CN102255609A - Low temperature cofired ceramic (LTCC)-process-based duplexer with novel structure - Google Patents
Low temperature cofired ceramic (LTCC)-process-based duplexer with novel structure Download PDFInfo
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- CN102255609A CN102255609A CN2010101770848A CN201010177084A CN102255609A CN 102255609 A CN102255609 A CN 102255609A CN 2010101770848 A CN2010101770848 A CN 2010101770848A CN 201010177084 A CN201010177084 A CN 201010177084A CN 102255609 A CN102255609 A CN 102255609A
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Abstract
The invention discloses a duplexer, which is applied to global system for mobile communication (GSM)/data communication system (DCS) frequency bands and realized by a low temperature cofired ceramic (LTCC) technology. The duplexer comprises a high-pass filter connected with a common port and a low-pass filter connected with the common port. A low temperature series resonator which attenuates low frequency component is connected in parallel between the common port and the high-pass filter, two capacitors with equal capacitance are connected in series between the common port and the high-pass filter, and the high-pass filter forms a maximal transmission coefficient point in a high frequency pass band; and a series resonator which attenuates high frequency components is connected in parallel between the common port and the low-pass filter, and a parallel resonator which attenuates higher frequency components is connected in series between the common port and the low-pass filter.
Description
Technical field
This product relates to a kind of duplexer that is used for communications field lamped element, particularly relates to a kind of lamped element duplexer that adopts multilayer LTCC technology to process.
Background technology
Along with the continuous development of mobile communication system and perfect day by day; requirement to mobile communication equipment is also more and more higher; constantly promoting mobile telephone system and developing, developing to the direction of low cost, miniaturization, high band thereby promoting duplexer to miniaturization, multimodeization (compatible GSM900/DCS1800, PCS, IS-95 and 3G system simultaneously) and high performance direction.
In mobile communication system, the reception of wireless signal and transmission all need to pass through antenna.If give receiver and antenna of each dispensing of sender, not only increased cost, volume, and also can the phase mutual interference between the antenna transmission signal.So wish the public common antenna of transmitting-receiving, this just need use duplex technology.Briefly, duplexer is exactly to solve the transmit-receive sharing common antenna and make its not interactional problem and the microwave device that designs, and it has become one of important component in the communication system.Duplexer has three ports, and its effect is that the Signal Separation that will work in different frequency range comes, and signal is sent in the corresponding connectivity port.And the LTCC technology can be embedded in resistance, inductance, electric capacity among the LTCC, forms the duplexer of three-dimensional structure.Can dwindle the volume of module significantly like this, this material has high reliability simultaneously, has also just brought the flexibility in the design.
Find through literature search prior art, Chinese patent 1661912A has proposed a kind of duplexer lump prototype that can suppress respectively a plurality of band signals losses of transmitting along high pass filter side and low pass filter side, from its lump prototype as can be seen, four resonators and two capacitor and inductors have been introduced in the patent, caused element too much like this, but this has also just caused when converting reality production and processing model to, disturb excessive between the element, thereby have a strong impact on the performance of duplexer, too much like this element also is unfavorable for the miniaturization of duplexer simultaneously, and as can be seen from the simulation result that provides subsequently, though duplexer can reach the high requirement of isolating, but it is relatively big to insert loss, and this just causes this lump prototype can't really be widely used in practice, and a kind of theoretic reference can only be provided; In addition, United States Patent (USP) case 0058063 uses many ground plates with the isolating circuit element, do effective mutual coupling and the ghost effect that has intercepted between the circuit element although it is so, but also strengthened board area on the other hand, this requires for miniaturization is can't meet the requirements of beyond doubt.
Also find in the retrieval, the miniaturization technology that nineteen ninety-fives such as A.Bruno Frazier deliver in IEEE transactions onindustrial electronics the 42nd volume: past, now, and following (TheMiniaturization Technologies:Past, Present, and Future), paper has well been told about the advantageous advantage that the LTCC technology is had aspect compact apparatus.
Summary of the invention
The object of the present invention is to provide the duplexer of the miniaturization lamped element design of a kind of GSM/DCS of being used for, and solve the deficiencies in the prior art.The present invention proposes a kind of three-dimensional duplexer device of unique structure, the resonator structure that adopts can produce transmission zero in corresponding filter passband, thereby can guarantee that signal is independent of each other in two passbands, and the introducing of its transmission zero has reduced element, improve performance, simplified design; The introducing of transmission coefficient maximum point has improved the pass-band performance of high pass filter; Duplexer adopts the LTCC technology to realize, thereby makes the three dimensional design of duplexer more flexible, and structure is compact more, also is easy to mutually integrated with its RF front-end module.
The present invention is achieved by the following technical solutions, the present invention includes high pass filter and low pass filter, described high pass filter is connected with low pass filter and forms public antenna end interface, high pass filter and low pass filter all adopt lamped element, to realize the low-loss performance of duplexer miniaturization.
The horizontal arrangement plane of described low pass filter element parallels with ground plane, and two resonators are arranged in parallel, the element of resonator own becomes a vertical direction to build in ground plane top, and by the metallization via hole with between each layer and element itself be connected with each other.Wherein the capacity cell of parallel resonator is configured in 1 and 2 layer, and inductance element is configured in the 3-7 layer; The inductance element of series resonator is configured in the 1-3 layer, and capacity cell is configured in the 5-7 layer.
The horizontal arrangement plane of described high pass filter element parallels with ground plane, and resonator and two capacitors are arranged in parallel, the element of resonator own becomes a vertical direction to build in ground plane top, and by the metallization via hole with between each layer and element itself be connected with each other.Wherein the inductance element of series resonator is configured in 1 and 2 layer, and capacity cell is configured in the 3-7 layer; The capacity cell of two equivalent symmetric arrays is configured in the 1-6 layer.
Three ports of described duplexer are in order to this device connection and antenna and rf processing circuitry, the mixed signal that antenna is accepted input to this duplexer in, low pass filter will filter out the HFS that is higher than its cut-off frequency, and in inserting the loss corresponding figures, form transmission zero, to suppress high-frequency signal; Equally, also can filter out the low-frequency component that is lower than its cut-off frequency in the high pass filter, high pass filter is except forming transmission zero with the inhibition low frequency composition in pass band, also the transmission coefficient maximum point will be formed in the high pass filter passband, to improve the transmission performance of high pass filter.
The well existing invention of the present invention is compared: the duplexer that existing employing lamped element is realized, some has adopted more element in order to reach performance requirement, but theoretical realization result has also just been given in such realization, and do not provide concrete processing result, in fact, it is the comparison difficulty that the duplexer of this multicomponent gets up in specific implementation, so such model can't specifically be used; Or provided lumped model, and provided implementation procedure simultaneously, and number of elements is fewer, still, the performance performance of this duplexer when specific implementation is general, has also just limited its application; Or be to increase many ground connection meals in order to reach the interference between the reduction element, improved performance though do like this, also increase area simultaneously, thereby restricted the development of its miniaturization aspect.Advantage of the present invention is at first to have introduced transmission zero and transmission maximal point, has realized duplexer performance preferably with less elements; Adopt multilayer LTCC technology simultaneously, make duplexer can be in three dimensions flexible configuration, thereby make structure compact more, reach the purpose that realizes miniaturization; Configuration of the present invention can significantly reduce parasitic capacitance effect in the circuit running, and it is all in institute's configuration capacitor that parasitic capacitance is partly added, and the value that adds the capacitor of parasitic capacitance part still equals original designed value.
Description of drawings
Fig. 1 is a duplexer lump prototype circuit of the present invention
Fig. 2 is the Layout figure by duplexer lump prototype of the present invention
Fig. 3 is low pass filter Layout figure of the present invention
Fig. 4-the 7th, the Layout figure of each element of low pass filter of the present invention
Fig. 8 is high pass filter Layout figure of the present invention
Fig. 9-the 11st, the Layout figure of each element of high pass filter of the present invention
Figure 12 is the typical frequencies response of low pass filter of the present invention and high pass filter
Figure 13 is transfer curve schematic diagram of the present invention and compares with measured result
Figure 14 is isolation characteristic curve synoptic diagram of the present invention and compares with measured result
Wherein: 1-public port, 2-high pass filter input port, 3-low pass filter input port, series resonator in the 4-high pass filter, 4a-inductance element, 4b-capacity cell, 5,6-capacity cell, the parallel resonator in the 7-low pass filter, 7a-capacity cell, the 7b-inductance element, series resonator in the 8-low pass filter, 8a-inductance element, 8b-capacity cell, 9-low-pass filter circuit prototype, 10-circuit of high pass filter prototype.
Embodiment
Below in conjunction with accompanying drawing example of the present invention is elaborated: present embodiment is implemented under the prerequisite with technical solution of the present invention, provided detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1, Fig. 1 is the lamped element duplexer prototype schematic diagram of this example.Duplexer comprises a low pass filter 9 and high pass filter 10, and two filter all is connected in a public port 1, so that the high frequency composition of the mixed signal of input separates with the low frequency composition.Low pass filter 9 is connected between public port 1 and the low frequency output port 3, it comprises resonator 7 and a series resonator 8 of a parallel connection, 7 resonance frequency is designed to than on the higher frequency of high frequency passband, and the resonance frequency of 8 resonators designs in the passband of high pass filter 10.High pass filter 10 is connected between public port 1 and the high frequency output port 2, high pass filter 10 comprises two series capacitors 5 and 6, series resonator 4 in parallel between this two electric capacity, the resonance frequency design of this series resonator is in the passband of low pass filter 9, high pass filter 10 suitable two series resonator of this symmetrical structure, resonance is gone into transmitting maximal point in the passband of high pass filter 10.
Example one:
The structural representation that is this example according to the duplexer Layout that Fig. 1 did shown in Figure 2.The concrete parameter of the exampleization is: the relative dielectric constant of used LTCC material is 5.9, totally seven layers of medium, every layer of dielectric thickness is 0.096mm, the dielectric loss tangent angle is 0.0015, and metal material is a silver, and every layer of metal thickness is 0.01mm, all live widths that realize inductance are 0.15mm, used square pad width is 0.235mm, and the metallization via diameter is 0.185mm, and through hole all is placed on the central authorities of pad.The wire length of the low pass output port 3 of being drawn by low pass filter 9 is 0.673mm, width is 0.235mm, the inductance element 7b of low pass filter 9 adopts five layers of clockwise spiral way to realize, capacity cell adopts the double face slab of 0.56mm*0.6mm to realize, inductance element 8a adopts three layers of counterclockwise spiral inductance mode to realize, capacity cell 8b adopts three layers of interdigital panel mode of 1.145mm*1.4mm to realize, is 0.1mm*0.115mm for realizing the interdigital rectangular block that cuts out; The wire length of the high pass output port 2 of being drawn by high pass filter 10 is 0.466mm, the inductance element 4a of high pass filter 10 adopts two-layer clockwise spiral to realize, 4b electric capacity adopts five layers of interdigital panel mode of 1.65mm*1.52mm to realize, for realizing that the inner interdigital rectangular block area of removing is 0.385mm*0.39mm, capacity cell 5 and 6 adopts six layers of interdigital panel mode of 1.35mm*0.89mm to realize, for realizing that the inner interdigital rectangular block area of removing is 0.387mm*0.387mm; The common antenna port 1 of termination is 0.115mm apart from the distance of low frequency output between low pass filter 9 and the high pass filter 10, and horizontal range is 0.622mm, is 0.625mm apart from high frequency delivery outlet horizontal range.
Figure 12 is the low pass filter of lump prototype among Fig. 1 and the typical frequencies response diagram of high pass filter, by seeing the improvement to transmission performance of transmission zero and transmission pole among the figure.
Figure 13 is the result that the insertion loss among Fig. 1 and Fig. 2 compares, and therefrom as can be seen, it is fairly good that two results coincide.
Figure 14 is the result that the isolation characteristic among Fig. 1 and Fig. 2 compares, and therefrom as can be seen, it is fairly good that two results also coincide.
According to test result as can be seen, the duplexer of this example has not only been accomplished miniaturization, have transmission characteristic and isolation characteristic preferably, and it is integrated into easily in other radio-frequency (RF) front-end circuit.This diplexer structure is fairly simple in addition, thus processing than being easier to, cost is lower.
Claims (15)
1. duplexer that uses the lamped element mode and adopt LTCC technology (LTCC) to realize, this duplexer comprises: low pass filter (9), high pass filter (10), and all be connected to public port (1).
2. according to the described duplexer of claim 1, it is characterized in that described low pass filter (9) comprises a parallel resonator (7) and a series resonator (8).Wherein, described parallel resonator (7) is connected between port (1) and the public port (3); Described series resonator (8) is joined with the terminal short circuit parallel branch.
3. according to the described duplexer of claim 2, it is characterized in that described series resonator (8) resonance is in high pass filter (10) passband, and parallel resonator (7) resonance is on than the higher frequency of high pass filter (10) passband;
4. according to the described duplexer of claim 1, it is characterized in that described high pass filter (10) adopts symmetrical structure, comprise equivalent capacitance element (5) and (6) of two series connection, and a series resonator (4).Wherein said series resonator (4) is joined with the terminal short circuit parallel branch.
5. according to the described duplexer of claim 4, it is characterized in that described series resonator (4) resonance is at the centre frequency place of low pass filter (9), high pass filter (10) overall resonance in the passband of high pass filter, thereby reach the transmission coefficient maximum.
6. according to the described duplexer of claim 1, it is characterized in that described duplexer uses multilayer LTCC technology to realize that element all adopts the lump mode to realize, and is configured in Different L TCC layer.
7. according to the described duplexer of claim 1, it is characterized in that described low pass filter (9) is arranged in LTCC side by side with high pass filter (10), all elements take seven layers.Being connected between all components and parts and layer and the layer all adopts the metallization via hole to link to each other, and the junction is provided with pad.
8. according to the described duplexer of claim 1, it is characterized in that the parallel resonator electric capacity (7a) of described low pass filter (9) is configured in 1 and 2 layer, inductance (7b) and is configured in the 3-7 layer; Series resonator (8) inductance (8a) is configured in the 1-3 layer, electric capacity (8b) is configured in the 5-7 layer, and joins with ground.
9. described according to Claim 8 duplexer, it is characterized in that the port that described capacitor board (7b) links to each other with parallel resonator (8) links to each other with port (3), port (3) is configured in ground floor, the another port of parallel resonator (7) links to each other with public port (1), and public port is configured in the second layer.
10. according to the described duplexer of claim 1, it is characterized in that the inductance element (4a) of the series resonator (4) of described high pass filter (10) is configured in 1,2 layer, capacitance arrangement is at the 3-7 layer and be connected to ground; The capacitor of two equivalent symmetric arrays (5) and (6) are configured in the 1-6 layer.
11., it is characterized in that described capacitor (5) is connected with public port (1) according to the described duplexer of claim 10, capacitor (6) is connected with port (2), port (2) is configured in the second layer.
12., it is characterized in that described inductance adopts multi-layer helical inductance mode to realize according to the described lamped element duplexer of claim 1.
13., it is characterized in that described electric capacity adopts the capacity plate antenna mode, and realizes greater than two-layer interdigital capacitor mode at least according to the described duplexer of claim 1.
14., it is characterized in that described duplexer ground plane becomes the 0th layer of lamped element duplexer according to the described duplexer of claim 1.
15., it is characterized in that described duplexer is applicable to the GSM/DCS communication system according to the described duplexer of claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101770848A CN102255609A (en) | 2010-05-17 | 2010-05-17 | Low temperature cofired ceramic (LTCC)-process-based duplexer with novel structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103023451A (en) * | 2012-12-29 | 2013-04-03 | 南京理工大学 | Band-pass/band-elimination type miniature low-temperature co-fired ceramic duplexer |
| CN103138703A (en) * | 2011-11-30 | 2013-06-05 | 西安电子科技大学 | Laminated high-pass filter |
| CN103618124A (en) * | 2013-12-04 | 2014-03-05 | 深圳市麦捷微电子科技股份有限公司 | Novel laminating piece type duplexer |
| CN103997309A (en) * | 2013-02-15 | 2014-08-20 | 株式会社村田制作所 | Polar-type low pass filter and demultiplexer equipped therewith |
| CN104052285A (en) * | 2014-03-18 | 2014-09-17 | 江苏中利电子信息科技有限公司 | DC power supply converter board |
| CN105703735A (en) * | 2015-09-01 | 2016-06-22 | 南京理工大学 | UHF-band miniature duplexer based on LTCC technology |
| KR20170101438A (en) * | 2016-02-29 | 2017-09-06 | 삼성전기주식회사 | Band pass filter of variable band split |
| CN112272014A (en) * | 2020-11-02 | 2021-01-26 | 电子科技大学 | Mixed medium frequency divider |
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2010
- 2010-05-17 CN CN2010101770848A patent/CN102255609A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103138703A (en) * | 2011-11-30 | 2013-06-05 | 西安电子科技大学 | Laminated high-pass filter |
| CN103138703B (en) * | 2011-11-30 | 2016-03-30 | 西安电子科技大学 | A kind of lamination high pass filter |
| CN103023451A (en) * | 2012-12-29 | 2013-04-03 | 南京理工大学 | Band-pass/band-elimination type miniature low-temperature co-fired ceramic duplexer |
| CN103997309A (en) * | 2013-02-15 | 2014-08-20 | 株式会社村田制作所 | Polar-type low pass filter and demultiplexer equipped therewith |
| CN103997309B (en) * | 2013-02-15 | 2017-03-01 | 株式会社村田制作所 | There are polar form low pass filter and the demultiplexer including it |
| CN103618124B (en) * | 2013-12-04 | 2015-12-30 | 深圳市麦捷微电子科技股份有限公司 | A kind of lamination sheet type duplexer |
| CN103618124A (en) * | 2013-12-04 | 2014-03-05 | 深圳市麦捷微电子科技股份有限公司 | Novel laminating piece type duplexer |
| CN104052285A (en) * | 2014-03-18 | 2014-09-17 | 江苏中利电子信息科技有限公司 | DC power supply converter board |
| CN104052285B (en) * | 2014-03-18 | 2017-12-01 | 江苏中利电子信息科技有限公司 | D/C power change-over panel |
| CN105703735A (en) * | 2015-09-01 | 2016-06-22 | 南京理工大学 | UHF-band miniature duplexer based on LTCC technology |
| KR20170101438A (en) * | 2016-02-29 | 2017-09-06 | 삼성전기주식회사 | Band pass filter of variable band split |
| KR102600021B1 (en) * | 2016-02-29 | 2023-11-07 | 삼성전기주식회사 | Band pass filter of variable band split |
| CN112272014A (en) * | 2020-11-02 | 2021-01-26 | 电子科技大学 | Mixed medium frequency divider |
| CN112272014B (en) * | 2020-11-02 | 2023-04-25 | 电子科技大学 | Mixed medium frequency divider |
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Application publication date: 20111123 |