CN102243985B - Waste heat utilization device for semiconductor production line and operating method thereof - Google Patents
Waste heat utilization device for semiconductor production line and operating method thereof Download PDFInfo
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- CN102243985B CN102243985B CN 201010168476 CN201010168476A CN102243985B CN 102243985 B CN102243985 B CN 102243985B CN 201010168476 CN201010168476 CN 201010168476 CN 201010168476 A CN201010168476 A CN 201010168476A CN 102243985 B CN102243985 B CN 102243985B
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Abstract
The invention discloses a waste heat utilization device for a semiconductor production line and an operating method thereof. The invention in particular relates to a heat source recycling device for a purification plant in a semiconductor chip manufactory and the operating method of the device. The device comprises a device for generating waste heat and a purification plant, as well as an air outlet, an air inlet, pipelines, a valve 1, a valve 2 and a valve 3, a temperature sensor and a controller, wherein the device for generating waste heat, the purification plant, the air outlet and the air inlet are connected through the pipelines; the valve 1 is arranged at the position of the air outlet; the valve 3 is arranged at the position of the air inlet; and the valve 2 is arranged on the pipeline between the device for generating waste heat and the purification plant; the temperature sensor comprises a sensor 1, a sensor 2 and a sensor 3; the sensor 1 is arranged at the position of a waste heat outlet of the device for generating waste heat; the sensor 2 is arranged at the position of the purification plant; and the sensor 3 is arranged outside the air inlet; and the valve 1, the valve 2 and the valve 3, as well as the sensor 1, the sensor 2 and the sensor 3, are respectively connected with the controller. Through the recycling of energy sources in a workshop, the resource utilization ratio is improved, the production and manufacturing cost is lowered, and the device and the method are suitable for the production requirements for low carbon and environmentally friendliness.
Description
Technical field
What the present invention relates to is device and the method for work that energy recovery is utilized, and relates in particular to device that a kind of semiconductor chip manufactory cleaning shop thermal source recycles and the method for work of this device.
Background technology
Present semiconductor production workshop mostly is the cleaning shop, the production equipment of the inside easily produces a large amount of high-temperature gases and emits, used heat equipment (diffusion furnace, baking oven, air compressor machine for example ...) the high temperature waste hot temperature that emits generally can reach about 80 ℃, if this high-temperature gas directly is discharged in the air, that is a kind of great waste.And general semiconductor production workshop is higher to the requirement of temperature, usually regulates indoor temperature with air-conditioning at present, and production cost also can increase like this.
The contradiction of Economic Development and resource environment is increasingly sharp-pointed, the discharging of greenhouse gas is so that global warming simultaneously, further strengthening energy-saving and emission-reduction work, is the active demand to global warming, the saving energy, also is the responsibility that our manufacturing industry should be born.
In view of above As-Is, to seek now and a kind ofly can avoid energy waste, the method that can reduce production costs again has certain Research Significance.
Summary of the invention
The present invention is directed to above problem, provide a kind of and used heat in the production link can have been produced the high-temperature gas that equipment exhausting goes out and recycle, and need to be applicable to waste heat utilization device and the method for work thereof of semiconductor production line of the production cleaning shop of specified temp.
Technical scheme of the present invention is: described production line comprises equipment and the cleaning shop that produces used heat, it comprises exhaust outlet, air inlet, pipeline, valve one～three, temperature inductor and controller, described pipeline links to each other equipment, cleaning shop, exhaust outlet and the air inlet of described generation used heat, described valve one is located at the exhaust outlet place, described valve three is located at the air inlet place, and described valve two is located on the equipment and the pipeline between the cleaning shop that produces used heat; Described temperature inductor comprises inductor one, inductor two and inductor three, and inductor one is located at the used heat exit of the equipment of described generation used heat, and inductor two is located at place, described cleaning shop, and inductor three is located at the air inlet outside; Valve one～three is connected with inductor～three connect respectively controller.
Method of work of the present invention is:
1), setting described cleaning shop target temperature value in controller is 18-28 ℃;
2.1), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during less than 18 ℃, the flow of control valve one～two, valve-off three is until inductor three temperature values are 18-28 ℃;
2.2), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during greater than 28 ℃, valve-off two, Open valve one and valve three are until inductor three temperature values are 18-28 ℃.
The present invention utilizes pipeline, valve that heat source body is effectively recycled, take recovery channel to draw certain heat, adjust air quantity by gas valve control, enter the purifier system and carry out secondary filter, regulate and send into the cleaning shop after temperature required, satisfy manufacturing technique requirent.Aspect control, realized intellectuality, can be according to keying, the folding amount realization workshop needed temperature of seasonal variations by the adjustments of gas pipeline valve.The present invention is recycling with the workshop energy, improves resource utilization, reduces manufacturing cost, adapts to the production requirement of low-carbon environment-friendly.
Description of drawings
Fig. 1 structural representation of the present invention
1 is that valve one, 2 is that valve two, 3 is valve three among Fig. 1.
Embodiment
The present invention as shown in Figure 1, described production line comprises equipment and the cleaning shop that produces used heat, it comprises exhaust outlet, air inlet, pipeline, valve 1, valve 22, valve 33, temperature inductor and controller, described pipeline links to each other equipment, cleaning shop, exhaust outlet and the air inlet of described generation used heat, described valve one is located at the exhaust outlet place, described valve three is located at the air inlet place, and described valve two is located on the equipment and the pipeline between the cleaning shop that produces used heat; Described temperature inductor comprises inductor one, inductor two and inductor three, and inductor one is located at the used heat exit of the equipment of described generation used heat, and inductor two is located at place, described cleaning shop, and inductor three is located at the air inlet outside; Valve one～three is connected with inductor～three connect respectively controller.
Method of work of the present invention is:
1), setting described cleaning shop target temperature value in controller is 18-28 ℃;
2.1), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during less than 18 ℃, the flow of control valve one～two, valve-off three is until inductor three temperature values are 18-28 ℃;
2.2), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during greater than 28 ℃, valve-off two, Open valve one and valve three are until inductor three temperature values are 18-28 ℃.
During concrete the application, according to the design of method as shown in the figure pipeline structure, wherein production equipment comprise outside the clean room and the clean room in production equipment and auxiliary device, according to workshop or production-scale difference, a plurality of exhaust outlets, a plurality of air inlet, a plurality of purifier, a plurality of production equipment even a plurality of cleaning shop can be arranged.
Production equipment (air compressor machine, diffusion furnace, baking oven ...) heat source temperature higher (about 80 ℃) of discharging, can come the needed temperature in production control workshop by the heat absorption of pipeline and the size of adjustments of gas valve.
This method method is adapted at use in winter, and winter, weather was colder, and temperature is lower in the cleaning shop, and this moment can be valve one
1 closes, and opens valve 22, and the hot gas that valve-off 33, production equipment give off enters purifier by pipeline, enters the cleaning shop after the purification, and the size of control valve 22 can be controlled the temperature in the cleaning shop.
Summer the cleaning shop temperature drift, but this moment valve-off 22, open the hot gas that valve 1 produces production equipment and discharge from exhaust outlet, open valve 33 and make outside air enter purifier to send into the cleaning shop, the valve 22 of this moment is in closed condition.
Claims (2)
1. the waste heat utilization device of a semiconductor production line, described production line comprises equipment and the cleaning shop that produces used heat, it is characterized in that, it comprises exhaust outlet, air inlet, pipeline, valve one～three, temperature inductor and controller, described pipeline links to each other equipment, cleaning shop, exhaust outlet and the air inlet of described generation used heat, described valve one is located at the exhaust outlet place, and described valve three is located at the air inlet place, and described valve two is located on the equipment and the pipeline between the cleaning shop that produces used heat; Described temperature inductor comprises inductor one, inductor two and inductor three, and inductor one is located at the used heat exit of the equipment of described generation used heat, and inductor two is located at place, described cleaning shop, and inductor three is located at the air inlet outside; Valve one～three is connected with inductor～three connect respectively controller.
2. the method for work of the waste heat utilization device of the described semiconductor production line of claim 1 is characterized in that, its method of work is:
1), setting described cleaning shop target temperature value in controller is 18-28 ℃;
2.1), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during less than 18 ℃, the flow of control valve one～two, valve-off three is until inductor three temperature values are 18-28 ℃;
2.2), receive Temperature numerical that temperature inductor one detects greater than the Temperature numerical of inductor two and inductor three when controller, and inductor three temperature values are during greater than 28 ℃, valve-off two, Open valve one and valve three are until inductor three temperature values are 18-28 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010168476 CN102243985B (en) | 2010-05-11 | 2010-05-11 | Waste heat utilization device for semiconductor production line and operating method thereof |
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| CN 201010168476 CN102243985B (en) | 2010-05-11 | 2010-05-11 | Waste heat utilization device for semiconductor production line and operating method thereof |
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| CN102243985A CN102243985A (en) | 2011-11-16 |
| CN102243985B true CN102243985B (en) | 2013-04-24 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201741671U (en) * | 2010-05-11 | 2011-02-09 | 扬州杰利半导体有限公司 | Waste heat utilizing device for semiconductor production line |
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| US7200005B2 (en) * | 2003-12-09 | 2007-04-03 | International Business Machines Corporation | Method and apparatus for generating electricity using recycled air from a computer server |
| JP2008251844A (en) * | 2007-03-30 | 2008-10-16 | Gm Global Technology Operations Inc | Structure and method for phase transition cooling of power electronic circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741671U (en) * | 2010-05-11 | 2011-02-09 | 扬州杰利半导体有限公司 | Waste heat utilizing device for semiconductor production line |
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| JP特开2008-251844A 2008.10.16 |
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