those skilled in the art those skilled in the art) additive, it for example, but be not limited to solvent (as acetone, butanone or isopropyl alcohol), fire retardant, thermal stabilizer, antioxidant, light stabilizer, lubricant, defoamer, smooth dose or its combination.
As shown in Figure 5, framework 12 of the present invention is to form by a micro-photographing process, and described micro-photographing process comprises:
1. at least one dry film photoresist layer of pressing 52A is on described base material 51;
2. a photomask is arranged at described dry film photoresist layer 52A top; The irradiation energy ray solidifies and graphical described dry film photoresist layer 52B;
3. the development of the zone of irradiation energy ray is not removed, to form at least 2 frameworks 53.
Described dry film photoresistance has characteristics such as high-resolution, fast, the anti-metallide of developing powder, anti-electroless plating and high-temp resisting high-humidity resisting, according to a preferred implementation of the present invention, at least one dry film photoresist layer of above-mentioned pressing 52A utilizes the dry film photoresistance 52A before hot pressing roller (lamination roller) processing procedure will expose to be formed on the base material 51, hot pressing speed 1.0～3.0m/min wherein, 100～120 ℃ of pressing-in temps, pressing pressure 2.5～3.5kg/cm
2In another preferred implementation, be that the dry film photoresistance 52A before utilizing vacuum pressing-combining (vacuum lamination) processing procedure to expose is formed on the base material 51, wherein inhale vacuum degree 〉=1.0mBar, 40～70 ℃ of pressing-in temps, pressing pressure 2～4kg/cm
2
According to one embodiment of the invention, above-mentioned irradiation energy ray is ultraviolet ray (UV), and irradiation ultraviolet radiation (UV) back produces polymerization reaction and solidifies described dry film photoresistance 52B, and the ultraviolet irradiation energy is about 100-1400mJ/cm
2, again with aqueous sodium carbonate with on the dry film photoresistance not the zone of irradiation energy ray develop to remove.At last again with high-temperature baking, the resin of dry film photoresistance is hardened fully to form 2 frameworks 53 at least, the thickness of baking temperature and time visible frame and deciding, according to one embodiment of the invention, toasted 30～60 minutes down with 60～80 ℃ earlier, again with 100～120 ℃ of bakings 30 minutes, at last again with about 150 ℃ of bakings 60 minutes.
Template of the present invention can be applicable on the luminescence component, such as but not limited to light-emitting diode component (LED), but make the more lightening and whole luminous power of lifting subassembly of component design, the manufacture method of above-mentioned luminescence component there is no particular restriction, can those skilled in the art's method known, for example with the dry film photoresistance with said method after forming framework on the base material, in framework, attach at least one chip again, coat said chip with packaging plastic again, solidify described packaging plastic.After the packaging plastic of luminescence component solidifies, can optionally remove framework, the method that removes described framework there is no particular restriction, for example can soak alkaline solution to remove said frame, the kind of above-mentioned packaging plastic there is no particular restriction, it for example but is not limited to epoxy resin (epoxy resin), silicones (silicone resin) or its mixture.
Figure 6 shows that the preferred implementation of template applications of the present invention on luminescence component.Described assembly comprises at least 2 chips 61, is light-emitting diode chip for backlight unit according to one of execution mode of this case; Packaging plastic 62; And as above-mentioned template 63, described template comprises a base material 631, one side surface of this base material has at least 2 frameworks 632, described chip is positioned at described framework, described packaging plastic coats described chip, said frame can be temporary or permanent being present on the luminescence component, if temporary exist available said method to remove above-mentioned dry film photoresistance after described luminescence component promptly do not have described framework.
Figure 7 shows that template applications of the present invention another preferred implementation on luminescence component.Described assembly comprises at least 2 chips 71, is light-emitting diode chip for backlight unit according to one of execution mode of this case; Packaging plastic 721; Fluorescent glue 722 comprises fluorescent material and transparent resin according to one of the execution mode of this case described fluorescent glue; And as above-mentioned template 73, described template comprises a base material 731, and a side surface of this base material has at least 2 outside frameworks 732, and further comprises at least 2 inner frames 733; Described chip is positioned at described inner frame, after coating described chip with described fluorescent glue, coat described inner frame, described fluorescent glue and described chip with described packaging plastic again, the thickness or the width demand of looking of above-mentioned Nei Kuang Jia With outside framework can be identical or different, be all identical according to one of the execution mode of this case inner frame with the thickness and the width of outside framework, above-mentioned inner frame or outside framework can be temporary or permanent being present on the luminescence component, if temporary exist available said method to remove above-mentioned dry film photoresistance after described luminescence component promptly do not have described framework.
Above-mentioned luminescence component can be used in the backlight (back Light) in billboards, illumination (Lighting) or the display etc.
The present invention will be further described with following example.
Preparation example 1
The light resistance composition (seeing Table 1) of the following composition of preparation tool, wherein the macromolecule binder has photo curable polyacrylic binder (b1) based on side chain.
Preparation example 2
The light resistance composition (seeing Table 1) of preparation tool following composition, wherein light trigger has the type of anti-xanthochromia light trigger (c21) and (c22).
Preparation example 3
The light resistance composition (seeing Table 1) of the following composition of preparation tool has wherein added chain-transferring agent (g1).
Preparation example 4
The light resistance composition (seeing Table 1) of the following composition of preparation tool, wherein having added colorant is titanium dioxide (f1).
Preparation example 5
The light resistance composition (seeing Table 1) of the following composition of preparation tool, wherein the macromolecule binder is only to have the structure of hydroxy-acid group separately; Light trigger is based on general common light trigger; And there is not any chain-transferring agent of adding.
Table 1: light resistance composition (preparation example 1～5) is formed submeter
A1: the epoxy acrylate of polyalcohols upgrading (Acrylated Epoxy Polyol) oligomer (Cognis corporate system, Photomer 4025)
B1:
R wherein
1Be methyl; R
2Be the photo curable acrylate group of tool.
R1 is methyl (DAICEL CHEMICAL corporate system, CYCLOMER-P (ACA) FAP-01)
B2: polyacrylic acid binder (mean molecule quantity is between 15000 to 30000, and acid value is between 180 to 250mg KOH/g)
C11: benzene idol vinegar dimethyl ketal (
Corporate system,
651)
C12:2, the 4-diethyl thioxanthone (
Corporate system, DETX)
C13:2-methyl isophthalic acid-(4-methyl mercapto phenyl)-2-morpholinyl-1-acetone (
Corporate system,
907)
C21:2,4,6-trimethylbenzene first anilide-diphenyl phosphine oxide light trigger (
Corporate system,
TPO)
C22: two benzene first anilide phenyl phosphine oxide light triggers (
Corporate system,
819)
D1:
R be methoxymethyl or other curing agent of n-butyl (ratio is 55/45) (the MONSANTO corporate system, RESIMENE755)
E1: silica-filled dose (the Cabot corporate system, Cab-SIL-M5)
F1: the titanium dioxide filler (the Sachtleben corporate system, RDIS)
G1: anilinoacetic acid chain-transferring agent
H1: butanone and isopropyl alcohol mixed solvent
Embodiment 1
After light resistance composition (preparation example 1) mixes, prepare about 45～60% solid content glue, with described glue be coated with by on 80 normality polyester films of biaxial oriented stretch and be dried to about 1% or still less residual solvent amount form the dry film photoresistance, afterwards then with the dry film photoresistance with thermal roller pressing machine under about 110 ℃ with 1.5m/min speed and 3kg/cm
2The pressure lamination covers on the copper composite plate to the 1 ounce/FR-4/1 ounce of handling through mechanical scrub.After finishing above-mentioned work of treatment, repeat said process again three times, after described dry film photoresistance thickness is promoted to 300 microns by repeating to fit, described layered composite board is placed to see through suitable optical tooling on ultraviolet ray (UV) exposure machine in order to through adjusting intensity 120-350 (mJ/cm again
2) energy exposure give imaging, and obtain available
21 rank wedges record different copper rank.Composite base plate after then will exposing goes out 28 ℃ via the spray cloth developing machine that uses conveyer to drive with about 24～26psi spray cloth, 0.85% aqueous sodium carbonate is developed, its residence time makes composite plate at 50～55% development point through being adjusted to, and then imposes hydro-peening for several times with running water and deionized water.Last carry out heat baking 1 hour via 150 ℃ baking oven again, form the template of tool framework, specifically figure as shown in Figure 8.
Embodiment 2
Light resistance composition (preparation example 2) prepares about 45～60% solid content glue after mixing, and the manufacture of the template of formation tool framework is with embodiment 1.
Embodiment 3
Light resistance composition (preparation example 3) prepares about 45～60% solid content glue after mixing, and the manufacture of the template of formation tool framework is with embodiment 1.
Embodiment 4
Light resistance composition (preparation example 4) prepares about 45～60% solid content glue after mixing, and sees through suitable optical tooling on ultraviolet ray (UV) exposure machine and adjusts intensity 600-1300 (mJ/cm in order to process
2) energy exposure give imaging, other manufacture of template that forms the tool framework is with embodiment 1.
Comparative example
Light resistance composition (preparation example 5) prepares about 45～60% solid content glue after mixing, and the manufacture of the template of formation tool framework is with embodiment 1.
Method of testing
Flatness: with formed framework its frame sides (side wall) is measured its thickness of 12 respectively with white light interferometer, define the flatness of its frame sides with the difference of 12 dot thickness.
The method for measurement of yellow index: under the situation of long-term irradiation and heat release, carry out the measurement of a*, b*, L* value for light-emitting diode component, judge the phenomenon of its xanthochromia.
Circuit adhesive force: utilize ETERTEC test light mask (pattern with different live widths) after carrying out the video picture processing procedure on the base material, the limit of observing its minimum feature promptly is its circuit adhesive force.
Table 2
| Embodiment 1 | Embodiment 3 | Comparative example | |
| Flatness (%) | 93 | 81 | 63 |
According to table 2 experimental result as can be known, embodiment 1 is that the macromolecule binder that will only possess hydroxy-acid group is replaced as the macromolecule binder that has carboxylic acid simultaneously and have two kinds of groups of photocurable.The photopolymerization reaction by having the photocurable group and the heat polymerization of hydroxy-acid group increase the crosslink density of integral material, and the flatness of frame sides is increased.
Have greatly improved with the flatness of the macromolecule binder with two kinds of groups of photocurable via experiment showed,, and the embodiment 3 that is added into chain-transferring agent also has good effect for the flatness of frame sides as the embodiment 1 of main body to have carboxylic acid.
Embodiment 2 is that (c11～c13) be replaced as 2,4,6-trimethylbenzene first anilide-diphenyl phosphine oxide (c21) is the light trigger of the type of anti-the xanthochromia with two benzene first anilide phenyl phosphine oxides (c22) with general light trigger.
Table 3
By the experimental result of table 3 as can be known, the b*=41.73 when comparative example does not carry out irradiation or heating test as yet after the framework moulding, but rising to 46.44 and 50.23 respectively through its b* after irradiation test and the high temperature resistant test, the phenomenon of xanthochromia is very obvious; Otherwise embodiment 2, if light trigger is modified to 2,4, behind 6-trimethylbenzene first anilide-diphenyl phosphine oxide (c21) and the two benzene first anilide phenyl phosphine oxides (c22), rising to 42.16 and 44.65 through the irradiation test respectively with high temperature resistant test its b* of back, the degree of comparing its xanthochromia with comparative example is very not obvious.
Embodiment 3 further adds a chain-transferring agent in the main body prescription, by the effect of chain-transferring agent, increases the circuit adhesive force of base of frame.
Table 4
| Embodiment 1 | Embodiment 3 | Comparative example | |
| Circuit adhesive force (micron) | 245 | 220 | 250 |
By the experimental result of table 4 as can be known, there is the embodiment 3 that adds chain-transferring agent not have crooked phenomenon to produce; Just can be when being 250 microns otherwise comparative example then will arrive the width of framework by test.
Embodiment 4 be further by result that first three embodiment found for forming, wherein have side chain have photo curable polyacrylic binder (b1), have the type of anti-xanthochromia light trigger (c21) and (c22), chain-transferring agent compound (g1), then original silica-filled thing (e1) that adds is converted to white colorant titanium dioxide (f1), come construction to go out the example of white system dry film photoresistance, the comparative result of itself and comparative example is as shown in table 5.
Table 5
Claims (21)
1. the template of a tool framework, it is characterized in that, described template comprises at least 2 frameworks that a base material and is positioned at a side of described base material, wherein said framework is to form by a micro-photographing process, the thickness of described framework is 75 microns to 500 microns, and the width of described framework is 50 microns to 500 microns.
2. the template of tool framework as claimed in claim 1 is characterized in that, described micro-photographing process comprises at least one dry film photoresist layer of pressing on described base material, and a photomask is arranged at described dry film photoresist layer top; And the irradiation energy ray, solidify and graphical described dry film photoresist layer, with the not zone development removal of irradiation energy ray, to form at least 2 frameworks.
3. the template of tool framework as claimed in claim 1 is characterized in that, the shape of wherein said framework is to be square, rectangle, circle, rhombus, ellipse or its mixing.
4. the template of tool framework as claimed in claim 3 is characterized in that, wherein said framework is to be square or rectangular, and the outermost minimum length of side of wherein said framework is between 150 microns to 2000 microns.
5. the template of tool framework as claimed in claim 1 is characterized in that, the material of wherein said base material is metal, pottery, silicon wafer, plastics, Bo Li Fiber Victoria or its combination.
6. the template of tool framework as claimed in claim 1 is characterized in that, wherein said framework is transparent or white.
7. the template of tool framework as claimed in claim 2 is characterized in that, wherein said dry film photoresist layer comprises light resistance composition, and described light resistance composition comprises
A) at least one photo curable monomer or oligomer or its mixture;
B) macromolecule binder;
C) light trigger; And
D) thermoinitiators.
8. the template of tool framework as claimed in claim 7 is characterized in that, described component a) is selected from the group that acrylic ester monomer, methacrylate ester monomer, acrylic ester oligomer, methacrylate ester oligomer and composition thereof are formed.
9. the template of tool framework as claimed in claim 7 is characterized in that, described component b) be to comprise unsaturated carboxylic acid monomer as polymerized unit.
10. the template of tool framework as claimed in claim 7 is characterized in that, described component b) side chain of macromolecule binder further comprises photo curable group.
11. the template of tool framework as claimed in claim 7 is characterized in that, the amount of component b of described light resistance composition), in component a) and b) totally 100 weight portions, its content is 0.5 to 8.0 weight portion.
12. the template of tool framework as claimed in claim 7 is characterized in that, described light resistance composition further comprises the type of anti-xanthochromia light trigger c2), in component a) and b) totally 100 weight portions, amount of component b 2) content be less than 8.0 weight portions.
13. the template of tool framework as claimed in claim 7 is characterized in that, described light resistance composition further comprises filler e).
14. the template of tool framework as claimed in claim 7 is characterized in that, the component e of described light resistance composition), in component a) and b) totally 100 weight portions, its content is 3 to 10 weight portions.
15. the template of tool framework as claimed in claim 7 is characterized in that, described light resistance composition further comprises colorant f).
16. the template of tool framework as claimed in claim 15 is characterized in that, described component f) be white colorant, described white colorant is titanium dioxide, calcium carbonate, zinc sulphide, zinc oxide or its mixture.
17. the template of tool framework as claimed in claim 7 is characterized in that, the component f of described light resistance composition), in component a) and b) totally 100 weight portions, its content is 50 to 100 weight portions.
18. the template of tool framework as claimed in claim 7 is characterized in that, described light resistance composition further comprises chain-transferring agent g), in component a) and b) totally 100 weight portions, chain-transferring agent g) content be 0.09 to 0.2 weight portion.
19. the manufacture method of the template of a tool framework is characterized in that, comprises:
One substrate is provided;
Form at least 2 frameworks on described substrate;
Wherein said framework is to form by a micro-photographing process, and described micro-photographing process comprises: at least one dry film photoresist layer of pressing is arranged at described dry film photoresist layer top with a photomask on described base material; The irradiation energy ray solidifies and graphical described dry film photoresist layer, with the not zone development removal of irradiation energy ray, to form at least 2 frameworks.
20., it is characterized in that described energy-ray comprises ultraviolet ray as described method as described in the claim 19.
21. a luminescence component is characterized in that described assembly comprises at least 2 chips, packaging plastic; And template according to claim 1, wherein said chip is positioned at described framework, and described packaging plastic coats described chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100118403A TWI445221B (en) | 2011-05-25 | 2011-05-25 | Board having frames, method of manufacturing the same and applications therefor |
| TW100118403 | 2011-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102270731A true CN102270731A (en) | 2011-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102563568A Pending CN102270731A (en) | 2011-05-25 | 2011-09-01 | Formwork with frame, its manufacturing method and application |
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|---|---|
| CN (1) | CN102270731A (en) |
| TW (1) | TWI445221B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104943433A (en) * | 2015-07-05 | 2015-09-30 | 林志苹 | Pattern transferring template and preparing method thereof |
| CN108425092A (en) * | 2017-11-09 | 2018-08-21 | 株式会社Selcos | Black titanium color gold plating method |
| CN112533365A (en) * | 2020-12-14 | 2021-03-19 | 深圳市艾诺信射频电路有限公司 | Substrate processing method and substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553039B (en) * | 2015-08-31 | 2016-10-11 | 長興材料工業股份有限公司 | The barrier plate and method for manufacturing the same, packaged display device and method for manufacturing |
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|---|---|---|---|---|
| TW200628539A (en) * | 2005-02-05 | 2006-08-16 | Eternal Chemical Co Ltd | Halogen free dry film photosensitive resin composition |
| US20070029569A1 (en) * | 2005-08-04 | 2007-02-08 | Peter Andrews | Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same |
| CN101584053A (en) * | 2006-12-21 | 2009-11-18 | 皇家飞利浦电子股份有限公司 | Carrier and optical semiconductor device based on such a carrier |
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- 2011-05-25 TW TW100118403A patent/TWI445221B/en active
- 2011-09-01 CN CN2011102563568A patent/CN102270731A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200628539A (en) * | 2005-02-05 | 2006-08-16 | Eternal Chemical Co Ltd | Halogen free dry film photosensitive resin composition |
| US20070029569A1 (en) * | 2005-08-04 | 2007-02-08 | Peter Andrews | Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same |
| CN101584053A (en) * | 2006-12-21 | 2009-11-18 | 皇家飞利浦电子股份有限公司 | Carrier and optical semiconductor device based on such a carrier |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104943433A (en) * | 2015-07-05 | 2015-09-30 | 林志苹 | Pattern transferring template and preparing method thereof |
| CN104943433B (en) * | 2015-07-05 | 2017-07-21 | 林志苹 | A kind of pattern transfer template and preparation method thereof |
| CN108425092A (en) * | 2017-11-09 | 2018-08-21 | 株式会社Selcos | Black titanium color gold plating method |
| CN108425092B (en) * | 2017-11-09 | 2020-10-27 | 株式会社Selcos | Black titanium gold plating method |
| CN112533365A (en) * | 2020-12-14 | 2021-03-19 | 深圳市艾诺信射频电路有限公司 | Substrate processing method and substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI445221B (en) | 2014-07-11 |
| TW201248944A (en) | 2012-12-01 |
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